HM920-QM87 [DFI]

4th Gen Intel Core COM Express Basic;


型号：	HM920-QM87
厂家：	DFI
描述：	4th Gen Intel Core COM Express Basic
文件：	总2页 (文件大小：826K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

4th Gen Intel^®Core^TM

COM Express^®

Basic

Features

HM920-QM87

MEMORY

EXPANSION

2 DDR3L SODIMM up to 16GB

1 PCIe x16, 5 PCIe x1, 4 PCI

1 LPC, 1 SMBus, 1 I²C, 1 IDE

1 VGA, 1 LVDS

QM87

BGA 1364

DDR3L_2

SODIMM

8 USB 2.0

4 SATA 3.0

SSD (optional)

DDR3L_1

SODIMM

4-bit input and 4-bit output GPIO

1 LAN

LAN

DIMENSIONS

Intel QM87

COM Express^®R2.1 Basic, Type 2

95mm x 125mm (3.74" x 4.9")

CPU Fan

SSD

Optional

DDR3L

USB 2.0

AMT 9.0

SATA 3.0

Mechanical Drawing

Block Diagram

91.00

87.00

91.00

87.00

Top View

45.39

LVDS Port

eDP

Processor

CORE CORE CORE CORE

PTN

0.00

4.00

0.00

4.00

3460

VR12.5

Channel A

4th Generation;

(Vcore)

Intel^®Core™ i7/i5/i3

1333/1600MHz

DDR3L

SODIMM

PEG 16x LANES

Memory

Controller

Graphics

CORE

Channel B

1333/1600MHz

DDR3L

SODIMM

DMI x4

(Direct Media

Interface)

Intel^®FDI

(Flexible Display

Interface)

PCIe x1

Lane 7

PCI BUS

IT8892E

PCIe to PCI

Bottom View

LPC Bus

14.00

CMOS

LPC TPM 1.2

SLB9635(option)

backup

2.00

0.00

I²C

Bus

PCIe x1

Lane 6

IDE BUS

IDB368

PCIe to PATA

WDT

Embedded

Controller

Mobile Intel^®

QM87

Express Chipset

SM Bus

53.00

SM Bus

DIO

4 in/4 out

DIO

USB 2.0 8x

SATA 3.0 4x

CRT

SATA Port

PCIe x1, Lane 1~5

SSD Chip

(option)

LAN Port

PCIe x1, Lane 8

Intel^®GLAN

PHY I217LM

Heat sink and fan

Heat spreader

Module PCB

standoff

4th Gen Intel^®Core^TM

COM Express^®

Basic

HM920-QM87

Speciﬁcations

* Optional and is not supported in standard model. Please contact your sales representative for more information.

PROCESSOR

TRUSTED PLATFORM MODULE (TPM)*

• 4th generation Intel^®Core^TMprocessors

• BGA 1364 packaging technology

• 22nm process technology

• Provides a Trusted PC for secure transactions

• Provides software license protection, enforcement and password protection

EXPANSION INTERFACES

• Supports 8 USB 2.0 interfaces

• Supports 1 PCIe x16 Gen 3 interface

• Supports 5 PCIe x1 interfaces

• Supports 4 PCI interfaces (PCI 2.3)

