EMK11G2H-19.960MTR [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 19.96MHz, LVCMOS OUTPUT, ROHS COMPLIANT, SMD, 4 PIN;
| 型号： | EMK11G2H-19.960MTR |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTAL OSCILLATOR, CLOCK, 19.96MHz, LVCMOS OUTPUT, ROHS COMPLIANT, SMD, 4 PIN 机械 输出元件 振荡器 |
| 文件： | 总6页 (文件大小：197K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
EMK11G2H-19.960M TR
EMK11 G 2 H -19.960M TR
Series
Packaging Options
RoHS Compliant (Pb-free) 4 Pad 5mm x 7mm SMD
1.8Vdc LVCMOS MEMS Oscillator
Tape & Reel
Nominal Frequency
Frequency Tolerance/Stability
±100ppm Maximum over -40°C to +85°C
19.960MHz
Output Control Function
Tri-State (Disabled Output: High Impedance)
Duty Cycle
50 ±5(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
19.960MHz
Frequency Tolerance/Stability
±100ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C,
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,
First Year Aging at 25°C, 260°C Reflow, Shock, and Vibration)
Aging at 25°C
±1ppm Maximum First Year
Operating Temperature Range
Supply Voltage
-40°C to +85°C
1.8Vdc ±5%
Input Current
15mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
90% of Vdd Minimum (IOH=-8mA)
10% of Vdd Maximum (IOL=+8mA)
2nSec Maximum (Measured from 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
15pF Maximum
Duty Cycle
Load Drive Capability
Output Logic Type
CMOS
Output Control Function
Output Control Input Voltage
Peak to Peak Jitter (tPK)
Start Up Time
Tri-State (Disabled Output: High Impedance)
+0.7Vdd Minimum or No Connect to Enable Output, +0.3Vdd Maximum to Disable Output
250pSec Maximum, 100pSec Typical
50mSec Maximum
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 2, HBM 2000V
Flammability
UL94-V0
Mechanical Shock
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only)
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
Temperature Cycling
Thermal Shock
Vibration
www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 1 of 6
EMK11G2H-19.960M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
0.85
±0.15
1.20 ±0.10 (x4)
2.1
1
Tri-State (High
Impedance)
5.00
±0.15
0.08
2
3
4
Ground
MAX
Output
2
R0.70 ±0.10
1.70
3
Supply Voltage
LINE MARKING
XXXX or XXXXX
7.00
±0.15
5.08
±0.10
A
1
XXXX or XXXXX=Ecliptek
Manufacturing Lot Code
1
4
C0.25 ±0.10
2.60 ±0.15
1.40
±0.10 (x4)
Note A: Center paddle is connected
internally to oscillator ground (Pad 2).
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
Solder Land
(X4)
2.88
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 2 of 6
EMK11G2H-19.960M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% of Waveform
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% of Waveform
20% of Waveform
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
Tri-State or
Power Down
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 3 of 6
EMK11G2H-19.960M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.2
2.0 ±0.2
DIA 1.5 ±0.1
0.30 ±0.05
7.5 ±0.2
16.0 ±0.3
A0*
6.75 ±0.20
8.0 ±0.2
B0*
K0*
*Compliant to EIA 481A
1.5 MIN
22.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
180 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
16.4 +2.0/-0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 4 of 6
EMK11G2H-19.960M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 5 of 6
EMK11G2H-19.960M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 6 of 6
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