AP2171DM8G-13 [DIODES]
Power Supply Support Circuit, Fixed, 1 Channel, PDSO8, MSOP-8;
| 型号： | AP2171DM8G-13 |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | Power Supply Support Circuit, Fixed, 1 Channel, PDSO8, MSOP-8 光电二极管 |
| 文件： | 总19页 (文件大小：1631K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AP2161D/AP2171D
Green
1A SINGLE CHANNEL CURRENT-LIMITED
POWER SWITCH WITH OUTPUT DISCHARGE
Description
Pin Assignments
The AP2161D and AP2171D are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is
( Top View )
1
2
3
4
8
7
6
5
NC
GND
IN
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and undervoltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
OUT
OUT
FLG
IN
All devices are available in SOT25, SO-8, MSOP-8, MSOP-8EP, and
U-DFN2018-6 packages.
EN
SO-8
Features
( Top View )
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Single USB Port Power Switches with Output Discharge
Over-Current and Thermal Protection
1.5A Accurate Current Limiting
NC
1
2
8
7
6
GND
OUT
IN
Fast Transient Response
OUT
FLG
3
4
IN
Reverse Current Blocking
EN
5
90mΩ On-Resistance
Input Voltage Range: 2.7V – 5.5V
MSOP-8 / MSOP-8EP
Note: Latter with Exposed Pad
(Dotted Line)
0.6ms Typical Rise Time
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 4kV HBM, 300V MM
Active High (AP2171D) or Active Low (AP2161D) Enable
Ambient Temperature Range -40°C to +85°C
SOT25, SO-8, MSOP-8, MSOP-8EP (Exposed Pad), and
U-DFN2018-6: Available in “Green” Molding Compound
(No Br, Sb)
( Top View )
1
5
4
OUT
GND
FLG
IN
2
3
•
•
•
•
•
EN
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
SOT25
( Top View )
1
6
5
4
GND
OUT
Applications
2
3
IN
OUT
FLG
•
Consumer Electronics – LCD TVs & Monitors, Game Machines
Communications – Set-Top-Boxes, GPS, Smartphones
Computing – Laptops, Desktops, Servers, Printers, Docking
Stations, HUBs
•
•
EN
U-DFN2018-6
Notes:
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
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AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Typical Applications Circuit
AP2171D Enable Active High
IN
Load
Power Supply
2.7V to 5.5V
OUT
0.1uF
0.1uF
10uF
ON
10k
120uF
FLG
EN
GND
OFF
Available Options
Part Number
Enable Pin
(EN)
Current Limit
(Typical)
Recommended Maximum
Continuous Load Current
Channel
AP2161D
AP2171D
1
1
Active Low
Active High
1.5A
1.5A
1A
1A
Pin Descriptions
Pin Number
Pin
Functions
SO-8
Name
MSOP-8EP
SOT25
U-DFN2018-6
MSOP-8
GND
IN
1
2, 3
4
1
2, 3
4
2
5
4
1
2
3
Ground
Voltage input pin (all IN pins must be tied together externally)
Enable input, active low (AP2161D) or active high (AP2171D)
EN
Over-current and over-temperature fault report; open-drain flag is active low when
triggered
FLG
5
5
3
4
OUT
NC
6, 7
8
6, 7
8
1
5, 6
N/A
Voltage output pin (all OUT pins must be tied together externally)
No internal connection; recommend tie to OUT pins
N/A
Exposed pad.
It should be connected to GND and thermal mass for enhanced thermal
impedance.
Exposed tab
-
Exposed tab
-
Exposed tab
It should not be used as electrical ground conduction path.
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AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Functional Block Diagram
Current
Sense
IN
OUT
FLG
Discharge
Control
UVLO
Current
Limit
Driver
EN
Deglitch
Thermal
Sense
GND
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
VIN
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Input Voltage
Ratings
4
Unit
kV
V
300
6.5
V
Output Voltage
V
VOUT
VEN , VFLG
ILOAD
VIN +0.3
6.5
Enable Voltage
V
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 4)
Internal Limited
150
A
°C
°C
TJMAX
-65 to +150
TST
Note:
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
VIN
Parameter
Min
2.7
0
Max
Unit
V
Input Voltage
5.5
1.0
0.8
VIN
Output Current
A
IOUT
VIL
EN Input Logic Low Voltage
EN Input Logic High Voltage
Operating Ambient Temperature
0
V
2
V
VIH
-40
+85
°C
TA
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AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.)
