FM25V20A [CYPRESS]

2-Mbit (256 K × 8) Serial (SPI) F-RAM;
FM25V20A
型号: FM25V20A
厂家: CYPRESS    CYPRESS
描述:

2-Mbit (256 K × 8) Serial (SPI) F-RAM

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FM25V20A  
2-Mbit (256 K × 8) Serial (SPI) F-RAM  
2-Mbit (256  
K × 8) Serial (SPI) F-RAM  
Features  
Functional Overview  
2-Mbit ferroelectric random access memory (F-RAM) logically  
organized as 256 K × 8  
High-endurance 100 trillion (1014) read/writes  
151-year data retention (See the Data Retention and  
Endurance table)  
NoDelay™ writes  
Advanced high-reliability ferroelectric process  
The FM25V20A is a 2-Mbit nonvolatile memory employing an  
advanced ferroelectric process. A ferroelectric random access  
memory or F-RAM is nonvolatile and performs reads and writes  
similar to a RAM. It provides reliable data retention for 151 years  
while eliminating the complexities, overhead, and system-level  
reliability problems caused by serial flash, EEPROM, and other  
nonvolatile memories.  
Unlike serial flash and EEPROM, the FM25V20A performs write  
operations at bus speed. No write delays are incurred. Data is  
written to the memory array immediately after each byte is  
successfully transferred to the device. The next bus cycle can  
commence without the need for data polling. In addition, the  
product offers substantial write endurance compared with other  
nonvolatile memories. The FM25V20A is capable of supporting  
1014 read/write cycles, or 100 million times more write cycles  
than EEPROM.  
Very fast serial peripheral interface (SPI)  
Up to 40-MHz frequency  
Direct hardware replacement for serial flash and EEPROM  
Supports SPI mode 0 (0, 0) and mode 3 (1, 1)  
Sophisticated write protection scheme  
Hardware protection using the Write Protect (WP) pin  
Software protection using Write Disable instruction  
Software block protection for 1/4, 1/2, or entire array  
These capabilities make the FM25V20A ideal for nonvolatile  
memory applications, requiring frequent or rapid writes.  
Examples range from data collection, where the number of write  
cycles may be critical, to demanding industrial controls where the  
long write time of serial flash or EEPROM can cause data loss.  
Device ID  
Manufacturer ID and Product ID  
Low power consumption  
300 A active current at 1 MHz  
100 A (typ) standby current  
3 A sleep mode current  
The FM25V20A provides substantial benefits to users of serial  
EEPROM or flash as a hardware drop-in replacement. The  
FM25V20A uses the high-speed SPI bus, which enhances the  
high-speed write capability of F-RAM technology. The device  
incorporates a read-only Device ID that allows the host to  
determine the manufacturer, product density, and product  
revision. The device specifications are guaranteed over an  
industrial temperature range of –40 C to +85 C.  
Low-voltage operation: VDD = 2.0 V to 3.6 V  
Industrial temperature: –40 C to +85 C  
Packages  
8-pin small outline integrated circuit (SOIC) package  
8-pin dual flat no leads (DFN) package  
For a complete list of related documentation, click here.  
Restriction of hazardous substances (RoHS) compliant  
Logic Block Diagram  
WP  
Instruction Decoder  
CS  
HOLD  
SCK  
Clock Generator  
Control Logic  
Write Protect  
256 K x 8  
F-RAM Array  
Instruction Register  
18  
8
Address Register  
Counter  
SI  
SO  
Data I/O Register  
3
Nonvolatile Status  
Register  
Cypress Semiconductor Corporation  
Document Number: 001-90261 Rev. *G  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised June 19, 2017  
FM25V20A  
Contents  
Pinouts ..............................................................................3  
Pin Definitions ..................................................................3  
Overview ............................................................................4  
Memory Architecture ...................................................4  
Serial Peripheral Interface – SPI Bus ..........................4  
SPI Overview ...............................................................4  
SPI Modes ...................................................................5  
Power Up to First Access ............................................6  
Command Structure ....................................................6  
WREN - Set Write Enable Latch .................................6  
WRDI - Reset Write Enable Latch ...............................6  
Status Register and Write Protection .............................7  
RDSR - Read Status Register .....................................7  
WRSR - Write Status Register ....................................7  
Memory Operation ............................................................8  
Write Operation ...........................................................8  
Read Operation ...........................................................8  
Fast Read Operation ...................................................8  
HOLD Pin Operation .................................................10  
Sleep Mode ...............................................................10  
Device ID ...................................................................11  
Endurance .................................................................11  
Maximum Ratings ...........................................................12  
Operating Range .............................................................12  
DC Electrical Characteristics ........................................12  
Data Retention and Endurance .....................................13  
Capacitance ....................................................................13  
Thermal Resistance ........................................................13  
AC Test Conditions ........................................................13  
AC Switching Characteristics .......................................14  
Power Cycle Timing .......................................................16  
Ordering Information ......................................................17  
Ordering Code Definitions .........................................17  
Package Diagrams ..........................................................18  
Acronyms ........................................................................20  
Document Conventions .................................................20  
Units of Measure .......................................................20  
Document History Page .................................................21  
Sales, Solutions, and Legal Information ......................22  
Worldwide Sales and Design Support .......................22  
Products ....................................................................22  
PSoC® Solutions .......................................................22  
Cypress Developer Community .................................22  
Technical Support .....................................................22  
Document Number: 001-90261 Rev. *G  
Page 2 of 22  
FM25V20A  
Pinouts  
Figure 1. 8-pin SOIC pinout  
8
7
6
5
V
CS  
SO  
1
2
3
DD  
HOLD  
SCK  
SI  
Top View  
not to scale  
WP  
V
4
SS  
Figure 2. 8-pin DFN pinout  
V
CS  
SO  
WP  
1
2
3
4
8
7
6
5
DD  
HOLD  
SCK  
SI  
EXPOSED  
PAD  
V
SS  
Top View  
not to scale  
Pin Definitions  
Pin Name  
I/O Type  
Input  
Description  
CS  
Chip Select. This active LOW input activates the device. When HIGH, the device enters low-power  
standby mode, ignores other inputs, and the output is tristated. When LOW, the device internally  
activates the SCK signal. A falling edge on CS must occur before every opcode.  
