MF35 [DYNEX]

Fast Recovery Diode; 快恢复二极管
MF35
型号: MF35
厂家: Dynex Semiconductor    Dynex Semiconductor
描述:

Fast Recovery Diode
快恢复二极管

二极管 快恢复二极管
文件: 总8页 (文件大小:72K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MF35  
Fast Recovery Diode  
Replaces March 1998 version, DS4625-3.1  
DSDS4625-4.0 January 2000  
APPLICATIONS  
KEY PARAMETERS  
VRRM  
IF(AV)  
IFSM  
Qr  
1200V  
40A  
400A  
10µC  
0.2ns  
Inverse, Parallel Or Series Connected Diode  
Power Supplies  
High Frequency Applications  
trr  
FEATURES  
Glass Passivation  
High Voltage Capability  
Fast Recovery Characteristics  
VOLTAGE RATINGS  
Type Number  
Repetitive Peak  
Conditions  
Reverse Voltage  
VRRM  
V
MF35 - 1200  
MF35 - 1000  
MF35 - 800  
MF35 - 600  
VRSM = VRRM +100V  
1200  
1000  
800  
600  
Lower voltage grades available.  
For stud anode add suffix 'R' to type number. e.g. MF35-1200R.  
Outline type code: DO5.  
See Package Details for further information.  
CURRENT RATINGS  
Symbol  
IF(AV)  
Parameter  
Mean forward current  
Conditions  
Max.  
40  
Units  
Half sine wave resistive load, Tcase = 65oC  
A
A
IF(RMS)  
RMS value  
T
case = 65oC  
case = 65oC  
63  
IF  
Continuous (direct) forward current  
T
50  
A
1/8  
MF35  
SURGE RATINGS  
Conditions  
Symbol  
Parameter  
Max.  
400  
Units  
A
10ms half sine; with VRRM 10V, Tj = 125oC  
10ms half sine; Tj = 125oC  
IFSM  
I2t  
Surge (non-repetitive) forward current  
I2t for fusing  
800  
A2s  
THERMAL AND MECHANICAL DATA  
Conditions  
Min.  
Max. Units  
Parameter  
Symbol  
Rth(j-c)  
oC/W  
oC/W  
dc  
-
-
0.8  
0.2  
Thermal resistance - junction to case  
Thermal resistance - case to heatsink  
Mounting torque 3.5Nm  
with mounting compound  
Rth(c-h)  
Forward (conducting)  
Reverse (blocking)  
-
125  
125  
125  
3.8  
oC  
oC  
Tvj  
Virtual junction temperature  
-
˚C  
Tstg  
-
Storage temperature range  
Mounting torque  
-55  
3.2  
Nm  
CHARACTERISTICS  
Symbol  
Typ.  
Units  
Parameter  
Conditions  
At 120A peak, Tcase = 25oC  
At VRRM, Tcase = 100oC  
Max.  
2.0  
5
VFM  
IRM  
trr  
Forward voltage  
Peak reverse current  
-
-
-
V
mA  
IF = 1A, diRR/dt = 25A/µs, Tcase = 25˚C,  
VR = 100V  
Reverse recovery time  
Recovered charge  
200  
ns  
IF = 50A, diRR/dt = 50A/µs, Tcase = 25˚C,  
VR = 100V  
QR  
-
10  
µC  
At Tvj = 125oC  
At Tvj = 125oC  
-
-
1.2  
7.0  
V
VTO  
rT  
Threshold voltage  
Slope resistance  
mΩ  
2/8  
MF35  
CURVES  
80  
60  
40  
20  
0
200  
Measured under pulse  
conditions  
Tcase = 25˚C  
95%  
5%  
Tj = 25˚C  
150  
100  
50  
Tj = 125˚C  
0
0
200 400 600 800 1000 1200  
Rate of rise of forward current - (A/µs)  
0
1.0  
2.0  
3.0  
Instantaneous forward voltage - (V)  
Fig.1 Maximum (limit) forward characteristics  
Fig.2 Forward recovery voltage vs rate of rise of forward  
voltage  
1.00  
0.75  
0.50  
0.25  
0
400  
350  
300  
250  
200  
Tcase = 125˚C  
VR = VRRM  
d.c.  
1
2
3 45  
10  
50  
0.001  
0.01  
0.1  
Time - (s)  
1.0  
10  
Cycles at 50Hz  
Duration  
Fig.3 Surge (non-repetitive) forward current vs time  
Fig.4 Maximum transient thermal impedance  
3/8  
MF35  
1200  
1000  
800  
Tcase = 125˚C (No snubber)  
IF = 100A  
IF = 50A  
600  
IF = 10A  
400  
200  
1000  
1
10  
100  
Rate of rise of reverse current - (A/µs)  
Fig.5 Recovery time vs dIR/dt  
60  
50  
40  
30  
20  
10  
0
Tcase = 125˚C (No snubber)  
IF = 100A  
IF = 50A  
IF = 10A  
1000  
1
10  
100  
Rate of change of reverse current - (A/µs)  
Fig.6 Peak reverse current vs dIR/dt  
20  
18  
16  
14  
12  
10  
8
IF = 100A  
IF = 50A  
Tcase = 125˚C (No snubber)  
IF = 10A  
6
4
2
0
1000  
1
10  
100  
Rate of change of reverse current - (A/µs)  
Fig.7 Recovered charge vs dIR/dt  
4/8  
MF35  
500  
100  
Tcase = 65˚  
10  
10  
100 1000  
Pulse width - (µs)  
10000  
