EM4022V14WS11_技术文档

EM MICROELECTRONIC - MARIN SA

EM4022

Multi Frequency Contactless Identification Device

Anti-Collision compatible with BTG's Supertag Category Protocols

Description

Features

The EM4022 (previously named P4022) chip implements

patented anti-collision protocols for both high frequency

and low frequency applications. It is even possible to

identify transponders with identical codes, thereby

making it possible to count identical items. The chip is

typically used in “passive” transponder applications, i.e. it

does not require a battery power source. Instead, it is

powered up by an electromagnetic energy field or beam

transmitted by the reader, which is received and rectified

to generate a supply voltage for the chip. A pre-

programmed code is transmitted to the reader by varying

the amount of energy that is reflected back to the reader.

This is done by modulating an antenna or coil, thereby

effectively varying the load seen by the reader.

ꢀ

Implements all BTG anti-collision protocols:

Fast SWITCH-OFF, SLOW-DOWN, and

FREE-RUNNING

Can be used to implement low frequency

inductive coupled transponders, high frequency

RF coupled transponders or bi-frequency

transponders

ꢀ

Reading 500 transponders in less than one

second for high frequency applications

Factory programmed 64 bit ID number

Data rate options form 4 kbit/s to 64 kbit/s

Manchester data encoding

ꢀ

Any field frequency: Typically 125 kHz, 13.56

MHz inductive and 100 MHz to 2.54 GHz RF

Data transmission done by amplitude

modulation

ꢀ

Typical Applications

ꢀ

Access control

Animal tagging

Asset control

Sports event timing

Licensing

Trimmed 110 pF ± 3% on-chip resonant

capacitor

ꢀ

On-chip oscillator, rectifier and voltage limiter

Low power consumption

Low voltage operation : down to 1.5 V at

ambient temperature

Electronic keys

Auto-tolling

ꢀ

-40 to +85 ^°C operating temperature range

Pin Assignment

Pad N°

Name

XCLK

V_DD

Function

1

2

external test clock input

positive supply

3

M

connection to antenna

test output

4

M_TST

COIL1

COIL2

V_SSTST

V_SS

11

10

9

5

Coil terminal 1

EM4022

6

Coil terminal 2

1

2

3

7

negative test supply output

negative supply

8

9

GAP

SI

GAP input

10

11

Serial test data input (pull down)

Test mode control (pull down)

4

5

6

7

8

TMC

Fig. 1

1

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EM4022

Typical Operating Configurations

Medium frequency applications are those which cannot

use the integrated full wave rectifier and where the

transponder power is transmitted through a coil. External

microwave schottky diodes are required to rectify the

carrier wave. An external power storage capacitor can be

added to improve reading range.

Low frequency inductive transponder .

V_DD

M

These applications allow higher data rates (64 kbit/s).

Where reading rates of 500 transponders per second

can be achieved

CPX

Coil1

L

EM4022

High frequency RF transponder implementation.

Coil2

GAP

V_SS

V_DD

M

Coil1

CPX

D1

D3

Fig. 2

EM4022

Low frequency applications are those applications that

can make use of the on-chip full wave rectifier bridge to

rectify the incident energy. These are typically

applications that use inductive coupling to transmit

energy to the chip. The carrier frequency is typically less

than 500 kHz. The design of the on-chip rectifier and

resonance capacitor is optimized for frequencies in the

order of 125 kHz. Low frequency transponders can be

implemented using just a EM4022 chip and an external

coil that resonates with the on-chip tuning capacitor at

the required carrier frequency. An external power

storage capacitor is required to maintain the supply

voltage above the integrated power on reset level.

In a very strong field, due to the forward resistance of the

diode, the GAP input must be limited at V_SS-0.3V by a

schottky diode (D1)

D2*

D1

Coil2

GAP

V_SS

Fig. 4

D2 in figure 2 and 3 is optional and is only used for GAP

enable versions. All diodes are schottky type.

