BAV99_10 [DIODES]
DUAL SURFACE MOUNT SWITCHING DIODE; 双表面贴装开关二极管型号: | BAV99_10 |
厂家: | DIODES INCORPORATED |
描述: | DUAL SURFACE MOUNT SWITCHING DIODE |
文件: | 总4页 (文件大小:80K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BAV99
DUAL SURFACE MOUNT SWITCHING DIODE
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Features
Mechanical Data
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•
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Fast Switching Speed
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•
Case: SOT-23
Surface Mount Package Ideally Suited for Automated Insertion
For General Purpose Switching Applications
High Conductance
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4)
Case Material: Molded Plastic, “Green” Molding Compound
(Note 4). UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.008 grams (approximate)
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•
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Qualified to AEC-Q101 Standards for High Reliability
SOT-23
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Non-Repetitive Peak Reverse Voltage
Symbol
VRM
Value
100
Unit
V
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
75
V
RMS Reverse Voltage
53
V
VR(RMS)
IFM
Forward Continuous Current (Note 1)
300
mA
2.0
1.0
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
A
IFSM
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Symbol
PD
Value
350
Unit
mW
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
357
°C/W
°C
Rθ
JA
-65 to +150
TJ, TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Reverse Breakdown Voltage (Note 2)
Symbol
Min
75
Max
⎯
Unit
V
Test Condition
V(BR)R
IR = 2.5μA
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
VR = 75V
0.715
0.855
1.0
Forward Voltage
V
VF
⎯
⎯
1.25
μA
μA
μA
nA
2.5
50
30
25
VR = 75V, TJ = 150°C
Reverse Current (Note 2)
IR
V
R = 25V, TJ = 150°C
VR = 20V
Total Capacitance
2.0
4.0
pF
CT
trr
⎯
⎯
VR = 0, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Reverse Recovery Time
ns
Notes:
1. Part mounted on Polymide PC board with pad dimensions 1.13mm x 1.27mm.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Product manufactured with Data Code 9W (week 39, 2009) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 9W are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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© Diodes Incorporated
BAV99
Document number: DS12007 Rev. 20 - 2
BAV99
10,000
1,000
1
0.1
100
10
1
0.01
0.001
0.1
1.0
0.5
0
1.5
20
40
60
80
100
0
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Forward Characteristics
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 2 Typical Reverse Characteristics
2.0
1.8
350
300
R
= 357°C/W
JA
θ
1.6
1.4
250
200
150
100
1.2
1.0
0.8
0.6
0.4
50
0
0.2
0.0
10
30
0
40
20
0
25
50
75
100
125
150
VR, REVERSE VOLTAGE (V)
TA, AMBIENT TEMPERATURE (
°C)
Fig. 3 Typical Capacitance vs. Reverse Voltage
Fig. 4 Power Derating Curve
Ordering Information (Note 5)
Part Number
BAV99-7-F
BAV99-13-F
Case
SOT-23
SOT-23
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
Notes:
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
KJE = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: N = 2002)
KJE
M = Month (ex: 9 = September)
Date Code Key
Year
1998
1999
2000
2001
2002
2003
2004 2005
2006
2007
2008
2009
2010
2011
2012
Code
J
K
L
M
N
P
R
S
T
U
V
W
X
Y
Z
Month
Code
Jan
1
Feb
2
Mar
3
Apr
4
May
5
Jun
6
Jul
7
Aug
8
Sep
9
Oct
O
Nov
N
Dec
D
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© Diodes Incorporated
BAV99
Document number: DS12007 Rev. 20 - 2
BAV99
Package Outline Dimensions
A
SOT-23
Dim
A
B
C
D
F
G
H
J
K
Min
Max
0.51
1.40
2.50
1.03 0.915
0.60 0.535
Typ
0.40
1.30
2.40
0.37
1.20
2.30
0.89
0.45
1.78
2.80
0.013 0.10
0.903 1.10
-
C
B
2.05
3.00
1.83
2.90
0.05
1.00
0.400
0.55
0.11
-
H
G
M
K
J
K1
K1
L
M
-
D
F
0.45
0.085 0.18
0° 8°
0.61
L
α
All Dimensions in mm
Suggested Pad Layout
Y
Dimensions Value (in mm)
Z
Z
X
Y
C
E
2.9
0.8
0.9
2.0
1.35
C
E
X
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© Diodes Incorporated
BAV99
Document number: DS12007 Rev. 20 - 2
BAV99
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
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© Diodes Incorporated
BAV99
Document number: DS12007 Rev. 20 - 2
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