B130LAW_08 [DIODES]
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER; 1.0A表面贴装肖特基整流器
| 型号： | B130LAW_08 |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER |
| 文件： | 总4页 (文件大小：118K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
B130LAW
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
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Features
Mechanical Data
•
•
•
Guard Ring Die Construction for Transient Protection
Very Low Forward Voltage Drop
Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
•
•
Case: SOD-123
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe) Solderable per MIL-STD-202, Method 208
•
•
•
•
•
•
Polarity: Cathode Band
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @T = 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
VRRM
VRWM
VR
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
30
V
RMS Reverse Voltage
21
V
A
VR(RMS)
IF(AV)
Average Forward Current (See Figure 6)
1.0
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
12
A
IFSM
Thermal Characteristics
Characteristic
Power Dissipation (Note 2)
Symbol
PD
Value
450
Unit
mW
°C/W
°C
Typical Thermal Resistance Junction to Ambient (Note 2)
Operating Temperature Range (See Figure 7)
Storage Temperature Range
222
Rθ
JA
-55 to +125
-55 to +150
TJ
TSTG
°C
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 1)
30
V
V(BR)R
⎯
⎯
IR = 1.5mA
IF = 0.1A
IF = 0.7A
IF =1.0A
⎯
⎯
⎯
0.25
0.35
0.38
⎯
0.37
0.42
Forward Voltage
V
VF
Leakage Current (Note 1)
Total Capacitance
0.15
40
1.0
mA
pF
IR
CT
⎯
⎯
VR = 30V, TA = 25°C
VR = 10V, f = 1.0MHz
⎯
Notes:
1. Short duration pulse test used to minimize self-heating effect.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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© Diodes Incorporated
B130LAW
Document number: DS30308 Rev. 9 - 2
B130LAW
0.5
0.4
10
1
T
= 125°C
J
0.3
0.2
T
= 25°C
J
0.1
0.01
0.1
0
0.001
0
0.2
0.4
0.6
0.8
1.0
1.2
0.2
0.4
0.6
0.8
1.0
1.2
0
IF(AV), AVERAGE FORWARD CURRENT (A)
Fig. 1 Forward Power Dissipation
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
100
10
1,000
T
= 25ºC
J
f = 1MHz
1.0
100
0.1
10
0.1
0.01
0
20
40
60
80
100
120
140
1.0
10
100
VR, DC REVERSE VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (°C)
Fig. 4 Total Capacitance vs. Reverse Voltage
Fig. 3 Typical Pulsed Reverse Characteristics
140
120
125
100
100
80
75
50
25
60
40
20
0
0.8
0
0.4
0.6
1
1.2
0.2
10
0
20
30
IF(AV), AVERAGE FORWARD CURRENT (A)
VR, DC REVERSE VOLTAGE (V)
Fig. 5 Forward Current Derating Curve
Fig. 6 Operating Temperature Derating
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© Diodes Incorporated
B130LAW
Document number: DS30308 Rev. 9 - 2
B130LAW
12.5
10
7.5
5.0
2.5
0
8.3ms Single Half Sine-Wave
1
10
NUMBER OF CYCLES AT 60 Hz
Fig. 7 Maximum Non-Repetitive Peak Forward Surge Current
100
Notes:
5. Device mounted on GETEK substrate, 2”x2”, 2 oz. copper, double-sided, cathode pad dimensions 0.75” x 1.0”, anode pad dimensions 0.25” x 1.0”.
6. Device mounted on FR-4 substrate, 2”x2”, 2 oz. copper, single-sided, pad layout as per Diodes Inc. suggested pad layout document AP02001 which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
7. RθJA estimated to be approximately 220 °C/W.
Ordering Information (Note 8)
Part Number
Case
Packaging
B130LAW-7-F
SOD-123
3000/Tape & Reel
Notes:
8. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
SX = Product Type Marking Code
YM = Date Code Marking
Y = Year ex: T = 2006
SX
M = Month (ex: 9 = September)
Date Code Key
Year
2006
2007
2008
2009
2010
2011
2012
Code
T
U
V
W
X
Y
Z
Month
Code
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
1
2
3
4
5
6
7
8
9
O
N
D
Package Outline Dimensions
C
H
SOD-123
Min
Dim
A
B
C
H
J
K
L
M
Max
0.55 Typ
A
B
1.40
3.55
2.55
0.00
1.00
0.25
0.10
0
1.70
3.85
2.85
0.10
1.35
0.40
0.15
8°
K
M
L
α
All Dimensions in mm
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June 2008
© Diodes Incorporated
B130LAW
Document number: DS30308 Rev. 9 - 2
B130LAW
Suggested Pad Layout
C
Dimensions Value (in mm)
Z
G
X
Y
C
4.9
2.5
0.7
1.2
3.7
X
G
Z
Y
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
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© Diodes Incorporated
B130LAW
Document number: DS30308 Rev. 9 - 2
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