RL0204-G-R600J [DELTA]

1/32W, 01005 Low Resistance Chip Resistor (Lead / Halogen free); 1 / 32W ， 01005低电阻贴片电阻（无铅/无卤素）


型号：	RL0204-G-R600J
厂家：	DELTA ELECTRONICS, INC.
描述：	1/32W, 01005 Low Resistance Chip Resistor (Lead / Halogen free) 1 / 32W ， 01005低电阻贴片电阻（无铅/无卤素）
文件：	总7页 (文件大小：91K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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SPECIFICATION FOR APPROVAL

1/32W, 01005 Low Resistance Chip Resistor (Lead / Halogen free)

1. Scope

This specification applies 0.2mm x 0.4mm (01005) size 1/32W, fixed metal film chip resistors

rectangular type for use in electronic equipment.

2. Type Designation

RL 0204

(1)

—

— □□□□

□

(2)

(3)

(4)

Where

(1) Series No.

(2) Power rating

G = 1/32W

(3) Resistance value:

For example—

R300 = 0.3 Ω

(4) Resistance tolerance:

F= ± 1%

G= ± 2%

J= ± 5%

3. Construction and Physical Dimensions

Code Letter Dimensions (mm)

0.40 ± 0.03

0.21 ± 0.03

0.14 ± 0.03

0.10 ± 0.03



NOTE:

Resistive element

( under protection film )

Electrode

①

②

③

Protection film

(up side:white color; down side:black color)

Substrate

④

Figure 1. Structure (No mark)

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SPECIFICATION FOR APPROVAL

4. Ratings

4-1 Specification

Power Rating*

1/32 W

Resistance Range

0.3Ω ~ 1.0Ω

±200ppm/℃

Temperature Coefficient of Resistance

Resistance Tolerance

±1% , ±2% , ±5%

Note*:

Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.

For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be

derated in accordance with the following curve.

100

Percentage of the

rated dissipation

℃

-55

125

Ambient temperature

Figure 2 Derating Curve

4-2 Rated Voltage

The rated voltage shall be determined by the following expression.

V = P × R

Where V：Rated voltage (V)

R：Nominal resistance value (Ω)

P：Rated dissipation (W)

4-3 Operating and Storage Temperature Range

-55 to +125℃

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SPECIFICATION FOR APPROVAL

5. Characteristics

Test Item

Condition of Test

Requirements

∆R : ± (2.0%+0.0005

Short Time Overload

2.5 * Rated power for 5 seconds

Refer to JIS C 5201-1 4.13

Ω)

Without significant damage by

flashover ( spark, arching ), burning

or breakdown etc.

Insulation Resistance

The resistor shall be cramped in the

Between Electrode and Protection

metal block and tested , as shown below. Film 100MΩ or over

Test voltage : 100 ± 15V_DCfor 1 minute Between Electrode and Substrate

Refer to JIS C 5201-1 4.6 Mounting

condition G.

1,000MΩ or over

Voltage Proof

The voltage : 100V_AC(rms.) for 1 minute ∆R : ± (2.0%+0.0005Ω)

Refer to JIS C 5201-1 4.7

Without damage by flashover, fire

or breakdown, as shown below.

Thermal Shock

-55 ~125℃ 5 cycles, 15 min at each

extreme condition

∆R : ± (1.0%+0.0005Ω)

Without distinct damage in

appearance

Refer to JIS C 5201-1 4.19

Low Temperature Storage

Kept at -55℃, 1,000 hours

∆R : ± (5.0%+0.0005Ω)

Refer to JIS C 5201-1 4.23.4

Without distinct damage in

appearance

High Temperature Exposure

Solderability

Kept at 125℃ for 1,000 hours

∆R : ± (5.0%+0.0005Ω)

Refer to JIS C 5201-1 4.23.2

Without distinct damage in

appearance

Temperature of Solder : 245 ± 5℃

Immersion Duration : 2 ± 0.5 second

Refer to JIS C 5201-1 4.17

Uniform coating of solder cover

minimum of 95% surface being

immersed

Resistance to Soldering Heat

Dipped into solder at 270 ± 5℃

for 10 ± 1 seconds

∆R : ± (1.0%+0.0005Ω)

Without distinct deformation in

appearance

Refer to JIS C 5201-1 4.18

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SPECIFICATION FOR APPROVAL

Test Item

Condition of Test

Requirements

Load Life

Rated voltage for 1.5 hours followed by a ∆R : ± (5.0%+0.0005Ω)

pause 0.5 hour at 70 ± 2℃.

Cycle repeated 1000 hours

Refer to JIS C 5201-1 4.25

Without distinct damage in

appearance

Damp Heat with Load

40 ± 2℃ with relative humidity 90% to

95%. D.C. rated voltage for 1.5 hours

ON and 30 minutes OFF. Cycle

repeated 1,000 hours

∆R : ± (5.0%+0.0005Ω)

Without distinct damage in

appearance

Refer to JIS C 5201-1 4.24

Mechanical Shock

Bending Test

100 G’s for 6milliseconds. 5 pulses

Refer to JIS C 5201-1 4.21

∆R : ± (0.5%+0.0005Ω)

Without mechanical damage such

as break

Glass-Epoxy board thickness : 1.6mm

Bending width : 2mm

∆R : ±(1.0%+0.0005Ω)

Without mechanical damage such

as break

Between the fulcrums : 90mm

Refer to JIS C 5201-1 4.33

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SPECIFICATION FOR APPROVAL

6. Recommended Solder Pad Dimensions

0204

0.2~0.4 0.5~0.8

0.17~0.3

Cu Trace

Unit : mm

Sensing Trace

Note : We recommend there is no circuit design between pads to avoid circuit short

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SPECIFICATION FOR APPROVAL

7. Packaging

7-1 Dimensions

7-1-1 Tape packaging dimensions

0.31±0.03

+0.1

-0.0

1.75±0.1

Sprocket hole

4.0±0.1

2.0±0.05

1.5

3.5±0.05

8.0±0.2

A=0.25±0.05

B=0.45±0.05

Carrier cavity

0.17±0.02

0.15±0.02

Pull Direction

Unit : mm

0.39max.

7-1-2 Reel dimensions

2.0±0.5

13 ± 0.2

21 ± 0.8

9.0 ± 0.3

11.4 ± 1.0

Unit : mm

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SPECIFICATION FOR APPROVAL

7-2 Peel force of top cover tape

The peel speed shall be about 300 mm/min.

The peel force of top cover tape shall be between 0.1 to 0.5 N.

Top Cover Tape

165 ~ 180°

0.1~0.7 N

7-3 Numbers of taping

20,000 pieces /reel

7-4 Making

The following items shall be marked on the reel.

(1) Type designation.

(2) Quantity

(3) Manufacturing date code

(4) Manufacturer’s name

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