PALCE20V8L-15JCT [CYPRESS]

Flash PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28;
PALCE20V8L-15JCT
型号: PALCE20V8L-15JCT
厂家: CYPRESS    CYPRESS
描述:

Flash PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28

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文件: 总14页 (文件大小:354K)
中文:  中文翻译
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20V8  
PALCE20V8  
Flash Erasable,  
Reprogrammable CMOS PAL Device  
• QSOP package available  
Features  
— 10, 15, and 25 ns com’l version  
15, and 25 ns military/industrial versions  
• High reliability  
• Active pull-up on data input pins  
• Low power version (20V8L)  
— 55 mA max. commercial (15, 25 ns)  
Proven Flash technology  
— 65 mA max. military/industrial  
(15, 25 ns)  
100% programming and functional testing  
• Standard version has low power  
Functional Description  
— 90 mA max. commercial  
(15, 25 ns)  
The Cypress PALCE20V8 is a CMOS Flash Erasable sec-  
ond-generation programmable array logic device. It is imple-  
mented with the familiar sum-of-product (AND-OR) logic struc-  
ture and the programmable macrocell.  
— 115 mA max. commercial (10 ns)  
— 130 mA max. military/industrial (15, 25 ns)  
• CMOS Flash technology for electrical erasability and  
reprogrammability  
• User-programmable macrocell  
— Output polarity control  
The PALCE20V8 is executed in a 24-pin 300-mil molded DIP,  
a 300-mil cerdip, a 28-lead square ceramic leadless chip car-  
rier, a 28-lead square plastic leaded chip carrier, and a 24-lead  
quarter size outline. The device provides up to 20 inputs and  
8 outputs. The PALCE20V8 can be electrically erased and re-  
programmed. The programmable macrocell enables the de-  
vice to function as a superset to the familiar 24-pin PLDs such  
as 20L8, 20R8, 20R6, 20R4.  
— Individually selectable for registered or combinato-  
rial operation  
Logic Block Diagram (PDIP/CDIP/QSOP)  
GND  
I
10  
I
9
I
8
I
7
I
6
I
5
I
4
I
3
I
2
I
1
CLK/I  
0
12  
11  
10  
9
8
7
6
5
4
3
2
1
PROGRAMMABLE  
AND ARRAY  
(64 x 40)  
8
8
8
8
8
8
8
8
MUX  
Macrocell  
Macrocell  
Macrocell  
Macrocell  
Macrocell  
Macrocell  
Macrocell  
Macrocell  
MUX  
13  
OE/I  
14  
15  
I/O  
16  
I/O  
17  
I/O  
18  
I/O  
19  
I/O  
20  
I/O  
21  
I/O  
22  
I/O  
23  
24  
I
12  
I
13  
V
CC  
11  
0
1
2
3
4
5
6
7
20V81  
PAL is a registered trademark of Advanced Micro Devices, Inc.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-03026 Rev. **  
Revised March 26, 1997  
PALCE20V8  
Pin Configuration  
PLCC/LCC  
Top View  
DIP/QSOP  
Top View  
CLK/I  
1
2
3
4
5
6
24  
23  
22  
V
0
CC  
I
13  
I
1
I
2
I/O  
4
3
2
1
2827 26  
25  
7
I
I/O  
3
21  
20  
19  
18  
17  
6
I
3
5
I/O  
6
I
4
I/O  
I/O  
I
I
5
5
6
7
8
9
10  
11  
4
I/O  
5
24  
23  
22  
21  
20  
19  
I
5
4
I/O  
4
I
6
I/O  
I/O  
7
8
3
NC  
NC  
I/O  
I
7
2
I
6
3
I/O  
I
I
9
9
1
16  
15  
14  
13  
I
8
I/O  
2
I/O  
1
7
I
8
10  
11  
12  
I/O  
0
121314 1516 1718  
I
I
12  
10  
OE/I  
GND  
11  
20V83  
20V82  
Selection Guide  
tPD ns  
tS ns  
tCO ns  
ICC mA  
Generic Part Number  
PALCE20V85  
Coml/Ind  
Mil  
Coml/Ind  
Mil  
Coml/Ind  
Mil  
Coml  
115  
115  
115  
90  
Mil/Ind  
5
3
4
5
PALCE20V87  
7.5  
10  
15  
25  
15  
25  
7
PALCE20V810  
PALCE20V815  
PALCE20V825  
PALCE20V8L15  
PALCE20V8L25  
10  
15  
25  
15  
25  
10  
12  
15  
12  
15  
10  
12  
20  
12  
20  
7
10  
12  
20  
12  
20  
130  
130  
130  
65  
10  
12  
10  
12  
90  
55  
55  
65  
Shaded area contains preliminary information.  
