B37472J5102M062 [EPCOS]
Multilayer ceramic capacitors Chip capacitors; 多层陶瓷电容贴片电容
| 型号： | B37472J5102M062 |
| 厂家： | 
EPCOS |
| 描述： | Multilayer ceramic capacitors Chip capacitors |
| 文件： | 总13页 (文件大小：113K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer ceramic capacitors
Chip capacitors, X8R
Date:
October 2006
Data Sheet
ꢀꢁ EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the
information contained therein without EPCOS’ prior express consent is prohibited.
Multilayer ceramic capacitors
X8R
Chip
Ordering code system
B37541
K
5
102
K
0
60
Packaging
^
60 cardboard tape, 180-mm reel
^
62 blister tape, 180-mm reel
^
70 cardboard tape, 330-mm reel
^
72 blister tape, 330-mm reel
Internal coding
Capacitance tolerance
^
^
^
J
K
M
M 5%
M 10% (standard)
20%
Capacitance, coded 102 10 · 102 pF = 1 nF
^
103 10 · 103 pF = 10 nF
^
(example)
Rated voltage
Rated voltage [VDC] 50
Code
5
^
^
Termination
Standard:
On request:
K
J
nickel barrier for all case sizes
silver-palladium for conductive adhesion for all case sizes
Type and size
Chip size
(inch / mm)
Temperature characteristic
X8R
0603 / 1608
0805 / 2012
1206 / 3216
1210 / 3225
B37540
B37541
B37472
B37550
Please read Cautions and warnings and
Important notes at the end of this document.
2
10/06
Multilayer ceramic capacitors
X8R
Chip
Features
■ Max. relative capacitance change up to 150 LC is M15%
■ Non-linear capacitance change
■ High insulation resistance
■ High pulse strength
■ To AEC-Q200
Applications
■ Automotive
■ Blocking
■ Coupling
■ Decoupling
■ Interference suppression
Termination
■ For soldering: Nickel barrier terminations (Ni)
Options
■ Alternative capacitance tolerances available on request
Delivery mode
■ Cardboard and blister tape (blister tape for chip thickness O1.2 M0.1 mm and case sizeꢁ1210)
180-mm and 330-mm reel available
Electrical data
Temperature characteristic
Max. relative capacitance change
within –55 LC to +150 LC
Climatic category (IEC 60068-1)
Standard
X8R
ꢂC/C
M15
55/150/56
EIA
%
Dielectric
Rated voltage1)
Class 2
50
VR
VDC
VDC
Test voltage
Vtest
CR
tan ꢃ
Rins
Rins
ꢅ
2.5 · VR/5 s
100 pF … 150 nF (E6)
<25 · 10–3
>105
>104
>1000
>100
–55 … +150
yes
Capacitance range / E series
Dissipation factor (limit value)
Insulation resistance2) at + 25 LC
Insulation resistance2) at +125 LC
Time constant2) at + 25 LC
Time constant2) at +125 LC
Operating temperature range
Ageing3)
Mꢄ
Mꢄ
s
s
LC
ꢅ
Top
1) Note: No operation on AC line.
2) For C >10 nF the time constant ꢀ = C · R is given.
R
ins
3) Refer to chapter “General technical information”, “Ageing”.
Please read Cautions and warnings and
Important notes at the end of this document.
3
10/06
Multilayer ceramic capacitors
X8R
X8R
Capacitance tolerances
Code letter
Tolerance
J
K
M
(standard)
M5%
M10%
M20%
Dimensional drawing
b
k
k
KKE0329-N
Dimensions (mm)
Case size (inch)
(mm)
0603
1608
0805
2012
1206
3216
1210
3225
l
1.6 M0.15
0.8 M0.10
0.8 M0.10
0.1 –0.40
2.00 M0.20
1.25 M0.15
1.30 max.
0.13 –0.75
3.2 M0.20
1.6 M0.15
1.30 max.
0.25 –0.75
3.2 M0.30
2.5 M0.30
1.30 max.
0.25 –0.75
b
s
k
Tolerances to CECC 32101-801
Please read Cautions and warnings and
Important notes at the end of this document.
