EN29LV160B-70BP_技术文档

EN29LV160

EN29LV160 ******PRELIMINARY DRAFT******

0.

16 Megabit (2048K x 8-bit / 1024K x 16-bit) Flash Memory

Boot Sector Flash Memory, CMOS 3.0 Volt-only

FEATURES

- Byte program time: 8µs typical

• 3.0V, single power supply operation

- Sector erase time: 500ms typical

- Minimizes system level power requirements

- Chip erase time: 17.5s typical

• High performance

• JEDEC Standard program and erase

- Access times as fast as 70 ns

commands

• Low power consumption (typical values at 5

MHz)

• JEDEC standard

polling and toggle

DATA

bits feature

- 9 mA typical active read current

- 20 mA typical program/erase current

- 1 µA typical standby current (standard access

time to active mode)

• Single Sector and Chip Erase

• Sector Unprotect Mode

• Embedded Erase and Program Algorithms

• Flexible Sector Architecture:

- One 16 Kbyte, two 8 Kbyte, one 32 Kbyte,

and

• Erase Suspend / Resume modes:

Read and program another Sector during

Erase Suspend Mode

thirty-one 64 Kbyte sectors (byte mode)

- One 8 Kword, two 4 Kword, one 16 Kword

and thirty-one 32 Kword sectors (word mode)

- Supports full chip erase

• 0.23 µm triple-metal double-poly

triple-well CMOS Flash Technology

• Low Vcc write inhibit < 2.5V

• >100K program/erase endurance cycle

• Package Options

- Individual sector erase supported

- Sector protection:

Hardware locking of sectors to prevent

program or erase operations within individual

sectors

- 48-pin TSOP (Type 1)

Additionally, temporary Sector Group

Unprotect allows code changes in previously

locked sectors.

- 48 ball 6mm x 8mm FBGA

• Commercial Temperature Range

• High performance program/erase speed

GENERAL DESCRIPTION

The EN29LV160 is a 16-Megabit, electrically erasable, read/write non-volatile flash memory,

organized as 2,097,152 bytes or 1,048,576 words. Any byte can be programmed typically in 8µs.

The EN29LV160 features 3.0V voltage read and write operation, with access times as fast as 70ns

to eliminate the need for WAIT states in high-performance microprocessor systems.

The EN29LV160 has separate Output Enable (

), Chip Enable (

), and Write Enable (WE)

CE

OE

controls, which eliminate bus contention issues. This device is designed to allow either single

Sector or full chip erase operation, where each Sector can be individually protected against

program/erase operations or temporarily unprotected to erase or program. The device can sustain a

minimum of 100K program/erase cycles on each Sector.

This Data Sheet may be revised by subsequent versions

Rev. A, Issue Date: 2004/03/30

1

or modifications due to changes in technical specifications.

EN29LV160

CONNECTION DIAGRAMS

A15

A14

A13

A12

A11

A10

A9

1

48

A16

2

47

BYTE#

3

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

Vss

4

DQ15/A-1

DQ7

DQ14

DQ6

DQ13

DQ5

DQ12

DQ4

Vcc

5

6

7

A8

8

A19

NC

9

Standard

TSOP

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

WE#

RESET#

NC

DQ11

DQ3

DQ10

DQ2

DQ9

DQ1

DQ8

DQ0

OE#

Vss

NC

RY/BY#

A18

A17

A7

A6

A5

A4

A3

A2

CE#

A0

A1

FBGA

Top View, Balls Facing Down

A6

B6

C6

D6

E6

F6

G6

DQ15/A-1

G5

H6

A13

A12

A14

A15

A16

BYTE#

F5

Vss

A5

B5

C5

D5

E5

H5

A9

A8

A10

A11

DQ7

DQ14

F4

DQ13

G4

DQ6

A4

WE#

A3

B4

RESET#

B3

C4

NC

C3

D4

A19

D3

E4

DQ5

E3

H4

DQ4

H3

DQ12

F3

Vcc

G3

RY/BY#

A2

NC

B2

DQ3

H2

A18

C2

NC

DQ2

E2

DQ10

F2

DQ11

G2

D2

A7

A1

A17

B1

A6

C1

A5

D1

DQ0

E1

DQ8

F1

DQ9

G1

DQ1

H1

A3

A4

A2

A1

A0

CE#

OE#

Vss

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

2

Rev. A, Issue Date: 2004/03/30

EN29LV160

TABLE 1. PIN DESCRIPTION

FIGURE 1. LOGIC DIAGRAM

Pin Name

A0-A19

Function

20 Addresses

15 Data Inputs/Outputs

DQ15 (data input/output, word mode),

A-1 (LSB address input, byte mode)

Chip Enable

EN29LV160

DQ0-DQ14

DQ15 / A-1

DQ0 – DQ15

(A-1)

A0 – A19

CE#

OE#

RESET#

RY/BY#

WE#

Output Enable

Hardware Reset Pin

Ready/Busy Output

Reset

CE

Write Enable

Supply Voltage

(2.7-3.6V)

OE

RY/BY

Vcc

WE

Byte

Vss

NC

BYTE#

Ground

Not Connected to anything

Byte/Word Mode

This Data Sheet may be revised by subsequent versions

Rev. A, Issue Date: 2004/03/30

3

or modifications due to changes in technical specifications.

EN29LV160

Table 2. Sector Address Tables (EN29LV160T)

Sector Size

(Kbytes/

Address Range (in hexadecimal)

Word Mode

Kwords)

Sector A19 A18 A17 A16 A15 A14 A13 A12

Byte mode (x8)

(x16)

SA0

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

X

0

X

0

X

0

62/32

64/32

32/16

8/4

000000–00FFFF

00000–07FFF

SA1

010000–01FFFF

020000–02FFFF

030000–03FFFF

040000–04FFFF

050000–05FFFF

060000–06FFFF

070000–07FFFF

080000–08FFFF

090000–09FFFF

0A0000–0AFFFF

0B0000–0BFFFF

0C0000–0CFFFF

0D0000–0DFFFF

0E0000–0EFFFF

0F0000–0FFFFF

100000–10FFFF

110000–11FFFF

120000–12FFFF

130000–13FFFF

140000–14FFFF

150000–15FFFF

160000–16FFFF

170000–17FFFF

180000–18FFFF

190000–19FFFF

1A0000–1AFFFF

1B0000–1BFFFF

1C0000–1CFFFF

1D0000–1DFFFF

1E0000–1EFFFF

1F0000–1F7FFF

1F8000–1F9FFF

1FA000–1FBFFF

1FC000–1FFFFF

08000–0FFFF

10000–17FFF

18000–1FFFF

20000–27FFF

28000–2FFFF

30000–37FFF

38000–3FFFF

40000–47FFF

48000–4FFFF

50000–57FFF

58000–5FFFF

60000–67FFF

68000–6FFFF

70000–77FFF

78000–7FFFF

80000–87FFF

88000–8FFFF

90000–97FFF

98000–9FFFF

A0000–A7FFF

A8000–AFFFF

B0000–B7FFF

B8000–BFFFF

C0000–C7FFF

C8000–CFFFF

D0000–D7FFF

D8000–DFFFF

E0000–E7FFF

E8000–EFFFF

F0000–F7FFF

F8000–FBFFF

FC000–FCFFF

FD000–FDFFF

FE000–FFFFF

SA2

SA3

SA4

SA5

SA6

SA7

SA8

SA9

SA10

SA11

SA12

SA13

SA14

SA15

SA16

SA17

SA18

SA19

SA20

SA21

SA22

SA23

SA24

SA25

SA26

SA27

SA28

SA29

SA30

SA31

SA32

SA33

SA34

1

0

1

8/4

1

X

16/8

This Data Sheet may be revised by subsequent versions

Rev. A, Issue Date: 2004/03/30

4

or modifications due to changes in technical specifications.