SCK  
SI[1]  
SO[1]  
WP  
Input  
Serial Clock. All I/O activity is synchronized to the serial clock. Inputs are latched on the rising  
edge and outputs occur on the falling edge. Because the device is synchronous, the clock  
frequency may be any value between 0 and 40 MHz and may be interrupted at any time.  
Input  
Serial Input. All data is input to the device on this pin. The pin is sampled on the rising edge of  
SCK and is ignored at other times. It should always be driven to a valid logic level to meet IDD  
specifications.  
Output  
Input  
Serial Output. This is the data output pin. It is driven during a read and remains tristated at all  
other times including when HOLD is LOW. Data transitions are driven on the falling edge of the  
serial clock.  
Write Protect. This Active LOW pin prevents write operation to the Status Register when WPEN  
is set to ‘1’. This is critical because other write protection features are controlled through the Status  
Register. A complete explanation of write protection is provided in Status Register and Write  
Protection on page 7. This pin must be tied to VDD if not used.  
HOLD  
Input  
HOLD Pin. The HOLD pin is used when the host CPU must interrupt a memory operation for  
another task. When HOLD is LOW, the current operation is suspended. The device ignores any  
transition on SCK or CS. All transitions on HOLD must occur while SCK is LOW. This pin must be  
tied to VDD if not used.  
VSS  
VDD  
Power supply Ground for the device. Must be connected to the ground of the system.  
Power supply Power supply input to the device.  
EXPOSED PAD No connect  
The EXPOSED PAD on the bottom of 8-pin DFN package is not connected to the die. The  
EXPOSED PAD should not be soldered on the PCB.  
Note  
1. SI may be connected to SO for a single pin data interface.  
Document Number: 001-90261 Rev. *G  
Page 3 of 22  
FM25V20A  
data are then transferred. The CS must go inactive after an  
operation is complete and before a new opcode can be issued.  
The commonly used terms in the SPI protocol are as follows:  
Overview  
The FM25V20A is a serial F-RAM memory. The memory array is  
logically organized as 262,144 × 8 bits and is accessed using an  
industry-standard serial peripheral interface (SPI) bus. The  
functional operation of the F-RAM is similar to serial flash and  
serial EEPROMs. The major difference between the FM25V20A  
and a serial flash or EEPROM with the same pinout is the  
F-RAM's superior write performance, high endurance, and low  
power consumption.  
SPI Master  
The SPI master device controls the operations on a SPI bus. An  
SPI bus may have only one master with one or more slave  
devices. All the slaves share the same SPI bus lines and the  
master may select any of the slave devices using the CS pin. All  
of the operations must be initiated by the master activating a  
slave device by pulling the CS pin of the slave LOW. The master  
also generates the SCK and all the data transmission on SI and  
SO lines are synchronized with this clock.  
Memory Architecture  
When accessing the FM25V20A, the user addresses 256K  
locations of eight data bits each. These eight data bits are shifted  
in or out serially. The addresses are accessed using the SPI  
protocol, which includes a chip select (to permit multiple devices  
on the bus), an opcode, and a three-byte address. The upper 6  
bits of the address range are 'don't care' values. The complete  
address of 18 bits specifies each byte address uniquely.  
SPI Slave  
The SPI slave device is activated by the master through the Chip  
Select line. A slave device gets the SCK as an input from the SPI  
master and all the communication is synchronized with this  
clock. An SPI slave never initiates a communication on the SPI  
bus and acts only on the instruction from the master.  
Most functions of the FM25V20A are either controlled by the SPI  
interface or handled by on-board circuitry. The access time for  
the memory operation is essentially zero, beyond the time  
needed for the serial protocol. That is, the memory is read or  
written at the speed of the SPI bus. Unlike a serial flash or  
EEPROM, it is not necessary to poll the device for a ready  
condition because writes occur at bus speed. By the time a new  
bus transaction can be shifted into the device, a write operation  
is complete. This is explained in more detail in the interface  
section.  
The FM25V20A operates as an SPI slave and may share the SPI  
bus with other SPI slave devices.  
Chip Select (CS)  
To select any slave device, the master needs to pull down the  
corresponding CS pin. Any instruction can be issued to a slave  
device only while the CS pin is LOW. When the device is not  
selected, data through the SI pin is ignored and the serial output  
pin (SO) remains in a high-impedance state.  
Note A new instruction must begin with the falling edge of CS.  
Therefore, only one opcode can be issued for each active Chip  
Select cycle.  
Serial Peripheral Interface – SPI Bus  
The FM25V20A is a SPI slave device and operates at speeds up  
to 40 MHz. This high-speed serial bus provides  
high-performance serial communication to a SPI master. Many  
common microcontrollers have hardware SPI ports allowing a  
direct interface. It is quite simple to emulate the port using  
ordinary port pins for microcontrollers that do not. The  
FM25V20A operates in SPI Mode 0 and 3.  
Serial Clock (SCK)  
The Serial Clock is generated by the SPI master and the  
communication is synchronized with this clock after CS goes  
LOW.  
The FM25V20A enables SPI modes 0 and 3 for data  
communication. In both of these modes, the inputs are latched  
by the slave device on the rising edge of SCK and outputs are  
issued on the falling edge. Therefore, the first rising edge of SCK  
signifies the arrival of the first bit (MSB) of a SPI instruction on  
the SI pin. Further, all data inputs and outputs are synchronized  
with SCK.  
