EQTG32D4HH-12.800M [ECLIPTEK]
LVPECL, Temperature Compensated Quartz Crystal Clock Oscillators TCXO LVPECL (PECL) 2.5Vdc 6 Pad 2.5mm x 3.2mm Ceramic Surface Mount (SMD) 12.800MHz ±1.5ppm over -20°C to +70°C;型号: | EQTG32D4HH-12.800M |
厂家: | Ecliptek |
描述: | LVPECL, Temperature Compensated Quartz Crystal Clock Oscillators TCXO LVPECL (PECL) 2.5Vdc 6 Pad 2.5mm x 3.2mm Ceramic Surface Mount (SMD) 12.800MHz ±1.5ppm over -20°C to +70°C 机械 输出元件 石英晶振 温度补偿晶振 振荡器 |
文件: | 总13页 (文件大小:872K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Ecliptek | EQTG32 Series Oscillator
http://www.ecliptek.com/oscillators/EQTG32/
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EQTG32 Series Oscillator
Temperature Compensated Quartz Crystal Clock Oscillators TCXO LVPECL (PECL) 2.5Vdc 6 Pad 2.5mm x 3.2mm Ceramic Surface
Mount (SMD)
Revision A 09/09/2015
Electrical Specifications
Nominal Frequency
10.000MHz to 625.000MHz
Some frequencies within this range may not be available.
Frequency Stability
Inclusive of Operating Temperature Range, at V =2.5V
DD
DC
±5.0ppm Maximum
±3.0ppm Maximum
±2.5ppm Maximum
±2.0ppm Maximum
±1.5ppm Maximum
±1.0ppm Maximum
Frequency Stability vs. Frequency
Tolerance
At 25°C ±2°C, at V =2.5V , PreꢀReflow
DD
DC
±2.0ppm Maximum
±1.5ppm Maximum
±1.0ppm Maximum
Frequency Stability vs. Input Voltage
Frequency Stability vs. Load
±0.2ppm Maximum (±5%)
±0.2ppm Maximum (±2pF)
Frequency Stability vs. Reflow
Frequency Stability vs. Aging
Operating Temperature Range
±1.0ppm Maximum (at 25°C, 24 hours after reflow, 1 time)
±1ppm/Year Maximum (at 25°C)
0°C to +50°C
ꢀ10°C to +60°C
0°C to +70°C
ꢀ20°C to +70°C
ꢀ30°C to +60°C
ꢀ30°C to +75°C
ꢀ30°C to +85°C
ꢀ40°C to +85°C
Supply Voltage
2.5V ±5%
DC
Input Current
75mA Maximum
Output Voltage Logic High (Voh)
V
V
ꢀ1.025V
ꢀ1.85V
Minimum, 1.6V
Typical, V ꢀ0.6V
DD
Maximum
Maximum
DD
DD
DC
DC
DC
Output Voltage Logic Low (Vol)
Rise/Fall Time
Minimum, 0.8V
Typical, V ꢀ1.62V
DC DD
DC
DC
Measured at 10% to 90% of Waveform
300pSec Maximum
Duty Cycle
Measured at 50% of Waveform
50 ±5(%)
Load Drive Capability
Output Logic Type
50 Ohms into V ꢀ2V
DD
DC
LVPECL
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Phase Noise
Click to Open Phase Noise Table
Output Enable (OE)
Output Control Function
Output Control Input Voltage Logic High
(Vih)
90% of V
Minimum or No Connect to Enable Output and
Complementary Output
DD
Output Control Input Voltage Logic Low
(Vil)
10% of V Maximum to Disable Output and Complementary Output
DD
(High Impedance)
100nSec Maximum
50nSec Maximum
Output Enable Time
Output Disable Time
Output Enable Current
Without Load (Pin 2 = Ground)
15mA Maximum
RMS Phase Jitter
Click to Open RMS Phase Jitter Table
0.2pSec Typical
Period Jitter (Deterministic)
Period Jitter (Random)
Period Jitter (RMS)
2pSec Typical
3pSec Maximum
Period Jitter (pkꢀpk)
Start Up Time
30pSec Maximum
10mSec Maximum
ꢀ55°C to +125°C
Storage Temperature Range
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Phase Noise
All Values are Typical
Nominal Frequency: 10MHz to 50MHz
Offset
10Hz
Phase Noise
-64dBc/Hz
100Hz
1kHz
-96dBc/Hz
-124dBc/Hz
-131dBc/Hz
-132dBc/Hz
-149dBc/Hz
-157dBc/Hz
-159dBc/Hz
10kHz
100kHz
1MHz
10MHz
20MHz
Nominal Frequency: 50.000001MHz to 100MHz
Offset
10Hz
Phase Noise
-58dBc/Hz
100Hz
1kHz
-90dBc/Hz
-118dBc/Hz
-125dBc/Hz
-126dBc/Hz
-145dBc/Hz
-155dBc/Hz
-157dBc/Hz
10kHz
100kHz
1MHz
10MHz
20MHz
Nominal Frequency: 100.000001MHz to 156.249999MHz
Offset
10Hz
Phase Noise
-57dBc/Hz
100Hz
1kHz
-86dBc/Hz
-114dBc/Hz
-121dBc/Hz
-122dBc/Hz
-141dBc/Hz
-151dBc/Hz
-153dBc/Hz
10kHz
100kHz
1MHz
10MHz
20MHz
Nominal Frequency: 156.25MHz to 212.5MHz
Offset
10Hz
Phase Noise
-58dBc/Hz
100Hz
1kHz
-86dBc/Hz
-110dBc/Hz
-116dBc/Hz
-117dBc/Hz
-136dBc/Hz
-146dBc/Hz
-148dBc/Hz
10kHz
100kHz
1MHz
10MHz
20MHz
Nominal Frequency: 212.500001MHz to 500MHz
Offset
10Hz
Phase Noise
-56dBc/Hz
-95dBc/Hz
100Hz
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1kHz
10kHz
100kHz
1MHz
-100dBc/Hz
-106dBc/Hz
-107dBc/Hz
-126dBc/Hz
-136dBc/Hz
-137dBc/Hz
10MHz
20MHz
Nominal Frequency: 500.000001MHz to 625MHz
Offset
10Hz
Phase Noise
-54dBc/Hz
-84dBc/Hz
-97dBc/Hz
-104dBc/Hz
-105dBc/Hz
-124dBc/Hz
-134dBc/Hz
-136dBc/Hz
100Hz
1kHz
10kHz
100kHz
1MHz
10MHz
20MHz
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RMS Phase Jitter
Fj=12kHz to 20MHz (Random)