EN29LV160

Table 3. Sector Address Tables (EN29LV160B)

Sector Size

(Kbytes/

Address Range (in hexadecimal)

Word Mode

Kwords)

Sector A19 A18 A17 A16 A15 A14 A13 A12

Byte mode (x8)

(x16)

SA0

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

X

16/8

8/4

000000–003FFF

00000–01FFF

SA1

0

1

0

004000–005FFF

006000–007FFF

008000–00FFFF

010000–01FFFF

020000–02FFFF

030000–03FFFF

040000–04FFFF

050000–05FFFF

060000–06FFFF

070000–07FFFF

080000–08FFFF

090000–09FFFF

0A0000–0AFFFF

0B0000–0BFFFF

0C0000–0CFFFF

0D0000–0DFFFF

0E0000–0EFFFF

0F0000–0FFFFF

100000–10FFFF

110000–11FFFF

120000–12FFFF

130000–13FFFF

140000–14FFFF

150000–15FFFF

160000–16FFFF

170000–17FFFF

180000–18FFFF

190000–19FFFF

1A0000–1AFFFF

1B0000–1BFFFF

1C0000–1CFFFF

1D0000–1DFFFF

1E0000–1EFFFF

1F0000–1FFFFF

02000–02FFF

03000–03FFF

04000–07FFF

08000–0FFFF

10000–17FFF

18000–1FFFF

20000–27FFF

28000–2FFFF

30000–37FFF

38000–3FFFF

40000–47FFF

48000–4FFFF

50000–57FFF

SA2

0

1

8/4

SA3

1

X

32/16

SA4

X

64/32

SA5

64/32

SA6

SA7

SA8

SA9

SA10

SA11

SA12

SA13

SA14

SA15

SA16

SA17

SA18

SA19

SA20

SA21

SA22

SA23

SA24

SA25

SA26

SA27

SA28

SA29

SA30

SA31

SA32

SA33

SA34

58000–5FFFF

60000–67FFF

68000–6FFFF

70000–77FFF

78000–7FFFF

80000–87FFF

88000–8FFFF

90000–97FFF

98000–9FFFF

A0000–A7FFF

A8000–AFFFF

B0000–B7FFF

B8000–BFFFF

C0000–C7FFF

C8000–CFFFF

D0000–D7FFF

D8000–DFFFF

E0000–E7FFF

E8000–EFFFF

F0000–F7FFF

F8000–FFFFF

This Data Sheet may be revised by subsequent versions

Rev. A, Issue Date: 2004/03/30

5

or modifications due to changes in technical specifications.

EN29LV160

PRODUCT SELECTOR GUIDE

Product Number

EN29LV160

Regulated Voltage Range: Vcc=3.0 – 3.6 V

Full Voltage Range: Vcc=2.7 – 3.6 V

Speed Option

-70

-90

Max Access Time, ns (t_acc

Max CE# Access, ns (t_ce)

Max OE# Access, ns (t_oe)

)

70

90

70

30

90

35

BLOCK DIAGRAM

RY/BY

Vcc

Vss

DQ0-DQ15 (A-1)

Block Protect Switches

Erase Voltage Generator

Input/Output Buffers

State

Control

WE

Program Voltage

Generator

Command

Register

STB

Chip Enable

Output Enable

Logic

Data Latch

CE

OE

Y-Decoder

Y-Gating

STB

Vcc Detector

A0-A19

Timer

X-Decoder

Cell Matrix

This Data Sheet may be revised by subsequent versions

Rev. A, Issue Date: 2004/03/30

6

or modifications due to changes in technical specifications.

EN29LV160

TABLE 3. OPERATING MODES

16M FLASH USER MODE TABLE

DQ8-DQ15

A0-

Byte#

= V_IH

D_OUT

D_IN

Byte#

Operation

CE#

OE# WE#

Reset#

A19

DQ0-DQ7

= V_IL

High-Z

Read

L

H

A_IN

X

D_OUT

Write

L

H

X

H

X

L

H

D_IN

CMOS Standby

TTL Standby

V_cc± 0.3V

X

H

X

V_cc± 0.3V

High-Z

High-Z High-Z

H

L

X

H

L

X

Output Disable

Hardware Reset

Temporary

X

Sector Unprotect

X

V_ID

A_IN

D_IN

X

Notes:

L=logic low= V_IL, H=Logic High= V_IH, V_ID=11 ± 0.5V, X=Don’t Care (either L or H, but not floating!),

D_IN=Data In, D_OUT=Data Out, A_IN=Address In

TABLE 4. DEVICE IDENTIFICTION (Autoselect Codes)

16M FLASH MANUFACTURER/DEVICE ID TABLE

Description

Mode

A19 A11 A9²A8 A7 A6 A5 A1 A0

DQ8

to

DQ7 to

DQ0

CE

OE WE

to

A12 A10

A2

DQ15

Manufacturer ID:

Eon

Device ID

(top boot

block)

Device ID

(bottom boot

block)

L

H

X

V_ID

H¹

X

L

X

L

X

1CH

Word

Byte

Word

Byte

L

H

22h

X

22h

X

C4H

49H

X

H

X

V_ID

X

L

X

L

01h

X

Sector Protection

Verification

(Protected)

L

H

SA

H

L

00h

(Unprotected)

Note:

1. A8=H is recommended for Manufacturing ID check. If a manufacturing ID is read with A8=L, the chip will output a

configuration code 7Fh

2. A9 = VID is for HV A9 Autoselect mode only. A9 must be ≤ Vcc (CMOS logic level) for Command Autoselect Mode.

This Data Sheet may be revised by subsequent versions

Rev. A, Issue Date: 2004/03/30

7

or modifications due to changes in technical specifications.

EN29LV160

USER MODE DEFINITIONS

Word / Byte Configuration

The signal set on the BYTE# Pin controls whether the device data I/O pins DQ15-DQ0 operate in

the byte or word configuration. When the Byte# Pin is set at logic ‘1’, then the device is in word

configuration, DQ15-DQ0 are active and are controlled by CE# and OE#.

On the other hand, if the Byte# Pin is set at logic ‘0’, then the device is in byte configuration, and

only data I/O pins DQ0-DQ7 are active and controlled by CE# and OE#. The data I/O pins DQ8-

DQ14 are tri-stated, and the DQ15 pin is used as an input for the LSB (A-1) address function.

Standby Mode

The EN29LV160 has a CMOS-compatible standby mode, which reduces the current to < 1µA

(typical). It is placed in CMOS-compatible standby when the

pin is at V_CC± 0.5. RESET# and

CE

BYTE# pin must also be at CMOS input levels. The device also has a TTL-compatible standby mode,

which reduces the maximum V_CCcurrent to < 1mA. It is placed in TTL-compatible standby when the

pin is at V_IH. When in standby modes, the outputs are in a high-impedance state independent of

CE

the

input.

OE

Read Mode

The device is automatically set to reading array data after device power-up. No commands are required to

retrieve data. The device is also ready to read array data after completing an Embedded Program or

Embedded Erase algorithm.

After the device accepts an Erase Suspend command, the device enters the Erase Suspend mode. The

system can read array data using the standard read timings, except that if it reads at an address within

erase-suspended sectors, the device outputs status data. After completing a programming operation in

the Erase Suspend mode, the system may once again read array data with the same exception. See

“Erase Suspend/Erase Resume Commands” for more additional information.

The system must issue the reset command to re-enable the device for reading array data if DQ5 goes

high, or while in the autoselect mode. See the “Reset Command” additional details.

Output Disable Mode

When the

or

pin is at a logic high level (V_IH), the output from the EN29LV160 is disabled.

OE

CE

The output pins are placed in a high impedance state.

Auto Select Identification Mode

The autoselect mode provides manufacturer and device identification, and sector protection

verification, through identifier codes output on DQ15–DQ0. This mode is primarily intended for

programming equipment to automatically match a device to be programmed with its corresponding

programming algorithm. However, the autoselect codes can also be accessed in-system through the

command register.

When using programming equipment, the autoselect mode requires V_ID(10.5 V to 11.5 V) on

address pin A9. Address pins A6, A1, and A0 must be as shown in Autoselect Codes table. In

addition, when verifying sector protection, the sector address must appear on the appropriate

highest order address bits. Refer to the corresponding Sector Address Tables. The Command

Definitions table shows the remaining address bits that are don’t-care. When all necessary bits have

been set as required, the programming equipment may then read the corresponding identifier code

on DQ15–DQ0.

This Data Sheet may be revised by subsequent versions

Rev. A, Issue Date: 2004/03/30

8

or modifications due to changes in technical specifications.

EN29LV160

To access the autoselect codes in-system; the host system can issue the autoselect command via

the command register, as shown in the Command Definitions table. This method does not require

V_ID. See “Command Definitions” for details on using the autoselect mode.

Write Mode

Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two

unlock write cycles, followed by the program set-up command. The program address and data are written

next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further

controls or timings. The device automatically provides internally generated program pulses and verifies

the programmed cell margin. The Command Definitions in Table 5 show the address and data

requirements for the byte program command sequence.

