NIS5132MN1-FN-7 [DIODES]

Power Supply Support Circuit, Fixed, 1 Channel, PDSO10, U-DFN3030-10;
NIS5132MN1-FN-7
型号: NIS5132MN1-FN-7
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Power Supply Support Circuit, Fixed, 1 Channel, PDSO10, U-DFN3030-10

光电二极管
文件: 总12页 (文件大小:551K)
中文:  中文翻译
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NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Green  
3.6A 12V RESETTABLE ELECTRONIC FUSE  
Description  
Pin Assignments  
The NIS5132 is a self-protected resettable electronic fuse designed  
for consumer applications such as hard disk drives, to industrial  
applications to enhance system reliability against catastrophic and  
shutdown failures.  
(Top View)  
1
GND  
dv/dt  
Source  
Source  
Source  
Source  
Source  
10  
9
2
To support a wide range of demanding applications, the design has  
been optimized to operate over the supply range of 9.0V to 18V. For  
robustness and protections, the device integrates a low RDS(ON)  
NMOS buffer power device along with an undervoltage lockout,  
overvoltage clamp, a current limit, a dv/dt control and a thermal  
shutdown circuits. The overvoltage circuit limits the output voltage  
without shutting the device down to allow the load to continue  
operating during over voltage. Thermal shutdown can be either  
latching type (NIS5132MN1) or auto-retry type (NIS5132MN2).  
NIS5132MN1  
NIS5132MN2  
8
7
6
Enable/Fault  
ILIMIT  
3
4
5
NC  
U-DFN3030-10  
Applications  
Features  
Hard Drives  
9.0 to 18V Operating Input Voltage  
Mother Board Power Management  
Printer Load Power Management  
Integrated NMOS Power Device with RDS(ON) of 30mΩ Typical  
Internal Current Limit - No External Current Sense Resistor in  
Load Path  
Under Voltage Lockout  
Over Voltage Clamp (NIS5132MN1 and NIS5132MN2)  
Thermal Shutdown  
-40C to +150C Operating Junction Temperature  
ESD Ratings: HBM > 1500V; MM 200V  
Small Low Profile U-DFN3030-10 Package  
UL Recognized, Report E322375-20140529  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. Green” Device (Note 3)  
Notes:  
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Typical Application Circuits  
+12V  
11  
10  
9
VDD  
Source  
8
7
6
+
+
10µF  
NIS5132  
Load  
100µF  
RS  
3
Enable  
4
ILIMIT  
ENABLE  
GND  
dv/dt  
1
2
Cdv/dt  
Figure 1. Application Circuit with Direct Current Sensing  
1 of 12  
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May 2017  
© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Typical Application Circuits (Cont.)  
+12V  
11  
10  
9
VDD  
Source  
8
7
6
+
+
10µF  
NIS5132  
Load  
100µF  
RS  
3
Enable  
4
ILIMIT  
ENABLE  
dv/dt  
GND  
1
2
Cdv/dt  
Figure 2. Application Circuit with Kelvin Current Sensing  
5V  
12V  
CIN  
11  
10  
9
8
7
6
11  
1
VDD  
Source  
VDD  
Source  
2
3
4
5
CIN  
NIS5135  
NIS5132  
COUT  
COUT  
RS  
Load  
RS  
Load  
8
3
Enable  
4
Enabe  
dv/dt GND  
7
ILIMIT  
ILIMIT  
ENABLE  
GND  
dv/dt  
9
2
10  
1
Cdv/dt  
Cdv/dt  
Figure 3. Application Circuit with Common Thermal Shutdown  
Pin Descriptions  
Package: U-DFN3030-10  
Pin Number  
Pin Name  
Function  
1
GND  
Ground pin  
Internal NMOS power device turn-on time adjustment pin:  
2
dv/dt  
If this pin is left unconnected, the internal capacitor ensures the turn-on ramp is over a period of  
2ms typical. If an additional delay is required, connect a capacitor from this pin to the ground.  
Tri-state bi-directional interface pin:  
The output can be disabled by pulling this pin to ground through an open drain or an open collector.  