Symbol
VUVLO
ISHDN
IQ
Parameter
Test Conditions
Min
1.6
—
Typ
1.9
0.5
45
Max
2.5
1
Unit
V
Input UVLO
—
Input Shutdown Current
Input Quiescent Current
Input Leakage Current
Reverse Leakage Current
µA
µA
µA
µA
Disabled, IOUT = 0
Enabled, IOUT = 0
—
70
1
—
Disabled, OUT grounded
0.1
0.1
ILEAK
IREV
—
1
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
SOT25, MSOP-8,
—
95
115
MSOP-8EP, SO-8
U-DFN2018-6
+85°C
TA = +25°C
VIN = 5V,
IOUT= 1A
—
—
—
—
—
90
—
110
140
140
170
—
Switch On-Resistance
mΩ
RDS(ON)
-40°C
≤
TA
≤
≤
120
—
VIN = 3.3V, IOUT= TA = +25°C
1A
-40°C
≤
TA
+85°C
Short-Circuit Current Limit
Over-Load Current Limit
Current Limiting Trigger Threshold
EN Input Logic Low Voltage
EN Input Logic High Voltage
EN Input Leakage
1.2
1.5
2.0
—
A
ISHORT
ILIMIT
ITrig
Enabled into short circuit, CL = 22µF
1.1
—
1.9
—
A
A
VIN = 5V, VOUT = 4.0V, CL = 120µF, -40°C
≤ TA ≤ +85°C
Output Current Slew rate (<100A/s) , CL = 22µF
IN = 2.7V to 5.5V
—
0.8
—
V
VIL
V
—
2
V
VIH
VIN = 2.7V to 5.5V
VEN = 5V
—
—
—
—
—
—
—
1
µA
ms
ms
ms
ms
Ω
ISINK
TD(ON)
TR
Output Turn-On Delay Time
Output Turn-On Rise Time
Output Turn-Off Delay Time
Output Turn-Off Fall Time
FLG Output FET On-Resistance
FLG Blanking Time
0.05
0.6
0.05
0.05
20
—
CL = 1µF, RLOAD = 10
CL = 1µF, RLOAD = 10
CL = 1µF, RLOAD = 10
CL = 1µF, RLOAD = 10
Ω
Ω
Ω
Ω
1.5
—
TD(OFF)
TF
0.1
40
15
—
RFLG
TBlank
RDIS
TDIS
IFLG = 10mA
4
7
ms
Ω
CIN = 10µF, CL = 22µF
—
—
—
—
Discharge Resistance (Note 5)
Discharge Time
100
0.6
140
VIN = 5V, disabled, IOUT = 1mA
CL = 1µF, VIN = 5V, disabled to VOUT < 0.5V
—
ms
°C
°C
—
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
TSHDN
THYS
Enabled, RLOAD = 1k
—
Ω
—
25
170
127
118
67
SOT25 (Note 6)
SO-8 (Note 6)
MSOP-8 (Note 6)
MSOP-8EP (Note 7)
—
—
—
—
—
—
—
—
—
—
Thermal Resistance Junction-to-
Ambient
°C/W
θJA
U-DFN2018-6 (Note 7)
70
Notes:
5. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path
for the external storage capacitor.