SPI Overview  
The SPI is a four-pin interface with Chip Select (CS), Serial Input  
(SI), Serial Output (SO), and Serial Clock (SCK) pins.  
The SPI is a synchronous serial interface, which uses clock and  
data pins for memory access and supports multiple devices on  
the data bus. A device on the SPI bus is activated using the CS  
pin.  
Data Transmission (SI/SO)  
The SPI data bus consists of two lines, SI and SO, for serial data  
communication. SI is also referred to as Master Out Slave In  
(MOSI) and SO is referred to as Master In Slave Out (MISO). The  
master issues instructions to the slave through the SI pin, while  
the slave responds through the SO pin. Multiple slave devices  
may share the SI and SO lines as described earlier.  
The relationship between chip select, clock, and data is dictated  
by the SPI mode. This device supports SPI modes 0 and 3. In  
both of these modes, data is clocked into the F-RAM on the rising  
edge of SCK starting from the first rising edge after CS goes  
active.  
The SPI protocol is controlled by opcodes. These opcodes  
specify the commands from the bus master to the slave device.  
After CS is activated, the first byte transferred from the bus  
master is the opcode. Following the opcode, any addresses and  
The FM25V20A has two separate pins for SI and SO, which can  
be connected with the master as shown in Figure 3.  
Document Number: 001-90261 Rev. *G  
Page 4 of 22  
FM25V20A  
For a microcontroller that has no dedicated SPI bus, a  
general-purpose port may be used. To reduce hardware  
resources on the controller, it is possible to connect the two data  
pins (SI, SO) together and tie off (HIGH) the HOLD and WP pins.  
Figure 4 shows such a configuration, which uses only three pins.  
bits be set to 0s to enable seamless transition to higher memory  
densities.  
Serial Opcode  
After the slave device is selected with CS going LOW, the first  
byte received is treated as the opcode for the intended operation.  
FM25V20A uses the standard opcodes for memory accesses.  
Most Significant Bit (MSB)  
The SPI protocol requires that the first bit to be transmitted is the  
Most Significant Bit (MSB). This is valid for both address and  
data transmission.  
Invalid Opcode  
If an invalid opcode is received, the opcode is ignored and the  
device ignores any additional serial data on the SI pin until the  
next falling edge of CS, and the SO pin remains tristated.  
The 2-Mbit serial F-RAM requires a 3-byte address for any read  
or write operation. Because the address is only 18 bits, the first  
six bits, which are fed in are ignored by the device. Although  
these six bits are ‘don’t care’, Cypress recommends that these  
Status Register  
FM25V20A has an 8-bit Status Register. The bits in the Status  
Register are used to configure the device. These bits are  
described in Table 3 on page 7.  
Figure 3. System Configuration with SPI Port  
SCK  
MOSI  
MISO  
SCK  
FM25V20A  
HOLD WP  
SCK  
FM25V20A  
HOLD WP  
SI SO  
SI SO  
SPI  
Microcontroller  
CS  
CS  
C S 1  
H O LD 1  
W P 1  
C S 2  
H O LD 2  
W P 2  
Figure 4. System Configuration without SPI Port  
P1.0  
P1.1  
SCK  
CS  
SI SO  
Microcontroller  
FM25V20A  
HOLD WP  
P1.2  
active. If the clock starts from a HIGH state (in mode 3), the first  
SPI Modes  
rising edge after the clock toggles is considered. The output data  
is available on the falling edge of SCK.  
FM25V20A may be driven by a microcontroller with its SPI  
peripheral running in either of the following two modes:  
The two SPI modes are shown in Figure 5 on page 6 and Figure  
6 on page 6. The status of the clock when the bus master is not  
transferring data is:  
SPI Mode 0 (CPOL = 0, CPHA = 0)  
SPI Mode 3 (CPOL = 1, CPHA = 1)  
For both these modes, the input data is latched in on the rising  
edge of SCK starting from the first rising edge after CS goes  
SCK remains at 0 for Mode 0  
SCK remains at 1 for Mode 3  
Document Number: 001-90261 Rev. *G  
Page 5 of 22  
FM25V20A  
The device detects the SPI mode from the status of the SCK pin  
when the device is selected by bringing the CS pin LOW. If the  
SCK pin is LOW when the device is selected, SPI Mode 0 is  
assumed and if the SCK pin is HIGH, it works in SPI Mode 3.  
WREN - Set Write Enable Latch  
The FM25V20A will power up with writes disabled. The WREN  
command must be issued before any write operation. Sending  
the WREN opcode allows the user to issue subsequent opcodes  
for write operations. These include writing the Status Register  
(WRSR) and writing the memory (WRITE).  
Figure 5. SPI Mode 0  
Sending the WREN opcode causes the internal Write Enable  
Latch to be set. A flag bit in the Status Register, called WEL,  
indicates the state of the latch. WEL = ’1’ indicates that writes are  
permitted. Attempting to write the WEL bit in the Status Register  
has no effect on the state of this bit – only the WREN opcode can  
set this bit. The WEL bit will be automatically cleared on the rising  
edge of CS following a WRDI, a WRSR, or a WRITE operation.  
This prevents further writes to the Status Register or the F-RAM  
array without another WREN command. Figure 7 illustrates the  
WREN command bus configuration.  
CS  
0
1
2
3
4
5
6
7
SCK  
SI  
7
6
5
4
3
2
1
0
MSB  
LSB  
Figure 7. WREN Bus Configuration  
Figure 6. SPI Mode 3  
CS  
CS  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
SCK  
SI  
SCK  
0
0
0
0
0
1
1
0
SI  
7
6
5
4
3
2
1
0
HI-Z  
MSB  
LSB  
SO  
Power Up to First Access  
WRDI - Reset Write Enable Latch  
The FM25V20A is not accessible for a tPU time after power-up.  
