DTA124XA3-0-TB-G [CYSTEKEC]
PNP Digital Transistors;
| 型号： | DTA124XA3-0-TB-G |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | PNP Digital Transistors |
| 文件： | 总6页 (文件大小：411K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C266A3
Issued Date : 2017.11.23
Revised Date :
CYStech Electronics Corp.
Page No. : 1/6
PNP Digital Transistors (Built-in Resistors)
DTA124XA3
Features
Built-in bias resistors enable the configuration of an inverter circuit without connecting external input
resistors (see equivalent circuit).
The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing of the
input. They also have the advantage of almost completely eliminating parasitic effects.
Only the on/off conditions need to be set for operation, making device design easy.
Complements the DTC124XA3
Pb-free lead plating and Halogen-free package
Equivalent Circuit
Outline
TO-92
DTA124XA3
R1=22k , R2=47 k
IN(B) : Base
OUT(C) : Collector
GND(E) : Emitter
E C B
Ordering Information
Device
Package
TO-92
Shipping
DTA124XA3-0-TB-G
2000 pcs / Tape & Box
(Pb-free lead plating and halogen-free package)
TO-92
1000 pcs/ bag, 10 bags/box,
10boxes/carton
DTA124XA3-0-BK-G
(Pb-free lead plating and halogen-free package)
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, TB :2000 pcs/tape & box; BK: 1000 pcs / bag, 10 bags/box, 10 boxes/carton
Product rank, zero for no rank products
Product name
DTA124XA3
CYStek Product Specification
Spec. No. : C266A3
Issued Date : 2017.11.23
Revised Date :
CYStech Electronics Corp.
Page No. : 2/6
Absolute Maximum Ratings (Ta=25C)
Parameter
Symbol
VCC
VCBO
VCEO
VEBO
VI
IO
IO(max.)
PD
Limits
-50
-50
-50
-7
-40~+10
-50
-100
Unit
V
V
V
V
V
mA
mA
mW
C/W
C
Supply Voltage
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Input Voltage
Output Current
500
250
150
Power Dissipation @ TA=25C
Thermal Resistance, Junction to Ambient
Junction Temperature
RθJA
Tj
Storage Temperature
Operating Ambient Temperature
Tstg
Tamb
-65~+150
-65~+150
C
C
Electrical Characteristics (Ta=25C)
Parameter
Input Voltage
Symbol Min. Typ. Max. Unit
Test Conditions
VI(off)
VI(on)
VO(on)
II
-
-
-
-0.4
-
V
V
VCC=-5V, IO=-100μA
VO=-0.3V, IO=-2mA
-2.5
Output Voltage
Input Current
-
-
-
-46
-
-
-150 mV IO=-10mA, II=-0.5mA
-0.36 mA VI=-5V
-100
Output Current
Collector Base
Cutoff Current
Collector Emitter
Cutoff Current
DC Current Gain
Input Resistance
Resistance Ratio
Transition Frequency
IO(off)
nA
VCC=-50V, VI=0V
ICBO
ICEO
-
-
-
-
-100
nA
VCB=-50V, IE=0A
-500
nA
VCE=-50V, IB=0A
HFE
R1
R2/R1
fT
68
15.4
1.7
-
-
22
2.1
250
-
28.6
2.6
-
-
k
-
VCE=-5V, IC=-5mA
-
-
MHz VCE=-10V, IC=-5mA, f=100MHz *
* Transition frequency of the device
DTA124XA3
CYStek Product Specification
Spec. No. : C266A3
Issued Date : 2017.11.23
Revised Date :
CYStech Electronics Corp.
Page No. : 3/6
Typical Characteristics
DC Current Gain vs Output Current
Output Voltage vs Output Current
1000
100
10
1000
Vo=5V
Io / Ii = 20
100
10
1
1
10
Output Current ---Io(mA)
100
0.1
1
10
100
Output Current---Io(mA)
Input Voltage vs Output Current (ON Characteristics)
Output Current vs Input Voltage (OFF Characteristics)
100
10
1
10
Vo=0.3V
Vcc=5V
1
0.1
0.1
0.1
1
10
100
0
0.5
1
1.5
2
Input Voltage --- Vi(off)(V)
Output Current --- Io(mA)
Power Derating Curve
600
500
400
300
200
100
0
0
50
100
150
200
Ambient Temperature --- TA(℃ )
DTA124XA3
CYStek Product Specification
Spec. No. : C266A3
Issued Date : 2017.11.23
Revised Date :
CYStech Electronics Corp.
Page No. : 4/6
TO-92 Taping Outline
H2AH2A
D2
H2
H2
A
H3
H4 H
L
L1
W1
H1
W
D1
D
F1F2
P
P1
T2
T
T1
P2
Millimeters
DIM
Item
Min.
4.33
3.80
0.36
4.33
2.40
-
15.50
8.50
-
Max.
4.83
4.20
0.53
4.83
2.90
0.3
16.50
9.50
1
A
D
Component body height
Tape Feed Diameter
Lead Diameter
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
-
-
-
-
1
27
21
11
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
L1
P
2.50
12.50
5.95
50.30
-
-
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
P1
P2
T
T1
T2
W
-
0.36
17.50
5.00
253
W1
-
Adhesive Tape Width
20 pcs Pitch
DTA124XA3
CYStek Product Specification
Spec. No. : C266A3
Issued Date : 2017.11.23
Revised Date :
CYStech Electronics Corp.
Page No. : 5/6
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
265 +0/-5 C
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100C
150C
60-120 seconds
150C
200C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183C
60-150 seconds
217C
60-150 seconds
Peak Temperature(TP)
240 +0/-5 C
265 +0/-5 C
Time within 5C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6C/second max.
6C/second max.
6 minutes max.
8 minutes max.
Time 25 C to peak temperature
Note : All temperatures refer to topside of the package, measured on the package body surface.
DTA124XA3
CYStek Product Specification
Spec. No. : C266A3
Issued Date : 2017.11.23
Revised Date :
CYStech Electronics Corp.
Page No. : 6/6
TO-92 Dimension
2
3
Marking:
A
B
1
2
3
A124X
□□
Date Code
C
E
D
H
G
1
Style: Pin 1.Emitter 2.Collector 3.Base
I
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
F
*: Typical
Inches
Min. Max.
0.1704 0.1902
0.1704 0.1902
Millimeters
Inches
Min. Max.
0.0142 0.0220
Millimeters
DIM
DIM
Min.
4.33
4.33
12.70
0.36
-
Max.
4.83
4.83
-
0.56
*1.27
3.76
Min.
0.36
Max.
0.56
*2.54
*1.27
*5
A
B
C
D
E
F
G
H
I
1
2
3
-
-
-
-
-
*0.1000
*0.0500
*5
-
-
-
-
-
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
-
-
*2
*2
*2
3.36
*2
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: Pure tin plated.
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DTA124XA3
CYStek Product Specification
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