When the Embedded Program algorithm is complete, the device then returns to reading array data and

addresses are no longer latched. The system can determine the status of the program operation by using

DQ7 or DQ6. See “Write Operation Status” for information on these status bits.

Any commands written to the device during the Embedded Program Algorithm are ignored.

Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed

from a “0” back to a “1”. Attempting to do so may halt the operation and set DQ5 to “1”, or cause the

Data# Polling algorithm to indicate the operation was successful. However, a succeeding read will show

that the data is still “0”. Only erase operations can convert a “0” to a “1”.

Sector Protection/Unprotection

The hardware sector protection feature disables both program and erase operations in any sector. The

hardware sector unprotection feature re-enables both program and erase operations in previously

protected sectors.

There are two methods to enabling this hardware protection circuitry. The first one requires only

that the RESET# pin be at V_IDand then standard microprocessor timings can be used to enable or

disable this feature. See Flowchart 7a and 7b for the algorithm and Figure 12 for the timings.

When doing Sector Unprotect, all the other sectors should be protected first.

The second method is meant for programming equipment. This method requires V_IDbe applied to

both OE# and A9 pin and non-standard microprocessor timings are used. This method is described

in a separate document called EN29LV160 Supplement, which can be obtained by contacting a

representative of Eon Silicon Solution, Inc.

Temporary Sector Unprotect

Start

This feature allows temporary unprotection of previously protected

sector groups to change data while in-system. The Sector Unprotect

mode is activated by setting the RESET# pin to V_ID. During this mode,

formerly protected sectors can be programmed or erased by simply

selecting the sector addresses. Once is removed from the RESET#

pin, all the previously protected sectors are protected again. See

accompanying figure and timing diagrams for more details.

Reset#=V_ID(note 1)

Perform Erase or Program

Operations

Reset#=V_IH

Notes:

1. All protected sectors unprotected.

2. Previously protected sectors protected

COMMON FLASH MEMORY

Temporary Sector

again.

Unprotect Completed _{(note 2)}

INTERFACE

(CFI)

The

common

flash

interface

(CFI)

which allows specific vendor-specified

software algorithms to be used for entire

families of devices. Software support can

specification outlines device and host

systems software interrogation handshake,

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

9

Rev. A, Issue Date: 2004/03/30

EN29LV160

then be device-independent, JEDEC ID-

independent, and forward- and backward-

compatible for the specified flash device

families. Flash vendirs can standardize their

existing interfaces for long-term compatibility.

The system can read CFI information at the

addresses given in Tables 5-8. In word mode,

the upper address bits (A7–MSB) must be all

zeros. To terminate reading CFI data, the

system must write the reset command.

This device enters the CFI Query mode when

the system writes the CFI Query command,

98h, to address 55h in word mode (or

address AAh in byte mode), any time the

device is ready to read array data.

The system can also write the CFI query

command when the device is in the

autoselect mode. The device enters the CFI

query mode and the system can read CFI

data at the addresses given in Tables 5–8.

The system must write the reset command to

return the device to the autoselect mode.

Table 5. CFI Query Identification String

Adresses

(Word Mode) (Byte Mode)

Data

Description

10h

11h

12h

13h

14h

15h

16h

17h

18h

19h

1Ah

20h

22h

24h

26h

28h

2Ah

2Ch

2Eh

30h

32h

34h

0051h

0052h Query Unique ASCII string “QRY”

0059h

0002h

Primary OEM Command Set

0000h

0040h

Address for Primary Extended Table

0000h

Alternate OEM Command set (00h = none exists)

0000h

Address for Alternate OEM Extended Table (00h = none exists

0000h

Table 6. System Interface String

Addresses

(Word Mode) (Byte Mode)

Data

Description

1Bh

1Ch

36h

38h

0027h Vcc Min (write/erase)

D7-D4: volt, D3 –D0: 100 millivolt

0036h Vcc Max (write/erase)

D7-D4: volt, D3 –D0: 100 millivolt

1Dh

1Eh

1Fh

20h

3Ah

3Ch

3Eh

40h

0000h Vpp Min. voltage (00h = no Vpp pin present)

0000h Vpp Max. voltage (00h = no Vpp pin present)

0004h

0000h

Typical timeout per single byte/word write 2^N µs

Typical timeout for Min, size buffer write 2^N µs (00h = not

supported)

21h

22h

23h

24h

25h

26h

42h

44h

46h

48h

4Ah

4Ch

000Ah Typical timeout per individual block erase 2^N ms

0000h Typical timeout for full chip erase 2^N ms (00h = not supported)

0005h Max. timeout for byte/word write 2^N times typical

0000h Max. timeout for buffer write 2^N times typical

0004h Max. timeout per individual block erase 2^N times typical

0000h Max timeout for full chip erase 2^N times typical (00h = not

supported)

Table 7. Device Geometry Definition

Addresses

(Word mode)

(Byte Mode)

Data

0015h

Description

27h

4Eh

Device Size = 2^N byte

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

10

Rev. A, Issue Date: 2004/03/30

EN29LV160

28h

29h

2Ah

2Bh

2Ch

2Dh

2Eh

2Fh

30h

31h

32h

33h

34h

35h

36h

37h

38h

39h

3Ah

3Bh

3Ch

50h

52h

54h

56h

58h

5Ah

5Ch

5Eh

60h

62h

64h

66h

68h

6Ah

6Ch

6Eh

70h

72h

74h

76h

78h

0002h

0000h

0004h

0000h

0040h

0000h

0001h

0000h

0020h

0000h

0080h

0000h

001Eh

0000h

0001h

Flash Device Interface description (refer to CFI publication 100)

Max. number of byte in multi-byte write = 2^N

(00h = not supported)

Number of Erase Block Regions within device

Erase Block Region 1 Information

(refer to the CFI specification of CFI publication 100)

Erase Block Region 2 Information

Erase Block Region 3 Information

Erase Block Region 4 Information

Table 8. Primary Vendor-specific Extended Query

Adresses

Addresses

(Word Mode)

(Byte Mode)

80h

Data

Description

Query-unique ASCII string “PRI”

40h

41h

42h

43h

44h

0050h

0052h

0049h

0031h

0030h

82h

84h

86h

Major version number, ASCII

88h

Minor version number, ASCII

Address Sensitive Unlock

45h

46h

47h

48h

8Ah

8Ch

8Eh

90h

0000h

0002h

0001h

0 = Required, 1 = Not Required

Erase Suspend

0 = Not Supported, 1 = To Read Only, 2 = To Read & Write

Sector Protect

0 = Not Supported, X = Number of sectors in per group

Sector Temporary Unprotect

00 = Not Supported, 01 = Supported

Sector Protect/Unprotect scheme

01 = 29F040 mode, 02 = 29F016 mode,

03 = 29F400 mode, 04 = 29LV800A mode

Simultaneous Operation

49h

92h

0004h

4Ah

4Bh

4Ch

94h

96h

98h

0000h

00 = Not Supported, 01 = Supported

Burst Mode Type

00 = Not Supported, 01 = Supported

Page Mode Type

00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

11

Rev. A, Issue Date: 2004/03/30

EN29LV160

Hardware Data protection

The command sequence requirement of unlock cycles for programming or erasing provides data

protection against inadvertent writes as seen in the Command Definitions table. Additionally, the following

hardware data protection measures prevent accidental erasure or programming, which might otherwise be

caused by false system level signals during Vcc power up and power down transitions, or from system

noise.

Low V_CCWrite Inhibit

When Vcc is less than V_LKO, the device does not accept any write cycles. This protects data during Vcc

power up and power down. The command register and all internal program/erase circuits are disabled,

and the device resets. Subsequent writes are ignored until Vcc is greater than V_LKO. The system must

provide the proper signals to the control pins to prevent unintentional writes when Vcc is greater than V_LKO

.

Write Pulse “Glitch” protection

Noise pulses of less than 5 ns (typical) on

,

or

do not initiate a write cycle.

W E

OE CE

Logical Inhibit

Write cycles are inhibited by holding any one of

= VIL,

= VIH, or

= VIH. To initiate a write

W E

OE

CE

cycle,

and

must be a logical zero while

is a logical one. If

,

, and

W E

are all

OE

CE

OE

CE

W E

logical zero (not recommended usage), it will be considered a read.

