EMDS23N2J-187.500MTR
更新时间：2024-09-18 14:22:23
品牌：ECLIPTEK
描述：CRYSTAL OSCILLATOR, CLOCK, 187.5MHz, LVDS OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN
概述
规格参数
数据手册EMDS23N2J-187.500MTR 概述
CRYSTAL OSCILLATOR, CLOCK, 187.5MHz, LVDS OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN XO
EMDS23N2J-187.500MTR 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Obsolete | Reach Compliance Code： | compliant |
| ECCN代码： | EAR99 | HTS代码： | 8542.39.00.01 |
| 风险等级： | 5.84 | Is Samacsys： | N |
| 其他特性： | TRI-STATE; COMPLEMENTARY OUTPUT; TAPE AND REEL | 最长下降时间： | 0.325 ns |
| 频率调整-机械： | NO | 频率稳定性： | 25% |
| JESD-609代码： | e4 | 安装特点： | SURFACE MOUNT |
| 标称工作频率： | 187.5 MHz | 最高工作温度： | 70 °C |
| 最低工作温度： | -20 °C | 振荡器类型： | LVDS |
| 输出负载： | 100 OHM | 物理尺寸： | 5.0mm x 3.2mm x 0.75mm |
| 最长上升时间： | 0.325 ns | 最大供电电压： | 3.6 V |
| 最小供电电压： | 3 V | 标称供电电压： | 3.3 V |
| 表面贴装： | YES | 最大对称度： | 55/45 % |
| 端子面层： | Nickel/Palladium/Gold (Ni/Pd/Au) | Base Number Matches： | 1 |
EMDS23N2J-187.500MTR 数据手册
通过下载EMDS23N2J-187.500MTR数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载RoHS
Pb
EMDS23N2J-187.500M TR
EMDS23 N 2 J -187.500M TR
Series
Packaging Options
RoHS Compliant (Pb-free) 3.3V 6 Pad 3.2mm x 5mm
Plastic SMD LVDS MEMS Oscillator
Tape & Reel
Nominal Frequency
Frequency Tolerance/Stability
±25ppm Maximum over -20°C to +70°C
187.500MHz
Logic Control / Additional Output
Standby (ST) and Complementary Output
Duty Cycle
50 ±5(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
187.500MHz
Frequency Tolerance/Stability
±25ppm Maximum over -20°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C,
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,
1st Year Aging at 25°C, Reflow, Shock, and Vibration)
Aging at 25°C
±1ppm First Year Maximum
Supply Voltage
+3.3Vdc ±0.3Vdc
Input Current
80mA Maximum (Excluding Load Termination Current)
1.425Vdc Typical
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Differential Output Voltage (Vod)
Offset Voltage (Vos)
1.075Vdc Typical
247mVdc Minimum, 350mVdc Typical, 454mVdc Maximum
1.125V Minimum, 1.250V Typical, 1.375V Maximum
225pSec Typical, 325pSec Maximum (Measured over 20% to 80% of waveform)
50mVdc Maximum
Rise/Fall Time
Differential Output Error (dVod)
Duty Cycle
50 ±5(%) (Measured at 50% of waveform)
50mVdc Maximum
Offset Error (dVos)
Load Drive Capability
Output Logic Type
100 Ohms Between Output and Complementary Output
LVDS
Logic Control / Additional Output
Output Control Input Voltage
Standby (ST) and Complementary Output
Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc
Maximum to Disable Output and Complementary Output (High Impedance)
Standby Current
30µA Maximum (ST) Without Load
0.2pSec Typical
Period Jitter (Deterministic)
Period Jitter (Random)
Period Jitter (RMS)
2.0pSec Typical
1.8pSec Typical, 2.5pSec Maximum
25pSec Typical, 30pSec Maximum
1.6pSec Typical
Period Jitter (pk-pk)
RMS Phase Jitter (Fj = 637kHz to
10MHz; Random)
RMS Phase Jitter (Fj = 1MHz to
20MHz; Random)
0.7pSec Typical
0.6pSec Typical
RMS Phase Jitter (Fj = 1.875MHz to
20MHz; Random)
Start Up Time
10mSec Maximum
-55°C to +125°C
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 2, HBM 2000V
Flammability
UL94-V0
Mechanical Shock
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Pads on bottom of package only)
MIL-STD-883, Method 1010, Condition B
Temperature Cycling
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 6
EMDS23N2J-187.500M TR
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Thermal Shock
MIL-STD-883, Method 1011, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A, 20G
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
5
6
Standby (ST)
No Connect
3.20
±0.15
0.75
1.00 ±0.10 (x6)
Case Ground
Output
±0.15
Complementary Output
Supply Voltage
3
2
1
4
5
6
5.00
±0.15
2.54
LINE MARKING
±0.10
1
XXXXX
XXXXX=Ecliptek
Manufacturing Lot Code
1.27 TYP
(x4)
0.64
±0.10 (x6)
1.20
±0.10
0.08 MAX
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.40 (X6)
1.00 (X6)
0.27 (X4)
Solder Land
0.80 (X2)
(X6)
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 6
EMDS23N2J-187.500M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
Q
Q
HIGH IMPEDANCE
STATE
VOS
VOL
VOD
80%
0V
HIGH IMPEDANCE
STATE
VOp-p
20%
tPLZ
tPZL
Fall
Time
Rise
Time
TW
Duty Cycle (%) = TW/T x 100
T
Test Circuit for Tri-State and Complementary Output
Frequency
Counter
Oscilloscope
Probe 2
(Note 2)
Probe 1
(Note 2)
Supply
Voltage
(VDD
)
100 Ohms
Current
Meter
Output
Complementary
Output
0.1µF
(Note 1)
0.01µF
(Note 1)
Switch
Ground
Power
Supply
Voltage
Meter
Power
Supply
Tri-State
No
Connect
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)
to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is
recommended.
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 6
EMDS23N2J-187.500M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.1
2.0 ±0.1
DIA 1.5 +0.1/-0
0.30 ±0.05
5.5 ±0.1
12.0 ±0.2
A0*
6.5 ±0.1
8.0 ±0.2
B0*
K0*
*Compliant to EIA 481A
1.5 MIN
18.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
180 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
12.4 +2.0/-0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 4 of 6
EMDS23N2J-187.500M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 6
EMDS23N2J-187.500M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 6 of 6
EMDS23N2J-187.500MTR 相关器件
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