Additionally, this pin output goes to an intermediate state to indicate that the device is in thermal  
shutdown state. This pin can also be connected together with other NIS5132 devices to cause a  
system-wide simultaneous shutdown during thermal events.  
3
Enable/Fault  
Current limit setting pin:  
4
5
ILIMIT  
NC  
A resistor between Source pins and this pin sets the overload and short-circuit current limit  
thresholds.  
No connection  
The internal NMOS power device’s Source pins:  
6 to 10  
Exposed PAD  
Source  
These pins are the Source of internal power device and also the output terminal of the electronic  
fuse  
Positive input voltage to the device  
VDD  
2 of 12  
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May 2017  
© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Functional Block Diagram  
VDD  
Charge  
Pump  
Enable/  
Fault  
Enable  
Source  
ILIMIT  
Current  
Limit  
Thermal  
Shutdown  
UVLO  
dv/dt  
Voltage  
Clamp  
dv/dt  
Control  
GND  
Figure 4. Block Diagram  
4.3V  
12µA  
Startup  
Blanking  
Enable SD  
2.64V  
0.58V  
+
-
Enable/Fault  
1.4V  
-
+
Thermal Reset  
SD  
Thermal  
Shutdown  
Thermal SD  
Figure 5. Enable/Fault Function Circuit  
3 of 12  
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May 2017  
© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Absolute Maximum Ratings (Note 4) (@TA = +25°C, unless otherwise specified.)  
Symbol  
Characteristic  
Input Voltage in Steady State Operating Conditions (Note 5)  
Input Voltage - Transient (100ms)  
Value  
-0.6 to +18  
-0.6 to +25  
227  
Unit  
V
VDD  
0.1 in2 (Note 6)  
0.5 in2 (Note 6)  
Junction to Air Thermal Resistance  
JA  
95  
°C/W  
Junction to Lead Thermal Resistance  
Junction to Case Thermal Resistance  
27  
JL  
JC  
PDMAX  
20  
1.3  
W
mW/°C  
°C  
Package Power Dissipation at TA= +25°C  
Thermal Derating Above +25°C  
10.4  
Storage Temperature Range  
-55 to +155  
-40 to +150  
+260  
TS  
Operating Junction Temperature (Note 7)  
Lead Temperature During Soldering (10s)  
°C  
TJ  
°C  
TL  
Notes:  
4.Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings  
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device  
reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.  
5. Negative voltage will not damage the device provided that the power dissipation is within the package dissipation rating.  
6. 1 oz copper on double sided FR-4 PCB.  
7. Thermal limit is set above the maximum thermal rating. It is not recommended to operate the device at temperature above the maximum rating  
for extended period.  
Recommended Operating Conditions  
Symbol  
Characteristic  
Supply Voltage  
Operating Junction Temperature Range  
Test Condition  
Rating  
Unit  
VDD  
Operating  
9.0 to 18.0  
V
TJ  
Operating  
-40 to +150  
°C  
4 of 12  
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NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Electrical Characteristics (VDD = 12V, CL = 100µF, dv/dt pin open, RLIMIT = 10, and TA = +25°C, unless otherwise noted.)  
