CH960-QM370TS-9850HE [DFI]
8th/9th Gen Intel Core Processor COM Express Basic;型号: | CH960-QM370TS-9850HE |
厂家: | DFI |
描述: | 8th/9th Gen Intel Core Processor COM Express Basic |
文件: | 总2页 (文件大小:812K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
8th/9th Gen Intel® CoreTM Processor
COM Express® Basic
Features
CH960-CM246/QM370
• Dual channel DDR4 2666MHz SODIMM up to 64GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI
Supports three independent displays
CM246
QM370
BGA 1440
• eDP resolution supports up to 4096x2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
* Populated by default
DDR4_2
SODIMM
DDR4_1
SODIMM
850C
R
2.1
Intel CM246/
QM370
-400C
Wide
Temperature
Type
6
3 Displays
USB 3.1
AMT
CPU Fan
Mechanical Drawing
Block Diagram
DDR4 2666MHz
SODIMM
Processor
(optional)
Channel A
Channel B
DDR4 2666MHz
SODIMM
8th/9th Generation
Intel® Xeon® E3 / Core™ i7 (6 CORE)
eDP
LVDS
VGA
PTN3460
8th Generation
PCIe x16 (PEG)
Intel® Core™ i5/i3 (4 CORE)
DDI Port 1
DDI Port 2
Memory
2x Graphics
CORES
Controller
CH7517
LPC Bus
4.00
0.00
Serial Port 0,1
SLP/LID
WDT
TPM 1.2/2.0
(optional)
Embedded
Controller
IT8528E
Fan PWM/
TACH_IN
19.43
I
2C Bus
USB 3.1 4x
41.53
58.67
Mobile
Intel® CM246/QM370
Chipset
PCIe (2 x1/1 x2)
PCIe (4 x1/1 x4)
PCIe (2 x1/1 x2)
PCIe x1
MDI
Intel® GLAN
I219LM
87.00
91.00
USB 2.0 8x
SATA 30 4x
HDA
SPI Bus
SPI Flash
PCIe L0~3
PCIe L4~5
x2
PCIe L6~7
x2
x4
x4
x2
x2
x1
x1
x1
x1
x1
x1
x1
x1
* 8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2
CH960-CM246/QM370
Specifications
SYSTEM
Processor
8th/9th Generation Intel® Core™ Processors, BGA 1440
Intel® Core™ i7-8850H, 6 Cores, 12M Cache, 2.6GHz (4.3GHz), 45W (CM246/QM370)
Intel® Core™ i5-8400H, 4 Cores, 8M Cache, 2.5GHz (4.2GHz), 45W (CM246/QM370)
Intel® Core™ i3-8100H, 4 Cores, 6M Cache, 3.0GHz, 45W (QM370)
Intel® Core™ i7-9850HL, 6 Cores, 9M Cache, 1.9GHz (4.1GHz), 25W (QM370)
Intel® Core™ i7-9850HE, 6 Cores, 9M Cache, 2.7GHz (4.4GHz), 45W (QM370)
Intel® Xeon® E-2176M, 6 Cores, 12M Cache, 2.7GHz (4.4GHz), 45W (CM246/QM370)
Intel® Xeon® E-2276ML, 6 Cores, 12M Cache, 2.0GHz (4.2GHz), 25W (CM246)
Intel® Xeon® E-2276ME, 6 Cores, 12M Cache, 2.8GHz (4.5GHz), 45W (CM246)
Intel® Xeon® E-2254ML, 4 Cores, 8M Cache, 1.7GHz (3.5GHz), 25W (CM246)
Intel® Xeon® E-2254ME, 4 Cores, 8M Cache, 2.6GHz (3.8GHz), 45W (CM246)
Intel® Celeron® G4930E, 2 Cores, 2M Cache, 2.4GHz (2.4GHz), 35W (CM246)
Chipset
Memory
BIOS
Controller
Feature
Intel® CM246 Chipset (Support ECC)
Two 260-pin SODIMM up to 64GB
AMI SPI 128Mbit
Intel® QM370 Chipset
Dual Channel DDR4 2666MHz
GRAPHICS
Intel® HD Graphics
OpenGL up to 4.5, DirectX 11, OpenCL 2.1
HW Decode: HEVC/H.265, H.264, M/JPEG, MPEG2, VC1/WMV9, VP8 (8-bit), VP9 (10-bit)
HW Encode: HEVC/H.265, M/JPEG, MPEG2, VP8
Display
1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request)
2 x DDI (HDMI/DVI/DP++)
VGA: resolution up to 1920x1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