High frequency applications are similar to medium

frequency applications. These are typically applications

that use electromagnetic RF coupling to transmit energy

to the chip using carrier frequencies greater than

100 MHz. High frequency transponders can be

implemented using a EM4022 chip, two or three

microwave diodes and a printed antenna. High frequency

RF coupled applications typically have higher reading

distances (> 4 m) and

Medium frequency (13.56 MHz) inductive transponder

implementation

V_DD

M

Bi-frequency applications are possible by implementing

a coil between coil1 and coil2 connections in the high

frequency application (fig. 4).

CPX

EM4022

C

L

D2*

GAP

V_SS

D1

Fig. 3

L:

coil antenna (typical value 1.35 µH).

tuning capacitor (typical value 100 pF)

C:

2

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Copyright  2002, EM Microelectronic-Marin SA

EM4022

This device has built-in protection against high static

voltages or electric fields; however, due to the unique

properties of this device, anti-static precautions should

be taken as for any other CMOS component. Unless

otherwise specified, proper operation can only occur

when all the terminal voltages are kept within the supply

voltage range.

Absolute Maximum Ratings

Handling Procedures

Parameter

Symbol

Conditions

Maximum AC peak current

induced on COIL1 and

COIL2

± 30 mA

I _COIL

Maximum DC voltage

induced between M and V_SS

Maximum DC current

supplied into M

5 V

V_M

(note1)

I_M

60 mA

(note1)

Operating Conditions

Power supply

V

T

- V_SS-0.3 to V_M

V_DD+ 0.3 V

DD

Parameter

Symbol Min Typ Max Units

Max. voltage other pads

Min. voltage other pads

Storage temperature

max

STORE

V

Operating temperature

Maximum coil current

AC voltage on coil*

DC voltage on M*

-40

-10

+85 ^oC

T_A

V_SS- 0.3 V

-55 to +125^oC

10

15

mA

I_COIL

V_COIL

V_M

V_pp

Electrostatic discharge

maximum to MIL-STD-883C

method 3015

1000 V

ESD

3.5

V

note1) whatever is reached first

* The AC voltage on the coil and the DC voltage at pad

M are limited by the on-chip shunt regulator loaded at

I_COILin table 3

Stresses above these listed maximum ratings may cause

permanent damage to the device. Exposure beyond

specified operating conditions may affect device

reliability or cause malfunction.

Electrical Characteristics

V

_SUPPLYbetween 2.0 V and 3.0 V, T_A= 25 ^OC, unless otherwise specified.

Parameter

Symbol Test conditions

Min

Typ Max Units

V_PONR+100mV

V_M

V

Supply voltage (V_DD- V_SS

)

V_SUPPLY

Regulated voltage

V_M

I_M= 50 mA

3.3

92

0.9

0.7

80

4

4.7

Oscillator frequency

125 160 kHz

F_OSC

V_PONR

V_PONF

V_PHYS

T_GAP

V_SUPPLY= 3 V

V_SUPPLYrising

V_SUPPLYfalling

Power-on reset threshold

1.4

1.2

160 240

0.4

1.8

1.6

V

Power-on reset hysteresis

GAP input time constant

mV

µs

Extrapolated with an external

capacitor of 64nF

Modulation transistor ON resistance

4

8

R_ON

C_R

V_SUPPLY= 3 V

Ω

Resonance capacitor

f = 100KHz, 100mVpp

V_SUPPLY= 2 V

106.7

6

110 113.3 pF

Supply capacitor

C_SUP

I_MOD

I_SHUNT

I_GAP

I_DYN

140

9

pF

µA

nA

µA

Current consumption in modulation state

Shunt Regulator current consumption

Gap pull-up current consumption

Dynamic current consumption

13

200 500

V_SUPPLY= 2V

1.8

3.5

5

7

6.5

V_GAP= 0V, V_SUPPLY= 2V

f_OSC= 128KHz, V_SUPPLY= 2V

Timing Characteristics

1) All timings are derived from the on-chip oscillator.

2) The minimum low frequency GAP width for a single chip is 1 bit at its own clock frequency. The reader must however

allow for the spread in clock frequencies possible in a group of tags. Therefore the minimum width of the GAP in MUTE

and WAKE-UP signals must be 1.5 bits. High frequency GAPs can be arbitrarily.