6. Device mounted on FR-4 4 substrate PCB, 2oz copper, with minimum recommended pad layout.
7. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
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AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Typical Performance Characteristics
VEN
VEN
50%
50%
50%
50%
TD(OFF)
TD(OFF)
TR
TR
TF
TF
TD(ON)
TD(ON)
90%
90%
90%
90%
VOUT
VOUT
10%
10%
10%
10%
Figure 1 Voltage Waveforms: AP2161D (left), AP2171D (right)
All Enable Plots are for AP2171D Active High
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
VEN
5V/div
VEN
5V/div
VOUT
2V/div
CL =1µF
TA = +25°C
RL = 10
Ω
CL = 1µF
TA = +25°C
VOUT
2V/div
RL = 10
Ω
100µs/div
100µs/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
VEN
5V/div
VEN
5V/div
VOUT
2V/div
CL = 120µF
TA = +25°C
CL = 120µF
TA = +25°C
RL = 10
Ω
RL = 10
Ω
VOUT
2V/div
500µs/div
500µs/div
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AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Typical Performance Characteristics (continued)
Short Circuit with Blanking Time and Recovery
Short Circuit Current,
VOUT
5V/div
Device Enabled Into Short
VFLAG
2V/div
VEN
5V/div
V
IN = 5V
V
IN = 5V
TA = +25°C
CL = 22µF
IOUT
1A/div
TA = +25°C
CL = 22µF
IOUT
500mA/d
20ms/div
100µs/div
Ω Load Connected to Enabled Device
1
2Ω Load Connected to Enabled Device
VFLAG
2V/div
VFLAG
2V/div
VIN = 5V
VIN = 5V
TA = +25°C
CL = 22µF
TA = +25°C
CL = 22µF
IOUT
1A/div
IOUT
1A/div
1ms/div
1ms/div
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© Diodes Incorporated
AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Typical Performance Characteristics (cont.)
Power On
Power Off
TA = +25°C
CL = 120µF
RL = 10Ω
VFLAG
5V/div
VFLAG
5V/div
IOUT
500mA/d
TA = +25°C
CL = 120µF
RL = 10Ω
IOUT
500mA/d
VEN
5V/div
VEN 5V/div
VOUT
5V/div
VOUT 5V/div
2ms/div
20ms/div
UVLO Increasing
TA = +25°C
CL = 22µF
RL = 10Ω
UVLO Decreasing
TA = +25°C
CL = 22µF
RL = 10Ω
VIN
2V/div
VIN
2V/div
IOUT
500mA/div
IOUT
500mA/d
2ms/div
20ms/div
Discharge Time
No Load Resistance
Inrush Current
VIN = 5V
TA = +25°C
VIN = 5V
No Load
VOUT
2V/div
TA = +25°C
RL = 10Ω
CL=680µF
CL = 470µF
CL=220µF
CL=100µF
IIN
400mA/d
CL = 120µF
CL=22µF
VEN
2V/div
VEN
5V/div
1ms/div
100ms/div
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AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Typical Performance Characteristics (cont.)
Turn-On Time vs Input Voltage
Turn-Off Time vs Input Voltage
800
700
600
500
400
31
31
30
30
29
29
28
28
CL = 1µF
RL = 10Ω
TA = +25°C
CL = 1µF
300
RL = 10Ω
TA = 25°C
200
100
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
Rise Time vs Input Voltage
Fall Time vs Input Voltage
600
500
400
300
200
100
0
25
24
23
22
21
20
19
CL = 1µF
RL = 10Ω
TA = +25°C
CL = 1µF
RL = 10Ω
T= +25°C
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
Supply Current, Output Enabled vs Ambient Temperature
Supply Current, Output Disabled vs Ambient Temperature
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
65
60
55
50
45
40
35
30
VIN = 5.5V
VIN = 5.0V
VIN = 5.5V
VIN = 5.0V
VIN = 3.3V
VIN = 2.7V
VIN = 2.7V
VIN = 3.3V
-45
-25
-5
15
35
55
75
95
-60
-40
-20
0
20
40
60
80
100
Ambient Temperature (°C)
Ambient Temperature (°C)
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AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Typical Performance Characteristics (cont.)
