CY8C20111_11 [CYPRESS]
CapSense Express – One Button and Two Button Capacitive Controllers; 的CapSense Express的 - 一个按键，两个按键电容式控制器
| 型号： | CY8C20111_11 |
| 厂家： | 
CYPRESS |
| 描述： | CapSense Express – One Button and Two Button Capacitive Controllers |
| 文件： | 总43页 (文件大小：919K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY8C20111, CY8C20121
CapSense® Express™ – One Button and
Two Button Capacitive Controllers
■ I2C communication
❐ Supported from 1.8 V
1. Features
■ Capacitive button input tied to a configurable output
❐ Robust sensing algorithm
❐ Internal pull-up resistor support option
❐ Data rate up to 400 kbps.
❐ High sensitivity, low noise
❐ Configurable I2C addressing
❐ Immunity to RF and AC noise
❐ Low radiated EMC noise
■ Industrial temperature range: –40 °C to +85 °C
■ Available in 8-Pin SOIC package
❐ Supports wide range of input capacitance, sensor shapes,
and sizes
2. Overview
■ Target Applications
❐ Printers
The CapSense® Express™ controllers support two capacitive
sensing (CapSense) buttons and two general purpose outputs in
CY8C20121 and one CapSense button and one general
purpose output in CY8C20111. The device functionality is
configured through the I2C port and can be stored in on-board
nonvolatile memory for automatic loading at power on. The
digital outputs are controlled from CapSense inputs in factory
default settings, but are user configurable for direct control
through I2C.
❐ Cellular handsets
❐ LCD monitors
❐ Portable DVD players
■ Industry's best configurability
❐ Custom sensor tuning
❐ Output supports strong 20 mA sink current
❐ Output state can be controlled through I2C or directly from
The four key blocks that make up the CY8C20111 and
CY8C20121 controllers are: a robust capacitive sensing core
with high immunity against radiated and conductive noise,
control registers with nonvolatile storage, configurable outputs,
and I2C communications. The user can configure registers with
parameters needed to adjust the operation and sensitivity of the
CapSense buttons and outputs and permanently store the
settings. The standard I2C serial communication interface allows
the host to configure the device and read sensor information in
real time. I2C address is fully configurable without any external
hardware strapping.
CapSense input state
❐ Run time reconfigurable over I2C
■ Advanced features
❐ Plug-and-play with factory defaults – tuned to support up to
1 mm overlay
❐ Nonvolatile storage of custom settings
❐ Easy integration into existing products – configure output to
match system
❐ No external components required
❐ World class free configuration tool
■ Wide range of operating voltages
❐ 2.45 V to 2.9 V
❐ 3.10 V to 3.6 V
❐ 4.75 V to 5.25 V
Cypress Semiconductor Corporation
Document Number: 001-53516 Rev. *G
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 24, 2011
[+] Feedback
CY8C20111, CY8C20121
3. Contents
Pinouts ..............................................................................3
Typical Circuits .................................................................4
Circuit-1: One Button and One LED[1] ........................4
Circuit-2: One Button and One LED with
CS_READ_BLx .........................................................21
CS_READ_DIFFx ......................................................21
CS_READ_RAWx .....................................................21
CS_READ_STATUS .................................................22
COMMAND_REG ......................................................22
Layout Guidelines and Best Practices .........................24
Example PCB Layout Design with
I2C Interface ................................................................4
Circuit-3: Two Buttons and Two LEDs with
I2C Interface ................................................................5
Circuit-4: Compatibility with 1.8 V I2C Signaling[2] .....5
Circuit-5: Powering Down CapSense Express
Two CapSense Buttons and Two LEDs ....................26
Operating Voltages .........................................................27
CapSense Constraints ...................................................27
Electrical Specifications ................................................28
Absolute Maximum Ratings .......................................28
Operating Temperature .............................................28
DC Electrical Characteristics .....................................28
DC Chip Level Specifications ....................................28
DC GPIO Specifications ............................................28
DC POR and LVD Specifications ..............................29
DC Flash Write Specifications ...................................29
DC I2C Specifications ...............................................30
CapSense Electrical Characteristics .........................30
AC Electrical Specifications .......................................31
AC Chip-Level Specifications ....................................31
AC GPIO Specifications ............................................31
AC I2C Specifications ................................................31
Examples of Frequently Used I2C Commands ............33
Ordering Information ......................................................34
Ordering Code Definitions .........................................34
Thermal Impedances ......................................................34
Solder Reflow Specifications ........................................34
Package Diagram ............................................................35
Acronyms ........................................................................36
Acronyms Used ..............................................................36
Document Conventions .................................................36
Units of Measure .......................................................36
Numeric Conventions ................................................36
Glossary ..........................................................................37
Document History Page .................................................42
Sales, Solutions, and Legal Information ......................43
Worldwide Sales and Design Support .......................43
