S30AG250KY1234 [DILABS]
HEAT SINKS AND STANDOFFS; 散热片和螺母柱
| 型号： | S30AG250KY1234 |
| 厂家： | 
Dielectric Laboratories, Inc. |
| 描述： | HEAT SINKS AND STANDOFFS |
| 文件： | 总2页 (文件大小：604K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HEAT SINKS
AND STANDOFFS
Single Layer Aluminum Nitride for use as
Standoffs or Heatsinks.
Part Number
S 30 AG 250 K Y 1234
Product Code
Width Code
Drawing Reference
Code
Surface Finish Code
Material Code
Thickness Code
Thickness Tolerance
Code
Applications
Benefits
❏ High therm al conductivity
❏ Low capacitance
❏ Available with AuSn for solder die attach
❏ Laser diode m ounts
❏ HPA MMIC subm ounts
❏ Standoffs
❏ 4.6 PPM/°C coefficient of therm al
expansion provides stable m atch for
GaAs and Si die
25
HEAT SINKS AND STANDOFFS
Part Number
S 30 AG 250 K Y 1234
Metalization Options
M= 300Å TiW, 100µ" Au (min)
T= 300Å TiW, 50µ" Au A side, 300Å TiW,
50µ" NiV, 300µ",AuSn B side
E= 300Å TiW, 50µ" Au both sides. Patterned
TiW/NiV/AuSn (300µ" min) per customer
specifications. 4mil minimum exposure of
underlying TiW Au to ensure bondability.
N= 300Å TiW, 50µ" NiV /100µ" Au
1
Characteristics
Material Alum inum Nitride: >97% purity
Therm al Conductivity: 170 W/mK
Coefficient of Therm al Expansion: 4.6 ppm/°C
Dielectric Constant: 8.85
Dissipation Factor : .0005 Max @ 1GHz (Unmetalized)
Insulation Resistance: 106 megohms minimum
25°C
Thickness Code: Thickness in thousandths of an inch.
250 = .025"
Thickness Tolerance Codes
K= ± 10% As Fired
± .002 Machined
Surface Finish Codes
X= As Fired
Y= Machined
Typical Applications
Packaging
LED or Laser Diode
Aluminum Nitride
Standard: Waffle Packs.
Custom packaging available.
Call with requirements.
Heat Sink Metalized
6 Sides (i. e. DC Short)
Outline Drawing
Pkg Floor
Photo-Diode
Standoff (Metalization
L
Wire Bonds
For Signal
& Bias
W
Top & Bottom Only
i. e. DC Isolated)
{
T
Pkg Floor
Standard Tolerance
L & W ± .002''
26
相关型号：
©2020 ICPDF网 联系我们和版权申明