MINIMELF [DIODES]
SUGGESTED PAD LAYOUT; 拟议的焊盘布局
| 型号： | MINIMELF |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | SUGGESTED PAD LAYOUT |
| 文件： | 总12页 (文件大小：169K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SUGGESTED PAD LAYOUT
Based on IPC-7351A
DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC
C
X
G
Z
Y
DFN1006-2 /
DFN1006H4-2
Dimensions
MiniMELF
MELF
SOD-123
SOD-323
SOD-523
SMA
SMB
SMC
Z
G
X
Y
C
1.1
0.3
0.7
0.4
0.7
4.7
2.1
1.7
1.3
3.5
6.3
3.3
2.7
1.5
4.8
4.9
2.5
0.7
1.2
3.7
3.75
1.05
0.65
1.35
2.40
2.3
1.1
0.8
0.6
1.7
6.5
1.5
1.7
2.5
4.0
6.8
1.8
2.3
2.5
4.3
9.4
4.4
3.3
2.5
6.8
DFN1006-3 / DFN1006H4-3
C
Dimensions Value (in mm)
X1
Z
G1
G2
X
1.1
0.3
0.2
0.7
0.25
0.4
0.7
G2
X
X1
Y
G1
Z
C
Y
DFN1411-3
C
Dimensions
Value (in mm)
1.38
Z
G1
G2
X
X2
0.15
0.15
0.95
X1
X
G2
X1
X2
Y
0.75
0.40
0.75
Y
C
0.76
G1
Z
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
© Diodes Incorporated
DFN1612-6 / DFN1310H4-6
X2
G2
Dimensions DFN1612-6
DFN1310H4-6
0.16
G1
G2
G3
X1
X2
Y1
Y2
a
0.15
0.175
0.15
0.60
0.25
0.65
0.45
0.10
0.15
Y2
G1
0.17
0.15
0.52
0.20
0.52
0.375
0.09
b
Y1
X1
b
0.06
a
G3
DFN1616-6
DFN1616-8
Y
X2
a
G2
C
Dimensions Value (in mm)
Y2
Dimensions Value (in mm)
X2
G1
G2
X1
X2
Y1
Y2
C
0.15
0.20
0.65
0.25
1.25
0.50
0.40
0.10
Z
G
X1
X2
Y
1.3
0.175
0.50
0.525
0.30
0.50
G
X1
Y1
G1
C
a
C
X1
Z
DFN2018-6
X
C
Y
Dimensions
Value (in mm)
0.50
C
G
0.20
Y1
X
0.25
X1
Y
1.60
0.35
Y1
1.20
G
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
© Diodes Incorporated
DFN2020-3
Dimensions Value (in mm)
DFN2020B-3
C
G
X
1.00
0.15
1.40
0.35
0.45
0.322
1.10
0.60
0.45
0.45
0.698
0.225
0.05
0.20
X
X
X3
X2
Dimensions Value (in mm)
Y1
X1
X2
X3
Y
Y1
Y2
Y3
Y4
R1
R2
R3
R2
Y
Y3
Y4
C
G
1.30
0.24
0.35
1.52
1.09
0.47
0.50
Y2
X
X1
Y
Y
R1
R3
G
G
Y1
Y2
X1
C
Y1
Y2
X1
C
DFN2020-6
DFN2020B-6
Y
C
C
Y
Dimensions Value (in mm)
G
G
Dimensions Value (in mm)
Z
G
G1
X1
X2
Y
1.67
0.20
0.40
1.0
0.45
0.37
0.70
0.65
X2
X2
Z
G
1.67
0.15
0.90
0.45
0.37
0.65
G1
X1
X1
X2
Y
X1
G
C
Y1
C
G
Y
Z
Y1
Z
DFN3020B-8
C
X
Dimensions
Value (in mm)
0.650
C
G
Y1
Y
0.285
G1
G
G1
X
X1
Y
0.090
0.400
1.120
0.730
Y2
Y1
Y2
0.500
0.365
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
© Diodes Incorporated
DFN3030-4
DFN3030-8
Dimensions Value (in mm)
C
1.300
0.100
0.150
0.830
0.115
0.135
0.170
0.500
0.500
0.150
0.500
1.375
1.225
1.175
1.980
1.015
0.715
0.650
C
G1
G2
G3
G4
G5
G6
G7
G8
R
