BAV170_15 [DIODES]
DUAL SURFACE MOUNT LOW LEAKAGE DIODE;型号: | BAV170_15 |
厂家: | DIODES INCORPORATED |
描述: | DUAL SURFACE MOUNT LOW LEAKAGE DIODE |
文件: | 总4页 (文件大小:86K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BAV170
DUAL SURFACE MOUNT LOW LEAKAGE DIODE
Features
Mechanical Data
•
•
•
Surface Mount Package Ideally Suited for Automated Insertion
Very Low Leakage Current
Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 1 and 2)
Qualified to AEC-Q101 Standards for High Reliability
•
•
Case: SOT23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
•
•
•
•
•
Polarity: See Diagram
Weight: 0.008 grams (approximate)
SOT23
Top View
Top View
Internal Schematic
Ordering Information (Note 3)
Part Number
BAV170-7-F
BAV170-13-F
BAV170Q-7-F
BAV170Q-13-F
Qualification
Commercial
Commercial
Automotive
Automotive
Case
Packaging
SOT23
SOT23
SOT23
SOT23
3,000/Tape & Reel
10,000/Tape & Reel
3,000/Tape & Reel
10,000/Tape & Reel
Notes:
1. No purposefully added lead. Halogen and Antimony Free.
2. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
K51 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: Y = 2011)
K51
M = Month (ex: 9 = September)
Date Code Key
Year
2001
2002
…..
…..
2009
2010
2011
2012
2013
2014
2015
2016
2017
Code
M
N
W
X
Y
Z
A
B
C
D
E
Month
Code
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
1
2
3
4
5
6
7
8
9
O
N
D
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January 2012
© Diodes Incorporated
BAV170
Document number: DS30234 Rev. 11 - 2
BAV170
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Symbol
VRRM
VRWM
VR
Value
85
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RMS Reverse Voltage
60
V
VR(RMS)
Forward Continuous Current (Note 4)
Single Diode
Double Diode
215
125
500
mA
mA
IFM
Repetitive Peak Forward Current
IFRM
4.0
1.0
0.5
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
A
IFSM
Thermal Characteristics
Characteristic
Symbol
Value
250
Unit
mW
Power Dissipation (Note 4)
PD
Thermal Resistance Junction to Ambient Air (Note 4)
Operating and Storage Temperature Range
500
°C/W
°C
Rθ
JA
-65 to +150
TJ, TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Reverse Breakdown Voltage (Note 5)
Symbol
V(BR)R
Min
85
Typ
⎯
Max
⎯
Unit
V
Test Condition
IR = 100μA
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
VR = 75V
0.90
1.0
1.1
Forward Voltage
V
VF
⎯
⎯
1.25
5.0
80
nA
nA
Leakage Current (Note 5)
Total Capacitance
IR
CT
trr
⎯
⎯
⎯
⎯
2
VR = 75V, TJ = 150°C
pF
⎯
VR = 0, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Reverse Recovery Time
3.0
⎯
μs
Notes:
4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
5. Short duration pulse test used to minimize self-heating effect.
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January 2012
© Diodes Incorporated
BAV170
Document number: DS30234 Rev. 11 - 2
BAV170
1,000
100
10
300
250
Note 4
200
150
T
= 150ºC
A
T
= 125ºC
A
T
A
= 85ºC
A
100
T
= 25ºC
1
T
= -55ºC
A
50
0
0.1
0
25
50
75
100
125
150
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
TA, AMBIENT TEMPERATURE (°C)
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
Fig. 1 Power Derating Curve
100
10
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
T
= 150ºC
A
T
= 125ºC
A
T
= 85ºC
A
1
T
= 25ºC
A
T
= -55ºC
A
0.1
0
0
10
VR, REVERSE VOLTAGE (V)
0
10
20
30
40
50
60
70 80
30
40
20
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
Fig. 4 Typical Capacitance vs. Reverse Voltage
Package Outline Dimensions
A
SOT23
Dim
A
B
C
D
F
G
H
J
K
Min
0.37
1.20
2.30
0.89
0.45
1.78
2.80
0.013 0.10
0.903 1.10
-
0.45
0.085 0.18
0° 8°
Max
0.51
1.40
2.50
1.03 0.915
0.60 0.535
Typ
0.40
1.30
2.40
C
B
2.05
3.00
1.83
2.90
0.05
1.00
0.400
0.55
0.11
-
H
G
M
K
J
K1
K1
L
M
-
D
F
L
0.61
α
All Dimensions in mm
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January 2012
© Diodes Incorporated
BAV170
Document number: DS30234 Rev. 11 - 2
BAV170
Suggested Pad Layout
Y
Dimensions Value (in mm)
Z
X
Y
C
E
2.9
0.8
0.9
2.0
Z
C
1.35
X
E
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
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January 2012
© Diodes Incorporated
BAV170
Document number: DS30234 Rev. 11 - 2
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