3) The maximum GAP width for a single chip is 6 bits at its own clock frequency. The reader must however allow for the

spread in clock frequencies possible in a group of tags. Therefore the maximum width of the GAP in MUTE and WAKE-UP

signals must be 5 bits.

Parameter

Symbol Test conditions

T_HFGAP

Min Typ Max Units

High frequency GAP width

50

ns

bit

High frequency ACK GAP width

High frequency MUTE and WAKE-UP GAP width

Low frequency ACK GAP width

Low frequency MUTE and WAKE-UP GAP width

GAP separation in WAKE-UP signal

6

5

6

5

W_HFACK

W_HFMUTE

1.0

1.5

2

W_LFGAP

W_LFACK

W_LFMUTE

3

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Copyright  2002, EM Microelectronic-Marin SA

EM4022

Calculation example :

Power storage capacitor calculation

Below we define typical cases combinations :

The global current consumption of the device defines the

external storage capacitor.

F_OSC= 125 KHz

V_PHYS= 120 mV

When the device modulate, the supply voltage is picked

from the supply capacitor and should never decrease

under the falling edge of the power on reset (V_PONF). If

this occurs, the device goes in a reset mode and any

data transmission is aborted. The worst case for the

storage capacitor calculation is when the device is put in

the electromagnetic field. At this moment the supply

reaches the V_PONRand start to modulate. During

modulation the power store in the capacitor must be high

enough so that at the end of the modulation the supply is

higher than V_PORF.. This means that the voltage reduction

on the capacitor must be less than the hysteresis of the

power on reset (V_PHYS).

I

_MOD= 9 µA

Data rate is 4 KBaud.

I

_MOD*128*10³

CPx =

F

_OSC*V_HYS* BaudRate

9*10⁻⁶*128*10³

=

= 14.4nF

125*10³*160*10⁻³*4*10³

Of course, this value can be adapted to the

electromagnetic power and to the performances that

must be achieved. If a tag is put in a field within a short

time, the emitting power must be high enough to charge

up the capacitor.

And this when the chip has a supply voltage of around

the power on reset threshold

The total current consumption from the storage capacitor

The chip integrates a 140pF supply capacitor.

is defined by the modulation current I_MOD

,

This current is the consumption of the power on reset

block, oscillator and the logic which work at a typical

frequency of 125KHz. The GAP current is also included

in this parameter.

The duration where this currents is present for the

capacitor calculation, is dependent of the data rate

Block Diagram

M

VDD

P

N

R

C

PON

COIL1

D2

Q1

Q2

LOGIC

CP

D4

D3

Shunt

CR

GAP TST

VSS

OSC

COIL2

VSS

D1

VDD

DG

CG

RG

GAP

VSS VSS VSS

SI XCLK TMC

Fig. 5

4

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EM4022

Gap detection

Functional description

Poly-silicon diode DG is used to detect a gap in the

illuminating field. It is a minimum sized diode with

forward resistance in the order of 2 kΩ.==The low pass

filter shown diagrammatically as CG and RG actually

consists of a pull-up transistor (approximately 100 kΩ) in

conjunction with the parasitic capacitance of the GAP

input pad (approximately 2.5 pF).

Resonance capacitor

The resonance capacitor CR has a nominal value of 110

pF and is trimmed to achieving a high stability over the

whole production. For resonance at 125 kHz an external

14.7 mH coil is required. At 13.65 MHz the required coil

inductance drops to 1.2 µH.

Through the diode the GAP input will be pulled low

during each negative going cycle of the carrier. When

the carrier is switched off, the GAP input will be pulled

high by the pull-up transistor.

Rectifier bridge

Diodes D1-D4 form a full wave rectifier bridge. They

have relatively large forward resistances (100 -200 Ω).

This is sufficient at 125 kHz, where the output

impedance of the tuned circuit is high, but at 13.5 MHz

the diode resistance becomes significant and external

diodes have to be used to bypass the internal ones. The

diode resistance affects the rate at which the power

capacitor CP can be charged. It also affects the

modulation depth that can be achieved.

