DMN61D8LVT-13 [DIODES]

Provides a more reliable and robust interface between sensitive logic and DC relay coils.;
DMN61D8LVT-13
型号: DMN61D8LVT-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Provides a more reliable and robust interface between sensitive logic and DC relay coils.

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DMN61D8L/LVT  
Product Summary  
Features and Benefits  
Provides a more reliable and robust interface between sensitive  
logic and DC relay coils.  
ID max  
V(BR)DSS  
RDS(ON) max  
TA = +25°C  
Replaces 3-4 discrete components enabling PCB footprint to be  
reduced.  
1.8Ω @ VGS = 5V  
2.4Ω @ VGS = 3V  
60V  
470mA  
Internal active clamp removes the need for external zener diode.  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Mechanical Data  
Description and Applications  
Case: SOT23  
DMN61D8L/LVT provides a single component solution for switching  
inductive loads such as relays, solenoids, and small DC motors in  
automotive applications, without the need of a freewheeling diode.  
DMN61D8L/LVT accepts logic level inputs, thus allowing it to be  
driven by logic gates, inverters, and microcontrollers. It is ideally  
suited for doors, windows, and antenna relay coils.  
Case Material: Molded Plastic, “Green” Molding Compound;  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish Matte Tin Annealed over Alloy 42 Leadframe.  
(Lead-Free Plating). Solderable per MIL-STD-202, Method 208  
Terminal Connections: See Diagram  
Weight: 0.008 grams (Approximate)  
Case: TSOT26  
Case Material: Molded Plastic, “Green” Molding Compound;  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals Connections: See Diagram  
ESD protected  
Terminals: Finish Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.013 grams (Approximate)  
SOT-23  
D
S
G
Equivalent Circuit  
TSOT26  
Top View  
Top View  
Internal Schematic  
Ordering Information (Note 4)  
Part Number  
DMN61D8L-7  
Case  
Packaging  
SOT23  
SOT23  
3,000/Tape & Reel  
10,000/Tape & Reel  
3,000/Tape & Reel  
10,000/Tape & Reel  
DMN61D8L-13  
DMN61D8LVT-7  
DMN61D8LVT-13  
TSOT26  
TSOT26  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.  
1 of 9  
www.diodes.com  
April 2015  
© Diodes Incorporated  
DMN61D8L/LVT  
Document number: DS37630 Rev. 3 - 2  
DMN61D8L/LVT  
Marking Information  
1D8 YM  
Y M 8 D 1  
1D8 = Product Type Marking Code  
YM = Date Code Marking  
1D8  
Y or Y̅ = Year (ex: C= 2015)  
M = Month (ex: 9 = September)  
SOT23  
TSOT26  
Date Code Key  
Year  
2014  
2015  
2016  
2017  
2018  
2019  
2020  
Code  
B
C
D
E
F
G
H
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
60  
V
V
VDSS  
VGSS  
±12  
Steady  
State  
470  
370  
TA = +25°C  
TA = +70°C  
Continuous Drain Current (Note 6) SOT23  
Continuous Drain Current (Note 6) TSOT26  
mA  
ID  
Steady  
State  
630  
500  
TA = +25°C  
TA = +70°C  
mA  
A
ID  
IS  
Maximum Continuous Body Diode Forward Current (Note 6)  
Single Pulse Drain-to-Source Avalanche Energy  
0.5  
200  
20  
EZ  
mJ  
W
(for relay coils/inductive loads of 80Ω or higher) (TJ initial = +85°C)  
Peak Power Dissipation, Drain-to-Source (non-repetitive current square  
pulse 1.0 ms duration) (TJ initial = +85°C)  
PPK  
Load Dump Pulse, Drain-to-Source, RSOURCE = 0.5Ω, T = 300 ms)  
(for relay coils/inductive loads of 80Ω or higher) (TJ Initial = +85°C)  
ELD1  
60  
V
V
Inductive Switching Transient 1, Drain-to-Source  
(Waveform: RSOURCE = 10Ω, T = 2.0 ms)  
ELD2  
100  
(for relay coils/inductive loads of 80Ω or higher) (TJ Initial = +85°C)  
Inductive Switching Transient 2, Drain-to-Source  
(Waveform: RSOURCE = 4.0Ω, T = 50 µs)  
(for relay coils/inductive loads of 80Ω or higher) (TJ Initial = +85°C)  
ELD3  
300  
-14  
V
V
Reverse Battery, 10 Minutes (Drain-to-Source)  
(for relay coils/inductive loads of 80Ω or higher)  
Rev−Bat  
Dual Voltage Jump Start, 10 Minutes (Drain-to-Source)  
ESD Human Body Model (HBM)  
Dual−Volt  
28  
V
V
ESD  
4,000  
2 of 9  
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April 2015  
© Diodes Incorporated  
DMN61D8L/LVT  
Document number: DS37630 Rev. 3 - 2  
DMN61D8L/LVT  
Thermal Characteristics (SOT23) (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
PD  
Value  
Units  
mW  
Total Power Dissipation (Note 5)  
390  
321  
Steady State  
Steady State  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
mW  
RθJA  
610  
PD  
Thermal Resistance, Junction to Ambient (Note 6)  
Operating and Storage Temperature Range  
208  
°C/W  
°C  
RθJA  
-55 to +150  
TJ, TSTG  
Thermal Characteristics (TSOT26) (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
PD  
Value  
820  
Units  
mW  
Total Power Dissipation (Note 5)  
Steady State  
Steady State  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
154  
°C/W  
mW  
RθJA  
1090  
PD  
Thermal Resistance, Junction to Ambient (Note 6)  
Operating and Storage Temperature Range  
116  
°C/W  
°C  
RθJA  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
60  
V
BVDSS  
IDSS  
VGS = 0V, ID = 10mA  
VDS = 60V, VGS = 0V  
VDS = 12V, VGS = 0V  
50  
0.5  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
µA  
VGS = ±5V, VDS = 0V  
VGS = ±3V, VDS = 0V  
±90  
±60  
µA  
IGSS  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
1.3  
2.0  
V
VGS(th)  
VDS = VGS, ID = 1mA  
VGS =5V, ID = 0.15A  
VGS = 3V, ID = 0.15A  
VDS =12V, ID = 0.15A  
VGS = 0V, IS = 0.15A  
1.1  
1.4  
1.8  
2.4  
Static Drain-Source On-Resistance  
Ω
RDS(ON)  
Forward Transfer Admittance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
80  
ms  
V
|Yfs|  
VSD  
1.2  
  