Symbol  
Device  
Characteristic  
Test Condition  
Min  
Typ  
Max  
Unit  
Bias Current  
Device operational  
0.8  
0.4  
1.5  
mA  
mA  
IBIAS  
Bias Current During Shutdown  
Device shutdown  
IBIAS_SD  
Minimum Operating Voltage Once  
Successfully Started Up  
7.6  
V
VDD_MIN  
NMOS Power Device  
Enabling of the IC to ID = 100mA  
(with 1A resistive load)  
Chip Enable Delay Time  
220  
µs  
tDLY  
NMOS fully on  
20  
30  
45  
40  
NMOS Drain to Source Kelvin ON  
Resistance (Note 8)  
mΩ  
V
RDS(ON)  
VOUT_OFF  
ID  
NMOS fully on, TJ = +140°C  
VDD = 18V, VGS = 0V, RL =   
TA = +25°C, 0.5 in.2 pad  
TA = +80°C, min copper  
VDS = 12V, VGS = 0V, f = 1MHz  
Off State Output Voltage  
Continuous Current (Note 9)  
Output Capacitance  
0.19  
3.6  
1.7  
250  
0.3  
A
pF  
dv/dt Ramp  
tSLEW  
Output Voltage Ramp Time  
Maximum Capacitor Voltage  
1.5  
1.8  
2.5  
ms  
V
Device enable to VDS = 11.7V  
VC_MAX  
VDD  
Under/Over Voltage Protection  
Undervoltage Lockout Threshold  
Turn on, Voltage rising  
7.7  
8.5  
9.3  
V
V
VUVLO  
Undervoltage Lockout Hysteresis  
0.80  
VUVLO_HYST  
During overvoltage protection,  
VDD = 18V  
Overvoltage Clamp Limit (Note 10)  
14  
15  
16.2  
V
VCLAMP  
Current Limit  
ILIMIT_SS  
Kelvin Short Circuit Current Limit  
(Note 11)  
2.75  
3.5  
3.44  
4.6  
4.25  
6.0  
A
A
RLIMIT = 15.4Ω  
RLIMIT = 15.4Ω  
Kelvin over Load Current Limit  
(Note 11)  
ILIMIT_OL  
Thermal Protection  
Thermal Shutdown Junction Temperature  
Threshold (Note 9)  
Temperature rising  
+150  
+175  
+45  
+200  
TSD  
C  
C  
Thermal Shutdown Hysteresis in Non  
Latching Devices  
TSD_HYST  
Enable/Fault  
VEN_LOW  
VEN_MID  
Enable Logic Level Low Voltage  
Enable Logic Level Mid Voltage  
Enable Logic Level High  
Output disabled  
Output disabled, Thermal fault  
Output enabled  
0.35  
0.82  
1.96  
3.4  
0.58  
1.4  
0.81  
1.95  
3.3  
V
V
2.64  
4.3  
V
VEN_HI  
High State Maximum Voltage  
Logic Low Sink Current  
5.3  
V
VEN_MAX  
IEN_SINK  
-17  
-25  
µA  
VENABLE = 0V  
Logic High Leakage Current for External  
Switch  
1.0  
3.0  
µA  
IEN_LKG  
Fanout  
VENABLE = 3.3V  
Maximum Fanout Number of Device  
that can be Connected Together to this  
Pin for Simultaneous Shutdown  
Units  
Notes:  
8. Pulse test with pulse width of 300µs, duty cycle 2%.  
9. This parameter is not tested in production. It is guaranteed by design, process control and characterization.  
10. Over voltage clamp feature is available on in NIS5132MN1 and NIS5132MN2 versions.  
11. Refer to application note on explanation on short circuit and overload conditions.  
5 of 12  
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May 2017  
© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Performance Characteristics  
9
8.8  
8.6  
8.4  
8.2  
8
0.88  
0.86  
0.84  
0.82  
0.8  
0.78  
0.76  
0.74  
7.8  
7.6  
7.4  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Temperature (oC)  
Temperature (oC)  
Figure 6. UVLO Turn-On Voltage vs. Temperature  
Figure 7. UVLO Hysteresis vs. Temperature  
15.3  
15.2  
15.1  
15  
14.9  
14.8  
14.7  
14.6  
14.5  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Temperature (oC)  
(oC)  
Figure 8. Output Clamp Voltage vs. Temperature  
Figure 9. Output Voltage dv/dt Ramp Time vs. Temperature  
1.80  
1.60  
1.40  
1.20  
1.00  
0.80  
0.60  
0.40  
0.20  
0.00  
400.00  
500.00  
600.00  
700.00  
800.00  
900.00  
1000.00  
Forward Voltage (V)  
Figure 10. Input Transient Response  
Figure 11. Body Diodes Forward Characteristics  
6 of 12  
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© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Performance Characteristics (Cont.)  
