HCM0503-100-R [EATON]
High current power inductors;型号: | HCM0503-100-R |
厂家: | Eaton All Rights Reserved. |
描述: | High current power inductors |
文件: | 总7页 (文件大小:296K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Effective June 2015
Technical Data 4430
Supersedes June 2014
HCM0503
High current power inductors
Applications
•
Voltage Regulator Module (VRM)
•
Multi-phase regulators
•
Point-of-Load modules
•
Desktop and server VRMs and EVRDs
•
Base station equipment
•
Notebook and laptop regulators
•
Battery power systems
•
Graphics cards
•
Data networking and storage systems
Environmental data
•
Storage temperature range (Component):
Product features
-55 °C to +125 °C
•
High current carrying capacity
•
Operating temperature range: -55 °C to +125 °C
(ambient + self-temperature rise)
•
Low core losses
•
•
Magnetically shielded, low EMI
Solder reflow temperature:
J-STD-020 (latest revision) compliant
•
Frequency range up to 1 MHz
•
Inductance range from 0.2 μH to 22 μH
HALOGEN
•
Current range from 1.9 A to 22 A
HF
Pb
FREE
•
5.5 mm x 5.3 mm footprint surface mount
package in a 3.0 mm height
•
Iron powder core material
•
Halogen free, lead free, RoHS compliant
HCM0503
High current power inductors
Technical Data 4430
Effective June 2015
Product Specifications
DCR (mΩ)
typical @
+ꢀ2 °C
OCL1
(μH) ꢀ20
FLLꢀ (μH)
minimum
Irms
(A)
Isat
DCR (mΩ)
3
4
Part Number6
HCM0503-R20-R
HCM0503-R35-R
HCM0503-R47-R
HCM0503-R75-R
HCM0503-1R0-R
HCM0503-1R5-R
HCM0503-2R2-R
HCM0503- 3R3-R
HCM0503-4R7-R
HCM0503-5R6-R
HCM0503-100-R
HCM0503-150-R
HCM0503-220-R
(A)
21.0
14.9
11.5
9.7
8.5
7.0
6.5
6.0
5.5
3.5
2.3
2.1
1.9
maximum @ +ꢀ2 °C K-factor5
0.20
0.35
0.47
0.75
1.0
1.5
2.2
3.3
4.7
5.6
10
0.13
0.22
0.30
0.48
0.64
0.96
1.4
22.2
16.6
12.0
11.3
10.1
7.5
2
2.3
4.3
7.2
9.4
12
1764
1259
820
801
588
393
325
273
226
206
158
127
106
4
6
8
10
17
23
36
54
63
122
138
260
19
6.8
25
2.1
5.5
41
3.0
4.5
60
3.6
4.3
71
6.4
2.8
132
166
270
15
9.6
2.4
22
14
1.9
1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc, @ +25 °C
2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.25 Vrms, @ Isat, @ +25 °C
3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating
conditions verified in the end application.
4. Isat: Peak current for approximately 20% rolloff @ +25 °C
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (Gauss), K: (K-factor from table), L:
(Inductance in μH), ΔI (Peak to peak ripple current in Amps).
6. Part Number Definition: HCM0503-xxx-R
HCM0503 = Product code and size
xxx= inductance value in μH, R= decimal point ,
If no R is present then last character equals number of zeros
-R suffix = RoHS compliant
Dimensions (mm)
Recommended Pad Layout
Schematic
1.±
±±.ꢀ
ꢀ.15
typ.
ꢀ.±
max
ꢁ.ꢁ
5.15
±±.ꢀ5
1
ꢁ
ꢁ.±5
ꢁ.ꢁ
1
ꢁ
XXX
wly
R
5.1±
±±.ꢁ
1
ꢁ
ꢁ
1
1.5
±±.ꢀ±
a
b
Part marking: xxx=inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros.