Electronic Signature  
Functional Description (continued)  
An electronic signature word is provided in the PALCE20V8  
that consists of 64 bits of programmable memory that can con-  
tain user-defined data.  
The PALCE20V8 features 8 product terms per output and 40  
input terms into the AND array. The first product term in a mac-  
rocell can be used either as an internal output enable control  
or as a data product term.  
Security Bit  
There are a total of 18 architecture bits in the PALCE20V8  
macrocell; two are global bits that apply to all macrocells and  
16 that apply locally, two bits per macrocell. The architecture  
bits determine whether the macrocell functions as a register or  
combinatorial with inverting or noninverting output. The output  
enable control can come from an external pin or internally from  
a product term. The output can also be permanently enabled,  
functioning as a dedicated output or permanently disabled,  
functioning as a dedicated input. Feedback paths are select-  
able from either the input/output pin associated with the mac-  
rocell, the input/output pin associated with an adjacent pin, or  
from the macrocell register itself.  
A security bit is provided that defeats the readback of the in-  
ternal programmed pattern when the bit is programmed.  
Low Power  
The Cypress PALCE20V8 provides low-power operation  
through the use of CMOS technology, and increased testability  
with Flash reprogrammability.  
Product Term Disable  
Product Term Disable (PTD) fuses are included for each prod-  
uct term. The PTD fuses allow each product term to be individ-  
ually disabled.  
Power-Up Reset  
Input and I/O Pin Pull-Ups  
All registers in the PALCE20V8 power-up to a logic LOW for  
predictable system initialization. For each register, the associ-  
ated output pin will be HIGH due to active-LOW outputs.  
The PALCE20V8 input and I/O pins have built-in active  
pull-ups that will float unused inputs and I/Os to an active  
HIGH state (logical 1). All unused inputs and three-stated I/O  
pins should be connected to another active input, VCC, or  
Ground to improve noise immunity and reduce ICC  
.
Document #: 38-03026 Rev. **  
Page 2 of 14  
PALCE20V8  
Configuration Table  
CG0  
CG1  
CL0x  
Cell Configuration  
Registered Output  
Devices Emulated  
Registered Med PALs  
0
0
1
1
1
1
1
0
0
1
0
1
0
1
1
Combinatorial I/O  
Combinatorial Output  
Input  
Registered Med PALs  
Small PALs  
Small PALs  
Combinatorial I/O  
20L8 only  
Macrocell  
To  
1 1  
Adjacent  
Macrocell  
OE  
1 0  
0 0  
1 1  
V
CC  
0 X  
1 0  
0 1  
CL0  
x
CG  
1
1 1  
0 X  
I/O  
x
D
Q
Q
1 0  
V
CC  
CLK  
1 0  
1 1  
0 X  
CL1  
x
From  
Adjacent  
Pin  
CG for pin 16 to 21 (DIP)  
1
CL0  
x
20V84  
CG for pin 15 and 22 (DIP)  
0
Output Current into Outputs (LOW)............................. 24 mA  
DC Programming Voltage............................................. 12.5V  
Latch-Up Current..................................................... >200 mA  
Maximum Ratings  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Storage Temperature ..................................... −65°C to +150°C  
Operating Range  
Ambient Temperature with  
Ambient  
Power Applied.................................................. −55°C to +125°C  
Range  
Commercial  
Industrial  
Temperature  
VCC  
Supply Voltage to Ground Potential  
(Pin 24 to Pin 12).................................................−0.5V to +7.0V  
0°C to +75°C  
5V ±5%  
5V ±10%  
5V ±10%  
40°C to +85°C  
55°C to +125°C  
DC Voltage Applied to Outputs  
in High Z State.....................................................−0.5V to +7.0V  
Military[1]  
Note:  
DC Input Voltage .................................................−0.5V to +7.0V  
1. TA is the instant oncase temperature.  
Document #: 38-03026 Rev. **  
Page 3 of 14  
PALCE20V8  
Electrical Characteristics Over the Operating Range[2]  
Parameter  
Description  
Test Conditions  
IOH = 3.2 mA  
IOH = 2 mA  
IOL = 24 mA  
Min.  