At very high carrier frequencies (> 100 MHz) the carrier

will be filtered out, so that the GAP input will be low

continuously when the carrier is present. When the

carrier disappears, the GAP input will go high with the

time constant of the low pass filter. At very low

frequencies the GAP input will go high and low at each

cycle of the carrier, and will stay high when the carrier

disappears. To detect the gap, the logic must check for

a high period longer than the maximum high period of

the carrier.

Shunt regulator

The shunt regulator has two functions. It limits the

voltage across the logic and in high frequency

applications it limits the voltage across the external

microwave Schottky diodes, which typically have reverse

breakdown voltages of 5 V.

As the rise and fall times of the GAP can be slow, a

Schmitt trigger is used to buffer the GAP input.

LOGIC block

Depending on the state of the SI input at power-up, the

EM4022 either enters a test mode (SI = 1) or its normal

operating mode (SI = 0). The SI pin is internally pulled

down, so that it can be left open for normal operation.

Oscillator

The on-chip RC oscillator has a center frequency of 128

kHz. It gives the main clock of the logic and defines the

effective data/rate.

After the power-on reset has disappeared, the chip boots

by reading the SEED and CTL ROMs.

Power-on reset (PON)

The reset signal keeps the logic in reset when the supply

The chip then enters its normal operating mode, which

basically consists of clocking a 16 bit timer counter with

the bit rate clock until it compares with the number in the

random number generator. At this point a code (which is

stored in the ID ROM) is transmitted with the correct

preamble at the correct data rate and encoded correctly.

The random number generator is clocked to generate a

new pseudo random number, and the 16 bit counter is

reset to start a new delay.

voltage is lower than the threshold voltage.

This

prevents incorrect operation and spurious transmissions

when the supply voltage is too low for the oscillator and

logic to work properly. It also ensures that transistor Q2

is off and transistor Q1 is on during power-up to ensure

that the chip starts up.

Modulation transistor

The N channel transistor Q2 is used to modulate the

transponder coil or antenna. When it is turned on it loads

the antenna or coil, thereby changing the load seen by

the reader antenna or coil, and effectively changing the

amount of energy that is reflected to the reader. Its low

on resistance is especially designed for high frequency

applications.

The width of the comparison between the 16 bit random

number and the 16 bit delay count determines the

maximum possible delay between transmissions

(repetition rate). Any one of eight maximum delay

settings can be pre-programmed.

The basic free-running mode as described above can be

modified by the reception of GAP (MUTE and ACK)

signals, if these are enabled by the CTL bits.

Charge preservation transistor

If an ACK signal is received after transmission of a code,

the chip either turns itself off completely or reduces the

rate at which the delay counter is clocked, thereby

slowing down the rate at which codes are transmitted.

If a MUTE signal is received while the chip is not

transmitting, the current operation of the chip is

interrupted for 128 clock periods, after which it continues

normally. Reception of more MUTEs during the sleep

state restarts the sleep state. The sleep state is also

terminated by the reception of a WAKE-UP signal (an

The P channel transistor Q1 is turned off whenever the

modulation transistor Q2 is turned on to prevent Q2 from

discharging the power storage capacitor. This is done in

a non-overlapping manner, i.e. Q1 is first turned off

before Q2 is turned on, and Q2 is turned off before Q1 is

turned on.

ACK signal to

transmitting).

a chip which has just completed

5

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EM4022

ACK timing diagram

ACK timing

Bit n

Clock

Data

HF ACK

LF ACK

T

1

Fig. 6

GAP Detection Algorithm

MUTE

The GAP detection logic contains two main controllers,

one for detecting the ACK signal, and one for detecting

the MUTE and WAKE-UP signals. The WAKE-UP signal

is also called an asynchronous ACK, as it is really an

ACK meant for another chip. It also contains a pre-

processor for low frequency GAP signals.

The MUTE signal is received asynchronously by the

transponder. The controller checks for a HIGH less than

7 bits wide after pre-processing (T₂in the timing

diagram). As in the case of the ACK, low frequency

MUTE GAPs must be at least one bit wide (T1 in the

timing diagram), but high frequency GAPs can be

arbitrarily narrow.