Power-up Write Inhibit

During power-up, the device automatically resets to READ mode and locks out write cycles. Even

with

W E

= V ,

= V_ILand

= V_IH, the device will not accept commands on the rising edge of

OE

CE

.

WE

IL

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

12

Rev. A, Issue Date: 2004/03/30

EN29LV160

COMMAND DEFINITIONS

The operations of the EN29LV160 are selected by one or more commands written into the

command register to perform Read/Reset Memory, Read ID, Read Sector Protection, Program,

Sector Erase, Chip Erase, Erase Suspend and Erase Resume. Commands are made up of data

sequences written at specific addresses via the command register. The sequences for the

specified operation are defined in the Command Definitions table (Table 5). Incorrect addresses,

incorrect data values or improper sequences will reset the device to Read Mode.

Table 9. EN29LV160 Command Definitions

Bus Cycles

1^st

2^nd

Write Cycle

Data

3^rd

4^th

5^th

6^th

Write Cycle

Data Add Data

Command

Sequence

Write Cycle

Add

RA

xxx

Data Add

Add

Data

Add

Data

Add

Read

Reset

1

RD

F0

000/ 7F/

Word

Byte

555

2AA

55

555

Manufacturer

ID

100

1C

4

AA

90

000/ 7F/

AAA

200

x01

x02

x01

x02

1C

22C4

C4

Device ID

Top Boot

Word

Byte

Word

Byte

555

2AA

55

555

4

AA

90

AAA

555

AAA

Device ID

555

AAA

2AA

555

2AA

555

AAA

2249

49

55

Bottom Boot

(SA) XX00

Word

555

X02

Sector Protect

Verify

XX01

4

AA

55

90

(SA) 00

Byte

AAA

555

AAA

X04

PA

01

Word

Byte

Word

Byte

555

2AA

55

555

Program

Unlock Bypass

4

3

AA

A0

20

PD

AAA

555

AAA

555

2AA

55

AAA

555

AAA

Unlock Bypass Program

Unlock Bypass Reset

2

XXX A0

XXX 90

PA

PD

XXX 00

Word

555

2AA

555

2AA

555

2AA

555

10

Chip Erase

6

AA

55

80

AA

55

Byte

Word

Byte

AAA

555

AAA

555

AAA

555

AAA

555

2AA

Sector Erase

6

AA

55

SA

30

AAA

555

AAA

Erase Suspend

Erase Resume

1

xxx

B0

30

Address and Data values indicated in hex

RA = Read Address: address of the memory location to be read. This is a read cycle.

RD = Read Data: data read from location RA during Read operation. This is a read cycle.

PA = Program Address: address of the memory location to be programmed. X = Don’t-Care

PD = Program Data: data to be programmed at location PA

SA = Sector Address: address of the Sector to be erased or verified. Address bits A19-A12 uniquely select any Sector.

Reading Array Data

The device is automatically set to reading array data after power up. No commands are required to

retrieve data. The device is also ready to read array data after completing an Embedded Program or

Embedded Erase algorithm.

Following an Erase Suspend command, Erase Suspend mode is entered. The system can read array data

using the standard read timings, with the only difference in that if it reads at an address within erase suspended

sectors, the device outputs status data. After completing a programming operation in the Erase Suspend mode,

the system may once again read array data with the same exception.

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

13

Rev. A, Issue Date: 2004/03/30

EN29LV160

The Reset command must be issued to re-enable the device for reading array data if DQ5 goes high, or while in

the autoselect mode. See next section for details on Reset.

Reset Command

Writing the reset command to the device resets the device to reading array data. Address bits are don’t-

care for this command.

The reset command may be written between the sequence cycles in an erase command sequence before

erasing begins. This resets the device to reading array data. Once erasure begins, however, the device

ignores reset commands until the operation is complete. The reset command may be written between the

sequence cycles in a program command sequence before programming begins. This resets the device to

reading array data (also applies to programming in Erase Suspend mode). Once programming begins,

however, the device ignores reset commands until the operation is complete.

The reset command may be written between the sequence cycles in an autoselect command sequence.

Once in the autoselect mode, the reset command must be written to return to reading array data (also

applies to autoselect during Erase Suspend).

If DQ5 goes high during a program or erase operation, writing the reset command returns the device to

reading array data (also applies during Erase Suspend).

Autoselect Command Sequence

The autoselect command sequence allows the host system to access the manufacturer and devices

codes, and determine whether or not a sector is protected. The Command Definitions table shows the

address and data requirements. This is an alternative to the method that requires V_IDon address bit A9

and is intended for PROM programmers.

Two unlock cycles followed by the autoselect command initiate the autoselect command sequence.

Autoselect mode is then entered and the system may read at addresses shown in Table 4 any number of

times, without needing another command sequence.

The system must write the reset command to exit the autoselect mode and return to reading array data.

Word / Byte Programming Command

The device may be programmed by byte or by word, depending on the state of the Byte# Pin.

Programming the EN29LV160 is performed by using a four bus-cycle operation (two unlock write

cycles followed by the Program Setup command and Program Data Write cycle). When the program

command is executed, no additional CPU controls or timings are necessary. An internal timer

terminates the program operation automatically. Address is latched on the falling edge of

or

CE

, whichever is last; data is latched on the rising edge of

or

, whichever is first.

W E

CE

W E

Programming status may be checked by sampling data on DQ7 (

polling) or on DQ6 (toggle

DATA

bit). ). When the program operation is successfully completed, the device returns to read mode and

the user can read the data programmed to the device at that address. Note that data can not be

programmed from a 0 to a 1. Only an erase operation can change a data from 0 to 1. When

programming time limit is exceeded, DQ5 will produce a logical “1” and a Reset command can

return the device to Read mode.

Unlock Bypass

To speed up programming operation, the Unlock Bypass Command may be used. Once this feature

is activated, the shorter two cycle Unlock Bypass Program command can be used instead of the

normal four cycle Program Command to program the device. This mode is exited after issuing the

Unlock Bypass Reset Command. The device powers up with this feature disabled.

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

14

Rev. A, Issue Date: 2004/03/30

EN29LV160

Chip Erase Command

Chip erase is a six-bus-cycle operation. The chip erase command sequence is initiated by writing two

unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the

chip erase command, which in turn invokes the Embedded Erase algorithm. The device does not require

the system to preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and

verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required

to provide any controls or timings during these operations. The Command Definitions table shows the

address and data requirements for the chip erase command sequence.

Any commands written to the chip during the Embedded Chip Erase algorithm are ignored.

The system can determine the status of the erase operation by using DQ7, DQ6, or DQ2. See “Write

Operation Status” for information on these status bits. When the Embedded Erase algorithm is complete,

the device returns to reading array data and addresses are no longer latched.

Flowchart 4 illustrates the algorithm for the erase operation. See the Erase/Program Operations tables in

“AC Characteristics” for parameters, and to the Chip/Sector Erase Operation Timings for timing

waveforms.

Sector Erase Command Sequence

Sector erase is a six bus cycle operation. The sector erase command sequence is initiated by writing two

un-lock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the

address of the sector to be erased, and the sector erase command. The Command Definitions table

shows the address and data requirements for the sector erase command sequence.

Once the sector erase operation has begun, only the Erase Suspend command is valid. All other

commands are ignored.

When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses

are no longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, or

DQ2. Refer to “Write Operation Status” for information on these status bits. Flowchart 4 illustrates the

algorithm for the erase operation. Refer to the Erase/Program Operations tables in the “AC

Characteristics” section for parameters, and to the Sector Erase Operations Timing diagram for timing

waveforms.

Erase Suspend / Resume Command

The Erase Suspend command allows the system to interrupt a sector erase operation and then read data

from, or program data to, any sector not selected for erasure. This command is valid only during the

sector erase operation. The Erase Suspend command is ignored if written during the chip erase operation

or Embedded Program algorithm. Addresses are don’t-cares when writing the Erase Suspend command.

When the Erase Suspend command is written during a sector erase operation, the device requires a

maximum of 20 µs to suspend the erase operation.

After the erase operation has been suspended, the system can read array data from or program data to

any sector not selected for erasure. (The device “erase suspends” all sectors selected for erasure.)

Normal read and write timings and command definitions apply. Reading at any address within erase-

suspended sectors produces status data on DQ7–DQ0. The system can use DQ7, or DQ6 and DQ2

together, to determine if a sector is actively erasing or is erase-suspended. See “Write Operation Status”

for information on these status bits.