• Supports LPC interface

Please refer to the Ordering Information below

CHIPSET

• Intel^®QM87 Express Chipset

• Supports SMBus interface

SYSTEM MEMORY

• Two 204-pin DDR3L SODIMM sockets

• Supports DDR3L 1333/1600MHz SODIMM

• Supports up to 16GB system memory

• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM technologies are

supported for x8 and x16 devices, unbuﬀered, non-ECC

• Supports I²C interface

• Supports IDE interface

• Supports 4-bit input and 4-bit output GPIO

DAMAGE FREE INTELLIGENCE

• Monitors CPU temperature and overheat alarm

• Monitors CPU fan speed and failure alarm

• Monitors Vcore/1.05V/DDR voltages and failure alarm

ONBOARD GRAPHICS FEATURES

• Intel^®HD Graphics 4600

BIOS

• AMI BIOS

- 64Mbit SPI BIOS

• Supports 1 VGA and 1 LVDS

• VGA: resolution up to 2048x1536 @ 60Hz

• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz

• Intel^®Clear Video Technology

WATCHDOG TIMER

• Software programmable from 1 to 255 seconds

• Intel^®Advanced Vector Extensions (Intel^®AVX) Instructions

• Supports DirectX 11.1, OpenGL 4.0, OpenCL 1.2

POWER

• Input: 12V, VCC_RTC, 5VSB*

ONBOARD AUDIO FEATURES

• Supports High Deﬁnition Audio interface

POWER CONSUMPTION

• TBD

ONBOARD LAN FEATURES

OS SUPPORT

• Intel^®I217LM with iAMT9.0 Gigabit Ethernet Phy

• Integrated 10/100/1000 transceiver

• Windows XP Professional x86 & SP3 (32-bit) (limited function)

• Windows 7 Ultimate x86 & SP1 (32-bit)

• Windows 7 Ultimate x64 & SP1 (64-bit)

• Windows 8 Enterprise x86 (32-bit)

• Windows 8 Enterprise x64 (64-bit)

• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab

SERIAL ATA (SATA) INTERFACE

• Supports 4 SATA 3.0 with data transfer rate up to 6Gb/s

• Integrated Advanced Host Controller Interface (AHCI) controller

• Supports RAID 0/1/5/10

TEMPERATURE

• Operating: 0^oC to 60^oC

• Storage: -20^oC to 85^oC

• Supports Intel^®Smart Response Technology

HUMIDITY

• 5% to 90%

SSD*

MTBF

• 2GB/4GB/8GB/16GB/32GB/64GB

• Write: 30MB/sec (max), Read: 70MB/sec (max)

• SATA to SSD onboard

• 727,289 hrs @ 25°C; 420,729 hrs @ 45°C

• Calculation model: Telcordia Issue 2, Method I Case 3

• Environment: GB, GC – Ground Benign, Controlled

INTEL ACTIVE MANAGEMENT TECHNOLOGY (AMT)

• Supports iAMT9.0

• Out-of-band system access

• Remote troubleshooting and recovery

• Hardware-based agent presence checking

• Proactive alerting

PCB

• Dimensions

- COM Express^®Basic

- 95mm (3.74") x 125mm (4.9")

• Compliance

- PICMG COM Express^®R2.1, Type 2

• Remote hardware and software asset tracking

CERTIFICATION

• CE

• FCC Class B

• RoHS

IDE INTERFACE

• Supports one IDE device

• DMA mode: Ultra ATA up to 100MB/s

• PIO mode: up to 16MB/s

Ordering Information

Model Name

Processor

Memory

SSD

Power

ATX/AT

Thermal

None

Temperature

0^oC to 60^oC

HM920-QM87BS0-4700EQ Intel^®Core^TMi7-4700EQ, 6M Cache, 2.4GHz (3.4GHz), 47W 2 SODIMM

None

HM920-QM87BS0-4700EQ Intel^®Core^TMi7-4700EQ, 6M Cache, 2.4GHz (3.4GHz), 47W

2 SODIMM

Cooler

None

HM920-QM87BS0-4400E

HM920-QM87BS0-4402E

Intel^®Core^TMi5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W

Intel^®Core^TMi5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W

Cooler

None

Cooler

Packing List

Optional Items

• 1 HM920 board

• Heat spreader with heat sink and fan: 761-HSWMBL-000G

• COM330-B carrier board kit: 770-COM330-000G

• Heat spreader: A71-011029-000G

DFI reserves the right to change the speciﬁcations at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales

representative for the exact revision oﬀered in your area. All product names mentioned are trademarks of their respective companies. © December 20, 2019 DFI Inc.

www.dﬁ.com

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