Max. Unit  
VOH  
Output HIGH Voltage  
VCC = Min.,  
VIN = VIH or VIL  
Coml  
Mil/Ind  
Coml  
Mil/Ind  
2.4  
V
VOL  
Output LOW Voltage  
VCC = Min.,  
VIN = VIH or VIL  
0.5  
V
IOL = 12 mA  
VIH  
Input HIGH Level  
Input LOW Level  
Guaranteed Input Logical HIGH Voltage for All Inputs[3]  
Guaranteed Input Logical LOW Voltage for All Inputs[3]  
2.0  
V
V
[4]  
VIL  
0.5  
0.8  
10  
IIH  
Input or I/O HIGH Leakage 3.5V < VIN < VCC  
Current  
µA  
[5]  
IIL  
Input or I/O LOW Leakage  
Current  
0V < VIN < VIN (Max.)  
100 µA  
ISC  
ICC  
Output Short Circuit Current VCC = Max., VOUT = 0.5V[6,7]  
30  
150 mA  
Operating Power Supply  
Current  
VCC = Max.,  
VIL = 0V, VIH = 3V,  
Output Open,  
f = 15 MHz  
5, 7, 10 ns  
15, 25 ns  
Coml  
115  
90  
mA  
mA  
mA  
mA  
mA  
15L, 25L ns  
10, 15, 25 ns  
15L, 25L ns  
55  
(counter)  
Mil/Ind  
Mil/Ind  
130  
65  
Capacitance[7]  
Parameter  
CIN  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
Typ.  
Unit  
VIN = 2.0V @ f = 1 MHz  
VOUT = 2.0V @ f = 1 MHz  
5
5
pF  
pF  
COUT  
Endurance Characteristics[7]  
Parameter  
Description  
Minimum Reprogramming Cycles  
Test Conditions  
Min.  
100  
Max.  
Unit  
N
Normal Programming Conditions  
Cycles  
Notes:  
2. See the last page of this specification for Group A subgroup testing information.  
3. These are absolute values with respect to device ground. All overshoots due to system or tester noise are included.  
4.  
VIL (Min.) is equal to 3.0V for pulse durations less than 20 ns.  
5. The leakage current is due to the internal pull-up resistor on all pins.  
6. Not more than one output should be tested at a time. Duration of the short circuit should not be more than one second. VOUT = 0.5V has been chosen to avoid test problems  
caused by tester ground degradation.  