Refer to the timing diagrams in Figure 6 and 7 for the

following detailed description of the GAP detection

algorithms.

When transmitting a MUTE, the reader must take into

account that there could be a spread in the clock

frequencies of all the receiving transponders.

The reader should therefor limit the width of a MUTE to

be less than 5 bits of the nominal bit rate (T₄in the timing

diagram). A low frequency MUTE should also be wider

than 1.5 bits of the nominal bit rate (T₃in the timing

diagram).

ACK

The controller checks for a LOW 1.75 bit periods after

the last bit of code has been transmitted. It then checks

for a HIGH 3 bits later, a LOW 3 bits later and finally a

HIGH a further 3 bits later.

The MUTE should be sent as early as possible after a

code transmission has been detected, while still making

sure that it is a code transmission and not just noise. The

earlier the MUTE is sent, the more time the reader has to

recover before the SYNCH and code bits arrive, and the

smaller the probability that another transponder has

started a colliding transmission

The reader should synchronise itself to the frequency of

the received code, check the CRC and then send two

GAPs so that the above pattern is matched. Ideally to

achieve the lowest error rate, the GAPS should be as

narrow as possible and situated 4.75 and 7.75 bits after

the last bit of code.

In practice allowance must be made for the fact that the

on-chip oscillator can drift in the time between when the

last code bit is transmitted and when the GAPs are

expected. One reason for the drift is that the oscillator is

supply voltage dependent, and the supply voltage will

typically be rising during this time, since the transponder

will not be modulating its coil or antenna.

The slope of the rising and falling edges of the GAPs can

also be adjusted to reduce reader power bandwidth. In

the case of high frequency GAPs the envelope is used

directly. Low frequency GAPs have to be pre-processed.

They are detected by checking for high periods lasting

longer than one bit period. For this reason there is a set-

up time of 1 bit. The minimum GAP width is therefore 1

bit period (T₁in the timing diagram).

6

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EM4022

MUTE and WAKE-UP timing diagrams

Fig. 7

WAKE-UP

This has an implication in the case of the high frequency

ACK, which could theoretically consist of two very narrow

GAPs 6 bits apart. In practice though, the GAPs will be

typically at least one bit wide, making the separation five

bits.

An ACK sent after correct reception of a code is

interpreted by the other transponders in the field as a

WAKE-UP. The ACK arrives synchronously at the

transponder

that

has

just

transmitted,

but

asynchronously at all the other transponders. If

necessary, a WAKE-UP can also be sent if the code is

not received correctly, ensuring that it will not be

interpreted as an ACK by the transmitting transponder.

This could speed up the protocol, but runs the risk of

turning transponders off by accident.

Like the MUTE, the low frequency ACK GAPs should be

at least 1.5 bits wide to serve as a reliable WAKE-UP.

It should be noted that failure to reliably recognise

WAKE-UPs is not critical. The protocol might be slowed

down marginally, but will still work, as the chips time-out

of the sleep mode automatically after 128 bits.

To detect a WAKE-UP, the chip checks for two GAPs,

less than 7 bits apart and each less than seven bits

wide. As with the MUTE allowance must made for the

spread in clock frequencies. To be safely interpreted as

a WAKE-UP, the GAPs should be sent less than 5 bits

apart, and each should be less than 5 bits wide.

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EM4022

The second encoding method is called GLITCH

encoding. A ONE is represented by a HIGH in the first

quarter of the bit period, while a ZERO is represented by

a HIGH in the third quarter of the bit period.

Data Encoder

The transmitted code always consists of an 11 bit

preamble followed by the 64 code bits. The preamble

consists of 8 start bits (ZEROES), followed by a SYNCH.

The SYNCH consists of a LOW for two bit periods

followed by a ONE.

In GLITCH encoding the longest modulation period is

one quarter of a bit period, compared to the Manchester

encoding, where the longest modulation period is one full

bit period. GLITCH encoding therefore requires a much

smaller power storage capacitor.