4
10/06
Multilayer ceramic capacitors
X8R
X8R
Recommended solder pad
D
KKE0308-1
Recommended dimensions (mm) for reflow soldering
Case size
(inch/mm)
Type
A
C
D
0603/1608
0805/2012
1206/3216
1210/3225
single chip
single chip
single chip
single chip
0.6 … 0.7
0.6 … 0.7
0.8 … 0.9
1.0 … 1.2
1.8 … 2.20
2.2 … 2.60
3.8 … 4.32
4.0 … 4.80
0.6 … 0.8
0.8 … 1.1
1.0 … 1.4
1.8 … 2.3
Recommended dimensions (mm) for wave soldering
Case size
(inch/mm)
Type
A
C
D
0603/1608
0805/2012
1206/3216
single chip
single chip
single chip
0.8 … 0.9
0.9 … 1.0
1.0 … 1.1
2.2 … 2.8
2.8 … 3.2
4.2 … 4.8
0.6 … 0.8
0.8 … 1.1
1.0 … 1.4
Termination
Ceramic body
Termination
(nickel barrier)
Inner electrode
AgPd
Substrate electrode
Intermediate electrode
External electrode
Ag
Ni
Sn
KKE0484-W
Please read Cautions and warnings and
Important notes at the end of this document.
5
10/06
Multilayer ceramic capacitors
X8R
X8R
Product range chip capacitors, X8R
1)
Size
inch
0603
0805
1206
1210
mm
1608
2012
3216
3225
Type
B37540
B37541
B37472
B37550
V (VDC)
R
50
50
50
50
C
R
100 pF
150 pF
220 pF
330 pF
470 pF
680 pF
1.0 nF
1.5 nF
2.2 nF
3.3 nF
4.7 nF
6.8 nF
10 nF
15 nF
22 nF
33 nF
47 nF
68 nF
100 nF
150 nF
1) l P b (inch) / l P b (mm)
Please read Cautions and warnings and
Important notes at the end of this document.
6
10/06
Multilayer ceramic capacitors
X8R; 0603 and 0805
X8R
Ordering codes and packing for X8R, 50 VDC, nickel barrier terminations
Chip thickness
Cardboard tape, Cardboard tape,
b 180-mm reel
b 330-mm reel
^
^
** 60
** 70
1)
2)
C
Ordering code
mm
pcs/reel
pcs/reel
R
Case size 0603, 50 VDC
100. pF
150. pF
220. pF
330. pF
470. pF
680. pF
1.0 nF
B37540K5101K0**
B37540K5151K0**
B37540K5221K0**
B37540K5331K0**
B37540K5471K0**
B37540K5681K0**
B37540K5102K0**
B37540K5152K0**
B37540K5222K0**
B37540K5332K0**
B37540K5472K0**
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
1.5 nF
2.2 nF
3.3 nF
4.7 nF
Case size 0805, 50 VDC
470. pF
680. pF
1.0 nF
B37541K5471K0**
0.6 M 0.1
0.6 M 0.1
0.6 M 0.1
0.6 M 0.1
0.6 M 0.1
0.6 M 0.1
0.6 M 0.1
0.6 M 0.1
0.6 M 0.1
0.6 M 0.1
0.6 M 0.1
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
B37541K5681K0**
B37541K5102K0**
B37541K5152K0**
B37541K5222K0**
B37541K5332K0**
B37541K5472K0**
B37541K5682K0**
B37541K5103K0**
B37541K5153K0**
B37541K5223K0**
1.5 nF
2.2 nF
3.3 nF
4.7 nF
6.8 nF
10. nF
15. nF
22. nF
1) Other capacitance values on request.
2) The table contains the ordering codes for the standard capacitance tolerance.
For other available capacitance tolerances see page 4.
Please read Cautions and warnings and
Important notes at the end of this document.
7
10/06
Multilayer ceramic capacitors
X8R; 1206 and 1210
X8R
Ordering codes and packing for X8R, 50 VDC, nickel barrier terminations
Chip thickness
Cardboard tape, Cardboard tape,
b 180-mm reel
b 330-mm reel
^
^
** 60
** 70
1)
2)
C
Ordering code
mm
pcs/reel
pcs/reel
R
Case size 1206, 50 VDC
1.0 nF
1.5 nF
2.2 nF
3.3 nF
4.7 nF
B37472K5102K0**
B37472K5152K0**
B37472K5222K0**
B37472K5332K0**
B37472K5472K0**
B37472K5682K0**
B37472K5103K0**
B37472K5153K0**
B37472K5223K0**
B37472K5333K0**
B37472K5473K0**
B37472K5683K0**
B37472K5104K0**
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
1.2 M 0.1
1.2 M 0.1
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
6.8 nF
10. nF
15. nF
22. nF
33. nF
47. nF
68. nF
100. nF
3)
4)
3000
3000
12000
12000
3)
4)
Blister tape,
Blister tape,
b 180-mm reel
b 330-mm reel
^
^
** 62
** 72
pcs/reel
pcs/reel
Case size 1210, 50 VDC
10. nF
15. nF
22. nF
33. nF
47. nF
68. nF
100. nF
150. nF
B37550K5103K0**
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
0.8 M 0.1
1.2 M 0.1
4000
4000
4000
4000
4000
4000
4000
3000
16000
16000
16000
16000
16000
16000
16000
12000
B37550K5153K0**
B37550K5223K0**
B37550K5333K0**
B37550K5473K0**
B37550K5683K0**
B37550K5104K0**
B37550K5154K0**
1) Other capacitance values on request.
