B37933-K5040-B760 [EPCOS]
CAPACITOR, CERAMIC, MULTILAYER, 50 V, CH, 0.0000047 uF, SURFACE MOUNT, 0603, CHIP;
| 型号： | B37933-K5040-B760 |
| 厂家： | 
EPCOS |
| 描述： | CAPACITOR, CERAMIC, MULTILAYER, 50 V, CH, 0.0000047 uF, SURFACE MOUNT, 0603, CHIP |
| 文件： | 总11页 (文件大小：317K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
Hi-Q Capacitors 0603
Description
The “High-Q-series” was designed for wireless communications and high frequency applications.
The “High-Q-Capacitors” have a class 1 dielectric ceramic and copper inner electrode. The class 1
dielectric ceramic used, HQM, is a very stable dielectric offering a temperature coefficient of
capacitance (TCC) of 0± 60ppm/°C. The higher conductivity of copper give a lower ESR. These
advantages mean a improved performance of matching circuits, lower power dissipation and less
energy absorption.
Features
ꢀ Ultra low ESR and high Q-factor
ꢀ Tight capacitance tolerances
ꢀ Class 1 capacitor with Cu-inner-electrodes
ꢀ High stability with respect of time, temperature, frequency and voltage
ꢀ Excellent attenuation
ꢀ High self resonance frequency
ꢀ Lead free component
ꢀ AgNiSn (Nickel Barrier) Termination
Applications
ꢀ Cellular Communication
ꢀ Bluetooth
ꢀ DECT
ꢀ Cable TV
ꢀ Satellite TV (LNB)
ꢀ GPS
ꢀ Vehicle Location Systems
ꢀ Paging
ꢀ Test and Measurement
ꢀ Filters
ꢀ RF Amplifiers
ꢀ VCO´s
ꢀ HIPERLAN
EPCOS KB VS PE
Revision: d/2001
15.10.01
Page 1 of 11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
Ordering Code
Chip
-
-
B37933
K 5 100 J 5 60
Type and Size:
HQM / 0603
Termination Type:
K = Cu/Ni/Sn
Rated Voltage:
Rated Capacitance:
100 = 10 x 100pF
Capacitance Tolerance:
C<10pF: B = ±0.1pF C = ±0.25pF
C>10pF: J = ±5%
K = ±10%
Decimal place:
for cap. values <10pF, otherwise not used
Packaging code:
01 = bulk case
60 = card board, 180mm reel
Sample Kit
-
-
B37933
K 5 999 J 99
Cap values:
0.4, 0.5, 0.7, 0.8, 0.9, 1.0, 1.2, 1.5, 1.8, 2.2,
3.3, 3.9, 4.7, 5.6, 6.8, 8.2, 10, 12, 15, 18
Capacitance Tolerance:
C<3.9pF: B = ±0.1pF
4.7pF<C10pF C = ±0.25pF
C>10pF: J = ±5%
EPCOS KB VS PE
Revision: d/2001
15.10.01
Page 2 of 11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
Figure
l
Symbol Min
Max
1.75
Unit
mm
b
s
l
1.45
b
s
k
0.70
0.70
0.25
0.90
0.90
0.50
mm
mm
mm
Dimensions and tolerances in accordance with
CECC 32101-801
k
Electrical Data
Capacitance Test Conditions
Test frequency:
Test voltage:
1.0 MHz ± 0,2 MHz
1.0 V ± 0.2 V
25°C ± 1°C (EIA)
< 1.0 x 10-3
Reference Temperature
Dissipation factor tan δ (limit value):
Insulation Resistance:
Ageing:
> 105 MΩ
none
Temperature coefficient (tolerance) 0 ± 60*10-6 1/K
Operating Temperature Range:
Climatic category (IEC 68-1):
Capacitance Range:
-55°C ... +125°C
55/125/56
0.4 ... 82pF (up from 1pF Series E12)
RF Measuring Systems Performance
S-Parameter Measuring Configuration:
ꢀ HP 8753D (30kHz – 6GHz)
Impedance Measuring Configuration:
ꢀ Agilent E 4991A (1MHz – 3GHz)
ꢀ Test fixture 16197A
ꢀ parts not soldered
ꢀ HP 8722D (1MHz – 40GHz)
ꢀ samples soldered on microstrip PCB’s
ꢀ Measuring Direction: Shunt
ꢀ
EPCOS KB VS PE
Revision: d/2001
Page 3 of 11
15.10.01
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
Typical RF Performance
1
2
Capacitance
[pF]
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
fres
ESR@ 1GHz 2 Q@ 1GHz 2
ESR@ fres
[mΩ]
595
540
510
440
410
390
365
335
300
285
250
235
210
200
185
170
155
140
130
118
108
100
90
[MHz]
17800
17100
13600
12200
11400
10600
9600
