SH960MD-CM236T1-E3-1515M [DFI]
6th Gen Intel Xeon/Core Processor COM Express Basic;型号: | SH960MD-CM236T1-E3-1515M |
厂家: | DFI |
描述: | 6th Gen Intel Xeon/Core Processor COM Express Basic |
文件: | 总2页 (文件大小:720K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
6th Gen Intel® Xeon®/CoreTM Processor
COM Express® Basic
SH960MD-CM236/QM170
CM236
QM170
Features
BGA 1440
• Dual channel DDR4 2133MHz onboard Memory up to 16GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI
Supports three independent displays
• eDP resolution supports up to 4096x2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
* Populated by default
DDR4
Intel CM236
/QM170
850C
CPU Fan
R
2.1
-400C
Wide
Temperature
Type
6
3 Displays
RAID
AMT
Mechanical Drawing
Block Diagram
DDR4 2133MHz
Memory Down
Processor
(optional)
Channel A
Channel B
CORE CORE
CORE CORE
DDR4 2133MHz
Memory Down
eDP
LVDS
6th Generation
PTN3460
PCIe x16 (PEG)
Intel® Xeon®/Core™ E3/i7/i5
DDI Port 1
DDI Port 2
Memory
Controller
Graphics
CORE
VGA
CH7517
LPC Bus
Serial Port 0,1
SLP/LID
TPM 1.2
optional)
WDT
Embedded
Controller
IT8528E
Fan PWM/
TACH_IN
I
2C Bus
USB 3.0 4x
Coming Soon
Mobile
Intel® CM236/QM170
Chipset
PCIe (2 x1/1 x2)
PCIe (4 x1/1 x4)
PCIe (2 x1/1 x2)
PCIe x1
MDI
Intel® GLAN
I210IT
USB 2.0 8x
SATA 3.0 4x
HDA
SPI Bus
SPI Flash
PCIe L0~3
PCIe L4~5
x2
PCIe L6~7
x2
x4
x4
x2
x2
x1
x1
x1
x1
x1
x1
x1
x1
* 8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2
SH960MD-CM236/QM170
Specifications
SYSTEM
Processor
6th Generation Intel® CoreTM Processors, BGA 1440
Intel® Xeon® E3-1515M v5 Processor, Quad Core, 8M Cache, 2.8GHz (3.7GHz), 45W (Support ECC)
Intel® Core™ i7-6820EQ Processor, Quad Core, 8M Cache, 2.8GHz (3.5GHz), 45W
Intel® Core™ i5-6442EQ Processor, Quad Core, 6M Cache, 1.9GHz (2.7GHz), 25W
Intel® Core™ i3-6100E Processor, Dual Core, 3M Cache, 2.7GHz, 35W (Support ECC)
Intel® Celeron® Processor G3900E, Dual Core, 2M Cache, 2.4GHz, 35W (Support ECC)
Chipset
Memory
BIOS
Controller
Feature
Intel® CM236 Chipset
Intel® QM170 Chipset
8GB/16GB DDR4 Memory Down
Insyde SPI 128Mbit
Dual Channel DDR4 2133MHz
GRAPHICS
Intel® HD Graphics
OpenGL up to 4.4, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
Display
1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request)
2 x DDI (HDMI/DVI/DP++)
VGA: resolution up to 1920x1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz or 2560x1600 @ 60Hz
DVI: resolution up to 1920x1200 @ 60Hz
DP++/eDP: resolution up to 4096x2304 @ 60Hz
Triple Displays
Interface
VGA + LVDS + DDI or VGA + DDI1 + DDI2 eDP + 2 DDI (available upon request)
EXPANSION
1 x PCIe x16 or 2 x PCIe x8 (Gen 3)
8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)
AUDIO
ETHERNET
I/O
Interface
Controller
USB
HD Audio
1 x Intel® I210IT (10/100/1000Mbps)
4 x USB 3.0
8 x USB 2.0
SATA
4 x SATA 3.0 (up to 6Gb/s)
RAID 0/1/5/10
DIO
1 x 8-bit DIO
WATCHDOG TIMER
SECURITY
Output & Interval
TPM
System Reset, Programmable via Software from 1 to 255 Seconds
Available Upon Request
POWER
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
OS SUPPORT
Windows 8.1 64-bit
Windows 7 (/WES7) 32/64-bit
Windows 10 IoT Enterprise 64-bit
Debian 8 (with VESA graphic driver)
CentOS 7 (with VESA graphic driver)
Linux
ENVIRONMENT
Temperature
Operating: 0 to 60°C
-40 to 85°C
Storage: -40 to 85°C
Humidity
MTBF
Dimensions
Compliance
Operating: 5 to 90% RH
TBD
COM Express® Basic
PICMG COM Express® R2.1, Type 6
CE, FCC, RoHS
Storage: 5 to 90% RH
MECHANICAL
95mm (3.74") x 125mm (4.9")
CERTIFICATIONS
Ordering Information
Model Name
P/N
Processor Memory VGA/DDI LVDS/eDP GbE USB 3.0 USB 2.0 Power Thermal Temp.
Coating
VGA
VGA
VGA
VGA
VGA
VGA
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
1
1
1
1
1
1
4
4
4
4
4
4
8
8
8
8
8
8
ATX/AT Cooler
ATX/AT Cooler
ATX/AT Cooler
ATX/AT Cooler
ATX/AT Cooler
ATX/AT Cooler
-40 to 85oC Upon Request
-40 to 85oC Upon Request
-40 to 85oC Upon Request
-40 to 85oC Upon Request
-40 to 85oC Upon Request
-40 to 85oC Upon Request
SH960MD-CM236T1-E3-1515M 770-SH96M1-000G E3-1515M
16G onboard
8G onboard
16G onboard
8G onboard
8G onboard
8G onboard
SH960MD-QM170T8-6442EQ
SH960MD-QM170T1-6820EQ
SH960MD-HM170T8-6100E
SH960MD-CM236T8-G3900E
SH960MD-QM170T1-6822EQ
770-SH96M1-100G i5-6442EQ
770-SH96M1-200G i7-6820EQ
770-SH96M1-300G i3-6100E
770-SH96M1-400G G3900E
770-SH96M1-500G i7-6822EQ
Note: HALT test, shock/ vibration test and conformal coating are optional for the application in especially harsh environments.
Optional Items
Packing List
• COM332-B carrier board kit
• Heat spreader (Height: 11mm)
770-CM3321-000G
TBD
• 1 SH960MD-CM236/QM170 board
• 1 Cooler (Height: 36.58mm)
A71-111101-000G
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © Aug 25, 2020 DFI Inc.
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