Static Drain-Source On-State Resistance vs Ambient
Temperature
Short-Circuit Output Current vs Ambient Temperature
710
700
690
680
670
660
650
640
630
200
190
180
VIN = 5.0V
VIN = 3.3V
VIN = 2.7V
IN
VIN = 3.3V
170
160
150
140
130
120
110
100
VIN = 5.5V
VIN = 5V
60
-60
-40
-20
0
20
40
80
100
-60
-40
-20
0
20
40
60
80
100
Ambient Temperature (°C)
Ambient Temperature (°C)
Undervoltage Lockout vs Ambient Temperature
Threshold Trip Current vs Input Voltage
1.15
1.14
1.13
1.12
1.11
1.10
2.05
2.04
2.03
2.02
2.01
2.00
1.99
1.98
1.97
1.96
1.95
UVLO Rising
UVLO Falling
TA = +25°C
CL = 22µF
2.8
3.3
3.8
4.3
4.8
5.3
-60
-40
-20
0
20
40
60
80
100
Input Voltage (V)
Ambient Temperature (°C)
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AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Application Note
The AP2161D and AP2171D are integrated high-side power switches optimized for Universal Serial Bus (USB) that require protection functions.
The power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. This, along with the various
protection features and special functions, makes these power switches ideal for hot-swap or hot-plug applications.
Protection Features:
Undervoltage Lockout (UVLO)
Undervoltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The UVLO functions only when the
switch is enabled. Even if the switch is enabled, the switch is not turned ON until the power supply has reached at least 1.9V. Whenever the input
voltage falls below approximately 1.9V, the power switch is turned off. This facilitates the design of hot-insertion systems where it is not possible to
turn off the power switch before input power is removed.
Over-current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
The different overload conditions and the corresponding response of the AP2161D/2171D are outlined below:
S.NO
Conditions
Explanation
Behavior of the AP2161D/2171D
Output is shorted before input
voltage is applied or before the
part is enabled
The IC senses the short circuit and immediately clamps output
current to a certain safe level namely ILIMIT.
Short circuit condition at
start-up
1
• At the instance the overload occurs, higher current may flow
for a very short period of time before the current limit function
can react.
Short-Circuit or Overload
condition that occurs when the
part is enabled.
Short-circuit or over-current
condition
2
3
• After the current limit function has tripped (reached the over-
current trip threshold), the device switches into current limiting
mode and the current is clamped at ILIMIT
.
Gradual increase from
nominal operating current to
ILIMIT
The current rises until ITRIG or thermal limit. Once the threshold
has been reached, the device switches into its current limiting
Load increases gradually until
the current-limit threshold.(ITRIG
)
mode and is set at ILIMIT
.
Note that when the output has been shorted to GND at an extremely low temperature (< -30°C), a minimum 120-µF electrolytic capacitor on the
output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than a 10% variation of capacitance change when operated at extremely low temperatures. Our recommended aluminum
electrolytic capacitor type is Panasonic FC series.
Thermal Protection
Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly occurs when heavy-overload or
short-circuit faults are present for extended periods of time. The AP2161D/AP2171D implements thermal sensing to monitor the operating junction
temperature of the power distribution switch. Once the die temperature rises to approximately 140°C, the Thermal protection feature gets activated
as follows: The internal thermal sense circuitry turns the power switch off and the FLG output is asserted thus preventing the power switch from
damage. Hysteresis in the thermal sense circuit allows the device to cool down to approximately 25°C before the output is turned back on. The
built-in thermal hysteresis feature avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until
the load fault is removed, resulting in a pulsed output. The FLG open-drain output is asserted when an over-current occurs with 7-ms deglitch.
Reverse Current Protection
In a normal MOSFET switch, current can flow in reverse direction (from the output side to the input side) when the output side voltage is higher
than the input side, even when the switch is turned off. A reverse-current blocking feature is implemented in the AP21x1 series to prevent such
back currents. This circuit is activated by the difference between the output voltage and the input voltage. When the switch is disabled, this feature
blocks reverse current flow from the output back to the input.
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AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Application Note (continued)
Special Functions:
Discharge Function
When enable is de-asserted, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge
resistance of 100Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the
resistance and the output capacitor.