2) The table contains the ordering codes for the standard capacitance tolerance.
For other available capacitance tolerances see page 4.
^
^
3) Blister tape, 180-mm reel, ordering code **
4) Blister tape, 330-mm reel, ordering code **
62
72
Please read Cautions and warnings and
Important notes at the end of this document.
8
10/06
Multilayer ceramic capacitors
X8R
X8R
1)
Typical characteristics
Capacitance change ꢂC/C versus
Capacitance change ꢂC/C versus
25
0
temperature T
superimposed DC voltage V
KKE0489-3
KKE0417-6
5
%
15
%
100 nF/50 V/size 1206
∆C
C25
∆C
0
C0
5
_5
_10
_15
_20
_25
_30
_35
0
_5
_10
_15
_20
_25
_30
_35
_40
_45
_50
_60 _40 _20
0
20 40 60 80 100120 C160
0
5 10 15 20 25 30 35 40 45 50 V
V
˚
T
Impedance |Z| versus
frequency f
Dissipation factor tan ꢃ versus
temperature T
_1
KKE0264-6
104
KKE0265-D
10
Ω
Case size 1206
Z
tan δ
102
101
1 nF
_2
10 nF
100 nF
10
100
_1
10
_2
100
_3
10
10
_60 _40 _20 0 20 40 60 80 100 120 C 160
101
102
MHz 103
f
˚
T
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
9
10/06
Multilayer ceramic capacitors
X8R
X8R
1)
Typical characteristics
Insulation resistance R versus
Capacitance change ꢂC/C versus
ins
1
temperature T
time t
KKE0266-L
KKE0394-X
107
10
%
∆C
C1
M
ins
Ω
R
5
106
105
104
103
102
0
_5
_10
_15
_20
_60
_20
20
60
100
C 160
T
100
101
102
103
104 h 105
t
˚
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
10 10/06
Multilayer ceramic capacitors
Cautions and warnings
Notes on the selection of ceramic capacitors
In the selection of ceramic capacitors, the following criteria must be considered:
1. Depending on the application, ceramic capacitors used to meet high quality requirements should
at least satisfy the specifications to AEC-Q200. They must meet quality requirements going
beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of
critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS
and airbag equipment or durable industrial goods).
2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at
positions with stranding potential, to reduce the probability of short circuits following a fracture,
two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated
series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single
component.
3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the require-
ments to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R
ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these
capacitors should not be used as discrete components (see the chapter “Effects on mechanical,
thermal and electrical stress”, point 1.4).
4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the
chapter “Effects on mechanical, thermal and electrical stress”, point 1.4).
5. An application-specific derating or continuous operating voltage must be considered in order to
cushion (unexpected) additional stresses (see the chapter “Reliability”).
The following should be considered in circuit board design
1. If technically feasible in the application, preference should be given to components having an
optimal geometrical design.
2. At least FR4 circuit board material should be used.
3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed.
4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the
circuit board. High bending forces may be exerted there when the panels are separated and dur-
ing further processing of the board (such as when incorporating it into a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit
board.
6. No screw connections should be used to fix the board or to connect several boards. Compo-
nents should not be placed near screw holes. If screw connections are unavoidable, they must
be cushioned (for instance by rubber pads).
11 10/06
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter “Soldering directions”).
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
12 10/06
Multilayer ceramic capacitors
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As
a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of passive electronic components
or failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of a passive electronic component could endanger human life or health
(e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of
suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third
parties in the event of malfunction or failure of a passive electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as “hazardous”). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap,
PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
13 10/06
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