7. Tested initially and after any design or process changes that may affect these parameters.  
Document #: 38-03026 Rev. **  
Page 4 of 14  
PALCE20V8  
AC Test Loads and Waveforms  
ALL INPUT PULSES  
90%  
3.0V  
90%  
10%  
10%  
GND  
2 ns  
2 ns  
20V85  
5V  
S1  
R1  
OUTPUT  
TEST POINT  
R2  
C
L
20V86  
Commercial  
R1 R2  
200390Ω  
Military  
Specification  
tPD, tCO  
tPZX, tEA  
S1  
CL  
R1  
390Ω  
R2  
Measured Output Value  
Closed  
50 pF  
750Ω  
1.5V  
1.5V  
Z H: Open  
Z L: Closed  
tPXZ, tER  
H Z: Open  
L Z: Closed  
5 pF  
H Z: VOH 0.5V  
L Z: VOL + 0.5V  
Document #: 38-03026 Rev. **  
Page 5 of 14  
PALCE20V8  
Commercial and Industrial Switching Characteristics[2]  
20V85  
20V87  
20V810  
20V815  
20V825  
Parameter  
Description  
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Unit  
tPD  
Input to Output  
1
5
1
7.5  
1
10  
1
15  
1
25  
ns  
Propagation Delay[8]  
OE to Output Enable  
OE to Output Disable  
tPZX  
tPXZ  
tEA  
5
5
6
6
6
9
10  
10  
10  
15  
15  
15  
20  
20  
25  
ns  
ns  
ns  
Input to Output  
Enable Delay[7]  
tER  
Input to Output  
6
4
9
5
10  
7
15  
10  
25  
12  
ns  
Disable Delay[7,9]  
tCO  
tS  
Clock to Output Delay[8]  
1
3
1
7
1
1
1
ns  
ns  
Input or Feedback  
Set-Up Time  
10  
12  
15  
tH  
tP  
Input Hold Time  
0
7
0
0
0
0
ns  
ns  
External Clock Period  
(tCO + tS)  
12  
17  
22  
27  
tWH  
Clock Width HIGH[7]  
Clock Width LOW[7]  
3
3
5
5
8
8
8
8
12  
12  
37  
ns  
ns  
tWL  
fMAX1  
External Maximum  
143  
83  
58  
45.5  
MHz  
Frequency (1/(tCO + tS))[7,10]  
fMAX2  
Data Path Maximum  
Frequency  
166.  
6
100  
100  
62.5  
62.5  
62.5  
50  
41.6  
40  
MHz  
(1/(tWH + tWL))[7, 11]  
fMAX3  
tCF  
Internal Feedback Maximum 166.  
MHz  
ns  
Frequency (1/(tCF + tS))[7,12]  
6
Register Clock to  
3
3
6
8
10  
Feedback Input[7, 13]  
tPR  
Power-Up Reset Time[7]  
1
1
1
1
1
µs  
Shaded area contains preliminary information.  
Notes:  
8. Min. times are tested initially and after any design or process changes that may affect these parameters.  
9. This parameter is measured as the time after OE pin or internal disable input disables or enables the output pin. This delay is measured to the point at which a previous  
HIGH level has fallen to 0.5 volts below VOH min. or a previous LOW level has risen to 0.5 volts above VOL max.  
10. This specification indicates the guaranteed maximum frequency at which a state machine configuration with external feedback can operate.  
11. This specification indicates the guaranteed maximum frequency at which the device can operate in data path mode.  
12. This specification indicates the guaranteed maximum frequency at which a state machine configuration with internal only feedback can operate.  
13. This parameter is calculated from the clock period at fMAX internal (1/fMAX3) as measured (see Note 7 above) minus tS.  
Document #: 38-03026 Rev. **  
Page 6 of 14  
PALCE20V8  
Military Switching Characteristics[2]  
20V810  
20V815  
20V825  
Parameter  
Description  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
tPD  
Input to Output  
1
10  
1
15  
1
25  
ns  
Propagation Delay[8]  
tPZX  
tPXZ  
tEA  
tER  
tCO  
tS  
OE to Output Enable  
10  
10  
10  
10  
10  
15  
15  
15  
15  
12  
20  
20  
25  
25  
20  
ns  
ns  
OE to Output Disable  
Input to Output Enable Delay[7]  
Input to Output Disable Delay[7,9]  
Clock to Output Delay[8]  
Input or Feedback Set-Up Time  
Input Hold Time  
ns  
ns  
1
10  
0
1
12  
0
1
ns  
20  
0
ns  
tH  
ns  
tP  
External Clock Period (tCO + tS)  
Clock Width HIGH[7]  
Clock Width LOW[7]  
20  
8
24  
10  
10  
41.7  
40  
15  
15  
25  
ns  
tWH  
tWL  
ns  
8
ns  
fMAX1  
fMAX2  
fMAX3  
tCF  
External Maximum Frequency  
(1/(tCO + tS)[7,10]  
50  
MHz  
Data Path Maximum Frequency  
(1/(tWH + tWL))[7, 11 ]  
62.5  
62.5  
50  
50  
33.3  
33.3  
MHz  
MHz  
ns  
Internal Feedback Maximum  
Frequency (1/(tCF + tS))[7,12]  
Register Clock to  
6
8
10  
Feedback Input[7, 13]  
tPR  
Power-Up Reset Time[7]  
1
1
1
µs  
Shaded area contains preliminary information.  