Z
Y3 (2x)
Y2
G6
Dimensions Value (in mm)
G4
X3
G1
R
Z
G
X1
X2
Y
2.59
0.11
2.49
0.65
0.39
0.65
G3
X1
Y
G2
X2
G5
X1
Y1
X
X1
X2
X3
Y
Y1
Y2
Y3
C
X2
G
G7
G8
Y
C
X (4x)
DFN3030E-8
X (x8)
C
Y
(x8)
Dimensions
Value (in mm)
C
C1
X
Y
Y1
Y2
0.65
2.35
0.30
0.65
1.60
2.75
Y1
Y2
C1
DFN3030-10
DFN3030-12
Y
C
Y
C
X1
G
X1
Dimensions Value (in mm)
Dimensions Value (in mm)
G
Z
G
X
2.60
0.15
1.80
0.60
0.30
0.50
Z
G
X
2.60
0.15
1.80
0.60
0.28
0.45
X
X
X1
Y
X1
Y
G
G
C
C
Z
Z
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
© Diodes Incorporated
DFN5020-6
Y
G
Dimensions Value (in mm)
X
C
C
G
X
X1
X2
Y
Y2
Y3
0.50
0.35
0.35
0.90
1.80
0.70
1.60
3.20
X1
Y2
Y3
X2
MSOP-8L
DF-S / MiniDIP
X
X
Dimensions DF-S MiniDIP
Dimensions Value (in mm)
Z
X
Y
C
10.26
1.2
1.52
5.2
6.91
0.60
0.76
2.67
X
Y
C1
C2
0.45
1.4
4.4
C1
Z
0.65
C2
Y
Y
C
MSOP-8L-EP
MSOP-10L
X
X
Dimensions Value (in mm)
X1
C1
C2
X
X1
Y
4.2
0.65
0.32
1.95
0.8
Dimensions Value (in mm)
X
Y
0.30
1.4
C1
C1
Y1
C2
C1
C2
4.4
0.50
C2
Y1
1.65
Y
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
© Diodes Incorporated
PowerDI®5
PowerDI®123 / PowerDI®323
X
X1
G
X2
Y
Y2
Y1
X1
(2x)
G
Y1
(2x)
C
Dimensions Value (in mm)
Dimensions PowerDI®123 PowerDI®323
C
G
1.840
0.852
3.360
1.390
4.860
1.400
G
1.0
2.2
0.9
1.4
1.4
0.5
2.0
0.8
0.8
1.1
X1
X2
Y1
Y2
X
X1
Y
Y1
PowerDI3333-8
PowerDI5060-8
X
X
G
Y2
8
5
4
Y2
Y3
X1
G1
Y1
Y1
Y
Y
G1
1
C
Y3 (4x)
X2 (8x)
G
X2
C
Dimensions
Value (in mm)
1.270
Dimensions
Value (in mm)
0.650
C
G
G1
X
X1
X2
Y
Y1
Y2
Y3
C
G
G1
Y
Y1
Y2
Y3
X
0.660
0.820
4.420
4.100
0.610
6.610
3.810
1.020
0.230
0.420
3.700
2.250
1.850
0.700
2.370
0.420
X2
1.270
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
© Diodes Incorporated
SM-8
SO-8
X
Y (8x)
Dimensions Value (in mm)
C1
Dimensions Value (in mm)
C
C1
X
1.52
4.6
0.95
2.80
6.80
Y1
X
Y
C1
C2
0.60
1.55
5.4
C1
Y
1.27
Y1
C2
Y
X (8x)
C
SOD-323F
X1
Dimensions Value (in mm)
X
X1
Y
0.710
2.700
0.403
Y (2x)
X (2x)
SOP-14L
X
Dimensions Value (in mm)
X
Y
C1
C2
0.60
1.50
5.4
C1
1.27
C2
Y
SOP-16L
X
Dimensions Value (in mm)
X
Y
C1
C2
0.60
1.50
5.4
C1
1.27
C2
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
© Diodes Incorporated
SOT-143
SOT-223
X1
X
X2
Y1
Y
C1
C
G
Z
Y2
C2
X2
X1
X2
Dimensions Value (in mm)
Dimensions Value (in mm)
Z
G
X
X1
X2
Y
2.70
1.30
2.50
1.0
0.60
0.70
2.0
X1
X2
Y1
Y2
C1
C2
3.3
1.2
1.6
1.6
6.4
2.3
C
SOT-523 / SOT-323 / SOT23 / SC-59
Y
Z
C
X
E