HDMI: resolution up to 4096x2160 @ 30Hz 24bpp
DVI: resolution up to 1920x1200 @ 60Hz
DP++/eDP: resolution up to 4096x2304 @ 60Hz
Triple Displays
Interface
VGA + LVDS + DDI or VGA + DDI 1 + DDI 2 eDP + 2 DDI (available upon request)
EXPANSION
1 x PCIe x16 or 2 x PCIe x8 (Gen 3)
8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)
AUDIO
ETHERNET
I/O
Interface
Controller
USB
HD Audio
1 x Intel® I219LM with iAMT12.0 PCIe (10/100/1000Mbps)
4 x USB 3.1
8 x USB 2.0
SATA
4 x SATA 3.0 (up to 6Gb/s)
RAID 0/1/5/10
DIO
1 x 8-bit DIO (Default 4 inputs and 4 outputs)
WATCHDOG TIMER
SECURITY
Output & Interval
TPM
System Reset, Programmable via Software from 1 to 255 Seconds
Available Upon Request
POWER
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption
Typical: 12V @ 0.85A (13.07Watt)
Max.: 12V @ 5.75A (74.084Watt)
OS SUPPORT
Windows: Windows 10 IoT Enterprise 64-bit Linux
ENVIRONMENT
Temperature
Operating: 0 to 60°C
-40 to 85°C
Storage: -40 to 85°C
Humidity
MTBF
Operating: 5 to 90% RH
1,360,171 hrs @ 25°C; 892,642 hrs @ 45°C; 624,277 hrs @ 60°C excluding accessories
Calculation Model: Telcordia Issue 4
Storage: 5 to 90% RH
Environment: GB, GC – Ground Benign, Controlled
MECHANICAL
Dimensions
Compliance
COM Express® Basic
PICMG COM Express® R2.1, Type 6
95mm (3.74") x 125mm (4.9")
Ordering Information
Model Name
P/N
Processor
Memory
VGA/DDI LVDS/eDP GbE USB 3.0 USB 2.0 Power
Thermal Temp.
CH960-QM370TS-8850H 770-CH9601-000G i7-8850H
CH960-CM246BS-2176M 770-CH9601-100G E-2176M
CH960-QM370BS-8850H 770-CH9601-200G i7-8850H
CH960-QM370BS-8400H 770-CH9601-500G i5-8400H
CH960-QM370BS-8100H 770-CH9601-700G i3-8100H
CH960-CM246BS-2276ML 770-CH9601-800G E-2276ML
CH960-CM246TS-2276ME 770-CH9601-900G E-2276ME
CH960-CM246BS-2254ML 770-CH9601-A00G E-2254ML
CH960-CM246TS-2254ME 770-CH9601-B00G E-2254ME
CH960-QM370BS-9850HL 770-CH9601-C00G i7-9850HL
CH960-QM370TS-9850HE 770-CH9601-D00G i7-9850HE
CH960-CM246BS-G4930E 770-CH9601-G00G G4930E
2 SODIMM VGA
2 SODIMM VGA
2 SODIMM VGA
2 SODIMM VGA
2 SODIMM VGA
2 SODIMM VGA
2 SODIMM VGA
2 SODIMM VGA
2 SODIMM VGA
2 SODIMM VGA
2 SODIMM VGA
2 SODIMM VGA
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
1
1
1
1
1
1
1
1
1
1
1
1
4
4
4
4
4
4
4
4
4
4
4
4
8
8
8
8
8
8
8
8
8
8
8
8
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Cooler
Cooler
Cooler
Cooler
Cooler
Cooler
Cooler
Cooler
Cooler
Cooler
Cooler
Cooler
-40 to 85oC
0 to 60oC
0 to 60oC
0 to 60oC
0 to 60oC
0 to 60oC
-40 to 85oC
0 to 60oC
-40 to 85oC
0 to 60oC
-40 to 85oC
0 to 60oC
Optional Items
Packing List
• COM332-B carrier board kit
• Heat spreader (Height: 11mm)
770-CM3321-000G
A71-808316-000G
• 1 CH960-HM370 board
Wide Temp: A71-111100-010G
Standard: A71-111100-000G
• 1 Cooler (Height: 36.58mm)
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © April 1, 2020 DFI Inc.
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