MP04DD810-30-W3 [DYNEX]
Dual Rectifier Diode Water Cooled Module Preliminary Information; 双整流二极管水冷模块初步信息
| 型号： | MP04DD810-30-W3 |
| 厂家： | 
Dynex Semiconductor |
| 描述： | Dual Rectifier Diode Water Cooled Module Preliminary Information |
| 文件： | 总9页 (文件大小：208K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MP04DD810
Dual Rectifier Diode Water Cooled Module
Preliminary Information
DS5286-2.1 June 2001
FEATURES
KEY PARAMETERS
VRRM
IF(AV)
IFSM (per arm)
IF(RMS)
Visol
3000V
812A
20000A
1276A
3000V
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (Non-toxic) Isolation Medium
APPLICATIONS
■ Power Supplies
1
2
3
■ Large IGBT Circuit 'Front Ends'
■ Rectifiers
■ Battery Chargers
Fig.1 DD circuit configuration
VOLTAGE RATINGS
Type Number
Repetitive Peak
Voltages
VDRM VRRM
V
Conditions
MP04DD810-30
MP04DD810-28
MP04DD810-26
MP04DD810-24
3000
2800
2600
2400
Tvj = –40˚ to 150˚C,
VRSM = VRRM + 100V
Lower voltage grades available
Module outline type code:
Module outline type code:
MP04-W3
MP04-W3A
ORDERING INFORMATION
Order As:
MP04DD810-XX-W2
MP04DD810-XX-W3
MP04DD810-XX-W3A
1/4 - 18 NPT connection
1/4 - 18 NPT connection
1/4 - 18 NPT water connection
thread
XX shown in the part number about represents VDRM/100
selection required, eg. MP04DD810-28-W2
Note: When ordering, please use the complete part number.
Please quote full part number in all correspondance.
Module outline type code: MP04-W2
(See Package Details for further information)
Fig. 2 Module package variants - (not to scale)
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MP04DD810
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability.
Symbol
Parameter
Mean forward current
Conditions
Half wave resistive load
4.5 Ltr/min
Max.
885
Units
Twater (in) = 25oC
Twater (in) = 40oC
IF(AV)
A
A
812
IF(RMS)
RMS value
T
water (in) = 25oC, 4.5 Ltr/min
1392
A
Twater (in) = 40oC, 4.5 Ltr/min
1276
20
A
10ms half sine; Tj = 150oC
VR = 0
IFSM
Surge (non-repetitive) forward current
kA
I2t
IFSM
I2t
I2t for fusing
2.0 x 106
16
A2s
kA
A2s
V
10ms half sine; Tj = 150oC
VR = 50% VRRM
Surge (non-repetitive) forward current
I2t for fusing
1.28 x 106
3000
Visol
Isolation voltage
Commoned terminals to base plate AC RMS, 1 min, 50Hz
THERMAL AND MECHANICAL DATA
Conditions
Min.
Max. Units
0.102 oC/W
0.106 oC/W
0.112 oC/W
Symbol
Parameter
Rth(j-w)
dc, 4.5 Ltr/min
Thermal resistance - junction to water
(per diode)
-
-
Halfwave, 4.5 Ltr/min
-
-
3 Phase, 4.5 Ltr/min
Reverse (blocking)
Tvj
Tstg
-
Virtual junction temperature
Storage temperature range
Screw torque
150
150
-
oC
oC
–40
-
Mounting - M6
6 (53)
Nm (lb.ins)
Electrical connections - M10
-
-
-
12 (106) Nm (lb.ins)
Weight (nominal)
-
Refer to
Drawing
g
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MP04DD810
CHARACTERISTICS
Symbol
Parameter
Peak reverse current
Total stored charge
Conditions
At VRRM, Tcase = 150oC
Min.
Max. Units
IRRM
QS
IRR
VTO
rT
-
-
-
-
-
50
1600
85
mA
µC
A
IF = 1000A, dIRR/dt = 3A/µs
Tcase = 150˚C, VR = 100V
Peak recovery current
Threshold voltage. See Note 1.
Slope resistance. See Note 1.
At Tvj = 150˚C
At Tvj = 150˚C
0.7
V
0.29
mΩ
Note 1: The data given in this datasheet with regard to forward voltage drop is the for the calculation of the power dissipation in
the semiconductor elements only. Forward voltage drops measured at the power terminals will be in excess of these figures due to
the impedance of the busbars from the terminals to the semiconductor.
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MP04DD810
CURVES
2500
2200
2000
1800
1600
1400
1200
1000
800
Measured under pulse
conditions
2000
1500
1000
500
0
Tj = 150˚C
Tj = 25˚C
600
30°
60°
90°
400
120°
180°
DC
200
0
0
200 400 600 800 1000 1200 1400 1600 1800
Forward current, (Average, per arm) IF(AV) - (A)
0.5
0.75
1.0
1.25
1.5
Instantaneous forward voltage VF - (V)
Fig.3 Maximum (limit) forward characteristics
Fig.4 Power dissipation curves
10000
1000
100
1000
Conditions:
Tj = 150˚C
VR = 100V
IF = 1000A
Conditions:
Tj = 150˚C
VR = 100V
IF = 1000A
100
IF
QS
dIF/dt
IRR
10
0.1
1.0
10
100
1.0
10
100
Rate of decay of on-state current dIF/dt - (A/µs)
Rate of decay of forward current dIF/dt - (A/µs)
Fig.6 Maximum reverse recovery current
Fig.5 Maximum stored charge
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MP04DD810
0.12
0.1
35
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
I2t = Î2 x t
2
30
25
20
15
0.08
0.06
0.04
0.02
I2t
10
5
0
1
10
1
2
3
5
10 20
50
0
ms
Cycles at 50Hz
0.001
0.01
0.1
1
10
100
1000
Time (Seconds)
Duration
Fig.8 Transient thermal impedance - dc
Fig.7 Surge (non-repetitive) forward current vs time
(with 50% VRRM @ Tc - 150˚C)
100
90
80
70
60
50
40
30
20
10
0
30°
60°
90°
120°
180°
DC
100 200 300 400 500 600 700 800 900 1000 1100
Forward current (Average, per arm), IF(AV) - (A)
Fig. 9 Maximum permissible water inlet temperature vs on-state
current at specified conduction angles, sine wave 50/60Hz
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MP04DD810
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2060g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W2
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MP04DD810
PACKAGE DETAILS
Forfurtherpackageinformation, please visitourwebsiteorcontactyournearestCustomerServiceCentre. Alldimensionsinmm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2060g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W3
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MP04DD810
PACKAGE DETAILS
Forfurtherpackageinformation,please visitourwebsiteorcontactyournearestCustomerServiceCentre. Alldimensionsinmm,unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2530g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W3A
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MP04DD810
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise
the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is
available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
CUSTOMER SERVICE CENTRES
Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Fax: 00-44-(0)1522-500550
Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5286-2 Issue No. 2.1 June 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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