SK240 [CYSTEKEC]
2.0Amp. Surface Mount Schottky Barrier Diodes;
| 型号： | SK240 |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | 2.0Amp. Surface Mount Schottky Barrier Diodes |
| 文件： | 总5页 (文件大小：150K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C347SC
Issued Date : 2011.05.30
Revised Date :
CYStech Electronics Corp.
Page No. : 1/ 5
2.0Amp. Surface Mount Schottky Barrier Diodes
SK220SC-SK2150SC Series
Features
• For surface mounted applications.
• For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
• Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
• Low leakage current
• High surge capability
• High temperature soldering: 250°C/10 seconds at terminals
• Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
• Case: Molded plastic, SMC/JEDEC DO-214AB.
• Terminals: Solder plated, solderable per MIL-STD-750 method 2026
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight: 0.195 gram, 0.00585 ounce
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. )
Type
Parameter
Symbol
Units
SK220 SK240 SK260 SK2100 SK2150
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
VRRM
VRMS
VR
20
14
20
40
28
40
60
42
60
100
70
100
150
105
150
V
V
V
Maximum instantaneous
forward voltage, IF=2A
Average forward rectified current
Peak forward surge current @8.3ms single half sine
wave superimposed on rated load (JEDEC method)
Maximum DC reverse current
VF
IO
0.50
0.7
0.85
0.9
V
A
A
2
IFSM
50
mA
mA
℃
VR=VRRM,TA=25
0.5
10
IR
℃
VR=VRRM,TA=125
Maximum thermal resistance, Junction to ambient
Maximum thermal resistance, Junction to lead
Diode junction capacitance @ f=1MHz and applied
4VDC reverse voltage
Storage temperature
Operating temperature
Rth,JA
Rth,JL
55
℃
/W
20 (Note)
CJ
170(typ)
-55 ~ +150
-55 ~ +150
pF
Tstg
TJ
℃
℃
-55 ~ +125
Note : Measure on PCB with 0.2”×0.2”(5mm×5mm) copper pad area.
SK220SC-SK2150SC
CYStek Product Specification
Spec. No. : C347SC
Issued Date : 2011.05.30
Revised Date :
CYStech Electronics Corp.
Page No. : 2/ 5
Characteristic Curves
Maximum Non-Repetitive Forward Surge Current
Forward Current Derating Curve
60
50
40
30
20
10
0
2.5
2
Tj=25℃, 8.3ms Single Half
Sine Wave
JEDEC method
1.5
1
0.5
0
1
10
100
0
50
100
150
200
Number of Cycles at 60Hz
Ambient Temperature---TA(℃)
Forward Current vs Forward Voltage
Junction Capacitance vs Reverse Voltage
10
1
700
600
500
400
300
200
100
0
SK22-SK24
SK26
SK28-SK2B
0.1
0.01
Tj=25℃, Pulse width=300μs,
1% Duty cycle
0.01
0.1
1
10
100
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
Forward Voltage---VF(V)
Reverse Voltage---VR(V)
Reverse Leakage Current vs Reverse Voltage
100
10
1
Tj=75℃
Tj=25℃
0.1
0.01
0
20
40
60
80
100 120 140
Percent of Rated Peak
Reverse Voltage---(%)
SK220SC-SK2150SC
CYStek Product Specification
Spec. No. : C347SC
Issued Date : 2011.05.30
Revised Date :
CYStech Electronics Corp.
Page No. : 3/ 5
Ordering Information
Device
Package
Shipping
Marking
SK22
SK220SC
SMC
SMC
SMC
SMC
SMC
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
SK240SC
SK260SC
SK2100SC
SK2150SC
SK24
SK26
S210
S215
SK220SC-SK2150SC
CYStek Product Specification
Spec. No. : C347SC
Issued Date : 2011.05.30
Revised Date :
CYStech Electronics Corp.
Page No. : 4/ 5
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
6°C/second max.
6 minutes max.
20-40 seconds
6°C/second max.
8 minutes max.
Ramp down rate
Time 25 °C to peak
temperature
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK220SC-SK2150SC
CYStek Product Specification
Spec. No. : C347SC
Issued Date : 2011.05.30
Revised Date :
CYStech Electronics Corp.
Page No. : 5/ 5
DO-214AB/SMC Dimension
DO-214AB/SMC Plastic
Surface Mounted Package
CYStek Package Code : SC
*:Typical
Inches
Min.
0.114
0.220
0.260
0.078
Millimeters
Inches
Min.
0.006
0.004
0.030
0.305
Millimeters
DIM
DIM
Max.
0.126
0.245
0.280
0.103
Min.
2.90
5.59
6.60
1.98
Max.
3.20
6.22
7.11
2.62
Max.
0.012
0.008
0.060
0.320
Min.
0.15
0.10
0.76
7.75
Max.
0.31
0.20
1.52
8.13
A
B
C
D
E
F
G
H
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK220SC-SK2150SC
CYStek Product Specification
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