MP03G260-12 [DYNEX]
Rectifier Diode, 1 Phase, 2 Element, 267A, 1200V V(RRM), Silicon, MP03, 3 PIN;型号: | MP03G260-12 |
厂家: | Dynex Semiconductor |
描述: | Rectifier Diode, 1 Phase, 2 Element, 267A, 1200V V(RRM), Silicon, MP03, 3 PIN |
文件: | 总9页 (文件大小:94K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MP03 XX 260 Series
Dual Diode Modules
Replaces December 1998 version, DS5104-2.0
DS5104-3.0 January 2000
FEATURES
KEY PARAMETERS
VRRM
IFSM
IF(AV) (per arm)
Visol
1600V
8100A
267A
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (non-toxic) Isolation Medium
2500V
CIRCUIT OPTIONS
Code
Circuit
APPLICATIONS
HB
■ Rectifier Bridges
■ DC Power Bridges
■ Plating Rectifiers
■ Traction Systems
G
GN
VOLTAGE RATINGS
Conditions
Type
Number
Repetitive
Peak
PACKAGE OUTLINE
Voltages
VRRM
MP03/260-16
MP03/260-14
MP03/260-12
MP03/260-10
1600
1400
1200
1000
Tvj = 150oC
IRM = 30mA
VRSM = VRRM + 100V
Lower voltage grades available. For full description of part
numbers see "Ordering instructions" on page 3.
Module outline type code: MP03.
See Package Details for further information.
CURRENT RATINGS - PER ARM
Max.
267
240
235
Parameter
Conditions
Units
Symbol
Tcase = 75oC
case = 85oC
A
T
A
A
IF(AV)
Mean forward current
Halfwave, resistive load
Tcase = 75oC
Theatsink = 75oC
Theatsink = 85oC
211
420
A
A
IF(RMS)
RMS value
1/9
MP03 XX 260 Series
SURGE RATINGS - PER ARM
Symbol
Parameter
Units
A
Conditions
Max.
VR = 0
8100
10ms half sine;
IFSM
Surge (non-repetitive) forward current
I2t for fusing
Tj = 150˚C
A
VR = 50% VRRM
VR = 0
6500
A2s
328000
10ms half sine;
Tj = 150˚C
I2t
VR = 50% VRRM
A2s
211000
THERMAL & MECHANICAL RATINGS
Parameter
Max.
0.21
0.22
Symbol
Conditions
Units
oC/W
dc
Thermal resistance - junction to case
per Diode
Rth(j-c)
halfwave
3 phase
oC/W
oC/W
0.23
Thermal resistance - case to heatsink
per Diode
Mounting torque = 5Nm
with mounting compound
oC/W
oC
Rth(c-hs)
0.05
150
Tvj
Virtual junction temperature
Storage temperature range
-40 to 150 oC
Tsto
Commoned terminals to base plate
AC RMS, 1min, 50Hz
Isolation voltage
2.5
Visol
kV
CHARACTERISTICS
Symbol
Parameter
Max.
1.3
Conditions
At 600A, Tcase = 25oC
At VRRM, Tj = 150oC
At Tvj = 150oC
Units
V
VFM
IRM
VTO
rT
Forward voltage
Peak reverse current
30
mA
V
Threshold voltage
0.84
0.667
On-state slope resistance
At Tvj = 150oC
mΩ
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MP03 XX 260 Series
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP03 HB 260 - 16
MP = Pressure contact module
03
= Outline type
HB = Circuit configuration code (see "circuit options" - front page)
260 = Nominal average current rating at Tcase = 75oC
16
Examples:
MP03 HB260-10
= VRRM/100
MP03 G260-14
MP023GN260-12
Note: Preferred type is HB configuration. G & GN types are available for specific applications, only when requested.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of VTO and rT
informationinaccordancewithstandardformulae.Wecan
provide assistance with calculations or choice of heatsink
if required.
An even coating of thermal compound (eg. Unial) should be
appliedtoboth theheatsinkandmodulemountingsurfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 5Nm (44lb.ins) is reached at both ends.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.
Immediatelypriortomounting,theheatsinksurfaceshould
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should
be taken to ensure no foreign particles remain.
It is not acceptable to fully tighten one fixing bolt before
startingtotightentheothers. SuchactionmayDAMAGEthe
module.
3/9
MP03 XX 260 Series
CURVES
2500
2000
1500
1000
500
Tj = 150˚C
0
0.5
1.0
1.5
2.0
Instantaneous forward voltage IF - (V)
Fig. 1 Maximum (limit) forward characteristics (Per diode)
0.3
0.2
0.1
Rth(j-hs)
Rth(j-c)
0
0.001
0.010
0.100
1.0
10
100
Time - (s)
Fig. 2 Transient thermal impedance (DC) - (Per diode)
4/9
MP03 XX 260 Series
15000
12500
10000
7500
5000
2500
0
22
20
18
16
14
12
10
I2t
1
10
1
2 3
cycles at 50Hz
Duration
Fig. 3 Surge (non-repetitive) forward current vs time (with 0% VRRM, Tcase = 150˚C)
5
10 20 30 50
ms
5/9
MP03 XX 260 Series
500
450
400
350
300
250
200
150
100
50
d.c.
180˚ Rectangular
180˚ Sine
120˚ Rectangular
60˚ Rectangular
0
0
50
100
150
200
250
300
350
400 425
Mean forward current - (A)
Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz
160
140
120
100
80
d.c.
60
40
20
0
0
50
100
150
200
250
300
350
400 425
Forward current - (A)
Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz
6/9
MP03 XX 260 Series
1400
1200
1000
800
600
400
200
0
0.04
0.08
0.02
R- Load
L- Load
0.01 Rth(hs-a) ˚C/W
0.10
0.12
0.15
0.20
0.30
0.40
0
20
40
60
80 100 120 140
0
200
400
600
D.C. output current - (A)
Maximum ambient temperature - (˚C)
Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
1400
1200
0.08
0.04 0.02
Rth(hs-a) ˚C/W
0.01
R & L - Load
1000
800
600
400
200
0
0.10
0.12
0.15
0.20
0.30
0.40
0
20
40
60
80 100 120 140 160
0
200
400 500
D.C. output current - (A)
Maximum ambient temperature - (˚C)
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various
values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
7/9
MP03 XX 260 Series
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
42.5
35
28.5
4 holes Ø5.5
5
80
2
3
2x M8
1
92
Recommended fixings for mounting:
Recommended mounting torque:
M5 socket head cap screws.
5Nm (44lb.ins)
Recommended torque for electrical connections: 8Nm (70lb.ins)
Maximum torque for electrical connections:
Nominal weight: 950g
9Nm (80lb.ins)
Module outline type code: MP03
CIRCUIT CONFIGURATIONS
1
1
2
3
3
HB
2
G
1
2
3
GN
8/9
MP03 XX 260 Series
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e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE CENTRES
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Doddington Road, Lincoln.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
SALES OFFICES
Fax: 00-44-(0)1522-500550
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
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UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS5104-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
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