Fig.8 Frequency curves - square waveform  
500  
100  
Tcase = 85˚  
50Hz  
100  
10000  
5000  
2500  
1000  
500 300  
10  
10  
100 1000  
Pulse width - (µs)  
10000  
Fig.9 Frequency curves - square waveform  
500  
100  
0.05 0.1 0.2  
0.5 1.0  
2.0J  
10  
10  
100 1000  
Pulse width - (µs)  
10000  
Fig.10 Energy per pulse - square waveform  
5/8  
MF35  
500  
100  
Tcase = 65˚  
10  
10  
100 1000  
Pulse width - (µs)  
10000  
Fig.11 Frequency curves - sine waveform  
500  
100  
Tcase = 85˚  
10  
10  
100 1000  
Pulse width - (µs)  
10000  
Fig.12 Frequency curves - sine waveform  
500  
100  
0.05 0.1  
0.2  
0.5 1.0  
2.0J  
10  
10  
100 1000  
Pulse width - (µs)  
10000  
Fig.13 Energy per pulse - sine waveform  
6/8  
MF35  
PACKAGE DETAILS  
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.  
DO NOT SCALE.  
Hex. 17.35mm AF max  
Ø4.0  
Thread 1/4 in  
28 UNF 2A  
Weight: 20g  
Package outline type code: DO5  
ASSOCIATED PUBLICATIONS  
Title  
Application Note  
Number  
Calculating the junction temperature or power semiconductors  
Thyristor and diode measurement with a multi-meter  
Use of VTO, rT on-state characteristic  
AN4506  
AN4853  
AN5001  
7/8  
MF35  
POWER ASSEMBLY CAPABILITY  
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-  
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and  
current capability of our semiconductors.  
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The  
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of  
our customers.  
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete  
solution (PACs).  
HEATSINKS  
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the  
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on  
request.  
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the  
factory.  
http://www.dynexsemi.com  
e-mail: power_solutions@dynexsemi.com  
HEADQUARTERS OPERATIONS  
CUSTOMER SERVICE CENTRES  
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50  
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444  
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020  
DYNEX SEMICONDUCTOR LTD  
Doddington Road, Lincoln.  
Lincolnshire. LN6 3LF. United Kingdom.  
Tel: 00-44-(0)1522-500500  
SALES OFFICES  
Fax: 00-44-(0)1522-500550  
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50  
Germany Tel: 07351 827723  
DYNEX POWER INC.  
Unit 7 - 58 Antares Drive,  
Nepean, Ontario, Canada K2E 7W6.  
Tel: 613.723.7035  
Fax: 613.723.1518  
Toll Free: 1.888.33.DYNEX (39639)  
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /  
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.  
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020  
These offices are supported by Representatives and Distributors in many countries world-wide.  
© Dynex Semiconductor 2000 Publication No. DS4625-4 Issue No. 4.0 January 2000  
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM  
Datasheet Annotations:  
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-  
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.  
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.  
Advance Information: The product design is complete and final characterisation for volume production is well in hand.  
No Annotation: The product parameters are fixed and the product is available to datasheet specification.  
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as  
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves  
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such  
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication  
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury  
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.  
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.  
8/8  

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