Dimensions
SOT-523
1.8
0.4
0.51
1.3
SOT-323
2.8
SOT23
2.9
0.8
0.9
2.0
SC-59
3.4
0.8
1.0
2.4
Z
X
Y
C
E
0.7
0.9
1.9
1.0
0.7
1.35
1.35
SOT-23F
C
Dimensions Value (in mm)
C
X
Y
0.95
0.60
0.80
1.80
Y1
Y1
Y (3x)
X (3x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
© Diodes Incorporated
SC-74R / SOT-26 / SOT-363 / SOT-563
C2
SOT-25 / SOT-353
C2
C2
C2
C1
G
Y
C1
G
Y
Z
Z
X
X
Dimensions SC-74R / SOT-26
SOT-363
SOT-563
2.2
1.2
0.375
0.5
Dimensions
SOT-25
3.20
1.60
0.55
0.80
SOT-353
2.5
1.3
0.42
0.6
Z
G
3.20
1.60
0.55
0.80
2.40
0.95
2.5
1.3
0.42
0.6
1.9
0.65
Z
G
X
Y
C1
C2
X
Y
C1
C2
1.7
0.5
2.40
0.95
1.9
0.65
SOT-666
C
Y (6x)
Dimensions Value (in mm)
C
G
X
Y
0.50
0.80
0.35
0.50
G
X
(6x)
SOT-953
C
C
Dimensions Value (in mm)
C
X
Y
0.350
0.200
0.200
1.100
Y1
Y1
Y (5X)
X (5X)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
© Diodes Incorporated
SOT-963
C
C
Dimensions Value (in mm)
C
X
Y
0.350
0.200
0.200
1.100
Y1
Y1
Y (6X)
X (6X)
SOT89-3L
SOT89-5L
X1
X1
Dimensions Value (in mm)
Dimensions Value (in mm)
X
0.900
1.733
0.416
1.300
4.600
1.475
0.950
1.125
1.500
Y4
X1
X2
X3
Y1
Y2
Y3
Y4
C
1.7
0.55
0.4
4.6
1.2
0.5
1.1
3.0
X1
X2
Y
X2 (2x)
Y1
Y1
Y3
Y
Y4
Y1
Y2
Y3
Y4
C
X2
Y2
Y2
X3
Y3
C
C
X (3x)
TO252-3L (DPAK) / TO263-3L (D2PAK)
X2
TO252-3L /
TO263-3L /
D2PAK
16.9
Dimensions
DPAK
11.6
1.5
7.0
2.5
Y2
Z
X1
X2
Y1
Y2
C
1.1
10.8
3.5
11.4
Z
C
7.0
6.9
Y1
9.5
E1
2.3
2.5
X1
E1
TO252-4L
X1
Dimensions
Value (in mm)
1.27
c
Y1
c1
X
X1
Y
Y1
Y2
Y3
2.54
1.00
5.73
2.00
6.17
1.64
2.66
Y2
Y3
c1
Y
c
X (4x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
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TO252-5L
TO263-5L
X
X
Y1
Y1
Y2
Y
Y
C1
Y2
X1
X1
C2
C
Dimensions
Value (in mm)
Dimensions
Value (in mm)
X
X1
Y
Y1
Y2
C1
C2
5.6
0.6
11.0
5.6
2.0
7.2
X
X1
Y
Y1
Y2
C
10.9
1.05
15.7
9.1
2.5
1.7
1.27
TSOT23-5
C
C
Dimensions Value (in mm)
C
X
Y
0.950
0.700
1.000
3.199
Y1
Y1
Y (5x)
X (5x)
TSOT23-6
C
C
Dimensions Value (in mm)
C
X
Y
0.950
0.700
1.000
3.199
Y1
Y1
Y (6x)
X (6x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
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TSSOP-14L
X
Dimensions Value (in mm)
X
Y
C1
C2
0.45
1.45
5.9
C1
0.65
C2
Y
WL-CSD1010H6-4
ØD
Dimensions
Value (in mm)
C
C
D
0.50
0.25
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
12 of 12
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
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