The EM4022 can be programmed for one of two data

encoding methods. The first method is a variation on

Manchester II, i.e. a ONE is represented by a HIGH in

the first half of a bit period, and a ZERO is represented

by a LOW in the first half of a bit period.

Data Encoding

"0" "0" "1"

Fig. 8

ROM programming

CONTROL ROM

The EM4022 contains three laser fuse ROM blocks that

are pre-programmed by the foundry.

The operational modes of the EM4022 are pre-

programmed into the CONTROL ROM. The contents of

this one is not read out.

CODE ID ROM

This ROM contains the 64 bit ID code. The foundry will

automatically program a unique 48 bit ID and 16 bit

CRC. In this case the most significant bit of the ID is

programmed into bit 0 of the ROM, which will be

transmitted first.

CRC Block Diagram

Data Input

15

14 13 12 11 10 9 8 7 6 5 4 3 2

1 0

LSB

X0

MSB

X15

X2

Feedback before shift

Exclusive OR

Shift Register

X

CRC-CCITT Generating polynomial = X15 + X2 + X0

Fig.9

8

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EM4022

Anti-collision Protocol Overview

Control ROM Bit definition

The protocols are a collection of simple but fast and

reliable anti-collision protocols. They allow fast reading

of large numbers of transponders simultaneously using a

single reader. It is even possible to identify transponders

with identical codes, thereby making it possible to count

identical items.

Parameter

Fast / Normal

Mode

Value Mode

0

1

0

1

0

1

0

1

2

3

4

5

6

7

0

1

2

3

4

5

6

7

0

1

0

1

Normal

Fast

Free-running

GAP detection enabled

GAP disabled (Free-running)

Slow-down

ACK mode

Free-running protocol

Switch-off

The basis of the BTG-Supertag series of protocols is that

transponders transmit their own codes at random times

to a reader. By just listening and recording unique codes

when they are received, the reader can eventually detect

every tag. The reader detects collisions by typically

checking a CRC.

Maximum

initial random

delay

0 (Continuous)

16 bits

64 bits

256 bits

1 kbits

4 kbits

16 kbits

This basic protocol is known as the “Free-running”

protocol. It requires uniquely coded tags. Its main

advantage is that the reader design is simple, and the

spectrum requirement is much less – a very narrow band

is required.

64 kbits

Data rate

64 kbit/s

32 kbit/s

16 kbit/s

8 kbit/s

Figure 10 shows a sequence of three transponders. The

reader starts first to read transponder 1 but during his

data transmission, transponder 3 starts to modulate. In

this case, due to the CRC check no transponder is

detected. A transponder is taken into account, if it

4 kbit/s

2 kbit/s

1 kbit/s

0.5 kbit/s

Encoding

method

Glitch encoding

Manchester encoding

Low frequency GAP detection

High frequency GAP detection

transmits

a

complete data stream without any

disturbance

GAP type

Control ROM Map

15

14

13

12

11

10

HF

9

8

7

6

5

4

3

2

1

0

Byte[1]

Byte[0]

Random delay

Man-

Data rate

Switch- Free-

off running

Fast

GAP chester

9

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EM4022

Free running example

Transponder 1

Transponder 2

Transponder 3

Data stream in collision

Data stream detected

Fig. 10

In the EM4022 the ACK signal is implemented as two

consecutive gaps with the appropriate timing and

received at a specific time after a code has been

transmitted.

Bi-directional protocols

Allowing bi-directional communication between reader

and transponders can speed up the basic free-running

protocol.

Communication from the reader to

The slow-down mode is a compromise between the free-

running mode and the switch-off mode. Etch time a

transponder is read, the reader send an ACK to double

the random repetition rate. This reduces the collisions

and in the time increases the saturation level.

transponders is achieved by turning the illuminating

energy field off for short periods. The transponders

detect these gaps in the energy transmission and

interpret them as required.

Figure 12 show a typical case of this mode of operation.

