BAT46W [DIOTEC]

Surface Mount Schottky Barrier Diodes; 表面贴装肖特基势垒二极管
BAT46W
型号: BAT46W
厂家: DIOTEC SEMICONDUCTOR    DIOTEC SEMICONDUCTOR
描述:

Surface Mount Schottky Barrier Diodes
表面贴装肖特基势垒二极管

二极管
文件: 总2页 (文件大小:104K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BAT46W  
BAT46W  
Surface Mount Schottky Barrier Diodes  
Schottky-Barrier-Dioden für die Oberflächenmontage  
Version 2009-10-29  
Power dissipation – Verlustleistung  
200 mW  
100 V  
Repetitive peak reverse voltage  
Periodische Spitzensperrspannung  
2.7  
Plastic case – Kunststoffgehäuse  
Weight approx. – Gewicht ca.  
SOD-123  
0.01 g  
0.6  
0.1  
Type  
Code  
Plastic material has UL classification 94V-0  
Gehäusematerial UL94V-0 klassifiziert  
3.8  
Standard packaging taped and reeled  
Dimensions - Maße [mm]  
Standard Lieferform gegurtet auf Rolle  
Maximum ratings (TA = 25°C)  
Grenzwerte (TA = 25°C)  
BAT46W  
Power dissipation − Verlustleistung  
Ptot  
IFAV  
IFRM  
IFSM  
200 mW 1)  
Max. average forward current – Dauergrenzstrom (dc)  
150 mA 1)  
Repetitive peak forward current – Periodischer Spitzenstrom  
350 mA 1)  
Non repetitive peak forward surge current  
Stoßstrom-Grenzwert  
tp ≤ 10 ms  
750 mA  
Repetitive peak reverse voltage – Periodische Spitzensperrspannung  
VRRM  
100 V  
Junction temperature – Sperrschichttemperatur  
Storage temperature – Lagerungstemperatur  
Tj  
TS  
-55...+125°C  
-55…+150°C  
Characteristics (Tj = 25°C)  
Kennwerte (Tj = 25°C)  
Forward voltage  
Durchlass-Spannung  
IF = 0.1 mA  
IF = 10 mA  
IF = 250 mA  
VF  
VF  
VF  
< 0.25 V  
< 0.45 V  
< 1 V  
Leakage current – Sperrstrom 2)  
Leakage current – Sperrstrom 2)  
VR = 1.5 V  
VR = 10 V  
VR = 50 V  
VR = 75 V  
IR  
IR  
IR  
IR  
< 0.5 µA  
< 0.8 µA  
< 2 µA  
< 5 µA  
Tj = 60°C  
f = 1 Mhz  
VR = 1.5 V  
VR = 10 V  
VR = 50 V  
VR = 75 V  
IR  
IR  
IR  
IR  
< 5 µA  
< 7.5 µA  
< 15 µA  
< 20 µA  
Total capacitance  
Gesamtkapazität  
VR = 0 V  
VR = 1 V  
CT  
CT  
typ. 20 pF  
typ. 12 pF  
Thermal resistance junction to ambient air  
Wärmewiderstand Sperrschicht – umgebende Luft  
RthA  
< 420 K/W 1)  
1
Mounted on P.C. board with 3 mm2 copper pad at each terminal  
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss  
Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2%  
2
© Diotec Semiconductor AG  
http://www.diotec.com/  
1
 
 
BAT46W  
Marking – Stempelung  
BAT46W = XH  
1
120  
[%]  
[A]  
100  
10-1  
10-2  
80  
Tj = 125°C  
60  
40  
Tj = 25°C  
10-3  
IF  
20  
IFAV  
0
10-4  
VF  
0
0.4 0.6 0.8 1.0 [V] 1.4  
0
TA  
100  
150  
50  
[°C]  
Rated forward current versus ambient temperature1)  
Forward characteristics (typical values)  
Durchlasskennlinien (typische Werte)  
Zul. Richtstrom in Abh. von der Umgebungstemp.1)  
2
http://www.diotec.com/  
© Diotec Semiconductor AG  

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