FP1208 [EATON]
High frequency, high current power inductors;型号: | FP1208 |
厂家: | Eaton All Rights Reserved. |
描述: | High frequency, high current power inductors |
文件: | 总4页 (文件大小:540K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Effective June 2017
Supersedes August 2013
Technical Data 10148
FP1208
High frequency, high current power inductors
Applications
•
•
•
•
•
•
•
Multi-phase regulators
Voltage Regulator Modules (VRMs)
Desktop and server VRMs and EVRDs
Data networking and storage systems
Graphics cards and battery power systems
Point-of-Load modules
DCR Sensing circuits
Environmental data
Product features
•
Storage temperature range (component):
-40 °C to +125 °C
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
•
12.1x8.0x8.0mm maximum surface mount
package
•
•
•
•
•
•
•
Ferrite core material
Controlled DCR for sensing circuits
Inductance range from 150nH to 250nH
Current range from 44 to 85 Amps
Halogen free, lead free, RoHS compliant
J-STD-020 (latest revision) compliant
HALOGEN
Pb
HF
FREE
FP1208
Technical Data 10148
Effective June 2017
High frequency, high current power inductors
Product Specifications
1
2
3
Part
OCL
FLL min.
(nH)
114
I
I
14
I
25
I 36
sat
(Amps)
72
DCR
rms
sat
sat
7
Number 8
(nH) 1ꢀ0
15ꢀ
(Amps)
(Amps)
85
(Amps)
79
(mΩ) @ 2ꢀ°C
K-factor
283
283
283
283
FP12ꢀ8R1-R15-R
FP12ꢀ8R1-R18-R
FP12ꢀ8R1-R21-R
FP12ꢀ8R1-R23-R
FP12ꢀ8R1-R25-R
18ꢀ
21ꢀ
23ꢀ
25ꢀ
137
16ꢀ
176
191
72
65
61
55
66
57
53
48
63
55
5ꢀ
44
5ꢀ
ꢀ.29 50
283
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1V
, 0.0Adc@25°C
5. I 2: Peak current for approximately 20% rolloff @ 85°C
sat
6. I 3: Peak current for approximately 20% rolloff @ 125°C
sat
7. K-factor: Used to determine Bp-p for core loss (see graph). B = K * L
rms
, I
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V
3. I
1
rms sat
: DC current for an approximate temperature rise of 40°C without core loss. Derating is
p-p
rms
-3
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of
other heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in
the end application.
* ∆I * 10 . B :(Gauss), K: (K-factor from table),L: (Inductance in nH),
p-p
∆I (Peak to peak ripple current in Amps).
8. Part Number Definition: FP1208Rx-Rxx-R:
- FP1208= Product code and size
- Rx= DCR indicator
4. I 1: Peak current for approximately 20% rolloff @ 25°C
sat
- Rxx= Inductance value in µH
- “-R” suffix = RoHS compliant
Dimensions- mm
DCR measured from point “a” to point “b”
Part marking: 1208Rx (Rx= DCR indicator), Rxx = Inductance value in uH (R= decimal point) wwllyy= date
code, r= revision level
Tolerances are +/- 0.15 millimeters unless stated otherwise.
PCB tolerances are +/- 0.10 millimeters unless stated otherwise.
All soldering surfaces to be be coplanar within 0.1 millimeters.
Packaging information - mm
Supplied in tape and reel packaging, 500 parts on a 13” diameter reel.
www.eaton.com/electronics
2
FP1208
Technical Data 10148
Effective June 2017
High frequency, high current power inductor
Temperature rise vs total loss
50
40
30
20
10
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Total Loss (W)
Core loss vs Bp-p
10
1
0.1
0.01
0.001
100
1000
10000
B
p-p
(Gauss)
Inductance characteristics
% of OCL vs % of I sat1
100%
80%
60%
40%
20%
-40°C
+25°C
+85°C
+125°C
0%
0%
20%
40%
60%
80%
1
100%
120%
140%
% of Isat
3
www.eaton.com/electronics
FP1208
Technical Data 10148
High frequency, high current power inductor
Effective June 2017
Solder Reflow Profile
TP
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))
cc
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Volume
mm3
<350
235°C
220°C
Volume
mm3
Package
Thickness
<2.5mm
_
>350
TL
220°C
220°C
Preheat
A
t
_
>2.5mm
Tsmax
TTaabbllee 2 - LLeeaadd ((PPbb)) Frreee SSoolldeerr ((TT ))
cc
Volume
Volume
Volume
mm3
>2000
260°C
245°C
245°C
Tsmin
mm3
mm3
ts
Package
Thickness
<1.6mm
<350
260°C
1.6 – 2.5mm 260°C
>2.5mm 250°C
350 - 2000
260°C
250°C
245°C
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020
Profile Feature
Preheat and Soak
Standard SnPb Solder Lead (Pb) Free Solder
100°C
• Temperature min. (T
)
150°C
smin
• Temperature max. (T
)
150°C
200°C
smax
) (t )
• Time (T
smin
to T
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
smax s
Average ramp up rate T
to T
smax
p
Liquidous temperature (T
Time at liquidous (t )
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
Average ramp-down rate (T to T
c
)
smax
p
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Publication No. 10148 BU-SB13927
June 2017
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