Switch-off and Slow-down Modes

Reducing the effective population of transmitting

transponders in the reader field can speed up the free-

running protocol. One method to achieve this is by either

switching transponders off or slowing them down once

they have been detected. To achieve this, the reader

sends an ACK signal to a transponder after its code has

been successfully received. The transponder then either

switches off completely or reduces its repeat rate until it

is powered down. This reduces the number of collisions

between transponder transmissions, thereby reducing

the time required to read a group of tags.

Fast Mode

A second method of speeding up the reading of tags, is

to inhibit other transponders from transmitting while one

transponder is transmitting. This is done by sending a

MUTE signal to all of the transponders when the start of

a transmission is detected. The transponders stay muted

long enough (128 bit of its own clock) to allow the

transmission of one code (see figure 13). This allows the

transponder that has started transmitting to complete its

transmission without any collisions.

The other

transponders continue with their own protocols

automatically after a time out, or continue immediately

upon detection of an ACK signal indicating that the

transmission that caused the MUTE has been

completed.

Figure 11 shows a typical situation where a collision

occurs between transponder 1 and 3. Then, as soon as

transponder 2 is read, the reader sends an ACK signal to

this one switching it off as long hi is powered up from the

field. This eliminates the collision between transponder 1

and 2 in the next step The Switch-off protocol’s main

advantage is that identical transponders can be counted.

In the EM4022 the MUTE signal is implemented as a

single gap received while the transponder is not

transmitting.

10

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EM4022

Switch-off example

Transponder 1

Transponder 2

Transponder 3

Reader field

Data stream in collision

Transponder switched off

Transponder detected

Fig. 11

Slow-down example

Transponder 1

Transponder 2

Transponder 3

Reader field

Data stream in collision

Transponder detected

Fig. 12

Fast mode example

Transponder 1

Transponder 2

Transponder 3

Reader field

128 bit shift

Transponder detected

Fig. 13

11

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EM4022

Protocol combinations

Protocol saturation

The free-running and the two basic bi-directional

protocols, switch-off and slow-down, can all be combined

with the Fast protocol to give six different protocols, i.e.

Normal free-running, slow-down, Normal switch-off, Fast

free-running, slow-down, and Fast switch-off.

The following should be noted about the different

protocols:

As the number of transponders in a reader beam is

increased, the number of collisions increase, and it takes

longer to read all the tags. This process is not linear. To

read twice as many transponders could take more than

twice as long. This effect is called protocol saturation.

The normal free-running protocol saturates the easiest of

all the protocols, because it does not have any means of

reducing the transmitting population. The Fast protocols,

on the other hand, are virtually immune against

saturation, as they prevent collisions by muting all

transponders except the transmitting one.

1) The switch-off protocols must be used for counting

applications.

2) All the protocols except the switch-off protocols have

built in redundancy because of the fact that they can

transmit a code more than once.

One way of delaying the onset of saturation, is to reduce

the initial repeat rate (not data rate) at which

transponders transmit their codes. This is done by

increasing the maximum random delay between

transmissions.

3) Normal free-running is the only unidirectional

protocol. It has the lowest power spectrum requirement

because the reader transmits a CW wave.

4) Fast switch-off and Fast slow-down are the fastest

protocols, and should be used where speed is important,

or where the data rate limits the reading rate. Fast slow-

down is slightly slower, but theoretically has a lower error

rate.

Figure 14 and 15 below show's reading times for some

possible versions

Optimum repeat delay settings

5) For 125 kHz inductive applications using a 4 kbit/s

data rate, Fast slow-down is probably the best overall

protocol.

The following table lists the optimum repeat delay

settings for each of the protocols vx number of

transponders in a group.

6) For RF applications using a 64 kbit/s data rate,

normal free-running protocol is probably the best

protocol.

Protocol

Number of transponders

3

10

30

16k

4k

1k

100

64k

16k

4k

Free-running

Slow-down

1k

4k

Reader determined protocols

1k

If the reader does not send MUTE signals to

transponders that were programmed for one of the FAST

protocols, the protocol merely reverts to the equivalent

normal protocol. Similarly, if the reader does not send

ACK signals to transponders that were programmed for

SLOW-DOWN or SWITCH-OFF, the protocol reverts to

a FREE-RUNNING protocol. In this manner, the reader

can determine the protocol that is used.

