ES52F3B15N-16.384M [ECLIPTEK]
TCXO, CLIPPED SINE OUTPUT, 16.384 MHz, DIP-14/4;
| 型号： | ES52F3B15N-16.384M |
| 厂家： | 
Ecliptek |
| 描述： | TCXO, CLIPPED SINE OUTPUT, 16.384 MHz, DIP-14/4 机械 输出元件 石英晶振 温度补偿晶振 振荡器 |
| 文件： | 总4页 (文件大小：114K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ES52F3B15N-16.384M
ES52F3 B 15 N -16.384M
Series
Nominal Frequency
3.3Vdc 14-Pin DIP Clipped Sinewave TCXO
16.384MHz
Operating Temperature Range
0°C to +70°C
Control Voltage
None (No Connect on Pin 1)
Frequency Stability
±1.5ppm Maximum
ELECTRICAL SPECIFICATIONS
Nominal Frequency
16.384MHz
Frequency Stability
±1.5ppm Maximum (Inclusive of Operating Temperature Range)
Frequency Stability vs. Input Voltage ±0.3ppm Maximum (±5%)
Aging at 25°C
±1ppm/Year Maximum
±0.2ppm Maximum (±2pF)
0°C to +70°C
Frequency Stability vs. Load
Operating Temperature Range
Supply Voltage
3.3Vdc ±5%
Input Current
1.5mA Maximum
Output Voltage
0.7Vp-p Minimum
Load Drive Capability
Output Logic Type
Control Voltage
10kOhms//10pF
Clipped Sinewave
None (No Connect on Pin 1)
±3ppm Minimum (Top of Can)
10kHz Minimum (Measured at -3dB with a Control Voltage of 1.65Vdc)
10kOhms Typical
Internal Trim
Modulation Bandwidth
Input Impedance
Phase Noise
-70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, -
145dBc at 100kHz Offset
Storage Temperature Range
-40°C to +85°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A (Internal Crystal Only)
Gross Leak Test
Lead Integrity
MIL-STD-883, Method 1014 Condition C (Internal Crystal Only)
MIL-STD-883, Method 2004
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 1 of 4
ES52F3B15N-16.384M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
No Connect
Case/Ground
Output
Internal Trim Access
4.8 ±0.3
Hole Ø3.5 ±0.5
3
4
Supply Voltage
4.0 ±0.3
5.0 ±1.0
4.0 ±0.3
LINE MARKING
1
2
ECLIPTEK
11.7
±0.5
7.62
±0.30
MARKING
ORIENTATION
16.384M
M=Nominal Frequency Unit
of Measure
1.2 +0/-0.5
Ø0.50
±0.05
(x4)
3
XXYZZ
XX=Ecliptek Manufacturing
Code
2.5 ±0.3
2
15.24 ±0.40
1
18.3 ±0.5
Y=Last Digit of the Year
ZZ=Week of the Year
OUTPUT WAVEFORM
0VDC
VP-P
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 2 of 4
ES52F3B15N-16.384M
Test Circuit for No Connect Option
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
Current
Meter
0.01µF
(Note 1)
0.1µF
(Note 1)
Power
Supply
Voltage
Meter
Ground
CL = 10pF
(Note 3)
RL = 10kOhms
No Connect
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 3 of 4
ES52F3B15N-16.384M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
Low Temperature Solder Bath (Wave Solder) Note 1
Device is non-hermetic; Post reflow aqueous wash is not recommended
Low Temperature Solder Bath (Wave Solder) Note 2
Temperatures shown are applied to back of PCB board and device leads only.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 4 of 4
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