DMP3018SFV-7 [DIODES]

30V P-CHANNEL ENHANCEMENT MODE MOSFET;
DMP3018SFV-7
型号: DMP3018SFV-7
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

30V P-CHANNEL ENHANCEMENT MODE MOSFET

文件: 总7页 (文件大小:464K)
中文:  中文翻译
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DMP3018SFV  
30V P-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI3333-8 (Type UX)  
Product Summary  
Features and Benefits  
ID Max  
Low RDS(ON) ensures on-state losses are minimized  
Small form factor thermally efficient package enables higher  
density end products  
BVDSS  
RDS(ON) Max  
TC = +25°C  
12m@ VGS = -10V  
21mΩ @ VGS = -4.5V  
-35A  
-25A  
-30V  
Occupies just 33% of the board area occupied by SO-8 enabling  
smaller end product  
ESD Protected Gate  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Description  
This MOSFET is designed to minimize the on-state resistance  
(RDS(ON)) and yet maintain superior switching performance, making it  
ideal for high-efficiency power management applications.  
Mechanical Data  
®
Case: PowerDI 3333-8 (Type UX)  
Case Material: Molded Plastic, "Green" Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See Diagram  
Terminals: Finish Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Applications  
Backlighting  
Power Management Functions  
DC-DC Converters  
Weight: 0.03 grams (Approximate)  
D
Pin1  
S
S
S
G
G
ESD PROTECTED  
D
Gate Protection  
D
D
S
Diode  
D
Top View  
Bottom View  
Equivalent Circuit  
Ordering Information (Note 4)  
Part Number  
DMP3018SFV-7  
DMP3018SFV-13  
Case  
Packaging  
2,000/Tape & Reel  
3,000/Tape & Reel  
PowerDI3333-8 (Type UX)  
PowerDI3333-8 (Type UX)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and  
Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.  
Marking Information  
V18 = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 18 = 2018)  
WW = Week Code (01 to 53)  
V18  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
www.diodes.com  
January 2018  
© Diodes Incorporated  
DMP3018SFV  
Document number: DS40134 Rev. 3 - 2  
DMP3018SFV  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-30  
Unit  
V
Gate-Source Voltage  
±25  
V
VGSS  
Steady  
State  
TA = +25°C  
-11  
-9  
A
A
Continuous Drain Current (Note 6) VGS = -10V  
Continuous Drain Current (Note 7) VGS = -10V  
ID  
ID  
TA = +70°C  
TC = +25°C  
TC = +70°C  
Steady  
State  
-35  
-25  
Maximum Continuous Body Diode Forward Current (Note 7)  
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
-30  
-70  
-70  
-14  
104  
A
A
IS  
IDM  
ISM  
IAS  
EAS  
Pulsed Body Diode Forward Current (10µs Pulse, Duty Cycle = 1%)  
Avalanche Current (Note 8) L = 1mH  
A
A
Avalanche Energy (Note 8) L = 1mH  
mJ  
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
1.0  
133  
Unit  
W
Total Power Dissipation (Note 5)  
TA = +25°C  
Steady State  
PD  
RθJA  
PD  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
1.9  
TA = +25°C  
Steady State  
Thermal Resistance, Junction to Ambient (Note 6)  
Total Power Dissipation (Note 7)  
66  
°C/W  
W
RθJA  
PD  
30  
Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
3.7  
°C/W  
°C  
RθJC  
TJ, TSTG  
-55 to +150  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 9)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-30  
-1  
V
BVDSS  
IDSS  
VGS = 0V, ID = -250μA  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
μA  
μA  
VDS = -24V, VGS = 0V  
VGS = ±20V, VDS = 0V  
±10  
IGSS  
ON CHARACTERISTICS (Note 9)  
Gate Threshold Voltage  
-1.0  
-3.0  
12  
V
mΩ  
V
VGS(TH)  
RDS(ON)  
VSD  
VDS = VGS, ID = -250μA  
VGS = -10V, ID = -11.5A  
VGS = -4.5V, ID = -8.5A  
VGS = 0V, IS = -1A  
Static Drain-Source On-Resistance  
21  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 10)  
Input Capacitance  
-0.7  
-1.2  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
Rg  
2,147  
407  
358  
24  
VDS = -15V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
VDS = 0V, VGS = 0V, f = 1.0MHz  
28  
nC  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Total Gate Charge (VGS = -5V)  
Total Gate Charge (VGS = -10V)  
Gate-Source Charge  
Qg  
51  
Qg  
VDS = -15V, ID = -11.5A  
6.6  
15  
Qgs  
Qgd  
tD(ON)  
tR  
Gate-Drain Charge  
Turn-On Delay Time  
7.8  
Turn-On Rise Time  
VDD = -15V, VGS = -10V,  
19.9  
57.5  
42.8  
21.5  
11.6  
Turn-Off Delay Time  
tD(OFF)  
tF  
RG = 6, ID = -11.5A  
Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
tRR  
IS = -11.5A, dI/dt = 100A/μs  
QRR  
Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.  
7. Thermal resistance from junction to soldering point (on the exposed drain pad).  
8. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C.  
9. Short duration pulse test used to minimize self-heating effect.  
10. Guaranteed by design. Not subject to product testing.  
2 of 7  
www.diodes.com  
January 2018  
© Diodes Incorporated  
DMP3018SFV  
Document number: DS40134 Rev. 3 - 2  
DMP3018SFV  
30  
25  
20  
15  
10  
5
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
VDS = -5V  
VGS = -4.0V  
VGS = -4.5V  
VGS = -10.0V  
VGS = -3.5V  
VGS = -3.2V  
TJ=125  
TJ=85℃  
TJ=150℃  
TJ=25℃  
VGS = -3.0V  
TJ= -55℃  
0.0  
0
0
0.5  
1
1.5  
2
2.5  
3
1.5  
2
2.5  
3
3.5  
4
4.5  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 2.Typical Transfer Characteristic  
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
0.2  
0.15  
0.1  
ID = -11.5A  
VGS = -4.5V  
ID = -8.5A  
VGS = -10V  
0.05  
0
0
2
4
6
8
10 12 14 16 18 20  
0
5
10  
15  
20  
25  
30  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 4. Typical Transfer Characteristic  
ID, DRAIN-SOURCE CURRENT (A)  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
1.8  
1.6  
1.4  
1.2  
1
0.016  
0.014  
0.012  
0.01  
VGS = -10V  
TJ= 150℃  
VGS = -10V, ID = -11.5A  
TJ= 125℃  
TJ= 85℃  
TJ= 25℃  
TJ= -55℃  
0.008  
0.006  
0.004  
VGS = -4.5V, ID = -8.5A  
0.8  
0.6  
0
5
10  
15  
20  
25  
30  
-50  
-25  
0
25  
50  
75  
100 125 150  
ID, DRAIN CURRENT (A)  
TJ, JUNCTION TEMPERATURE ()  
Figure 6. On-Resistance Variation with Junction  
Temperature  
Figure 5. Typical On-Resistance vs. Drain Current and  
Junction Temperature  
3 of 7  
www.diodes.com  
January 2018  
© Diodes Incorporated  
DMP3018SFV  
Document number: DS40134 Rev. 3 - 2  
DMP3018SFV  
3
2.8  
2.6  
2.4  
2.2  
2
0.03  
0.028  
0.026  
0.024  
0.022  
0.02  
0.018  
0.016  
0.014  
0.012  
0.01  
0.008  
0.006  
0.004  
0.002  
0
VGS = -4.5V, ID = -8.5A  
ID = -1mA  
ID = -250μA  
1.8  
1.6  
1.4  
1.2  
1
VGS = -10V, ID = -11.5A  
-50  
-25  
0
25  
50  
75  
100 125 150  
-50  
-25  
0
25  
50  
75  
100 125 150  
TJ, JUNCTION TEMPERATURE ()  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
TJ, JUNCTION TEMPERATURE ()  
Figure 7. On-Resistance Variation with Junction  
Temperature  
30  
25  
20  
15  
10  
5
10000  
f=1MHz  
VGS = 0V  
Ciss  
1000  
Coss  
TJ = 85℃  
TJ = 125℃  
TJ = 25℃  
Crss  
TJ = 150℃  
TJ = -55℃  
0
100  
0
0.3  
0.6  
0.9  
1.2  
1.5  
0
5
10  
15  
20  
25  
30  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
10  
8
100  
10  
PW =100µs  
RDS(ON) Limited  
6
PW =1ms  
PW =10ms  
TJ(Max) = 150℃  
1
4
VDS = -15V, ID = -11.5A  
PW =100ms  
PW =1s  
PW =10s  
TC = 25℃  
0.1  
0.01  
Single Pulse  
DUT on 1*MRP  
Board  
2
DC  
10  
VGS= -10V  
0
0
10  
20  
30  
40  
50  
60  
0.01  
0.1  
1
100  
Qg (nC)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Figure 11.Gate Charge  
4 of 7  
www.diodes.com  
January 2018  
© Diodes Incorporated  
DMP3018SFV  
Document number: DS40134 Rev. 3 - 2  
DMP3018SFV  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
0.01  
D=0.01  
RθJA(t) = r(t) * RθJA  
RθJA = 131/W  
D=0.005  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
0.001  
1E-06 1E-05 0.0001 0.001  
0.01  
0.1  
1
10  
100  
1000  
10000 100000 1000000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
www.diodes.com  
January 2018  
© Diodes Incorporated  
DMP3018SFV  
Document number: DS40134 Rev. 3 - 2  
DMP3018SFV  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
PowerDI3333-8 (Type UX)  
D
D1  
A
A1  
PowerDI3333-8  
(Type UX)  
Dim  
Min  
Max  
Typ  
A
A1  
b
c
D
D1  
D2  
E
E1  
E2  
E2a  
E2b  
e
0.75  
0.00  
0.25  
0.10  
3.20  
2.95  
2.30  
3.20  
2.95  
1.60  
0.95  
0.10  
0.85 0.80  
0.05  
--  
E1 E  
0.40 0.32  
0.25 0.15  
3.40 3.30  
3.15 3.05  
2.70 2.50  
3.40 3.30  
3.15 3.05  
2.00 1.80  
1.35 1.15  
0.30 0.20  
0
c
L
E2a  
E2b  
E2  
0.65 BSC  
k
L
θ
0.50  
0.30  
0°  
0.90 0.70  
0.50 0.40  
12°  
10°  
D2  
k
All Dimensions in mm  
L
b
e
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
PowerDI3333-8 (Type UX)  
X3  
X2  
Dimensions Value (in mm)  
8
C
0.650  
0.420  
0.420  
0.230  
2.370  
0.700  
1.850  
2.250  
3.700  
0.540  
Y4  
X
X1  
X2  
X3  
Y
X1  
Y1  
Y2  
Y1  
Y2  
Y3  
Y4  
Y3  
Y
1
X
C
6 of 7  
www.diodes.com  
January 2018  
© Diodes Incorporated  
DMP3018SFV  
Document number: DS40134 Rev. 3 - 2  
DMP3018SFV  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2018, Diodes Incorporated  
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January 2018  
© Diodes Incorporated  
DMP3018SFV  
Document number: DS40134 Rev. 3 - 2  

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