12.9  
17  
pF  
pF  
pF  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
Ciss  
Coss  
Crss  
Qg  
VDS = 12V, VGS = 0V  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
0.84  
0.74  
0.19  
0.16  
131  
301  
582  
440  
VGS = 5V, VDS = 12V,  
ID =150mA  
Gate-Source Charge  
Qgs  
Qgd  
tD(on)  
tr  
Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
VDD = 12V, VGS = 5V.  
Turn-Off Delay Time  
tD(off)  
tf  
Turn-Off Fall Time  
Notes:  
5. Device mounted on FR-4 PCB, with minimum recommended pad layout.  
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. copper, single sided.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
3 of 9  
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April 2015  
© Diodes Incorporated  
DMN61D8L/LVT  
Document number: DS37630 Rev. 3 - 2  
DMN61D8L/LVT  
1
1
V
= 10V  
GS  
V
= 3.0V  
GS  
V
V
= 5.0V  
DS  
= 4.0V  
GS  
V
= 4.5V  
GS  
0.8  
0.8  
V
= 5.0V  
GS  
0.6  
0.4  
0.2  
0
0.6  
0.4  
V
= 2.5V  
GS  
T
= 150°C  
A
T
A
= 125°C  
T
= 85°C  
A
0.2  
0
T
= 25°C  
A
V
= 2.0V  
= 1.8V  
GS  
T
= -55°C  
A
V
GS  
1.5  
3.5  
1
2
2.5  
3
0
1
2
3
4
5
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1 Typical Output Characteristic  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
2
1.8  
1.6  
1.4  
5
4
3
V
= 3V  
GS  
V
= 5V  
1.2  
1
GS  
I
= 150mA  
D
2
0.8  
1
0
0.6  
0.4  
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9  
1
0
2
4
6
8
10  
12  
ID, DRAIN-SOURCE CURRENT (A)  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 4 Typical Transfer Characteristic  
3
2
V
= 5V  
GS  
1.8  
1.6  
1.4  
1.2  
V
= 5V  
2.5  
2
GS  
= 150mA  
I
T
= 150°C  
= 125°C  
D
A
T
A
V
= 3V  
GS  
= 150mA  
I
D
T
= 85°C  
= 25°C  
A
1.5  
1
T
A
1
T
= -55°C  
A
0.5  
0
0.8  
0.6  
0
0.2  
0.4  
0.6  
0.8  
1
100 125  
TJ, JUNCTION TEMPERATURE (C)  
Figure 6 On-Resistance Variation with Temperature  
-50 -25  
0
25  
50  
75  
150  
ID, DRAIN CURRENT (A)  
Figure 5 Typical On-Resistance vs.  
Drain Current and Temperature  
4 of 9  
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April 2015  
© Diodes Incorporated  
DMN61D8L/LVT  
Document number: DS37630 Rev. 3 - 2  
DMN61D8L/LVT  
3
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
2.5  
I
= 1mA  
D
V
= 3V  
GS  
2
1.5  
1
I
= 150mA  
D
I
= 250µA  
D
V
= 5V  
GS  
I
= 150mA  
D
0.5  
0
1
0.9  
-50 -25  
25  
0
50  
75 100 125 150  
-50 -25  
TJ, JUNCTION TEMPERATURE (C)  
Figure 7 On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
TJ, JUNCTION TEMPERATURE (C)  
Figure 8 Gate Threshold Variation vs. Ambient Temperature  
1
100  
f = 1MHz  
T
= 150°C  
0.8  
A
C
iss  
T
= 125°C  
A
10  
C
oss  
T
= 85°C  
= 25°C  
0.6  
A
T
0.4  
0.2  
0
A
1
C
rss  
T
= -55°C  
A
0
0
5
10  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 10 Typical Junction Capacitance  
15  
20  
25  
30  
35  
40  
0
0.3  
0.6  
0.9  
1.2  
1.5  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 9 Diode Forward Voltage vs. Current  
7
6
5
4
3
2
1
0
V
I
= 12V  
DS  
= 150mA  
D
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
Qg, TOTAL GATE CHARGE (nC)  
Figure 11 Gate Charge  
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April 2015  
© Diodes Incorporated  
DMN61D8L/LVT  
Document number: DS37630 Rev. 3 - 2  
DMN61D8L/LVT  
SOT23:  
1
D = 0.9  
D = 0.7  
D = 0.5  
D = 0.3  
0.1 D = 0.1  
D = 0.05  
D = 0.02  
0.01  
D = 0.01  
D = 0.005  
Rthja(t) = r(t) * R  
thja  
RJA = 323°C/W  
Duty Cycle, D = t1/ t2  
D = Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10 100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 12 Transient Thermal Resistance  
TSOT26:  
1
D = 0.9  
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.05  
D = 0.02  
0.01  
D = 0.01  
D = 0.005  
Rthja(t) = r(t) * R  
thja  
RJA = 154°C/W  
Duty Cycle, D = t1/ t2  
D = Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 13 Transient Thermal Resistance  
6 of 9  
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April 2015  
© Diodes Incorporated  
DMN61D8L/LVT  
Document number: DS37630 Rev. 3 - 2  
DMN61D8L/LVT  
Package Outline Dimensions  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.  
SOT23  
All 7°  
H
GAUGE PLANE  
SOT23  
0.25  
J
Dim  
A
B
C
D
F
G
H
J
Min  
0.37  
1.20  
2.30  
0.89  
0.45  
1.78  
2.80  
Max  
0.51  
1.40  
2.50  
1.03 0.915  
0.60 0.535  
Typ  
0.40  
1.30  
2.40  
K
K1  
a
M
A
L
L1  
2.05  
3.00  
1.83  
2.90  
0.05  
0.013 0.10  
K
K1  
L
0.890 1.00 0.975  
0.903 1.10 1.025  
C
B
0.45  
0.25  
0.61  
0.55  
0.55  
0.40  
L1  
M
  
