EB52E8C2V-12.288MTR [ECLIPTEK]
TCVCXO, CLOCK, 12.288MHz, CMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 10 PIN;
| 型号： | EB52E8C2V-12.288MTR |
| 厂家： | 
Ecliptek |
| 描述： | TCVCXO, CLOCK, 12.288MHz, CMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 10 PIN 机械 输出元件 石英晶振 压控振荡器 有源晶体振荡电路 |
| 文件： | 总6页 (文件大小：220K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
EB52E8C2V-12.288M TR
EB52E8 C 2 V -12.288M TR
Series
Packaging Options
RoHS Compliant (Pb-free) 5mm x 7mm Ceramic SMD
3.3Vdc LVCMOS TC(VC)XO
Tape & Reel
Nominal Frequency
12.288MHz
Operating Temperature Range
-20°C to +70°C
Control Voltage
1.65Vdc ±1.65Vdc
Frequency Stability
±0.5ppm Maximum
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance
Frequency Stability
12.288MHz
±1.0ppm Maximum (Measured at 25°C ±2°C, at Vdd=3.3Vdc and Vc=1.65Vdc)
±0.5ppm Maximum (Not available with Operating Temperature Range of -40°C to +85°C)
Frequency Stability vs. Input Voltage ±0.3ppm Maximum (±5%)
Frequency Stability vs. Aging
Frequency Stability vs. Load
Operating Temperature Range
Supply Voltage
±1ppm/year Maximum (at 25°C)
±0.3ppm Maximum (±10%)
-20°C to +70°C
3.3Vdc ±5%
Input Current
10mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
90% of Vdd Minimum (IOH = -4mA)
10% of Vdd Maximum (IOL = +4mA)
5nSec Maximum (Measured at 20% to 80% of Waveform)
50 ±5(%) (Measured at 50% of Waveform)
15pF Maximum
Duty Cycle
Load Drive Capability
Output Logic Type
Control Voltage
CMOS
1.65Vdc ±1.65Vdc
Control Voltage Range
Frequency Deviation
Linearity
0.0Vdc to Vdd
±5ppm Minimum
5% Maximum
Transfer Function
Positive Transfer Characteristic
100kOhms Minimum
Input Impedance
Phase Noise
-80dBc/Hz at 10Hz Offset, -115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -145dBc/Hz at
>=10kHz Offset (Typical Values at 12.800MHz)
Tri-State Input Voltage (Vih and Vil)
+0.9Vdd Minimum to Enable Output; +0.1Vdd Maximum to Disable Output (High Impedance); No Connect
to Enable Output
RMS Phase Jitter
1pSec Maximum (Fj = 12kHz to 20MHz)
10mSec Maximum
Start Up Time
Storage Temperature Range
-40°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 1 of 6
EB52E8C2V-12.288M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
5
6
7
8
9
10
Do Not Connect
Do Not Connect
Do Not Connect
Ground
2.00
MAX
1.00 ±0.10 (x5)
0.80 ±0.10 (x4)
5.00
±0.10
0.40
±0.10
5
6
4
Output
1.00
±0.10
(x4)
Do Not Connect
Do Not Connect
Tri-State
3
2
7.00
±0.10
7
8
Supply Voltage
Voltage Control
1
1.27
±0.10
(x4)
0.60
±0.10
(x6)
10
9
LINE MARKING
2.54
±0.10
(x2)
1
EXX.XXX
0.80
±0.10
E=Ecliptek Designator
XX.XXX=Nominal
Frequency in MHz
2
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.34
1.4(x4)
1.3
1.4
4.6
1.0
1.8
1.2(x4)
Solder Land (x5)
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 2 of 6
EB52E8C2V-12.288M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% of Waveform
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% of Waveform
20% of Waveform
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for CMOS Output
Switch
Frequency
Counter
Oscilloscope
Power
Supply
Probe
Supply
Voltage
(Note 2)
Output
(VDD
)
Current
Meter
Tri-State
0.1µF
0.01µF
Power
Supply
(Note 1)
Voltage
Meter
(Note 1)
Voltage
Control
CL
(Note 3)
Ground
Power
Supply
Voltage
Meter
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a
0.01µF high frequency ceramic bypass capacitor close to the package ground
and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance
(>10Mohms), and high bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 3 of 6
EB52E8C2V-12.288M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.1
2.0 ±0.1
DIA 1.5 +1.0/-0
0.6 MAX
7.5 ±0.10
16.0 ±0.2
A0*
6.75 ±0.10
8.0 ±0.1
B0*
K0*
*Compliant to EIA 481A
1.5 MIN
22.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
360 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
16.4 +2.0/-0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 4 of 6
EB52E8C2V-12.288M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 5 of 6
EB52E8C2V-12.288M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 230°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
230°C Maximum
230°C Maximum 2 Times
10 seconds Maximum 2 Times
5°C/second Maximum
N/A
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 6 of 6
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