DS2002SF14 [DYNEX]
Rectifier Diode; 整流器器二极管
| 型号： | DS2002SF14 |
| 厂家： | 
Dynex Semiconductor |
| 描述： | Rectifier Diode |
| 文件： | 总7页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS2002SF
Rectifier Diode
Replaces September 2001 version, DS4178-5.0
DS4178-5.1 December 2001
APPLICATIONS
■ Rectification
KEY PARAMETERS
VRRM 1800V
■ Freewheel Diode
■ DC Motor Control
■ Power Supplies
■ Welding
IF(AV) 2996A
IFSM 41250A
■ Battery Chargers
FEATURES
■ Double Side Cooling
■ High Surge Capability
VOLTAGE RATINGS
Type Number
Repetitive Peak
Conditions
Reverse Voltage
VRRM
V
DS2002SF18
DS2002SF17
DS2002SF16
DS2002SF15
DS2002SF14
DS2002SF13
VRSM = VRRM + 100V
1800
1700
1600
1500
1400
1300
Outline type code: F
See Package Details for further information.
Fig. 1 Package outline
Lower voltage grades available.
ORDERING INFORMATION
When ordering, select the required part number shown in the
Voltage Ratings selection table, e.g.:
DS2002SF16
Note: Please use the complete part number when ordering
and quote this number in any future correspondance relating
to your order.
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DS2002SF
CURRENT RATINGS
Tcase = 75oC unless otherwise stated
Symbol
Parameter
Conditions
Max.
Units
Double Side Cooled
IF(AV)
IF(RMS)
IF
Mean forward current
Half wave resistive load
2996
4707
4122
A
A
A
RMS value
-
-
Continuous (direct) forward current
Single Side Cooled (Anode side)
IF(AV)
IF(RMS)
IF
Mean forward current
RMS value
Half wave resistive load
2093
3288
2693
A
A
A
-
-
Continuous (direct) forward current
T
case = 100oC unless otherwise stated
Symbol
Parameter
Conditions
Max.
Units
Double Side Cooled
IF(AV)
IF(RMS)
IF
Mean forward current
RMS value
Continuous (direct) forward current
Half wave resistive load
2320
3644
3300
A
A
A
-
-
Single Side Cooled (Anode side)
IF(AV)
IF(RMS)
IF
Mean forward current
RMS value
Half wave resistive load
1345
2110
1630
A
A
A
-
-
Continuous (direct) forward current
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DS2002SF
SURGE RATINGS
Symbol
Parameter
Conditions
10ms half sine; Tcase = 175oC
VR = 50% VRRM - 1/4 sine
10ms half sine; Tcase = 175oC
VR = 0
Max.
33.0
Units
kA
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
5.44 x 106
41.25
A2s
kA
Surge (non-repetitive) forward current
I2t for fusing
IFSM
I2t
8.5 x 106
A2s
THERMAL AND MECHANICAL DATA
Conditions
Min.
Max. Units
0.022 oC/W
0.038 oC/W
Parameter
Symbol
dc
Double side cooled
-
-
Rth(j-c)
Anode dc
Thermal resistance - junction to case
Single side cooled
Cathode dc
Double side
-
0.052 oC/W
0.004 oC/W
-
Clamping force 19.5kN
with mounting compound
Thermal resistance - case to heatsink
Virtual junction temperature
Rth(c-h)
Single side
-
-
0.008
185
oC/W
oC
Forward (conducting)
Reverse (blocking)
Tvj
-
oC
175
Tstg
-
Storage temperature range
Clamping force
-55
200
oC
18.0
22.0
kN
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DS2002SF
CHARACTERISTICS
Symbol
Parameter
Forward voltage
Peak reverse current
Conditions
At 3400A peak, Tcase = 25oC
At VRRM, Tcase = 175oC
Min.
Max. Units
VFM
IRRM
QS
IRR
-
-
-
-
-
-
1.18
50
V
mA
µC
A
1500
90
Total stored charge
Peak recovery current
Threshold voltage
Slope resistance
IF = 2000A, dIRR/dt = 3A/µs
T
case = 175˚C, VR = 100V
VTO
rT
At Tvj = 175˚C
At Tvj = 175˚C
0.74
0.088
V
mΩ
CURVES
8000
6000
5000
4000
3000
2000
1000
Measured under pulse conditions
6000
4000
2000
0
Tj = 175˚C
Tj = 25˚C
dc
Half wave
3 phase
6 phase
0
0
0.5
1.0
1.5
2.0
5000
1000
2000
3000
4000
Instantaneous forward voltage, VF - (V)
Mean forward current, IF(AV) - (A)
Fig.2 Maximum (limit) forward characteristics
VFM Equation:-
FM = A + Bln (IF) + C.IF+D.√IF
Fig.3 Dissipation curves
Where
A = –0.64773
B = 0.268581
C = 0.00016
D = –0.01796
V
these values are valid for Tj = 125˚C for IF 500A to 8000A
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DS2002SF
10000
1000
100
1000
100
10
Conditions:
Tj = 175˚C
Conditions:
Tj = 175˚C
V
R = 100V
V
R = 100V
IF = 2000A
IF = 2000A
I
F
Q
S
dI /dt
F
I
RM
1.0
10
100
0.1
1.0
10
100
Rate of decay of forward current dIF/dt - (A/µs)
Rate of decay of forward current, dIF/dt - (A/µs)
Fig.4 Total stored charge
Fig.5 Maximum reverse recovery current
60
50
40
30
20
10
0
0.1
I2t = Î2 x t
2
Anode side cooled
6
5
Double side cooled
0.01
I2t
4
3
2
Effective thermal resistance
Junction to case ˚C/W
Conduction
Double side
0.022
Single side
0.038
d.c.
Halfwave
3 phase 120˚
6 phase 60˚
0.024
0.040
0.026
0.042
1
50
0.027
0.043
0.001
1
10
1
2
3
5
10 20
Cycles at 50Hz
Duration
0.001
0.01
0.1
1.0
10
ms
Time - (s)
Fig.6 Surge (non-repetitive) forward current vs time (with
50% VRRM at Tcase 175˚C)
Fig.7 Maximum (limit) transient thermal impedance -
junction to case
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DS2002SF
PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Hole Ø3.6x2.0 deep (in both electrodes)
Cathode
Ø76 max
Ø48 nom
Ø48 nom
Anode
Nominal weight: 450g
Clamping force: 19.6kN ± 10%
Package outline type code: F
Note:
1. Package maybe supplied with pins and/or tags.
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DS2002SF
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,
and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current
capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our
customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution
(PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded
clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance
or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer
Services.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Fax: 00-44-(0)1522-500550
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS4187-5 Issue No. 5.1 December 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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