35  
10  
32.5  
30  
OL  
SC  
27.5  
1
25  
22.5  
20  
0.1  
10  
7
8
9
10  
11  
12  
13  
14  
15  
100  
1000  
VCC (V)  
RSENSE ()  
Figure 13. Current Limit vs. RSENSE for Direct Current  
Sensing  
Figure 12. Power Device ON Resistance (RDS(ON)) vs. VCC  
10  
4.5  
4
3.5  
3
2.5  
1
OL  
SC  
2
OL  
1.5  
SC  
1
0.5  
0
0.1  
1
10  
100  
-50  
-30  
-10  
10  
30  
50  
70  
90  
Temperature (oC)  
RLIMIT ()  
Figure 14. Direct Current Sensing Level vs.  
Temperature  
Figure 15. Current Limit vs. RSENSE for Kelvin Current  
Sensing  
(RSENSE = 27Ω)  
6
4
3.5  
3
5.5  
OL  
SC  
5
4.5  
4
2.5  
2
OL  
3.5  
3
1.5  
1
SC  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (oC)  
Temperature (oC)  
Figure 16. Kelvin Current Sensing Levels vs.  
Figure 17. Kelvin Current Sensing Levels vs. Temperature  
(RSENSE = 33  
Temperature (RSENSE = 15)  
7 of 12  
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May 2017  
© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Application Note  
Theory of Operation  
The NIS5132 is a self-protected, resettable electronic fuse. It monitors the input and output voltage, the output current and the die temperature.  
When the NIS5132 is powered up it will ramp up the output voltage based on the dv/dt setting (see description below) and current will begin to flow.  
The device current limit can be set with an external resistor, the ramp rate (dv/dt) can be adjusted with an external capacitor. The Overvoltage  
Clamp, Undervoltage Lockout and Thermal Protection are internally set.  
Power Supply Considerations  
Placing a high-value electrolytic capacitor or X7R (X5R) ceramic capacitor between VDD to GND (10µF) and Source to GND (100µF) as close to  
the device as possible is highly recommended. This precaution reduces power-supply transients that may cause ringing on the input and load  
transients that may cause output voltage falls below input voltage resulting device over-heat.  
Current Limit  
The NIS5132 incorporates a sensefet with a reference and amplifier to control the current in the device. The sensefet uses a small fraction of the  
load current to measure the actual current. This reduces the losses as a smaller sense resistor can be used. The current can be measured direct  
with the Rs resistor connected between the load and the ILIMIT pin (see Figure 1). That method includes the resistance of the bond wires in the  
current limiting circuit. Or a Kelvin connection (see Figure 2) can be used, in that case one of the 5 source pins will be used and the voltage is  
measured on the die eliminating the bond wire resistance. That reduces the source pins to the load to four and with that increases the on  
resistance of the effuse to the load.  
Overvoltage Clamp  
The NIS5132MN1 and NIS5132MN2 monitor the input voltage and clamp it once it exceeds 15V. This will allow for transient on the input for short  
periods of time. If the input voltage stays above 15V for extended time the voltage drop across the FET with the load current will increase the die  
temperature and the thermal shutdown feature will protect the device and shut it down.  
Undervoltage Lock Out  
The input voltage of the NIS5132 is monitored by an UVLO circuit (undervoltage lockout) if the input voltage drops below this threshold the output  
transistor will be pulled into a high impedance state.  
dv/dt  
The NIS5132 has an integrated control circuit that forces a linear ramp on the output voltage raise regardless of the load impedance. Without  
connecting a capacitor on the dv/dt pin the ramp time is roughly 2ms. Adding an external capacitor can increase this ramp rate. The internal  
current source of 90µA will charge the external capacitor at a slow rate. It is recommended to utilize a ceramic capacitor.  
The ramp time can be determined with the following equation  
Cext in Farad  
tramp in seconds  
The ramp up circuit is discharged and VOUT starts from 0V when the units shut down after a fault, enable shutdown or input power cycle.  