8800
7900
6900
5750
5100
4700
4150
3550
3130
2850
2730
2580
2400
2150
2050
1870
1780
[mΩ]
445
400
385
345
325
315
300
275
250
240
215
200
185
175
165
150
140
130
120
110
102
96
860
805
755
635
595
560
525
455
395
360
305
270
235
210
185
160
135
115
96
12
15
18
22
76
62
50
88
34
27
80
26
82
ESR@ 300MHz 2
Q@ 300MHz 2 ESR@ fres
1
2
Capacitance
fres
[pF]
[MHz]
[mΩ]
[mΩ]
82
930
52
105
52
1 Impedance Analyser E 4991A, parts not soldered
2 Network Analyser HP 8753D, parts soldered
EPCOS KB VS PE
Revision: d/2001
15.10.01
Page 4 of 11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
Fig. 1: Typical ESR for different Frequencies vs.
Capacitance 3
Fig. 2: Typical Q Factor for different Frequencies vs.
Capacitance 3
1000
10000
3 GHz
1 GHz
1000
1 GHz
3 GHz
100 MHz
300 MHz
100
100 MHz
300 MHz
100
10
10
0.1
1
10
100
0.1
1
10
100
C [pF]
C [pF]
Fig. 3: Typical Self Resonant Frequencies vs.
Capacitance 3
Fig. 4: Typical ESR at Resonant Frequencies for
soldered parts vs. Capacitance 4
100000
1000
10000
1000
100
100
10
0.1
1
10
100
0.1
1
10
100
C [pF]
C [pF]
Fig. 5: Typical ESR for different Capacitances vs.
Frequency 3
Fig. 6: Typical Q Factor for different Capacitances vs.
Frequency 3
10
10000
0.4pF
1000
0.4pF
1
3.3pF
3.3pF
12pF
100
10
1
12pF
27pF
27pF
0.1
0.01
100
1000
10000
100
1000
Frequency [MHz]
10000
Frequency [MHz]
3 Impedance Analyser E 4991A, parts not soldered
4 Network Analyser HP 8753D, parts soldered
EPCOS KB VS PE
Revision: d/2001
15.10.01
Page 5 of 11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
RF Experiences
The proporties of Hi-Q capacitors depend on soldering conditions and pad sizes. In general soldered
parts show a better RF behaveour then not soldered parts. The resonant frequency decreases with
bigger pad sizes.
Measurand
ESR@1GHz
Q@1GHz
ESR@fres
fres
Parts not soldered
see figure 1 and 5
see figure 2 and 6
higher
Parts soldered
lower
higher
see figure 4
lower
see figure 3
Mounting Instructions
Copper/Nickel/Tin terminations
Class 1 Ceramic
Copper Inner electrodes
Substrate electrode - copper
Intermediate electrode- nickel
External electrode - tin
Geometry of solder pads
Recommended maximum dimensions:
B
B
A
1.0
B
1.0
C
3.0
Unit
mm
A
C
EPCOS KB VS PE
Revision: d/2001
15.10.01
Page 6 of 11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
Recommended soldering profile
Test according IEC 68-2-58:
Wettability Test: 215°C ± 3°C / 3 sec ± 0,3sec (wetting of soldering area > 95%)
Leaching Test: 260°C ± 5°C / 10sec ± 1sec (no leaching of contacts)
Soldering conditions:
ꢀ Reflow soldering conditions according to CECC 00802, temperature characteristics at terminals
during infrared-reflow soldering
ꢀ Two reflow cycles and Pb free solder process admitted
ꢀ Manual hot gas soldering: (for rework only)*)
-
-
-
Max air temperature: 270 °C
Max air velocity: 10 m/s
Max exposure time: 30 s
ꢀ Manual soldering using soldering iron: (for rework only)*)
-
-
-
Max tip temperature: 270 °C
Max exposure time: 5 s
Antistatic protection not required
*) Care must be taken that the MLCC is not damaged
ꢀ Additional heat treatment
-
In addition to the reflow cycles a heat treatment
of 150°C±10°C is permitted for 5 minutes
EPCOS KB VS PE
Revision: d/2001
15.10.01
Page 7 of 11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
Storage conditions:
Solderability is guaranteed for 12 months from date of delivery, provided that the components are
stored in the original packages.