Users must comply with the timing parameter, tPU, which is the  
minimum time from VDD (min) to the first CS LOW.  
The WRDI command disables all write activity by clearing the  
Write Enable Latch. The user can verify that writes are disabled  
by reading the WEL bit in the Status Register and verifying that  
WEL is equal to ‘0’. Figure 8 illustrates the WRDI command bus  
configuration.  
Command Structure  
There are nine commands, called opcodes, that can be issued  
by the bus master to the FM25V20A. They are listed in Table 1.  
These opcodes control the functions performed by the memory.  
Figure 8. WRDI Bus Configuration  
Table 1. Opcode Commands  
CS  
Name  
WREN  
Description  
Set write enable latch  
Reset write enable latch  
Read Status Register  
Write Status Register  
Read memory data  
Fast read memory data  
Write memory data  
Enter sleep mode  
Opcode  
0000 0110b  
0000 0100b  
0000 0101b  
0000 0001b  
0000 0011b  
0000 1011b  
0000 0010b  
1011 1001b  
1001 1111b  
0
1
2
3
4
5
6
7
SCK  
SI  
WRDI  
RDSR  
WRSR  
READ  
FSTRD  
WRITE  
SLEEP  
RDID  
0
0
0
0
0
0
1
0
HI-Z  
SO  
Read device ID  
Document Number: 001-90261 Rev. *G  
Page 6 of 22  
FM25V20A  
is organized as follows. (The default value shipped from the  
factory for WEL, BP0, BP1, bits 4–5, WPEN is ‘0’, and for bit 6 is  
‘1’.)  
Status Register and Write Protection  
The write protection features of the FM25V20A are multi-tiered  
and are enabled through the status register. The Status Register  
Table 2. Status Register  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
WPEN (0)  
X (1)  
X (0)  
X (0)  
BP1 (0)  
BP0 (0)  
WEL (0)  
X (0)  
Table 3. Status Register Bit Definition  
Bit Definition  
Don’t care  
Description  
Bit 0  
This bit is non-writable and always returns ‘0’ upon read.  
Bit 1 (WEL)  
Write Enable  
WEL indicates if the device is write enabled. This bit defaults to ‘0’ (disabled) on power-up.  
WEL = '1' --> Write enabled  
WEL = '0' --> Write disabled  
Bit 2 (BP0)  
Bit 3 (BP1)  
Bit 4-5  
Block Protect bit ‘0’  
Block Protect bit ‘1’  
Don’t care  
Used for block protection. For details, see Table 4 on page 7.  
Used for block protection. For details, see Table 4 on page 7.  
These bits are non-writable and always return ‘0’ upon read.  
This bit is non-writable and always returns ‘1’ upon read.  
Bit 6  
Don’t care  
Bit 7 (WPEN)  
Write Protect Enable bit Used to enable the function of Write Protect Pin (WP). For details, see Table 5 on page 7.  
Bits 0 and 4-5 are fixed at ‘0’ and bit 6 is fixed at ‘1’; none of these  
bits can be modified. Note that bit 0 ("Ready or Write in progress”  
bit in serial flash and EEPROM) is unnecessary, as the F-RAM  
writes in real-time and is never busy, so it reads out as a ‘0’. An  
exception to this is when the device is waking up from sleep  
mode, which is described in Sleep Mode on page 10. The BP1  
and BP0 control the software write-protection features and are  
nonvolatile bits. The WEL flag indicates the state of the Write  
Enable Latch. Attempting to directly write the WEL bit in the  
Status Register has no effect on its state. This bit is internally set  
and cleared via the WREN and WRDI commands, respectively.  
write to the Status Register. Thus the Status Register is  
write-protected only when WPEN = '1' and WP = '0'.  
Table 5 summarizes the write protection conditions.  
Table 5. Write Protection  
Protected Unprotected  
Status  
Register  
WEL WPEN WP  
Blocks  
Blocks  
0
1
1
1
X
0
1
1
X
X
0
1
Protected  
Protected  
Protected  
Protected Unprotected Unprotected  
Protected Unprotected Protected  
Protected Unprotected Unprotected  
BP1 and BP0 are memory block write protection bits. They  
specify portions of memory that are write-protected as shown in  
Table 4.  
RDSR - Read Status Register  
The RDSR command allows the bus master to verify the  
contents of the Status Register. Reading the status register  
provides information about the current state of the  
write-protection features. Following the RDSR opcode, the  
FM25V20A will return one byte with the contents of the Status  
Register.  
Table 4. Block Memory Write Protection  
BP1  
BP0  
Protected Address Range  
None  
0
0
1
1
0
1
0
1
30000h to 3FFFFh (upper 1/4)  
20000h to 3FFFFh (upper 1/2)  
00000h to 3FFFFh (all)  
WRSR - Write Status Register  
The WRSR command allows the SPI bus master to write into the  
Status Register and change the write protect configuration by  
setting the WPEN, BP0 and BP1 bits as required. Before issuing  
a WRSR command, the WP pin must be HIGH or inactive. Note  
that on the FM25V20A, WP only prevents writing to the Status  
Register, not the memory array. Before sending the WRSR  
command, the user must send a WREN command to enable  
writes. Executing a WRSR command is a write operation and  
therefore, clears the Write Enable Latch.  
The BP1 and BP0 bits and the Write Enable Latch are the only  
mechanisms that protect the memory from writes. The remaining  
write protection features protect inadvertent changes to the block  
protect bits.  
The write protect enable bit (WPEN) in the Status Register  
controls the effect of the hardware write protect (WP) pin. When  
the WPEN bit is set to '0', the status of the WP pin is ignored.  
