DF45106 [DYNEX]
Fast Recovery Diode; 快恢复二极管
| 型号： | DF45106 |
| 厂家： | 
Dynex Semiconductor |
| 描述： | Fast Recovery Diode |
| 文件： | 总8页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DF451
Fast Recovery Diode
Replaces March 1999 version, DS4142-4.0
DS4143-5.0 January 2000
FEATURES
KEY PARAMETERS
VRRM
IF(AV)
IFSM
Qr
1600V
295A
3500A
■ Double Side Cooling
■ High Surge Capability
■ Low Recovery Charge
25µC
trr
1.22µs
Applications
■ Induction Heating
■ A.C. Motor Drives
■ Inverters And Choppers
■ Welding
■ High Frequency Rectification
■ UPS
Voltage Ratings
Type Number
Repetitive Peak
Conditions
Reverse Voltage
Outline type code: M771.
See Package Details for further information.
VRRM
V
DF451 16
DF451 14
DF451 12
DF451 10
DF451 08
DF451 06
VRSM = VRRM + 100V
1600
1400
1200
1000
800
600
CURRENT RATINGS
Max.
Units
Symbol
Parameter
Conditions
Double Side Cooled
IF(AV)
Half wave resistive load, Tcase = 65oC
Tcase = 65oC
295
543
391
A
A
A
Mean forward current
RMS value
Continuous (direct) forward current
Single Side Cooled (Anode side)
IF(RMS)
IF
T
case = 65oC
IF(AV)
IF(RMS)
IF
Mean forward current
RMS value
Half wave resistive load, Tcase = 65oC
case = 65oC
Tcase = 65oC
220
348
285
A
A
A
T
Continuous (direct) forward current
DF451
SURGE RATINGS
Conditions
Symbol
Parameter
Max.
Units
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
3.5
kA
10ms half sine; with 0% VRRM, Tj = 150oC
61.25 x 103 A2s
2.8 kA
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
10ms half sine; with 50% VRRM, Tj = 150oC
39.2 x 103 A2s
THERMAL AND MECHANICAL DATA
Conditions
-
-
-
Max. Units
Parameter
Symbol
dc
0.07
oC/W
Double side cooled
Rth(j-c)
0.133 oC/W
0.147 oC/W
Thermal resistance - junction to case
Anode dc
Single side cooled
-
-
-
Cathode dc
0.02
0.02
oC/W
oC/W
Double side
Clamping force 5.0kN
with mounting compound
Thermal resistance - case to heatsink
Rth(c-h)
Single side
oC
oC
kN
Tvj
Tstg
-
Forward (conducting)
-
150
150
Virtual junction temperature
Storage temperature range
–55
Clamping force
4.5
5.5
CHARACTERISTICS
Symbol
Typ.
Units
Parameter
Conditions
At 600A peak, Tcase = 25oC
At VRRM, Tcase = 125oC
Max.
2.65
100
VFM
IRRM
trr
Forward voltage
Peak reverse current
-
-
V
mA
µs
Reverse recovery time
1.22
-
QRA1
IRM
K
Recovered charge (50% chord)
Reverse recovery current
Soft factor
IF = 500A, diRR/dt = -80A/µs
-
-
25
40
-
µC
A
Tcase = 125oC, VR = 100V
1.7
-
VTO
rT
Threshold voltage
At Tvj = 125oC
-
-
-
1.6
1.5
40
V
mΩ
V
Slope resistance
At Tvj = 125oC
VFRM
Forward recovery voltage
di/dt = 1000A/µs, Tj = 125oC
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DF451
DEFINITION OF K FACTOR AND QRA1
QRA1 = 0.5x IRR(t1 + t2)
dIR/dt
k = t1/t2
t1
t2
τ
0.5x IRR
IRR
CURVES
3000
2500
2000
1500
1000
500
Measured under pulse conditions
Tj = 150˚C
Tj = 25˚C
2.0
3.0
4.0
5.0
6.0
Instantaneous forward voltage, VF - (V)
Fig.1 Maximum (limit) forward characteristics
3/8
DF451
500
400
300
200
100
0
Measured under pulse conditions
Tj = 150˚C
Tj = 25˚C
1.25
1.5
1.75
2.0
2.25
Instantaneous forward voltage, VF - (V)
Fig.2 Maximum (limit) forward characteristics
4/8
DF451
1000
100
10
50µs
Conditions:
Tj = 125˚C,
IF
QS
=
∫
0
V
R = 100V
QS
tp = 1ms
dIR/dt
IF = 2000A
IF = 1000A
IF = 500A
IRR
IF = 200A
IF = 100A
1
1
10
100
1000
Rate of rise of reverse current, dIR/dt - (A/µs)
Fig.3 Recovered charge
1000
Conditions:
Tj = 125˚C,
R = 100V
V
IF = 2000A
IF = 1000A
IF = 500A
100
10
1
I
= 100A
F
1
10
100
1000
Rate of rise of reverse current, dIR/dt - (A/µs)
Fig.4 Typical reverse recovery current vs rate of rise of forward current
5/8
DF451
0.1
d.c. Double side cooled
0.01
0.001
0.01
0.1
1
10
100
Time - (s)
Fig.5 Maximum (limit) transient thermal impedance - junction to case - (˚C/W)
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
2 holes Ø3.6 x 2.0 deep
(One in each electrode)
Cathode
Ø42 max
Ø19 nom
Ø19 nom
Anode
Nominal weight: 50g
Clamping force: 5kN ±10%
Package outine type code: M771
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DF451
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
Calculating the junction temperature or power semiconductors
Recommendations for clamping power semiconductors
Thyristor and diode measurement with a multi-meter
Use of VTO, rT on-state characteristic
AN4506
AN4839
AN4853
AN5001
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-
loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
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DF451
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
SALES OFFICES
Fax: 00-44-(0)1522-500550
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4143-5 Issue No. 5.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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