wly=date code, R=revision level
All soldering surfaces to be coplanar within 0.1 millimeters
Tolerances are 0.2 millimeters unless stated otherwise
DCR measured from point “a” to point “b”
Color: Grey
Do not route traces or vias underneath the inductor
2
www.eaton.com/electronics
HCM0503
High current power inductors
Technical Data 4430
Effective June 2015
Packaging information (mm)
Supplied in tape and reel packaging, 2,000 parts per 13” diameter reel
4.0
1.5 dia
2.0
1.5 dia
A
1.75
1
7.5
16.0
± ±0.3
5.7
5.2
2
2.0
5.4
2.9
3.2
A
8.0
SECTION A – A
User direction of feed
Temperature rise vs. total loss
50
40
30
20
10
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Total Loss (W)
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3
HCM0503
High current power inductors
Technical Data 4430
Effective June 2015
Core loss vs. B
p-p
10000.0
500kHz
1000.0
100.0
10.0
1.0
300kHz
200kHz
100kHz
50kHz
25kHz
0.1
100
1000
10000
Bp-p (Gauss)
Inductance characteristics
HCM0503-R20-R
HCM0503-R35-R
110%
100%
90%
80%
70%
60%
50%
40%
110%
100%
90%
80%
70%
60%
50%
40%
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30
IDC(Amps)
IDC(Amps)
4
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HCM0503
High current power inductors
Technical Data 4430
Effective June 2015
Inductance characteristics
HCM0503-R47-R
HCM0503-R75-R
110%
100%
90%
80%
70%
60%
50%
40%
110%
100%
90%
80%
70%
60%
50%
40%
0
2
4
6
8
10 12 14 16 18 20 22 24
0
2
4
6
8
10
12
14
16
18
20
IDC(Amps)
IDC(Amps)
HCM0503-1R0-R
HCM0503-1R5-R
110%
100%
90%
80%
70%
60%
50%
40%
110%
100%
90%
80%
70%
60%
50%
40%
0
2
4
6
8
10
12
0
2
4
6
8
10
12
14
16
I
DC(Amps)
IDC(Amps)
HCM0503-2R2-R
HCM0503-3R3-R
110%
100%
90%
80%
70%
60%
50%
40%
110%
100%
90%
80%
70%
60%
50%
40%
0
1
2
3
4
5
6
7
8
9
10 11 12
0
1
2
3
4
5
6
7
8
9
10 11
I
DC(Amps)
IDC(Amps)
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5
HCM0503
High current power inductors
Technical Data 4430
Effective June 2015
Inductance characteristics
HCM0503-4R7-R
HCM0503-5R6-R
110%
100%
90%
80%
70%
60%
50%
40%
110%
100%
90%
80%
70%
60%
50%
40%
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
IDC(Amps)
IDC(Amps)
HCM0503-100-R
HCM0503-150-R
110%
100%
90%
80%
70%
60%
50%
40%
110%
100%
90%
80%
70%
60%
50%
40%
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DC(Amps)
I
IDC(Amps)
HCM0503-220-R
110%
100%
90%
80%
70%
60%
50%
40%
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
I
DC(Amps)
6
www.eaton.com/electronics
HCM0503
High current power inductors
Technical Data 4430
Effective June 2015
Solder reflow profile
TP
Table 1 - Standard SnPb Solder (T )
c
TC -5°C
tP
Volume
mm3
Volume
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Package
mm3
≥352
Thickness
<352
<2.5mm)
≥2.5mm
235°C
220°C
220°C
220°C
TL
Preheat
t
Tsmax
Table 2 - Lead (Pb) Free Solder (T )
c
Volume
mm3
Volume
Volume
mm3
Package
mm3
Tsmin
Thickness
<352
352 - ꢀ222
>ꢀ222
ts
<1.6mm
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (T
smin
)
100°C
150°C
150°C
200°C
• Temperature max. (T
)
smax
• Time (T
to T
) (t )
smax s
60-120 Seconds
60-120 Seconds
smin
to T
Average ramp up rate T
3°C/ Second Max.
3°C/ Second Max.
smax
Liquidous temperature (Tl)
Time at liquidous (t )
p
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
c
Average ramp-down rate (T to T
p
)
smax
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used
in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2015 Eaton
All Rights Reserved
Printed in USA
Eaton is a registered trademark.
Publication No. 4430 BU-SB15267
June 2015
All other trademarks are property
of their respective owners.
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