After an erase-suspended program operation is complete, the system can once again read array data

within non-suspended sectors. The system can determine the status of the program operation using the

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

15

Rev. A, Issue Date: 2004/03/30

EN29LV160

DQ7 or DQ6 status bits, just as in the standard program operation. See “Write Operation Status” for more

information. The Autoselect command is not supported during Erase Suspend Mode.

The system must write the Erase Resume command (address bits are don’t-care) to exit the erase

suspend mode and continue the sector erase operation. Further writes of the Resume command are

ignored. Another Erase Suspend command can be written after the device has resumed erasing.

WRITE OPERATION STATUS

DQ7

DATA

Polling

The EN29LV160 provides

Polling on DQ7 to indicate to the host system the status of the

DATA

embedded operations. The

Polling feature is active during the Byte Programming, Sector

DATA

Erase, Chip Erase, Erase Suspend. (See Table 6)

When the Byte Programming is in progress, an attempt to read the device will produce the

complement of the data last written to DQ7. Upon the completion of the Byte Programming, an

attempt to read the device will produce the true data last written to DQ7. For the Byte Programming,

polling is valid after the rising edge of the fourth

or

WE

pulse in the four-cycle sequence.

CE

DATA

When the embedded Erase is in progress, an attempt to read the device will produce a “0” at the

DQ7 output. Upon the completion of the embedded Erase, the device will produce the “1” at the DQ7

output during the read. For Chip Erase, the

polling is valid after the rising edge of the sixth

DATA

pulse in the six-cycle sequence. For Sector Erase, polling is valid after the last

DATA

or

W E

CE

rising edge of the sector erase

or

pulse.

CE

W E

Polling must be performed at any address within a sector that is being programmed or

DATA

erased and not a protected sector. Otherwise,

polling may give an inaccurate result if the

DATA

address used is in a protected sector.

Just prior to the completion of the embedded operations, DQ7 may change asynchronously when

the output enable (

) is low. This means that the device is driving status information on DQ7 at

OE

one instant of time and valid data at the next instant of time. Depending on when the system

samples the DQ7 output, it may read the status of valid data. Even if the device has completed the

embedded operations and DQ7 has a valid data, the data output on DQ0-DQ6 may be still invalid.

The valid data on DQ0-DQ7 will be read on the subsequent read attempts.

The flowchart for

Polling (DQ7) is shown on Flowchart 5. The

Polling (DQ7) timing

DATA

diagram is shown in Figure 8.

RY/BY: Ready/Busy

The RY/BY is a dedicated, open-drain output pin that indicates whether an Embedded Algorithm is

in progress or complete. The RY/BY status is valid after the rising edge of the final WE pulse in the

command sequence. Since RY/BY is an open-drain output, several RY/BY pins can be tied together

in parallel with a pull-up resistor to Vcc.

In the output is low, signifying Busy, the device is actively erasing or programming. This includes

programming in the Erase Suspend mode. If the output is high, signifying the Ready, the device is

ready to read array data (including during the Erase Suspend mode), or is in the standby mode.

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

16

Rev. A, Issue Date: 2004/03/30

EN29LV160

DQ6

Toggle Bit I

The EN29LV160 provides a “Toggle Bit” on DQ6 to indicate to the host system the status of the

embedded programming and erase operations. (See Table 6)

During an embedded Program or Erase operation, successive attempts to read data from the device

at any address (by toggling

or

) will result in DQ6 toggling between “zero” and “one”. Once

CE

OE

the embedded Program or Erase operation is complete, DQ6 will stop toggling and valid data will be

read on the next successive attempts. During Byte Programming, the Toggle Bit is valid after the

rising edge of the fourth

pulse in the four-cycle sequence. For Chip Erase, the Toggle Bit is

WE

valid after the rising edge of the sixth-cycle sequence. For Sector Erase, the Toggle Bit is valid after

the last rising edge of the Sector Erase pulse.

W E

In Byte Programming, if the sector being written to is protected, DQ6 will toggles for about 2 µs, then

stop toggling without the data in the sector having changed. In Sector Erase or Chip Erase, if all

selected blocks are protected, DQ6 will toggle for about 100 µs. The chip will then return to the read

mode without changing data in all protected blocks.

Toggling either

or

will cause DQ6 to toggle.

OE

CE

The flowchart for the Toggle Bit (DQ6) is shown in Flowchart 6. The Toggle Bit timing diagram is

shown in Figure 9.

DQ5 Exceeded Timing Limits

DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit.

Under these conditions DQ5 produces a “1.” This is a failure condition that indicates the program or erase

cycle was not successfully completed. Since it is possible that DQ5 can become a 1 when the device has

successfully completed its operation and has returned to read mode, the user must check again to see if

the DQ6 is toggling after detecting a “1” on DQ5.

The DQ5 failure condition may appear if the system tries to program a “1” to a location that is previously

programmed to “0.” Only an erase operation can change a “0” back to a “1.” Under this condition, the

device halts the operation, and when the operation has exceeded the timing limits, DQ5 produces a “1.”

Under both these conditions, the system must issue the reset command to return the device to reading

array data.

DQ3 Sector Erase Timer

After writing a sector erase command sequence, the output on DQ3 can be used to determine whether or

not an erase operation has begun. (The sector erase timer does not apply to the chip erase command.)

When sector erase starts, DQ3 switches from “0” to “1.” This device does not support multiple sector

erase command sequences so it is not very meaningful since it immediately shows as a “1” after the first

30h command. Future devices may support this feature.

DQ2 Erase Toggle Bit II

The “Toggle Bit” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing

(that is, the Embedded Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle

Bit II is valid after the rising edge of the final WE# pulse in the command sequence. DQ2 toggles when the

system reads at addresses within those sectors that have been selected for erasure. (The system may

use either OE# or CE# to control the read cycles.) But DQ2 cannot distinguish whether the sector is

actively erasing or is erase-suspended. DQ6, by comparison, indicates whether the device is actively

erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

17

Rev. A, Issue Date: 2004/03/30

EN29LV160

status bits are required for sector and mode information. Refer to Table 5 to compare outputs for DQ2 and

DQ6.

Flowchart 6 shows the toggle bit algorithm, and the section “DQ2: Toggle Bit” explains the algorithm. See

also the “DQ6: Toggle Bit I” subsection. Refer to the Toggle Bit Timings figure for the toggle bit timing

diagram. The DQ2 vs. DQ6 figure shows the differences between DQ2 and DQ6 in graphical form.

Reading Toggle Bits DQ6/DQ2

Refer to Flowchart 6 for the following discussion. Whenever the system initially begins reading toggle bit

status, it must read DQ7–DQ0 at least twice in a row to determine whether a toggle bit is toggling.

Typically, a system would note and store the value of the toggle bit after the first read. After the second

read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not

toggling, the device has completed the program or erase operation. The system can read array data on

DQ7–DQ0 on the following read cycle.

However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the

system also should note whether the value of DQ5 is high (see the section on DQ5). If it is, the system

should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped

toggling just as DQ5 went high. If the toggle bit is no longer toggling, the device has successfully

completed the program or erase operation. If it is still toggling, the device did not complete the operation

successfully, and the system must write the reset command to return to reading array data.

The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has

not gone high. The system may continue to monitor the toggle bit and DQ5 through successive read

cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to

perform other system tasks. In this case, the system must start at the beginning of the algorithm when it

returns to determine the status of the operation (top of Flowchart 6).