FLG Response
The FLG open-drain output goes active low for any of the two conditions: Over-Current or Over-Temperature. The time from when a fault condition
is encountered to when the FLG output goes low is 7-ms (TYP). The FLG output remains low until both over-current and over-temperature
conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary Over-current condition, which
does not trigger the FLG due to the 7-ms deglitch timeout. The 7-ms timeout is also applicable for Over-current recovery and Thermal recovery.
The AP2161D/AP2171D are designed to eliminate erroneous Over-current reporting without the need for external components, such as an RC
delay network.
Applications Information:
Power Supply Considerations
A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. This limits the input
voltage drop during line transients. Placing a high-value electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended
when the output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the input. Additionally, bypassing
the output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents
output from going negative during turn-off due to inductive parasitics.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
The junction temperature can be calculated by:
TJ = PD x RθJA + TA
Where:
TA = Ambient Temperature °C
RθJA = Thermal Resistance
PD = Total Power Dissipation
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges as seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp up the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise and fall times of the AP2161D/AP2171D, these devices can be used to provide a softer
start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2161D/AP2171D also ensures that the switch is off after
the card has been removed, and that the switch is off during the next insertion.
By placing the AP2161D/AP2171D between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls
the system surge current and provides a hot-plugging mechanism for any device.
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© Diodes Incorporated
AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Application Note (cont.)
Dual-Purpose Port Applications
AP2161D/AP2171D is not recommended for use in dual-purpose port applications in which a single port is used for data communication between
the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a non-
recommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box
and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2161D/AP2171D includes an embedded
discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will
be subject to continual discharge whenever the AP2161D/AP2171D is disabled. An overstress condition to the device's discharge MOS transistor
may result. In addition, if the output of the AP2161D/AP2171D is subjected to a constant voltage that would be present during a dual-purpose port
application such as MHL, an overstress condition to the device may result.
Ordering Information
AP 21 X 1 D XX G - X
Packing
Green
Enable
Channel
Package
: SO-8
M8 : MSOP-8
G : Green
S
6 : Active Low
7 : Active High
1 : 1 Channel
7/13 : Tape & Reel
MP : MSOP-8EP
W : SOT25
FM : U-DFN2018-6
7”/13” Tape and Reel
Part Number Suffix
Part Number
Package Code
Packaging
Quantity
AP21X1DSG-13
AP21X1DM8G-13
AP21X1DMPG-13
AP21X1DWG-7
AP21X1DFMG-7
S
SO-8
MSOP-8
2,500/Tape & Reel
2,500/Tape & Reel
2,500/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
-13
-13
-13
-7
M8
MP
W
MSOP-8EP
SOT25
FM
U-DFN2018-6
-7
Marking Information
(1) SO-8
( Top View )
8
7
6
5
1 : 1 Channel
YY : Year : 08, 09,10~
Logo
Part Number
6 : Active Low
7 : Active High
AP21X X D
YY WW X X
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
G : Green
1
2
3
4
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© Diodes Incorporated
AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
(2) MSOP-8
( Top view )
8
7
6
5
X : Internal Code
Logo
Y W X
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z: 27~52 week;z represents
52 and 53 week
P
a
r