0.085 0.150 0.110  
8°  
D
G
F
All Dimensions in mm  
TSOT26  
D
TSOT26  
Dim Min Max Typ  
e1  
A
A1  
A2  
D
E
E1  
b
c
e
e1  
L
L2  
θ
1.00  
0.01 0.10  
0.84 0.90  
  
2.90  
2.80  
1.60  
0.95  
1.90  
E
E1  
L2  
c
0.30 0.45  
0.12 0.20  
L
4x1  
e
6x b  
0.30 0.50  
A2  
A1  
A
0.25  
4°  
0°  
4°  
8°  
12°  
θ1  
All Dimensions in mm  
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April 2015  
© Diodes Incorporated  
DMN61D8L/LVT  
Document number: DS37630 Rev. 3 - 2  
DMN61D8L/LVT  
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
SOT23  
Y
Dimensions Value (in mm)  
Z
Z
X
Y
C
E
2.9  
0.8  
0.9  
2.0  
1.35  
C
E
X
TSOT26  
C
C
Dimensions Value (in mm)  
C
X
Y
0.950  
0.700  
1.000  
3.199  
Y1  
Y1  
Y (6x)  
X (6x)  
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© Diodes Incorporated  
DMN61D8L/LVT  
Document number: DS37630 Rev. 3 - 2  
DMN61D8L/LVT  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2015, Diodes Incorporated  
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DMN61D8L/LVT  
Document number: DS37630 Rev. 3 - 2  

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