Write Operation Status

RY/BY

Operation

DQ7

DQ6

DQ5

DQ3

DQ2

#

0

1

Embedded Program

Algorithm

Embedded Erase Algorithm

No

DQ7#

Toggle

0

N/A

1

Standar

d Mode

toggle

0

1

Toggle

Reading within Erase

No

N/A

Toggle

Suspended Sector

Toggle

Erase

Suspend

Mode

Reading within Non-Erase

Suspended Sector

Data

0

Data

N/A

Data

N/A

1

0

Erase-Suspend Program

DQ7#

Toggle

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

18

Rev. A, Issue Date: 2004/03/30

EN29LV160

Table 10. Status Register Bits

DQ

Name

Logic Level

Definition

Erase Complete or

erase Sector in Erase suspend

Erase On-Going

‘1’

‘0’

Program Complete or

data of non-erase Sector

during Erase Suspend

DATA

7

POLLING

DQ7

DQ7#

‘-1-0-1-0-1-0-1-’

DQ6

Program On-Going

Erase or Program On-going

Read during Erase Suspend

TOGGLE

BIT

6

Erase Complete

‘-1-1-1-1-1-1-1-‘

‘1’

‘0’

‘1’

‘0’

Program or Erase Error

Program or Erase On-going

Erase operation start

5

3

ERROR BIT

ERASE

TIME BIT

Erase timeout period on-going

Chip Erase, Erase or Erase

suspend on currently

addressed

Sector. (When DQ5=1, Erase

Error due to currently

TOGGLE

BIT

2

‘-1-0-1-0-1-0-1-’

DQ2

addressed Sector. Program

during Erase Suspend on-

going at current address

Erase Suspend read on

non Erase Suspend Sector

Notes:

DQ7

Polling: indicates the P/E status check during Program or Erase, and on completion before checking bits DQ5

DATA

for Program or Erase Success.

DQ6 Toggle Bit: remains at constant level when P/E operations are complete or erase suspend is acknowledged.

Successive reads output complementary data on DQ6 while programming or Erase operation are on-going.

DQ5 Error Bit: set to “1” if failure in programming or erase

DQ3 Sector Erase Command Timeout Bit: Operation has started. Only possible command is Erase suspend (ES).

DQ2 Toggle Bit: indicates the Erase status and allows identification of the erased Sector.

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

19

Rev. A, Issue Date: 2004/03/30

EN29LV160

EMBEDDED ALGORITHMS

Flowchart 1. Embedded Program

START

Write Program

Command Sequence

(shown below)

Data Poll Device

Verify Data?

Last

Increment

Address

No

Address?

Yes

Programming Done

Flowchart 2. Embedded Program Command Sequence

See the Command Definitions section for more information.

555H / AAH

2AAH / 55H

555H / A0H

PROGRAM ADDRESS / PROGRAM DATA

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

20

Rev. A, Issue Date: 2004/03/30

EN29LV160

Flowchart 3. Embedded Erase

START

Write Erase

Command Sequence

Data Poll from

System or Toggle Bit

successfully

completed

Data =FFh?

No

Yes

Erase Done

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

21

Rev. A, Issue Date: 2004/03/30

EN29LV160

Flowchart 4. Embedded Erase Command Sequence

See the Command Definitions section for more information.

Chip Erase

555H/AAH

Sector Erase

555H/AAH

2AAH/55H

555H/80H

2AAH/55H

555H/80H

555H/AAH

2AAH/55H

555H/10H

555H/AAH

2AAH/55H

Sector Address/30H

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

22

Rev. A, Issue Date: 2004/03/30

EN29LV160

Flowchart 5.

DATA

Polling

Algorithm

Start

Read Data

Yes

DQ7 = Data?

No

DQ5 = 1?

Yes

Read Data (1)

Notes:

Yes

(1) This second read is necessary in case the

first read was done at the exact instant when

the status data was in transition.

DQ7 = Data?

No

Fail

Pass

Start

Flowchart 6. Toggle Bit Algorithm

Read Data twice

No

DQ6 = Toggle?

Yes

No

DQ5 = 1?

Yes

Read Data twice (2)

Notes:

No

(1) This second set of reads is necessary in case

the first set of reads was done at the exact

instant when the status data was in transition.

DQ6 = Toggle?

Yes

Fail

Pass

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

23

Rev. A, Issue Date: 2004/03/30

EN29LV160

Flowchart 7a. In-System Sector Protect Flowchart

START

PLSCNT = 1

RESET# = V_ID

Wait 1 µs

No

First Write

Cycle =

60h?

Temporary Sector

Unprotect Mode

Yes

Set up sector

address

Sector Protect: Write 60h

to sector addr with

A6 = 0, A1 = 1, A0 = 0

Wait 150 µs

Verify Sector Protect:

Write 40h to sector

address with

A6 = 0, A1 = 1, A0 = 0

Increment

PLSCNT

Reset

PLSCNT = 1

Wait 0.4 µs

Read from sector

address with

A6 = 0, A1 = 1, A0

No

Data = 01h?

Yes

PLSCNT = 25?

Yes

Device failed

Yes

Protect another

sector?

No

Remove V_ID

from RESET#

Write reset

command

Sector Protect

Algorithm

Sector Protect

complete

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

24

Rev. A, Issue Date: 2004/03/30

EN29LV160

Flowchart 7b. In-System Sector Unprotect Flowchart

START

PLSCNT = 1

Protect all sectors:

The indicated portion

RESET# = V_ID

of the sector protect

algorithm must be

performed for all

Wait 1 µS

unprotected sectors

prior to issuing the

first sector unprotect

No

address (see

Diagram 7a.)

Temporary Sector

Unprotect Mode

First Write

Cycle = 60h?

Yes

No

All sectors

protected?

Yes

Set up first sector

address

Sector Unprotect: Write 60H to

sector address with A6 = 1,

A1 = 1, A0 = 0

Wait 15 ms

Verify Sector Unprotect:

Write 40h to sector address

with A6 = 1, A1 = 1, A0 =0

Increment

PLSCNT

Wait 0.4 µS

Read from sector address with

A6 = 1, A1 = 1, A0 = 0

No

PLSCCNT =

1000?

Set up next sector

Data = 00h?

Yes

address

Yes

Sector

Unprotect

Algorithm

No

Last sector

verified?

Device failed

Yes

Remove V_IDfrom

RESET#

Write reset

command

Sector Unprotect

complete

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

25

Rev. A, Issue Date: 2004/03/30

EN29LV160

Table 11. DC Characteristics

(T_a= 0°C to 70°C or - 40°C to 85°C; V_CC= 2.7-3.6V)

Symbol

Parameter

Test Conditions

0V≤ V ≤ Vcc

Min

Max

Unit

Typ

Input Leakage Current

Output Leakage Current

Supply Current (read) CMOS Byte

(read) CMOS Word

±5

16

µA

I

LI

IN

I

0V≤ V

≤ Vcc

OUT

LO

9

mA

CE# = V ; OE# = V

IL

IH ;

I

CC1

f = 5MHZ

CE# = V

IH

,

BYTE# = RESET# =

Vcc ± 0.3V

Supply Current (Standby - TTL)

(Standby - CMOS)

0.4

1.0

5.0

mA

I

(Note 1)

CC2

CC3

CE# = BYTE# =

RESET# = Vcc ± 0.3V

(Note 1)

1

µA

Byte program, Sector or

20

30

mA

Supply Current (Program or Erase)

Input Low Voltage

Chip Erase in progress

-0.5

0.8

V

IL

0.7 x

Vcc ±

Input High Voltage

V

IH

Vcc

0.3

Output Low Voltage

0.45

V

I

= 4.0 mA

= -2.0 mA

OL

0.85 x

Vcc

Output High Voltage TTL

I

OH

V

OH

Vcc -

Output High Voltage CMOS

V

I

= -100 µA,

0.4V

A9 Voltage (Electronic Signature)

A9 Current (Electronic Signature)

10.5

2.3

11.5

100

V

ID

A9 = V_ID

µA

I

ID

Supply voltage (Erase and

V

LKO

2.5

V

Program lock-out)

Notes

1. BYTE# pin can also be GND ± 0.3V. BYTE# and RESET# pin input buffers are always enabled so that

they draw power if not at full CMOS supply voltages.