tN
u
m
b
e
r
AP21 X 1 D
6 : Active Low
7 : Active High
1 : 1 Channel
1
2
3
4
Marking Information (continued)
(3) MSOP-8EP
( Top view )
8
7
6
5
X : Internal Code
MSOP-8EP
Y : Year : 0~9
Logo
Y W X E
W : Week : A~Z : 1~26 week;
PartNumber
6 : Active Low
7 : Active High
AP21 X 1 D
a~z : 27~52 week;z represents
52 and 53 week
1 : 1 Channel
2
3
4
1
(4) SOT25
( Top View )
5
4
XX : Identification code
Y : Year 0~9
W X
XX Y
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
1
2
3
Device
Package Type
SOT25
Identification Code
AP2161DW
AP2171DW
JC
JD
SOT25
(5) U-DFN2018-6
Device
Package Type
U-DFN2018-6
U-DFN2018-6
Identification Code
AP2161DFM
AP2171DFM
JC
JD
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© Diodes Incorporated
AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(1) SO-8
SO-8
Min
-
Dim
A
Max
1.75
0.20
1.50
0.25
0.5
E1
E
Gauge Plane
Seating Plane
A1
A1
A2
A3
b
0.10
1.30
0.15
0.3
L
Detail ‘A’
7°~9°
D
4.85
5.90
3.85
4.95
6.10
3.95
h
°
45
E
E1
e
Detail ‘A’
A2
A3
A
1.27 Typ
h
-
0.35
0.82
8°
b
e
L
0.62
0°
D
D
θ
All Dimensions in mm
(2) MSOP-8
MSOP-8
Dim Min Max Typ
A
-
1.10
-
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
0.25
E
Gauge Plane
Seating Plane
x
b
c
D
E
0.22 0.38 0.30
0.08 0.23 0.15
2.90 3.10 3.00
4.70 5.10 4.90
y
a
L
Detail C
E1 2.90 3.10 3.00
E3 2.85 3.05 2.95
1
b
E3
e
L
a
x
y
-
-
0.65
0.40 0.80 0.60
A3
A2
A1
A
0°
-
-
8°
-
-
4°
0.750
0.750
e
E1
c
See Detail C
All Dimensions in mm
(3) MSOP-8EP
MSOP-8EP
Dim Min Max Typ
D
A
-
1.10
-
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
D1
b
c
D
0.22 0.38 0.30
0.08 0.23 0.15
2.90 3.10 3.00
x
E
E2
Gauge Plane
Seating Plane
y
D1 1.60 2.00 1.80
4.70 5.10 4.90
E
L
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e
L
a
x
y
1
8Xb
A3
e
Detail C
E3
E1
A1
-
-
0.65
0.40 0.80 0.60
c
A2
A
0°
-
-
8°
-
-
4°
0.750
0.750
D
See Detail C
All Dimensions in mm
14 of 19
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© Diodes Incorporated
AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Package Outline Dimensions (cont.) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(4) SOT25
A
SOT25
Dim Min Max Typ
A
B
C
D
H
J
K
L
M
N
α
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
0.95
B
C
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
0.70 0.80 0.75
H
K
J
M
N
L
D
0°
8°
All Dimensions in mm
(5) U-DFN2018-6
A3
A
SEATING PLANE
U-DFN2018-6
Dim Min Max Typ
A1
Pin#1 ID
D
A
A1
A3
b
0.545 0.605 0.575
0
D2
0.05 0.02
0.13
L
0.15 0.25 0.20
1.750 1.875 1.80
D2 1.30 1.50 1.40
D
E2
E
e
0.50
1.95 2.075 2.00
E
E2 0.90 1.10 1.00
L
z
z
0.20 0.30 0.25
0.30
b
e
All Dimensions in mm
15 of 19
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© Diodes Incorporated
AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) SO-8
X
Dimensions Value (in mm)
X
Y
C1
C2
0.60
1.55
5.4
C1
1.27
C2
Y
(2) MSOP-8
X
C
Y
Dimensions Value (in mm)
Y1
C
X
Y
Y1
0.650
0.450
1.350
5.300
(3) MSOP-8-EP
X
C
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
Y
G
Dimensions
C
G
X
X1
Y
Y1
Y2
Y2
Y1
X1
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© Diodes Incorporated
AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Suggested Pad Layout (continued)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4) SOT25
C2
C2
Dimensions Value (in mm)
3.20
1.60
0.55
0.80
Z
G
X
Y
C1
G
Y
Z
C1
C2
2.40
0.95
X
(5) U-DFN2018-6
X
C
Y
Dimensions
Value (in mm)
0.50
0.20
C
G
X
0.25
1.60
Y1
X1
Y
0.35
1.20
Y1
G
X1
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© Diodes Incorporated
AP2161D/AP2171D
Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
Taping Orientation (Note 8)
For U-DFN2018-6
Note: 8. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf
18 of 19
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© Diodes Incorporated
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Document number: DS32250 Rev. 6 - 2
AP2161D/AP2171D
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
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Document number: DS32250 Rev. 6 - 2
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