Document #: 38-03026 Rev. **  
Page 7 of 14  
PALCE20V8  
Switching Waveform  
INPUTS, I/O,  
REGISTERED  
FEEDBACK  
tWH  
tWL  
tS  
tH  
CP  
tCO  
tP  
[10]  
[10]  
[10]  
t
t
, t  
t
, t  
EA PZX  
PXZ ER  
REGISTERED  
OUTPUTS  
[10]  
tPD  
, t  
t
, t  
PXZ ER  
EA PZX  
COMBINATORIAL  
OUTPUTS  
20V87  
Power-Up Reset Waveform  
VCC  
90%  
10%  
POWER  
SUPPLY VOLTAGE  
tPR  
REGISTERED  
ACTIVE LOW  
OUTPUTS  
tS  
CLOCK  
tWL  
t
MAX= 1 µs  
20V88  
PR  
Document #: 38-03026 Rev. **  
Page 8 of 14  
PALCE20V8  
Functional Logic Diagram for PALCE20V8  
PIN NUMBERS DIP(PLCC) PACKAGE  
PIN NUMBERS DIP(PLCC)PACKAGE  
1 (2)  
0
4
8
12  
16  
20  
24  
28  
32  
32  
PTD  
1
0
2 (3)  
23 (27)  
22 (26)  
CG  
0
0
MC7  
CL1=2560  
CL0=2632  
280  
320  
3 (4)  
4 (5)  
5 (6)  
MC6  
CL1=2561  
CL0=2633  
21 (25)  
20 (24)  
600  
640  
MC5  
CL1=2562  
CL0=2634  
920  
960  
MC4  
CL1=2563  
CL0=2635  
19 (23)  
18 (21)  
17 (20)  
16 (19)  
15 (18)  
1240  
1280  
6 (7)  
7 (9)  
MC3  
CL1=2564  
CL0=2636  
1560  
1600  
MC2  
CL1=2565  
CL0=2637  
1880  
1920  
8 (10)  
MC1  
CL1=2566  
CL0=2638  
2200  
2240  
9 (11)  
MC0  
CL1=2567  
CL0=2639  
2520  
10 (12)  
11 (13)  
0
1
14 (17)  
13 (16)  
CG  
0
ELECTRONIC SIGNATURE ROW  
2569. . . . . . 2630  
. . . BYTE1  
2568  
2631  
CG =2704  
1
0
BYTE7 BYTE6 . . .  
MSB LSB  
BYTE0  
CG =2705  
20V89  
Document #: 38-03026 Rev. **  
Page 9 of 14  
PALCE20V8  
Ordering Information for PALCE20V8  
ICC  
tPD  
tS  
tCO  
Package  
Name  
Operating  
Range  
(mA) (ns)  
(ns)  
(ns)  
Ordering Code  
PALCE20V85JC  
PALCE20V87JC  
PALCE20V87PC  
PALCE20V810JC  
PALCE20V810PC  
PALCE20V810QC  
Package Type  
115  
115  
5
3
7
4
5
J64  
J64  
P13  
J64  
P13  
Q13  
J64  
P13  
D14  
L64  
J64  
P13  
Q13  
J64  
P13  
Q13  
D14  
L64  
J64  
P13  
Q13  
J64  
P13  
Q13  
D14  
L64  
28-Lead Plastic Leaded Chip Carrier  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
24-Lead Quarter-Size Outline  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
24-Lead (300-Mil) CerDIP  
Commercial  
Commercial  
7.5  
115  
130  
10  
10  
10  
10  
7
10 PALCE20V810JI  
PALCE20V810PI  
Industrial  
Military  
PALCE20V810DMB  
PALCE20V810LMB  
10 PALCE20V815JC  
PALCE20V815PC  
PALCE20V815QC  
12 PALCE20V815JI  
PALCE20V815PI  
28-Pin Square Leadless Chip Carrier  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
24-Lead Quarter-Size Outline  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
24-Lead Quarter-Size Outline  
24-Lead (300-Mil) CerDIP  
90  
15  
15  
12  
12  
Commercial  
130  
Industrial  
PALCE20V815QI  
PALCE20V815DMB  
PALCE20V815LMB  
12 PALCE20V825JC  
PALCE20V825PC  
PALCE20V825QC  
20 PALCE20V825JI  
PALCE20V825PI  
Military  
28-Pin Square Leadless Chip Carrier  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
24-Lead Quarter-Size Outline  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
24-Lead Quarter-Size Outline  
24-Lead (300-Mil) CerDIP  
90  
25  
25  
15  
20  
Commercial  
130  
Industrial  
Military  
PALCE20V825QI  
PALCE20V825DMB  
PALCE20V825LMB  
28-Pin Square Leadless Chip Carrier  
Shaded area contains preliminary information.  