Enable/Fault  
The NIS5132 has a tri state Enable/Fault pin. It is used to turn on and off the device with high and low signals from a GPIO, but can also indicate a  
thermal fault. When the Enable/Fault pin is pulled low the output is turned off, when the Enable/Fault pin is pulled high the output is turned on. In  
the event of a thermal fault the Enable/Fault pin will be pulled low to an intermediate voltage by an internal circuit. This can be used to chain up to  
4 NIS5132 together that during a thermal shut down the linked devices turn off as well.  
Due to this fault indication capability it should not be connected to any type of logic with an internal pull up device.  
The NIS5132MN1 connected to a 2nd device will latch-off until the Enable/Fault pin has been pulled to low and then allowed to go back up to a high  
signal, or if the power has been cycled. Once the part starts up again it will go through the startup ramp determined by the internal circuit or based  
on the externally connected capacitor on pin dv/dt.  
The MN2 devices will auto restart once the part that indicated a thermal shutdown has cooled down. It will also go through the startup ramp.  
8 of 12  
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© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Application Note (Cont.)  
Enable/Fault (Cont.)  
Figure 18. Enable/Fault Signal Levels  
Thermal Protection  
The NIS5132 has an integrated temperature sensing circuit that protects the die in the event of over temperature. The trip point has been  
intentionally set high at +175˚C to allow for increase trip time during high power transient events. The NIS5132 will shut down current flow to the  
output when the die temperature reaches +175°C. The NIS5132MN1 will restart after the Enable pin has been toggled or the input power has  
been cycled. The NIS5132MN2 will auto restart after the die temperature has been reduced by -45°C.  
Even that the thermal trip point has been set high to allow for high current transients the circuit design should accomplish best thermal  
performance with good thermal layout of the PCB. It is not recommended to operate NIS5132 above +150°C over extended periods of time.  
Ordering Information  
NIS5132 XXX - XXX - 7  
Feature Option  
Packing  
Package  
7 : Tape & Reel  
FN : U-DFN3030-10  
MN1 : Thermal latching with VCLAMP  
MN2 : Thermal auto-retry with VCLAMP  
7” Tape and Reel  
Package  
Part Number  
Code  
Packaging  
Quantity  
Part Number Suffix  
NIS5132MN1-FN-7  
NIS5132MN2-FN-7  
FN  
FN  
U-DFN3030-10  
U-DFN3030-10  
3,000/Tape & Reel  
3,000/Tape & Reel  
-7  
-7  
9 of 12  
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© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Marking Information  
(1) Package Type: U-DFN3030-10  
( Top View )  
XX : Identification Code  
Y : Year : 0~9  
XX  
W : Week : A~Z : 1~26 week;  
a~z : 27~52 week; z represents  
Y W X  
52 and 53 week  
X : A~Z : Internal code  
Part Number  
NIS5132MN1  
NIS5132MN2  
Package  
Identification Code  
U-DFN3030-10  
U-DFN3030-10  
M2  
N2  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
U-DFN3030-10  
A3  
U-DFN3030-10  
Dim Min Max Typ  
A
SEATING PLANE  
A1  
A
A1  
A3  
b
0.57 0.63 0.60  
0
-
0.05 0.02  
0.15  
D
D2  
Pin#1 ID  
-
0.20 0.30 0.25  
2.90 3.10 3.00  
D
D2 2.30 2.50 2.40  
e
-
-
0.50  
E
2.90 3.10 3.00  
E
E2  
E2 1.50 1.70 1.60  
L
z
0.25 0.55 0.40  
0.375  
-
-
All Dimensions in mm  
L
b
e
z
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
U-DFN3030-10  
Y
C
Dimensions Value (in mm)  
X1  
G
Z
G
X
2.60  
0.15  
1.80  
0.60  
0.30  
0.50  
X
X1  
Y
C
G
Z
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© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
Taping Orientation  
(1) Package Type: U-DFN3030-10  
Note: 12. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.  
11 of 12  
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May 2017  
© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  
NOT RECOMMENDED FOR NEW DESIGN  
NO ALTERNATE PART  
NIS5132  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2017, Diodes Incorporated  
www.diodes.com  
12 of 12  
www.diodes.com  
May 2017  
© Diodes Incorporated  
NIS5132  
Document number: DS36457 Rev. 5 - 3  

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