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

26

Rev. A, Issue Date: 2004/03/30

EN29LV160

Test Conditions

3.3 V

2.7 kΩ

Device Under Test

C_L

6.2 kΩ

Note: Diodes are IN3064 or equivalent

Test Specifications

Test Conditions

Output Load

-70

-90

1 TTL Gate

100

Unit

Output Load Capacitance, C_L

Input Rise and Fall times

Input Pulse Levels

30

5

0.0-3.0

pF

ns

V

5

0.0-3.0

Input timing measurement

1.5

V

reference levels

Output timing measurement

reference levels

AC CHARACTERISTICS

Hardware Reset (Reset#)

Speed options

Unit

Parameter

Test

Description

Std

Setup

Max

-70

-90

Reset# Pin Low to Read or Write

Embedded Algorithms

t_READY

20

µs

Reset# Pin Low to Read or Write

t_READY

Max

500

nS

Non Embedded Algorithms

t_RP

t_RH

Reset# Pulse Width

Min

500

50

nS

Reset# High Time Before Read

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

27

Rev. A, Issue Date: 2004/03/30

EN29LV160

Reset# Timings

RY/BY#

0 V

CE#

OE#

t_RH

RESET#

t_RP

t_READY

Reset Timings NOT During Automatic Algorithms

RY/BY#

t_READY

CE#

OE#

RESET#

t_RP

t_RH

Reset Timings During Automatic Algorithms

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

28

Rev. A, Issue Date: 2004/03/30

EN29LV160

AC CHARACTERISTICS

Word / Byte Configuration (Byte#)

Speed

Unit

Std

Parameter

t_BCS

t_CBH

t_RBH

Description

-70

0

-90

0

Byte# to CE# switching setup time

CE# to Byte# switching hold time

RY/BY# to Byte# switching hold time

Min

ns

CE

OE

Byte

t_CBH

t_BCS

Byte timings for Read Operations

CE

WE

Byte

t_RBH

t_BCS

RY/BY

Byte timings for Write Operations

Note: Switching BYTE# pin not allowed during embedded operations

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

29

Rev. A, Issue Date: 2004/03/30

EN29LV160

Table 12. AC CHARACTERISTICS

Read-only Operations Characteristics

Parameter

Symbols

Speed Options

Test

Description

Setup

JEDEC

Standard

-70

-90

Unit

Min

70

90

ns

Read Cycle Time

t_AVAV

t_RC

Max

70

90

ns

Address to Output Delay

t_AVQV

t_ACC

CE = V_IL

= V_IL

OE

Max

Min

70

30

20

0

90

35

20

0

ns

Chip Enable To Output Delay

Output Enable to Output Delay

Chip Enable to Output High Z

t_ELQV

t_GLQV

t_EHQZ

t_GHQZ

t_AXQX

t_CE

t_OE

t_DF

t_OH

OE = V_IL

Output Enable to Output High Z

Output Hold Time from

Addresses,

or ,

CE OE

whichever occurs first

Notes:

For - 70

Vcc = 3.0V ± 5%

Output Load : 1 TTL gate and 30pF

Input Rise and Fall Times: 5ns

Input Rise Levels: 0.0 V to 3.0 V

Timing Measurement Reference Level, Input and Output: 1.5 V

For all others:

Vcc = 2.7V – 3.6V

Output Load: 1 TTL gate and 100 pF

Input Rise and Fall Times: 5 ns

Input Pulse Levels: 0.45 V to .8 x Vcc

Timing Measurement Reference Level, Input and Output: 0.8 V and .7 x Vcc

t_RC

Addresses Stable

t_ACC

Addresses

CE#

t_DF

t_OE

OE#

t_OEH

WE#

t_CE

t_OH

HIGH Z

Output Valid

Outputs

Reset#

RY/BY#

0V

Figure 5. AC Waveforms for READ Operations

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

30

Rev. A, Issue Date: 2004/03/30

EN29LV160

Table 13. AC CHARACTERISTICS

Write (Erase/Program) Operations

Parameter

Symbols

Speed Options

Description

JEDEC

Standard

-70

-90

Unit

Min

70

90

ns

t_AVAV

t_WC

Write Cycle Time

0

45

30

0

45

0

ns

t_AVWL

t_WLAX

t_DVWH

t_WHDX

t_AS

t_AH

Address Setup Time

Address Hold Time

Data Setup Time

t_DS

t_DH

t_OES

Data Hold Time

Min

MIn

Min

0

ns

Output Enable Setup Time

Read

Output Enable

Toggle and

t_OEH

Hold Time

10

Polling

DATA

Read Recovery Time before

Min

0

ns

t_GHWL

Write (

High to

Low)

W E

OE

CE

Min

0

ns

t_ELWL

t_WHEH

t_WLWH

t_WHDL

t_CS

t_CH

t_WP

t_WPH

SetupTime

Hold Time

CE

45

20

45

20

Write Pulse Width

Write Pulse Width High

Typ

8

µs

Programming Operation

(Word AND Byte Mode)

t_WHWH1t_WHWH1

Max

Typ

Max

Typ

Max

Min

300

0.5

300

0.5

µs

s

t_WHWH2t_WHWH2

t_WHWH3t_WHWH3

Sector Erase Operation

10

s

17.5

s

Chip Erase Operation

Vcc Setup Time

s

50

µs

t_VCS

Min

500

ns

t_VIDR

Rise Time to V

ID

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

31

Rev. A, Issue Date: 2004/03/30

EN29LV160

Table 14. AC CHARACTERISTICS

Write (Erase/Program) Operations

Alternate CE Controlled Writes

Parameter

Symbols

Speed Options

Description

JEDEC

Standard

-70

-90

Unit

Min

70

90

ns

Write Cycle Time

t_AVAV

t_WC

0

45

30

0

45

0

ns

Address Setup Time

Address Hold Time

Data Setup Time

t_AVEL

t_ELAX

t_DVEH

t_EHDX

t_AS

t_AH

t_DS

t_DH

t_OES

Data Hold Time

0

Output Enable Setup Time

0

ns

Output Enable Read

t_OEH

Hold Time

Toggle and

Data Polling

10

Min

10

Read Recovery Time before

0

ns

t_GHEL

Write (

High to

Low)

CE

OE

Min

0

ns

t_WLEL

t_EHWH

t_ELEH

t_EHEL

t_WS

t_WH

t_CP

SetupTime

Hold Time

W E

Min

Typ

Max

Typ

Max

Typ

Max

Min

35

20

45

20

ns

µs

s

Write Pulse Width

Write Pulse Width High

t_CPH

8

t_WHWH1t_WHWH1

t_WHWH2t_WHWH2

t_WHWH3t_WHWH3

Programming Operation

(Byte AND word mode)

300

0.5

10

300

0.5

10

Sector Erase Operation

Chip Erase Operation

Vcc Setup Time

s

17.5

s

50

µs

ns

t_VCS

t_VIDR

500

Rise Time to V

ID

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

32

Rev. A, Issue Date: 2004/03/30

EN29LV160

Table 15. ERASE AND PROGRAMMING PERFORMANCE

Limits

Max

Parameter

Comments

Typ

Unit

Sector Erase Time

Chip Erase Time

0.5

10

sec

Excludes 00H programming prior

to erasure

17.5

8

sec

µs

Byte Programming Time

Word Programming Time

300

8

µs

Excludes system level overhead

Minimum 100K cycles

Byte

16.8

8.4

50.4

25.2

Chip Programming

Time

sec

Word

Erase/Program Endurance

100K

cycles

Table 16. LATCH UP CHARACTERISTICS

Parameter Description

Min

Max

Input voltage with respect to V_sson all pins except I/O pins

-1.0 V

12.0 V

(including A9, Reset and

)

OE

Input voltage with respect to V_sson all I/O Pins

-1.0 V

Vcc + 1.0 V

100 mA

Vcc Current

-100 mA

Note : These are latch up characteristics and the device should never be put under

these conditions. Refer to Absolute Maximum ratings for the actual operating limits.

Table 17. 48-PIN TSOP PIN CAPACITANCE @ 25°C, 1.0MHz

Parameter Symbol

Parameter Description

Test Setup

= 0

Typ

Max

Unit

C

IN

V

IN

Input Capacitance

6

7.5

pF

C

V

= 0

OUT

Output Capacitance

8.5

7.5

12

9

pF

C

V

= 0

IN2

IN

Control Pin Capacitance

Table 18. DATA RETENTION

Parameter Description

Test Conditions

Min

Unit

150°C

10

Years

Minimum Pattern Data Retention Time

125°C

20

Years

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

33

Rev. A, Issue Date: 2004/03/30

EN29LV160

AC CHARACTERISTICS

Figure 6. AC Waveforms for Chip/Sector Erase Operations Timings

Erase Command Sequence (last 2 cycles)

Read Status Data (last two cycles)

t_WC

t_AS

t_AH

Addresses

CE#

0x2AA

SA

VA

0x555 for chip

erase

t_GHWL

t_CH

OE#

WE#

t_WP

t_CS

t_WPH

t_WHWH2or t_WHWH3

Data

0x55

t_DS

0x30

Status

D_OUT

t_DH

t_BUSY

t_RB

RY/BY#

V_CC

t_VCS

Notes:

1. SA=Sector Address (for sector erase), VA=Valid Address for reading status, D_out=true data at read address.

2. V_ccshown only to illustrate t_vcsmeasurement references. It cannot occur as shown during a valid command

sequence.