Switch-off

1k

Fast Free-running

Fast Slow-down

Fast Switch-off

256

1k

256

1k

Note, however, that unless

a

transponder was

specifically programmed for the free-running protocol, its

GAP input must be pulled down.

This happens

automatically in low frequency inductive applications,

where the GAP input is pulled down by the internal GAP

detector diode. In RF applications, however, the GAP

input will have to be pulled down explicitly.

12

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EM4022

Reading time versus quantities of transponders and protocol (4Kbauds)

100

10

1

versions

V11

V14

V12

V15

V10

V13

0.1

1

10

100

1000

Number of tags

Fig. 14

Reading time versus quantities of transponders and protocol (64Kbauds)

10

versions

1

V17

V20

V18

V21

V16

V19

0.1

0.01

1

10

100

1000

Number of transponders

Fig. 15

13

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EM4022

Chip and Packaging Information

Pad Location

Chip size is 57 x 69 mil

11

10

9

EM4022

1

2

3

4

5

6

7

8

Fig. 16

Pad location table with reference on pad 3 center :

Pad N°

X [µm]

Y [µm]

size [µm]

Pad name

Function

1

2

3

4

5

6

7

8

9

0

417

234

0

-13

1

196

374

552

98/98

175/98

98/98

XCLK

V_DD

M

M_TST

COIL1

COIL2

V_SSTST

V_SS

external test clock input

positive supply

connection to antenna

test output

Coil terminal 1

Coil terminal 2

negative test supply output

negative supply

GAP input

Serial test data input (pull down)

Test mode control (pull down)

125

228

1037

1200

1324

GAP

SI

TMC

10

11

Test inputs and outputs must be left open.

14

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EM4022

Ordering Information for samples

For other versions or other delivery form, please contact EM Microelectronic-Marin S.A. Please make sure to give

complete part number when ordering (without spaces between letters).

Control

ROM

EM internal

use only:

Data

rate

Random

Value

Part Number

Protocol

Die Form & Thickness

Bumping

Old version

[hex]

EM4022 V10 WS11

EM4022 V11 WS11

EM4022 V12 WS11

EM4022 V13 WS11

EM4022 V14 WS11

EM4022 V15 WS11

EM4022 V16 WS11

EM4022 V17 WS11

EM4022 V18 WS11

EM4022 V19 WS11

EM4022 V20 WS11

EM4022 V21 WS11

EM4022 V%% WS11

302

328

32C

303

321

325

202

228

22C

203

229

220

4

Continuous Free-Running

4096

Continuous Fast Free-Running Sawn wafer, 11 mils

1024

Continuous Free-Running

4096

Continuous Fast Free-Running Sawn wafer, 11 mils

4096

Sawn wafer, 11 mils

no bumps

010

011

012

013

014

015

016

017

018

019

020

021

%%%

Slow down

Switch off

Fast Slow down

Fast Switch off

Sawn wafer, 11 mils

4

64

Slow down

Switch off

Fast Slow down

Fast Switch off

custom

Sawn wafer, 11 mils

custom custom

For ICs to be used in mass production, the customer must define its options with the control ROM bit definition (page 9-10).

Using this information, EM Microelectronic-Marin S.A. will define a complete new Part Number for ordering.

WARNING: Use of this product is subject to license from British Technology Group (BTG, www.btg-et.com)

Product Support

Check our Web Site under Products/RF Identification section.

Questions can be sent to cid@emmicroelectronic.com

EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry

entirely embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to

change the circuitry and specifications without notice at any time. You are strongly urged to ensure that the

information given has not been superseded by a more up-to-date version.

15

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型号：	EM4022V14WS11
厂家：	EM MICROELECTRONIC - MARIN SA
描述：	Multi Frequency Contactless Identification Device Anti-Collision compatible with BTG Supertag Category Protocols 多频非接触式识别设备防碰撞与首旅集团的SuperTag类别协议兼容
文件：	总15页 (文件大小：278K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

EM4022V14WS11 [EMMICRO]

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