When the WPEN bit is set to '1', a LOW on the WP pin inhibits a  
Document Number: 001-90261 Rev. *G  
Page 7 of 22  
FM25V20A  
Figure 9. RDSR Bus Configuration  
CS  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
SCK  
Opcode  
SI  
0
0
0
0
0
1
0
1
Data  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB LSB  
HI-Z  
SO  
Figure 10. WRSR Bus Configuration (WREN not shown)  
CS  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
SCK  
Data  
Opcode  
SI  
1
0
0
0
0
0
0
0
D7  
MSB  
X
X
X
D3 D2  
X
X
LSB  
HI-Z  
SO  
clocked in (after the eighth clock). This allows any number of  
bytes to be written without page buffer delays.  
Memory Operation  
The SPI interface, which is capable of a high clock frequency,  
highlights the fast write capability of the F-RAM technology.  
Unlike serial flash and EEPROMs, the FM25V20A can perform  
sequential writes at bus speed. No page register is needed and  
any number of sequential writes may be performed.  
Note If the power is lost in the middle of the write operation, only  
the last completed byte will be written.  
Read Operation  
After the falling edge of CS, the bus master can issue a READ  
opcode. Following the READ command is a three-byte address  
containing the 18-bit address (A17-A0) of the first byte of the  
read operation. The upper six bits of the address are ignored.  
After the opcode and address are issued, the device drives out  
the read data on the next eight clocks. The SI input is ignored  
during read data bytes. Subsequent bytes are data bytes, which  
are read out sequentially. Addresses are incremented internally  
as long as the bus master continues to issue clocks and CS is  
LOW. If the last address of 3FFFFh is reached, the counter will  
roll over to 00000h. Data is read MSB first. The rising edge of CS  
terminates a read operation and tristates the SO pin. A read  
operation is shown in Figure 12.  
Write Operation  
All writes to the memory begin with a WREN opcode with CS  
being asserted and deasserted. The next opcode is WRITE. The  
WRITE opcode is followed by a three-byte address containing  
the 18-bit address (A17-A0) of the first data byte to be written into  
the memory. The upper six bits of the three-byte address are  
ignored. Subsequent bytes are data bytes, which are written  
sequentially. Addresses are incremented internally as long as  
the bus master continues to issue clocks and keeps CS LOW. If  
the last address of 3FFFFh is reached, the counter will roll over  
to 00000h. Data is written MSB first. The rising edge of CS  
terminates a write operation. A write operation is shown in Figure  
11.  
Fast Read Operation  
Note When a burst write reaches a protected block address, the  
automatic address increment stops and all the subsequent data  
bytes received for write will be ignored by the device.  
The FM25V20A supports a FAST READ opcode (0Bh) that is  
provided for code compatibility with serial flash devices. The  
FAST READ opcode is followed by a three-byte address  
containing the 18-bit address (A17-A0) of the first byte of the  
read operation and then a dummy byte. The dummy byte inserts  
a read latency of 8-clock cycle. The fast read operation is  
otherwise the same as an ordinary read operation except that it  
requires an additional dummy byte. After receiving opcode,  
EEPROMs use page buffers to increase their write throughput.  
This compensates for the technology's inherently slow write  
operations. F-RAM memories do not have page buffers because  
each byte is written to the F-RAM array immediately after it is  
Document Number: 001-90261 Rev. *G  
Page 8 of 22  
FM25V20A  
address, and a dummy byte, the FM25V20A starts driving its SO  
line with data bytes, with MSB first, and continues transmitting  
as long as the device is selected and the clock is available. In  
case of bulk read, the internal address counter is incremented  
automatically, and after the last address 3FFFFh is reached, the  
counter rolls over to 00000h. When the device is driving data on  
its SO line, any transition on its SI line is ignored. The rising edge  
of CS terminates a fast read operation and tristates the SO pin.  
A Fast Read operation is shown in Figure 13.  
Figure 11. Memory Write (WREN not shown) Operation  
CS  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
20 21 22 23  
0
1
2
3
4
5
6
7
SCK  
Opcode  
18-bit Address  
A17 A16 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0  
LSB MSB LSB  
Data  
SI  
0
0
0
0
0
0
1
0
X
X
X
X
X
X
MSB  
HI-Z  
SO  
Figure 12. Memory Read Operation  
CS  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
20 21 22 23  
0
1
2
3
4
5
6
7
SCK  
Opcode  
18-bit Address  
SI  
0
0
0
0
0
0
1
1
X
X
X
X
X
X
A17 A16  
A3 A2 A1 A0  
LSB  
MSB  
Data  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB LSB  
HI-Z  
SO  
Figure 13. Fast Read Operation  
CS  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
20 21 22 23 24 25 26 27 28 29 30 31  
0
1
2
3
4
5
6
7
SCK  
Opcode  
18-bit Address  
Dummy Byte  
SI  
0
0
0
0
1
0
1
1
X
X
X
X
X
X
A17A16  
A3 A2 A1 A0  
LSB  
X
X
X
X
X
X
X X  
MSB  
Data  
D7 D6 D5 D4 D3 D2 D1 D0  
HI-Z  
SO  
MSB  
LSB  
Document Number: 001-90261 Rev. *G  
Page 9 of 22  
FM25V20A  
HIGH while SCK is LOW will resume an operation. The  
transitions of HOLD must occur while SCK is LOW, but the SCK  
and CS pin can toggle during a hold state.  
HOLD Pin Operation  
The HOLD pin can be used to interrupt a serial operation without  
aborting it. If the bus master pulls the HOLD pin LOW while SCK  
is LOW, the current operation will pause. Taking the HOLD pin  
Figure 14. HOLD Operation[2]  
CS  
SCK  
HOLD  
SI  
VALID IN  
VALID IN  
SO  
pin. On the next falling edge of CS, the device will return to  
normal operation within tREC time. The SO pin remains in a HI-Z  
state during the wakeup period. The device does not necessarily  
respond to an opcode within the wakeup period. To start the  
wakeup procedure, the controller may send a “dummy” read, for  
example, and wait the remaining tREC time.  
