EMCL13E2J-106.250MTR [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 106.25MHz, LVPECL OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN;![EMCL13E2J-106.250MTR](http://pdffile.icpdf.com/pdf2/p00271/img/icpdf/EMCL13E2J-10_1624862_icpdf.jpg)
型号: | EMCL13E2J-106.250MTR |
厂家: | ![]() |
描述: | CRYSTAL OSCILLATOR, CLOCK, 106.25MHz, LVPECL OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN 机械 输出元件 振荡器 |
文件: | 总6页 (文件大小:237K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RoHS
Pb
EMCL13E2J-106.250M TR
EMCL13 E 2 J -106.250M TR
Series
Packaging Options
RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm
Plastic SMD LVPECL MEMS Oscillator
Tape & Reel
Nominal Frequency
Frequency Tolerance/Stability
±25ppm Maximum over 0°C to +70°C
106.250MHz
Logic Control / Additional Output
Standby (ST) and Complementary Output
Duty Cycle
50 ±5(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
106.250MHz
Frequency Tolerance/Stability
±25ppm Maximum over 0°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency
Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, 1st Year
Aging at 25°C, Reflow, Shock, and Vibration)
Aging at 25°C
±1ppm First Year Maximum
Supply Voltage
+3.3Vdc ±0.3Vdc
Input Current
80mA Maximum (Excluding Load Termination Current)
2.35Vdc Typical, Vcc-1.025Vdc Minimum
1.6Vdc Typical, Vcc-1.62Vdc Maximum
150pSec Typical, 300pSec Maximum (Measured over 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
50 Ohms into Vcc-2.0Vdc
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
LVPECL
Logic Control / Additional Output
Output Control Input Voltage
Standby (ST) and Complementary Output
Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc
Maximum to Disable Output and Complementary Output (High Impedance)
Standby Current
30µA Maximum (ST) Without Load
0.2pSec Typical
Period Jitter (Deterministic)
Period Jitter (Random)
Period Jitter (RMS)
2.0pSec Typical
1.5pSec Typical, 3.0pSec Maximum
20pSec Typical, 25pSec Maximum
1.6pSec Typical
Period Jitter (pk-pk)
RMS Phase Jitter (Fj = 637kHz to
10MHz; Random)
RMS Phase Jitter (Fj = 1MHz to
20MHz; Random)
1.0pSec Typical
0.5pSec Typical
RMS Phase Jitter (Fj = 1.875MHz to
20MHz; Random)
Start Up Time
10mSec Maximum
-55°C to +125°C
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 2, HBM 2000V
Flammability
UL94-V0
Mechanical Shock
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only)
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
Temperature Cycling
Thermal Shock
Vibration
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 1 of 6
EMCL13E2J-106.250M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
0.85
±0.15
1.20 ±0.10 (x4)
1.47
1
2
3
4
5
6
Standby (ST)
No Connect
5.00
±0.15
0.08
MAX
Case Ground
Output
3
2
1
4
Complementary Output
Supply Voltage
7.00
±0.15
5.08
±0.10
5
6
2.30
A
LINE MARKING
XXXX or XXXXX
1
XXXX or XXXXX=Ecliptek
Manufacturing Lot Code
2.54 TYP
2.60
±0.15
1.40
±0.10 (x4)
Note A: Center paddle is connected
internally to oscillator ground (Pad 3).
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.80 (X6)
2.00 (X6)
0.54 (X4)
Solder Land
2.39 (X3)
(X6)
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 2 of 6
EMCL13E2J-106.250M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80%
Q
Q
OUTPUT STANDBY
(HIGH IMPEDANCE
STATE)
50%
20%
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for Tri-State and Complementary Output
50 Ohms
Frequency
Counter
Oscilloscope
Pin Connections
1 Tri-State
2 No Connect
3 Ground
4 Output
Power
Supply
Probe 2 Probe 1
(Note 2) (Note 2)
5 Complementary Output
Supply
6 Supply Voltage (VDD
)
Voltage
(VDD
)
Output
50 Ohms
Current
Meter
Complementary
0.01µF
(Note 1)
0.1µF
(Note 1)
Output
Switch
Ground
Power
Supply
Voltage
Meter
Power
Supply
Power
Supply
Tri-State
No
Connect
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)
to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is
recommended.
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 3 of 6
EMCL13E2J-106.250M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.2
2.0 ±0.2
DIA 1.5 ±0.1
0.30 ±0.05
7.5 ±0.2
16.0 ±0.3
A0*
6.75 ±0.20
8.0 ±0.2
B0*
K0*
*Compliant to EIA 481A
1.5 MIN
22.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
180 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
16.4 +2.0/-0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 4 of 6
EMCL13E2J-106.250M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 5 of 6
EMCL13E2J-106.250M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 6 of 6
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