Storage temperature: -25 ... +45°C
Relative humidity: < 75% annual average, < 95% on max. 30 days in a year, dew precipitation and
wetness are inadmissible.
EPCOS KB VS PE
Revision: d/2001
15.10.01
Page 8 of 11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
Taping, Packing
Cardboard Taping
(in accordance with DIN IEC 286-3)
P
0
T
P
D
2
0
E
F
W
B
0
G
T
A
1
0
T
1
P
1
T
2
Direction of unreeling
Dimensions and Tolerances:
Definition
Symbol
Dimension (mm)
Tol. (mm)
Compartment width x Compartments length
Compartment height
Overall thickness
Sprocket hole diameter
Sprocket hole pitch
Distance center hole to center compartment
Pitch of the component compartments
Tape width
Distance edge to center of hole
Distance center hole to center compartment
1) ≤ +0.2 mm over 10 sprocket holes.
A0 x B0
T
T2
D0
P0
P2
P1
W
0.95 x 1.8
0.9
1.1
1.5
4.0
2.0
4.0
8.0
1.75
3.5
± 0.2
max.
max.
± 0.1
± 0.11)
± 0.05
± 0.1
± 0.3
± 0.1
± 0.05
E
F
Part orientation in tape pocket :
equivalent terminations
because of unipolar component
EPCOS KB VS PE
Revision: d/2001
15.10.01
Page 9 of 11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
Reel Packaging
W
2
+0,15
12,75
A
Ø62±1,5
W
1
Package 8-mm Tape
Definition
Symbol Dim.
Tol.
(mm)
-2/+0
Dim.
(mm)
330
Tol.
(mm)
± 2.0
(mm)
180
Reel diameter A
Reel width
(inside)
W1
8.4
+1.5/-0 8.4
+1.5/-0
Reel width
(outside)
W2
14.4
max.
14.4
max.
Packing units
Size
inch / mm
0603/1608
Chip
Cardboard
tape
Units /reel
Ø 180mm
4000 pcs
Units /bulk
case
thickness
0.8 mm
8 mm
15000 pcs
Leader, Trailer
Tape end (trailer)
ꢀ
40 min.
Vacant positions
Leader
25 min.
Vacant positions
300 mm
Top cover tape
EPCOS KB VS PE
Revision: d/2001
15.10.01
Page 10 of 11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
HQM / 0603 / 50V
B37933-K5***-***
Data Sheet
Additional Taping Information
Reel material:
Tape material:
Tape break force:
PS.
Cardboard
min 10 N
Top cover tape strength: min 10 N
Top cover tape peel force: 0.1-0.65 N at a peel speed of 300 mm/min, angle between top cover
tape and the direction of feed during peel off: 165 -180°.
Tape peel angle:
Cavity play:
Angle between top cover tape and the direction of feed during peel
off: 165 -180°
Each part rests in the cavity so that the angle between the part and
cavity centreline is no more than 20°
Weight of component:
Weight of loaded reel:
4.6 mg
max. 1500 g
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto
and the information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed
characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the
Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers'
Association), unless otherwise agreed.
EPCOS KB VS PE
Revision: d/2001
15.10.01
Page 11 of 11
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