Sleep Mode  
A low-power sleep mode is implemented on the FM25V20A  
device. The device will enter the low-power state when the  
SLEEP opcode B9h is clocked in and a rising edge of CS is  
applied. When in sleep mode, the SCK and SI pins are ignored  
and SO will be HI-Z, but the device continues to monitor the CS  
Figure 15. Sleep Mode Operation  
t
Enters Sleep Mode  
Recovers from Sleep Mode  
REC  
CS  
t
SU  
0
1
2
3
4
5
6
7
SCK  
SI  
VALID IN  
1
0
1
1
1
0
0
1
HI-Z  
SO  
Note  
2. Figure shows HOLD operation for input mode and output mode.  
Document Number: 001-90261 Rev. *G  
Page 10 of 22  
FM25V20A  
manufacturer ID places the Cypress (Ramtron) identifier in bank  
7; therefore, there are six bytes of the continuation code 7Fh  
followed by the single byte C2h. There are two bytes of product  
ID, which includes a family code, a density code, a sub code, and  
the product revision code.  
Device ID  
The FM25V20A device can be interrogated for its manufacturer,  
product identification, and die revision. The RDID opcode 9Fh  
allows the user to read the manufacturer ID and product ID, both  
of which are read-only bytes. The JEDEC-assigned  
Table 6. Device ID  
Device ID Description  
71–16  
15–13  
12–8  
7–6  
5–3  
2–0  
Device ID  
(9 bytes)  
(56 bits)  
(3 bits)  
(5 bits)  
(2 bits)  
(3 bits)  
(3 bits)  
Product ID  
Sub  
Manufacturer ID  
Family  
Density  
Rev  
Rsvd  
7F7F7F7F7F7FC22508h  
0111111101111111011111110111  
1111011111110111111111000010  
001  
00101  
00  
001  
000  
Figure 16. Read Device ID  
CS  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71  
SCK  
Opcode  
SI  
1
0
0
1
1
1
1
1
HI-Z  
SO  
D7 D6 D5 D4 D3 D2 D1 D0  
D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
LSB  
9-Byte Device ID  
F-RAM read and write endurance is virtually unlimited even at a  
40-MHz clock rate.  
Endurance  
The FM25V20A devices are capable of being accessed at least  
1014 times, reads or writes. An F-RAM memory operates with a  
read and restore mechanism. Therefore, an endurance cycle is  
applied on a row basis for each access (read or write) to the  
memory array. The F-RAM architecture is based on an array of  
rows and columns of 32K rows of 64-bits each. The entire row is  
internally accessed once, whether a single byte or all eight bytes  
are read or written. Each byte in the row is counted only once in  
an endurance calculation. Table 7 shows endurance calculations  
for a 64-byte repeating loop, which includes an opcode, a starting  
address, and a sequential 64-byte data stream. This causes  
each byte to experience one endurance cycle through the loop.  
Table 7. Time to Reach Endurance Limit for Repeating  
64-byte Loop  
SCK Freq Endurance  
Endurance  
Years to Reach  
Limit  
(MHz)  
Cycles/sec Cycles/year  
40  
73,520  
18,380  
9,190  
2.32 × 1012  
5.79 × 1011  
2.90 × 1011  
43.1  
172.7  
345.4  
10  
5
Document Number: 001-90261 Rev. *G  
Page 11 of 22  
FM25V20A  
Package power dissipation  
capability (TA = 25 °C) ................................................. 1.0 W  
Maximum Ratings  
Exceeding maximum ratings may shorten the useful life of the  
device. These user guidelines are not tested.  
Surface mount lead soldering  
temperature (3 seconds) ......................................... +260C  
Storage temperature ................................ –55 C to +125 C  
DC output current (1 output at a time, 1s duration) .... 15 mA  
Maximum accumulated storage time  
At 125 °C ambient temperature ................................. 1000 h  
At 85 °C ambient temperature ................................ 10 Years  
Electrostatic Discharge Voltage  
Human Body Model (JEDEC Std JESD22-A114-B) .............. 2 kV  
Charged Device Model (JEDEC Std JESD22-C101-A) ........ 500 V  
Latch-up current ....................................................> 140 mA  
Ambient temperature  
with power applied ................................... –55 °C to +125 °C  
Supply voltage on VDD relative to VSS .........–1.0 V to +4.5 V  
Input voltage ........... –1.0 V to +4.5 V and VIN < VDD + 1.0 V  
Operating Range  
Range  
Ambient Temperature (TA)  
VDD  
DC voltage applied to outputs  
in High-Z state ....................................0.5 V to VDD + 0.5 V  
Industrial  
–40 C to +85 C  
2.0 V to 3.6 V  
Transient voltage (< 20 ns) on  
any pin to ground potential .................2.0 V to VDD + 2.0 V  
DC Electrical Characteristics  
Over the Operating Range  
Parameter  
VDD  
Description  
Power supply  
Test Conditions  
Min  
2.0  
Typ[3]  
3.3  
Max  
3.6  
0.30  
3
Unit  
V
IDD  
VDD supply current  
SCK  
between  
toggling fSCK = 1 MHz  
fSCK = 40 MHz  
0.13  
1.4  
mA  
mA  
VDD – 0.2 V and VSS  
,
other inputs VSS or  
VDD – 0.2 V.  
SO = Open  
ISB  
VDD standby current  
Sleep mode current  
CS = VDD. All other TA = 25 C  
100  
150  
A  
A  
A  
A  
A  
A  
V
inputs VSS or VDD  
.
