RL0204-G-R900J [DELTA]
1/32W, 01005 Low Resistance Chip Resistor (Lead / Halogen free); 1 / 32W , 01005低电阻贴片电阻(无铅/无卤素)型号: | RL0204-G-R900J |
厂家: | DELTA ELECTRONICS, INC. |
描述: | 1/32W, 01005 Low Resistance Chip Resistor (Lead / Halogen free) |
文件: | 总7页 (文件大小:91K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DOCUMENT : SRQG0000NH
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SPECIFICATION FOR APPROVAL
1/32W, 01005 Low Resistance Chip Resistor (Lead / Halogen free)
1. Scope
This specification applies 0.2mm x 0.4mm (01005) size 1/32W, fixed metal film chip resistors
rectangular type for use in electronic equipment.
2. Type Designation
RL 0204
(1)
—
G
— □□□□
□
(2)
(3)
(4)
Where
(1) Series No.
(2) Power rating
G = 1/32W
(3) Resistance value:
For example—
R300 = 0.3 Ω
(4) Resistance tolerance:
F= ± 1%
G= ± 2%
J= ± 5%
3. Construction and Physical Dimensions
L
Code Letter Dimensions (mm)
a
a
L
W
t
0.40 ± 0.03
0.21 ± 0.03
0.14 ± 0.03
0.10 ± 0.03
0.10 ± 0.03
W
a
b
NOTE:
Resistive element
( under protection film )
Electrode
①
t
②
③
Protection film
b
b
(up side:white color; down side:black color)
Substrate
④
Figure 1. Structure (No mark)
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4. Ratings
4-1 Specification
Power Rating*
1/32 W
Resistance Range
0.3Ω ~ 1.0Ω
±200ppm/℃
Temperature Coefficient of Resistance
Resistance Tolerance
±1% , ±2% , ±5%
Note*:
Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.
For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be
derated in accordance with the following curve.
%
100
Percentage of the
50
rated dissipation
0
℃
-55
70
125
Ambient temperature
Figure 2 Derating Curve
4-2 Rated Voltage
The rated voltage shall be determined by the following expression.
V = P × R
Where V:Rated voltage (V)
R:Nominal resistance value (Ω)
P:Rated dissipation (W)
4-3 Operating and Storage Temperature Range
-55 to +125℃
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5. Characteristics
Test Item
Condition of Test
Requirements
∆R : ± (2.0%+0.0005
Short Time Overload
2.5 * Rated power for 5 seconds
Refer to JIS C 5201-1 4.13
Ω)
Without significant damage by
flashover ( spark, arching ), burning
or breakdown etc.
Insulation Resistance
The resistor shall be cramped in the
Between Electrode and Protection
metal block and tested , as shown below. Film 100MΩ or over
Test voltage : 100 ± 15VDC for 1 minute Between Electrode and Substrate
Refer to JIS C 5201-1 4.6 Mounting
condition G.
1,000MΩ or over
Voltage Proof
The voltage : 100VAC (rms.) for 1 minute ∆R : ± (2.0%+0.0005Ω)
Refer to JIS C 5201-1 4.7
Without damage by flashover, fire
or breakdown, as shown below.
Thermal Shock
-55 ~125℃ 5 cycles, 15 min at each
extreme condition
∆R : ± (1.0%+0.0005Ω)
Without distinct damage in
appearance
Refer to JIS C 5201-1 4.19
Low Temperature Storage
Kept at -55℃, 1,000 hours
∆R : ± (5.0%+0.0005Ω)
Refer to JIS C 5201-1 4.23.4
Without distinct damage in
appearance
High Temperature Exposure
Solderability
Kept at 125℃ for 1,000 hours
∆R : ± (5.0%+0.0005Ω)
Refer to JIS C 5201-1 4.23.2
Without distinct damage in
appearance
Temperature of Solder : 245 ± 5℃
Immersion Duration : 2 ± 0.5 second
Refer to JIS C 5201-1 4.17
Uniform coating of solder cover
minimum of 95% surface being
immersed
Resistance to Soldering Heat
Dipped into solder at 270 ± 5℃
for 10 ± 1 seconds
∆R : ± (1.0%+0.0005Ω)
Without distinct deformation in
appearance
Refer to JIS C 5201-1 4.18
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SPECIFICATION FOR APPROVAL
Test Item
Condition of Test
Requirements
Load Life
Rated voltage for 1.5 hours followed by a ∆R : ± (5.0%+0.0005Ω)
pause 0.5 hour at 70 ± 2℃.
Cycle repeated 1000 hours
Refer to JIS C 5201-1 4.25
Without distinct damage in
appearance
Damp Heat with Load
40 ± 2℃ with relative humidity 90% to
95%. D.C. rated voltage for 1.5 hours
ON and 30 minutes OFF. Cycle
repeated 1,000 hours
∆R : ± (5.0%+0.0005Ω)
Without distinct damage in
appearance
Refer to JIS C 5201-1 4.24
Mechanical Shock
Bending Test
100 G’s for 6milliseconds. 5 pulses
Refer to JIS C 5201-1 4.21
∆R : ± (0.5%+0.0005Ω)
Without mechanical damage such
as break
Glass-Epoxy board thickness : 1.6mm
Bending width : 2mm
∆R : ±(1.0%+0.0005Ω)
Without mechanical damage such
as break
Between the fulcrums : 90mm
Refer to JIS C 5201-1 4.33
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6. Recommended Solder Pad Dimensions
L
D
W
L
D
W
0204
0.2~0.4 0.5~0.8
0.17~0.3
Cu Trace
Unit : mm
Sensing Trace
Note : We recommend there is no circuit design between pads to avoid circuit short
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SPECIFICATION FOR APPROVAL
7. Packaging
7-1 Dimensions
7-1-1 Tape packaging dimensions
0.31±0.03
+0.1
-0.0
1.75±0.1
Sprocket hole
4.0±0.1
2.0±0.05
1.5
A
3.5±0.05
8.0±0.2
B
A=0.25±0.05
B=0.45±0.05
Carrier cavity
0.17±0.02
Pull Direction
Unit : mm
0.39max.
7-1-2 Reel dimensions
2.0±0.5
13 ± 0.2
21 ± 0.8
9.0 ± 0.3
11.4 ± 1.0
Unit : mm
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SPECIFICATION FOR APPROVAL
7-2 Peel force of top cover tape
The peel speed shall be about 300 mm/min.
The peel force of top cover tape shall be between 0.1 to 0.5 N.
Top Cover Tape
165 ~ 180°
0.1~0.7 N
7-3 Numbers of taping
20,000 pieces /reel
7-4 Making
The following items shall be marked on the reel.
(1) Type designation.
(2) Quantity
(3) Manufacturing date code
(4) Manufacturer’s name
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