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

34

Rev. A, Issue Date: 2004/03/30

EN29LV160

Figure 7. Program Operation Timings

Program Command Sequence (last 2 cycles)

t_WC

t_AS

t_AH

Addresses

CE#

0x555

PA

t_GHWL

t_WP

OE#

WE#

t_CH

t_WPH

t_CS

t_WHWH1

Data

OxA0

PD

Status

D_OUT

t_RB

t_DS

t_BUSY

t_DH

RY/BY#

V_CC

t_VCS

Notes:

1. PA=Program Address, PD=Program Data, D_OUTis the true data at the program address.

2. V_CCshown in order to illustrate t_VCSmeasurement references. It cannot occur as shown during a valid

command sequence.

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

35

Rev. A, Issue Date: 2004/03/30

EN29LV160

Figure 8. AC Waveforms for /DATA Polling During Embedded Algorithm

Operations

t_RC

VA

Addresses

VA

t_ACC

VA

t_CH

t_CE

CE#

t_OE

OE#

WE#

t_OEH

t_DF

t_OH

Comple-

ment

True

Complement

Status Data

Valid Data

DQ[7]

Status

Data

True

DQ[6:0]

t_BUSY

RY/BY#

Notes:

1. VA=Valid Address for reading Data# Polling status data

2. This diagram shows the first status cycle after the command sequence, the last status read cycle and the array data read cycle.

Figure 9. AC Waveforms for Toggle Bit During Embedded Algorithm

Operations

t_RC

Addresses

CE#

VA

t_ACC

t_CE

t_CH

t_OE

OE#

WE#

t_OEH

t_DF

t_OH

Valid Status

Valid Data

Valid Status

(first read)

Valid Status

DQ6, DQ2

RY/BY#

t_BUSY

(second

d)

(stops toggling)

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

36

Rev. A, Issue Date: 2004/03/30

EN29LV160

Figure 10. Alternate CE# Controlled Write Operation Timings

PA for Program

0x555 for Program

0x2AA for Erase

SA for Sector Erase

0x555 for Chip Erase

Addresses

VA

t_WC

t_AS

t_AH

WE#

OE#

CE#

Data

t_WH

t_GHEL

t_CP

t_CPH

t_CWHWH1/ t_CWHWH2/ t_CWHWH3

t_WS

t_BUSY

t_DS

t_DH

Status

D_OUT

PD for Program

0xA0 for

Program

0x30 for Sector Erase

0x10 for Chip Erase

RY/BY#

Reset#

t_RH

Notes:

PA = address of the memory location to be programmed.

PD = data to be programmed at byte address.

VA = Valid Address for reading program or erase status

D_out= array data read at VA

Shown above are the last two cycles of the program or erase command sequence and the last status read cycle

Reset# shown to illustrate t_RHmeasurement references. It cannot occur as shown during a valid command

sequence.

Figure 11. DQ2 vs. DQ6

Enter

Enter Erase

Erase

Embedded

Erase

Suspend

Program

Suspend

Resume

WE#

Erase

Enter

Suspend

Read

Enter

Erase

Suspend

Program

Suspend

Read

Complete

DQ6

DQ2

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

37

Rev. A, Issue Date: 2004/03/30

EN29LV160

Temporary Sector Unprotect

Speed Option

-70 -90

Unit

Parameter

Description

Std

t_VIDR

V_IDRise and Fall Time

Min

500

Ns

µs

RESET# Setup Time for Temporary

t_RSP

4

Sector Unprotect

Figure 12. Temporary Sector Unprotect Timing Diagram

V_ID

RESET#

0 or 3 V

t_VIDR

CE#

WE#

t_RSP

RY/BY#

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

38

Rev. A, Issue Date: 2004/03/30

EN29LV160

Figure 13. Sector Protect/Unprotect Timing Diagram

V_ID

Vcc

RESET#

0V

t_VIDR

SA,

Valid

A6,A1,A0

Data

60h

40h

Status

Sector Protect/Unprotect

Verify

CE#

>0.4µS

WE#

>1µS

Sector Protect: 150 uS

Sector Unprotect: 15 mS

OE#

Notes:

Use standard microprocessor timings for this device for read and write cycles.

For Sector Protect, use A6=0, A1=1, A0=0. For Sector Unprotect, use A6=1, A1=1, A0=0.

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

39

Rev. A, Issue Date: 2004/03/30

EN29LV160

FIGURE 14. TSOP 12mm x 20mm

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

40

Rev. A, Issue Date: 2004/03/30

EN29LV160

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

41

Rev. A, Issue Date: 2004/03/30

EN29LV160

FIGURE 15. 48TFBGA package outline

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

42

Rev. A, Issue Date: 2004/03/30

EN29LV160

ABSOLUTE MAXIMUM RATINGS

Parameter

Value

Unit

Storage Temperature

-65 to +125

°C

Plastic Packages

-65 to +125

°C

Ambient Temperature

With Power Applied

-55 to +125

°C

Output Short Circuit Current¹

200

MA

V

A9, OE#, Reset# ²

-0.5 to +11.5

Voltage with

All other pins ³

Vcc

-0.5 to Vcc+0.5

-0.5 to +4.0

V

Respect to Ground

Notes:

1.

2.

No more than one output shorted at a time. Duration of the short circuit should not be greater than one second.

Minimum DC input voltage on A9, OE#, RESET# pins is –0.5V. During voltage transitions, A9, OE#, RESET# pins may

undershoot V_ssto –1.0V for periods of up to 50ns and to –2.0V for periods of up to 20ns. See figure below. Maximum DC

input voltage on A9, OE#, and RESET# is 11.5V which may overshoot to 12.5V for periods up to 20ns.

Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, inputs may undershoot V_ssto –1.0V for

periods of up to 50ns and to –2.0 V for periods of up to 20ns. See figure below. Maximum DC voltage on output and I/O

pins is V_cc+ 0.5 V. During voltage transitions, outputs may overshoot to V_cc+ 1.5 V for periods up to 20ns. See figure

below.

3.

4.

Stresses above the values so mentioned above may cause permanent damage to the device. These values are for a stress

rating only and do not imply that the device should be operated at conditions up to or above these values. Exposure of the

device to the maximum rating values for extended periods of time may adversely affect the device reliability.

RECOMMENDED OPERATING RANGES¹

Parameter

Value

Unit

Ambient Operating Temperature

Commercial Devices

0 to 70

°C

Industrial Devices

-40 to 85

Regulated Voltage

Range: 3.0-3.6V

Operating Supply Voltage

Vcc

V

Full Voltage Range: 2.7 to

3.6V

1.

Recommended Operating Ranges define those limits between which the functionality of the device is guaranteed.

Vcc

+1.5V

Maximum Negative Overshoot

Waveform

Maximum Positive Overshoot

Waveform

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

43

Rev. A, Issue Date: 2004/03/30

EN29LV160

ORDERING INFORMATION

EN29LV160

T -

70

T

C

P

PACKAGING CONTENT

(Blank) = Conventional

P = Pb Free

TEMPERATURE RANGE

(Blank) = Commercial (0°C to +70°C)

I = Industrial (-40°C to +85°C)

PACKAGE

T = 48-pin TSOP

B = 48-Ball Fine Pitch Ball Grid Array (FBGA)

0.80mm pitch, 6mm x 8mm package

SPEED

70 = 70ns

90 = 90ns

BOOT CODE SECTOR ARCHITECTURE

T = Top boot Sector

B = Bottom boot Sector

BASE PART NUMBER

EN = EON Silicon Solution Inc.

29LV = FLASH, 3V Read Program Erase

160 = 16 Megabit (2M x 8 / 1M x 16)

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

44

Rev. A, Issue Date: 2004/03/30

EN29LV160

Revisions List

Revision No

Description

Date

A

Preliminary draft

3/30/2004

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

45

Rev. A, Issue Date: 2004/03/30


型号：	EN29LV160B-70BP
厂家：	EON SILICON SOLUTION INC.
描述：	16 Megabit (2048K x 8-bit / 1024K x 16-bit) Flash Memory Boot Sector Flash Memory, CMOS 3.0 Volt-only 16兆位（ 2048K ×8位/ 1024K ×16位）闪存引导扇区快闪记忆体， CMOS 3.0伏只闪存
文件：	总45页 (文件大小：420K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

EN29LV160B-70BP [EON]

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