TA = 85 C  
250  
IZZ  
CS = VDD. All other TA = 25 C  
3
5
inputs VSS or VDD  
VSS < VIN < VDD  
.
TA = 85 C  
8
ILI  
Input leakage current  
Output leakage current  
Input HIGH voltage  
Input LOW voltage  
±1  
ILO  
VSS < VOUT < VDD  
0.7 × VDD  
– 0.3  
2.4  
±1  
VIH  
VDD + 0.3  
VIL  
0.3 × VDD  
V
VOH1  
VOH2  
VOL1  
VOL2  
Output HIGH voltage  
Output HIGH voltage  
Output LOW voltage  
Output LOW voltage  
IOH = –1 mA, VDD = 2.7 V.  
IOH = –100 A  
V
VDD – 0.2  
V
IOL = 2 mA, VDD = 2.7 V  
IOL = 150 A  
0.4  
0.2  
V
V
Note  
3. Typical values are at 25 °C, V = V (typ). Not 100% tested.  
DD  
DD  
Document Number: 001-90261 Rev. *G  
Page 12 of 22  
FM25V20A  
Data Retention and Endurance  
Parameter  
TDR  
Description  
Data retention  
Test condition  
Min  
10  
Max  
Unit  
TA = 85 C  
TA = 75 C  
TA = 65 C  
Years  
38  
151  
1014  
NVC  
Endurance  
Over operating temperature  
Cycles  
Capacitance  
Parameter [4]  
Description  
Test Conditions  
Max  
8
Unit  
pF  
CO  
CI  
Output pin capacitance (SO)  
Input pin capacitance  
TA = 25 C, f = 1 MHz, VDD = VDD(typ)  
6
pF  
Thermal Resistance  
Description  
Test Conditions  
8-pin SOIC  
8-pin DFN  
Unit  
Parameter  
JA  
JC  
Thermal resistance  
(junction to ambient)  
Test conditions follow standard test  
methods and procedures for measuring  
thermal impedance, per EIA / JESD51.  
114  
30  
C/W  
Thermal resistance  
(junction to case)  
40  
11  
C/W  
AC Test Conditions  
Input pulse levels .................................10% and 90% of VDD  
Input rise and fall times ...................................................3 ns  
Input and output timing reference levels ................0.5 × VDD  
Output load capacitance .............................................. 30 pF  
Note  
4. This parameter is periodically sampled and not 100% tested.  
Document Number: 001-90261 Rev. *G  
Page 13 of 22  
FM25V20A  
AC Switching Characteristics  
Over the Operating Range  
Parameters [5]  
VDD = 2.0 V to 2.7 V  
VDD = 2.7 V to 3.6 V  
Description  
Unit  
Cypress  
Alt.  
Min  
Max  
Min  
Max  
Parameter Parameter  
fSCK  
tCH  
SCK clock frequency  
0
18  
18  
12  
12  
25  
0
11  
11  
10  
10  
40  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Clock HIGH time  
Clock LOW time  
Chip select setup  
Chip select hold  
Output disable time  
Output data valid time  
Output hold time  
Deselect time  
tCL  
tCSU  
tCSH  
tCSS  
tCSH  
tHZCS  
tCO  
[6, 7]  
tOD  
tODV  
tOH  
tD  
20  
16  
12  
9
0
0
60  
40  
[7, 8]  
tR  
Data in rise time  
Data in fall time  
50  
50  
50  
50  
[7, 8]  
tF  
tSU  
tH  
tHS  
tHH  
tSD  
tHD  
tSH  
tHH  
tHHZ  
tHLZ  
Data setup time  
8
5
Data hold time  
8
5
HOLD setup time  
HOLD hold time  
HOLD LOW to HI-Z  
HOLD HIGH to data active  
12  
12  
10  
10  
[6, 7]  
tHZ  
25  
25  
20  
20  
[7]  
tLZ  
Notes  
5. Test conditions assume a signal transition time of 3 ns or less, timing reference levels of 0.5 × V , input pulse levels of 10% to 90% of V , and output loading of  
DD  
DD  
the specified I /I and 30 pF load capacitance shown in AC Test Conditions on page 13.  
OL OH  
6.  
t
and t are specified with a load capacitance of 5 pF. Transition is measured when the outputs enter a high impedance state  
OD HZ  
7. Characterized but not 100% tested in production.  
8. Rise and fall times measured between 10% and 90% of waveform.  
Document Number: 001-90261 Rev. *G  
Page 14 of 22  
FM25V20A  
Figure 17. Synchronous Data Timing (Mode 0)  
t
D
CS  
SCK  
SI  
t
t
t
CSU  
CH  
CL  
t
CSH  
t
t
SU  
H
VALID IN  
VALID IN  
VALID IN  
t
t
t
OD  
OH  
ODV  
HI-Z  
HI-Z  
SO  
Figure 18. HOLD Timing  
CS  
SCK  
t
t
HH  
HH  
t
t
HS  
HS  
HOLD  
SI  
t
SU  
t
VALID IN  
VALID IN  
t
HZ  
LZ  
SO  
Document Number: 001-90261 Rev. *G  
Page 15 of 22  
FM25V20A  
Power Cycle Timing  
Over the Operating Range  
Parameter  
Description  
Min  
Max  
Unit  
Power-up VDD(min) to first access (CS LOW)  
Last access (CS HIGH) to power-down (VDD(min))  
VDD power-up ramp rate  
1
ms  
tPU  
tPD  
tVR  
tVF  
0
50  
100  
µs  
µs/V  
µs/V  
µs  
[9]  
[9]  
VDD power-down ramp rate  
[10]  
Recovery time from sleep mode  
450  
tREC  
Figure 19. Power Cycle Timing  
V
V
DD(min)  
DD(min)  
t
t
VR  
V
VF  
DD  
t
t
PU  
PD  
CS  
Notes  
9. Slope measured at any point on the V waveform.  
DD  
10. Guaranteed by design. Refer to Figure 15 for sleep mode recovery timing.  
Document Number: 001-90261 Rev. *G  
Page 16 of 22  
FM25V20A  
Ordering Information  
Package  
Diagram  
Operating  
Range  
Ordering Code  
Package Type  
FM25V20A-G  
001-85261 8-pin SOIC  
001-85261 8-pin SOIC  
001-85579 8-pin DFN  
001-85579 8-pin DFN  
Industrial  
FM25V20A-GTR  
FM25V20A-DG  
FM25V20A-DGTR  
All these parts are Pb-free. Contact your local Cypress sales representative for availability of these parts.  
