S1G-13-F [DIODES]

Rectifier Diode, 1 Element, 1A, 400V V(RRM), Silicon, GREEN, PLASTIC, SMA, 2 PIN;


型号：	S1G-13-F
厂家：	DIODES INCORPORATED
描述：	Rectifier Diode, 1 Element, 1A, 400V V(RRM), Silicon, GREEN, PLASTIC, SMA, 2 PIN 整流二极管光电二极管
文件：	总4页 (文件大小：101K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

S1A/B - S1M/B

Green

1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER

Features

Mechanical Data

•

Glass Passivated Die Construction for High Reliability

Surge Overload Rating to 30A Peak

Ideally Suited for Automated Assembly

Lead Free Finish/RoHS Compliant (Note 1)

Green Molding Compound (No Halogen and Antimony)

(Note 2)

•

Case: SMA/SMB

Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminals: Lead Free Plating (Matte Tin Finish). Solderable per

MIL-STD-202, Method 208

•

Polarity: Cathode Band or Cathode Notch

Weight: SMA - 0.064 grams (approximate)

SMB - 0.093 grams (approximate)

•

Qualified to AEC-Q101 Standards for High Reliability

Top View

Bottom View

Ordering Information (Note 3)

Part Number

S1x-13-F

S1xB-13-F

Qualification

Commercial

Case

SMA

SMB

Packaging

5000/Tape & Reel

3000/Tape & Reel

* x = Device type, e.g. S1A-13-F (SMA package); S1AB-13-F (SMB package).

Notes:

1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.

2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.

3. For packaging details, go to our website at http://www.diodes.com.

Marking Information

XXX = Product type marking code, ex: S1A (SMA package)

XXXX = Product type marking code, ex: S1AB (SMB package)

= Manufacturers’ code marking

YWW = Date code marking

Y = Last digit of year (ex: 2 for 2002)

YWW

xxx(x)

WW = Week code (01 to 53)

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October 2011

S1A/B - S1M/B

Document number: DS16003 Rev. 22 - 2

S1A/B - S1M/B

Maximum Ratings @T = 25°C unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitance load, derate current by 20%.

Characteristic

Symbol

Unit

A/AB B/BB D/DB G/GB J/JB

K/KB M/MB

V_RRM

V_RWM

V_R

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

100

200

140

400

600

420

800

560

1000

700

RMS Reverse Voltage

280

1.0

V_R(RMS)

I_O

Average Rectified Output Current

@ T_T= 100°C

Non-Repetitive Peak Forward Surge Current

8.3ms Single half sine-wave superimposed on rated load

I_FSM

Thermal Characteristics

Characteristic

Typical Thermal Resistance, Junction to Terminal (Note 4)

Operating and Storage Temperature Range

Symbol

R_θ

Value

Unit

°C/W

°C

-65 to +150

T_J,T_STG

Electrical Characteristics @T = 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

1.1

Forward Voltage

@ I_F= 1.0A

@ T_A25°C

@ T_A= 125°C

V_FM

Peak Reverse Leakage Current

at Rated DC Blocking Voltage

Reverse Recovery Time (Note 5)

5.0

100

I_RM

μA

1.8

3.0

t_rr

μs

Typical Total Capacitance

(Note 6)

C_T

Notes:

4. Thermal resistance junction to terminal, unit mounted on PC board with 5.0 mm²(0.013 mm thick) copper pads as heat sink.

5. Measured with I_F= 0.5A, I_R= 1.0A, I_RR= 0.25A.

6. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.

1.0

0.1

0.8

0.6

0.4

0.2

Resistive or

inductive load

0.01

0.4

0.8

1.2

1.6

80 100

120

140

160 180

Fig. 1 Forward Current Derating Curve

V_F, INSTANTANEOUS FORWARD VOLTAGE (V)

Fig. 2 Typical Forward Characteristics

T_T, TERMINAL TEMPERATURE (

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October 2011

S1A/B - S1M/B

Document number: DS16003 Rev. 22 - 2

S1A/B - S1M/B

1,000

100

8.3ms Single half sine-wave

T_J= 125°C

1.0

T_J= 25°C

0.1

0.01

100

120

PERCENT OF RATED PEAK REVERSE VOLTAGE (%)

Fig. 4 Typical Reverse Characteristics

NUMBER OF CYCLES @ 60Hz

Fig. 3 Typical Forward Characteristics

Package Outline Dimensions

SMA

Min

SMB

Min

Dim

Max

2.92

4.60

1.63

0.31

5.59

0.20

1.52

2.30

Dim

Max

3.94

4.57

2.21

0.31

5.59

0.20

1.52

2.50

2.29

4.00

1.27

0.15

4.80

0.05

0.76

2.01

3.30

4.06

1.96

0.15

5.00

0.05

0.76

2.00

All Dimensions in mm

Suggested Pad Layout

SMB

Dimensions

SMA

Dimensions

Value (in mm)

6.7

1.8

2.3

2.5

4.3

6.5

1.5

1.7

2.5

4.0

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October 2011

S1A/B - S1M/B

Document number: DS16003 Rev. 22 - 2

S1A/B - S1M/B

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and

hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

www.diodes.com

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October 2011

S1A/B - S1M/B

Document number: DS16003 Rev. 22 - 2

S1G-13-F [DIODES]

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