Document #: 38-03026 Rev. **  
Page 10 of 14  
PALCE20V8  
Ordering Information for PALCE20V8L  
ICC  
tPD  
tS  
(ns)  
tCO  
(ns)  
Package  
Name  
Operating  
Range  
(mA) (ns)  
Ordering Code  
Package Type  
55  
65  
15  
15  
12  
10 PALCE20V8L15JC  
PALCE20V8L15PC  
PALCE20V8L15QC  
12 PALCE20V8L15JI  
PALCE20V8L15PI  
J64  
P13  
Q13  
J64  
P13  
Q13  
D14  
L64  
J64  
P13  
Q13  
J64  
P13  
Q13  
D14  
L64  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
24-Lead Quarter-Size Outline  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
24-Lead Quarter-Size Outline  
24-Lead (300-Mil) CerDIP  
Commercial  
12  
Industrial  
PALCE20V8L15QI  
PALCE20V8L15DMB  
PALCE20V8L15LMB  
12 PALCE20V8L25JC  
PALCE20V8L25PC  
PALCE20V8L25QC  
20 PALCE20V8L25JI  
PALCE20V8L25PI  
Military  
28-Pin Square Leadless Chip Carrier  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
24-Lead Quarter-Size Outline  
28-Lead Plastic Leaded Chip Carrier  
24-Lead (300-Mil) Molded DIP  
24-Lead Quarter-Size Outline  
24-Lead (300-Mil) CerDIP  
55  
65  
25  
25  
15  
20  
Commercial  
Industrial  
Military  
PALCE20V8L25QI  
PALCE20V8L25DMB  
PALCE20V8L25LMB  
28-Pin Square Leadless Chip Carrier  
MILITARY SPECIFICATIONS  
Group A Subgroup Testing  
DC Characteristics  
Parameter  
Subgroups  
1, 2, 3  
ICC  
DC Characteristics  
Parameter  
VOH  
Subgroups  
1, 2, 3  
Switching Characteristics  
Parameter  
Subgroups  
9, 10, 11  
VOL  
VIH  
VIL  
IIX  
1, 2, 3  
1, 2, 3  
1, 2, 3  
1, 2, 3  
1, 2, 3  
tPD  
tCO  
tS  
9, 10, 11  
9, 10, 11  
9, 10, 11  
tH  
IOZ  
Document #: 38-03026 Rev. **  
Page 11 of 14  
PALCE20V8  
Package Diagrams  
24-Lead (300-Mil) CerDIP D14  
MILSTD1835 D9 Config.A  
28-Lead Plastic Leaded Chip Carrier J64  
28-Square Leadless Chip Carrier L64  
MILSTD1835 C4  
Document #: 38-03026 Rev. **  
Page 12 of 14  
PALCE20V8  
Package Diagrams (continued)  
24-Lead (300-Mil) Molded DIP P13/P13A  
24-Lead Quarter Size Outline Q13  
Document #: 38-03026 Rev. **  
Page 13 of 14  
© Cypress Semiconductor Corporation, 1997. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize  
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.  
PALCE20V8  
Document Title: PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL® Device  
Document Number: 38-03026  
Issue  
Date  
Orig. of  
Change  
REV.  
ECN NO.  
Description of Change  
Change from Spec Number: 38-00367 to 38-03026  
**  
106371  
07/11/01  
SZV  
Document #: 38-03026 Rev. **  
Page 14 of 14  

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