Ordering Code Definitions  
FM 25  
V
- DG TR  
A
20  
Option:  
blank = Standard; TR = Tape and Reel  
Package Type:  
DG = 8-pin DFN; G = 8-pin SOIC  
Device revision: A  
Density: 20 = 2-Mbit  
Voltage: V = 2.0 V to 3.6 V  
SPI F-RAM  
Cypress  
Document Number: 001-90261 Rev. *G  
Page 17 of 22  
FM25V20A  
Package Diagrams  
Figure 20. 8-pin SOIC (208 Mils) Package Outline, 001-85261  
001-85261 **  
Document Number: 001-90261 Rev. *G  
Page 18 of 22  
FM25V20A  
Package Diagrams (continued)  
Figure 21. 8-pin DFN (5 mm × 6 mm × 0.75 mm) Package Outline, 001-85579  
001-85579 *A  
Document Number: 001-90261 Rev. *G  
Page 19 of 22  
FM25V20A  
Acronyms  
Document Conventions  
Units of Measure  
Acronym  
Description  
CPHA  
CPOL  
Clock Phase  
Clock Polarity  
Symbol  
°C  
Unit of Measure  
degree Celsius  
hertz  
EEPROM Electrically Erasable Programmable Read-Only  
Memory  
Hz  
kHz  
k  
Mbit  
MHz  
A  
F  
s  
kilohertz  
kilohm  
EIA  
Electronic Industries Alliance  
Ferroelectric Random Access Memory  
Input/Output  
F-RAM  
I/O  
megabit  
megahertz  
microampere  
microfarad  
microsecond  
milliampere  
millisecond  
nanosecond  
ohm  
JEDEC  
JESD  
LSB  
Joint Electron Devices Engineering Council  
JEDEC standards  
Least Significant Bit  
MSB  
RoHS  
SPI  
Most Significant Bit  
mA  
ms  
ns  
Restriction of Hazardous Substances  
Serial Peripheral Interface  
Small Outline Integrated Circuit  
Dual Flat No-lead  
SOIC  
DFN  
%
percent  
pF  
V
picofarad  
volt  
W
watt  
Document Number: 001-90261 Rev. *G  
Page 20 of 22  
FM25V20A  
Document History Page  
Document Title: FM25V20A, 2-Mbit (256 K × 8) Serial (SPI) F-RAM  
Document Number: 001-90261  
Orig. of  
Change  
Submission  
Date  
Rev.  
ECN No.  
Description of Change  
**  
4211116  
4372700  
GVCH  
GVCH  
01/23/2014 New data sheet.  
*A  
05/07/2014 Changed status from Preliminary to Final.  
Updated Maximum Ratings:  
Removed “Machine Model” under “Electrostatic Discharge Voltage”.  
Updated Thermal Resistance:  
Changed value of JA corresponding to 8-pin TDFN package from 17 C/W  
to 30 C/W.  
Updated Ordering Information:  
Removed FM25V20A-GES and FM25V20A-DGES part numbers.  
*B  
*C  
4379377  
4462029  
GVCH  
ZSK  
05/14/2014 No technical updates.  
07/31/2014 Updated Package Diagrams:  
Updated 8-pin DFN package spec to the current revision.  
*D  
*E  
4567856  
4694684  
ZSK  
11/12/2014 Added related documentation hyperlink in page 1.  
GVCH  
03/25/2015 Replaced “TDFN” with “DFN” in all instances across the document.  
Updated Pin Definitions:  
Updated details in “Description” column of “EXPOSED PAD” pin.  
*F  
4878813  
ZSK / PSR  
08/10/2015 Updated Maximum Ratings:  
Removed “Maximum junction temperature”.  
Added “Maximum accumulated storage time”.  
Added “Ambient temperature with power applied”.  
Updated to new template.  
*G  
5777851 AESATMP9 06/19/2017 Updated logo and copyright.  
Document Number: 001-90261 Rev. *G  
Page 21 of 22  
FM25V20A  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at Cypress Locations.  
Products  
ARM® Cortex® Microcontrollers  
cypress.com/arm  
cypress.com/automotive  
cypress.com/clocks  
cypress.com/interface  
cypress.com/iot  
®
PSoC Solutions  
Automotive  
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6  
Clocks & Buffers  
Interface  
Cypress Developer Community  
Community | Forums | Blogs | Video | Training  
Internet of Things  
Memory  
cypress.com/memory  
cypress.com/mcu  
Technical Support  
Microcontrollers  
PSoC  
cypress.com/go/support  
cypress.com/psoc  
cypress.com/pmic  
cypress.com/touch  
cypress.com/usb  
Power Management ICs  
Touch Sensing  
USB Controllers  
Wireless Connectivity  
cypress.com/wireless  
© Cypress Semiconductor Corporation, 2014-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,  
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries  
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other  
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TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE  
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permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any  
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is  
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products  
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systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the  
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably  
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,  
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other  
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.  
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in  
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.  
Document Number: 001-90261 Rev. *G  
Revised June 19, 2017  
Page 22 of 22  

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