Nominal Frequency Range
10MHz to 50MHz
RMS Phase Jitter
1.5pSec Maximum
1.4pSec Maximum
1.3pSec Maximum
50.000001MHz to 100MHz
100.000001MHz to 625MHz
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Mechanical Dimensions
All Dimensions in Millimeters
Pin 1: Do Not Connect
Pin 2: Output Enable (OE)
Pin 3: Case/Ground
Pin 4: Output
Pin 5: Complementary Output
Pin 6: Supply Voltage
Marking Specifications
Line 1:
EXXXXXX
E = Ecliptek Designator
XXXXXX = Nominal Frequency in MHz (5 digits + Decimal)
Line 2:
XXXXX
XXXXX = Ecliptek Manufacturing Identifier
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Environmental and Mechanical Specifications
ESD Susceptibility
Fine Leak Test
MILꢀSTDꢀ883, Method 3015, Class 1, HBM: 1500V
MILꢀSTDꢀ883, Method 1014, Condition A
UL94ꢀV0
Flammability
Gross Leak Test
MILꢀSTDꢀ883, Method 1014, Condition C
MILꢀSTDꢀ883, Method 2002, Condition B
MILꢀSTDꢀ883, Method 1004
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
JꢀSTDꢀ020, MSL 1
MILꢀSTDꢀ202, Method 210, Condition K
MILꢀSTDꢀ202, Method 215
MILꢀSTDꢀ883, Method 2003
Temperature Cycling
Vibration
MILꢀSTDꢀ883, Method 1010, Condition B
MILꢀSTDꢀ883, Method 2007, Condition A
45°C/W (degrees Celsius per Watt)
Thermal Resistance (θ
Thermal Resistance (θ
)
)
JA
JC
19°C/W (degrees Celsius per Watt)
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Tape & Reel Dimensions
1000 pieces per reel
Compliant to EIAꢀ481
All Dimensions in Millimeters
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Test Circuit for PECL Output
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close
(less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low input capacitance (<12pF), 10X attentuation factor, high impedance (>10Mohms), and high bandwidth
(>500MHz) passive probe is recommended.
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.
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Recommended Solder Pad Dimensions
Tolerances = ±0.1
All Dimensions in Millimeters
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Solder Reflow Profile
High Temperature Infrared/Convection
Note: Temperatures shown are applied to body of
device.
T
MAX to T (Rampꢀup Rate)
3°C/Second Maximum
S
L
Preheat
ꢀ Temperature Minimum (T MIN)
S
150°C
ꢀ Temperature Typical (T TYP)
S
175°C
ꢀ Temperature Maximum (T MAX)
S
200°C
ꢀ Time (t )
S
60 ꢀ 180 Seconds
3°C/Second Maximum
Rampꢀup Rate (T to T )
L
P
Time Maintained Above:
ꢀ Temperature (T )
L
217°C
ꢀ Time (t )
L
60 ꢀ 150 Seconds
Peak Temperature (T )
P
260°C Maximum for 10 Seconds Maximum
250°C +0/ꢀ5°C
Target Peak Temperature (T Target)
P
Time within 5°C of actual peak (t )
P
20 ꢀ 40 Seconds
Rampꢀdown Rate
6°C/Second Maximum
8 Minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
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Low Temperature Infrared/Convection 240°C
Note: Temperatures shown are applied to body of
device.
T
MAX to T (Rampꢀup Rate)
5°C/Second Maximum
S
L
Preheat
ꢀ Temperature Minimum (T MIN)
S
N/A
ꢀ Temperature Typical (T TYP)
S
150°C
ꢀ Temperature Maximum (T MAX)
S
N/A
ꢀ Time (t )
S
60 ꢀ 120 Seconds
5°C/Second Maximum
Rampꢀup Rate (T to T )
L
P
Time Maintained Above:
ꢀ Temperature (T )
L
150°C
ꢀ Time (t )
L
200 Seconds Maximum
Peak Temperature (T )
P
240°C Maximum
Target Peak Temperature (T Target)
P
240°C Maximum 2 Times / 230°C Maximum 1 Time
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Time within 5°C of actual peak (t )
P
Rampꢀdown Rate
5°C/Second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
High Temperature Manual Soldering
Note: Temperatures shown are applied to body of device.
260°C Maximum for 5 Seconds Maximum, 2 times Maximum.
Low Temperature Manual Soldering
Note: Temperatures shown are applied to body of device.
185°C Maximum for 10 Seconds Maximum, 2 times Maximum.
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1 - Build A Part Number
2 - Next Page
Select the parameters that meet your requirements and then click
Access these Part Number specific
resources and tools
Next
Frequency in Megahertz (10 to 625):
Some frequencies within this range may not be
available
Frequency Stability vs. Frequency
Tolerance:
Operating Temperature Range:
Frequency Stability:
Packaging Options:
Part Numbering Guide
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