Products ....................................................................43
PSoC Solutions .........................................................43
Device for Low Power Requirements ..........................6
Operating Modes ..............................................................6
Normal Mode ...............................................................6
Setup Mode .................................................................6
I2C Interface ......................................................................6
I2C Device Addressing ................................................6
I2C Clock Stretching ....................................................7
Format for Register Write and Read ...........................7
Registers ...........................................................................7
OUTPUT_STATUS ...................................................10
OUTPUT_PORT ........................................................10
CS_ENABLE .............................................................10
DIG_ENABLE ............................................................11
SET_STRONG_DM ..................................................11
OP_SEL_x .................................................................13
LOGICAL_OPR_INPUTx ..........................................13
CS_NOISE_TH .........................................................14
CS_BL_UPD_TH .......................................................14
CS_SETL_TIME ........................................................14
CS_OTH_SET ...........................................................15
CS_HYSTERISIS ......................................................15
CS_DEBOUNCE .......................................................16
CS_NEG_NOISE_TH ................................................16
CS_LOW_BL_RST ....................................................16
CS_FILTERING .........................................................17
CS_SCAN_POS_x ....................................................17
CS_FINGER_TH_x ...................................................18
CS_IDAC_x ...............................................................18
I2C_ADDR_LOCK .....................................................18
DEVICE_ID ...............................................................19
DEVICE_STATUS .....................................................19
I2C_ADDR_DM .........................................................20
CS_READ_BUTTON .................................................20
Document Number: 001-53516 Rev. *G
Page 2 of 43
[+] Feedback
CY8C20111, CY8C20121
4. Pinouts
Figure 1. CY8C20111 Pin Diagram - 8 SOIC - 1 Button
Table 1. Pin Definitions – 8 SOIC- 1 Button
Pin No
Name
VSS
Description
1
2
3
4
5
6
7
8
Ground
I2C Clock
I2C Data
I2C SCL
I2C SDA
CS0
CapSense Input
No Connect
Digital Output
No Connect
Supply Voltage
NC
DIG0
NC
VDD
Figure 2. CY8C20121 Pin Diagram – 8 SOIC- 2 Button
Table 2. Pin Definitions – 8 SOIC- 2 Button
Pin No
Name
VSS
Description
1
2
3
4
5
6
7
8
Ground
I2C Clock
I2C Data
I2C SCL
I2C SDA
CS0
CapSense Input
CapSense Input
Digital Output
Digital Output
Supply Voltage
CS1
DIG0
DIG1
VDD
Document Number: 001-53516 Rev. *G
Page 3 of 43
[+] Feedback
CY8C20111, CY8C20121
5. Typical Circuits
[1]
5.1 Circuit-1: One Button and One LED
2
5.2 Circuit-2: One Button and One LED with I C Interface
Note
1. The sensors are factory tuned to work with 1 mm plastic or glass overlay.
Document Number: 001-53516 Rev. *G
Page 4 of 43
[+] Feedback
CY8C20111, CY8C20121
2
5.3 Circuit-3: Two Buttons and Two LEDs with I C Interface
2
[2]
5.4 Circuit-4: Compatibility with 1.8 V I C Signaling
Note
2. 1.8 V ≤ V _I2C ≤ V _CE and 2.4 V ≤ V _CE ≤ 5.25 V.
DD
DD
DD
Document Number: 001-53516 Rev. *G
Page 5 of 43
[+] Feedback
CY8C20111, CY8C20121
5.5 Circuit-5: Powering Down CapSense Express Device for Low Power Requirements
Output
enable
Output
VDD
LDO
I2C Pull
UPs
LED
Master
Or
Host
SDA
SCL
CapSense Express
I2C
BUS
2
For low power requirements, if VDD is to be turned off, the above
concept can be used. The VDDs of CapSense Express, I2C
pull-ups, and LEDs must be from the same source. Turning off
the VDD ensures that no signal is applied to the device while it is
unpowered. The I2C signals should not be driven high by the
master in this situation. If a port pin or group of port pins can cater
to the power supply requirement of the circuit, the LDO can be
avoided.
7. I C Interface
The CapSense Express devices support the industry standard
I2C protocol, which can be used to:
■ Configure the device
■ Read the status and data registers of the device
■ Control device operation
6. Operating Modes
■ Execute commands
The I2C address can be modified during configuration.
6.1 Normal Mode
2
In normal mode of operation, the acknowledgment time is
optimized. The timings remain approximately the same for
different configurations of the slave. To reduce the acknowl-
edgment times in normal mode, the registers 0x07, 0x08, 0x11,
0x50, 0x51, 0x5C, 0x5D are given only read access. Writing to
these registers can be done only in setup mode.
7.1 I C Device Addressing
The device uses a seven bit addressing protocol. The I2C data
transfer is always initiated by the master sending one byte
address; first 7-bit contains address and LSb indicates the data
transfer direction. Zero in the LSb indicates the write transaction
form master and one indicates read transfer by the master.
Table 3 shows example for different I2C addresses.
6.2 Setup Mode
All registers have read and write access (except those which are
read only) in this mode. The acknowledgment times are longer
compared to normal mode. When CapSense scanning is
disabled (command code 0x0A in command register 0xA0), the
acknowledgment times can be improved to values similar to the
normal mode of operation.
Table 3. I2C Addresses
7 Bit Slave Address (in Dec)
D7
0
D6
0
D5
0
D4
0
D3
0
D2
0
D1
1
D0
8 Bit Slave Address (in Hex)
1
1
0(W)
1(R)
0(W)
1(W)
02
03
96
97
0
0
0
0
0
0
1
75
75
1
0
0
1
0
1
1
1
0
0
1
0
1
1
Document Number: 001-53516 Rev. *G
Page 6 of 43
[+] Feedback
CY8C20111, CY8C20121
An I2C master which does not support clock stretching (a bit
banged software I2C Master) must wait for a specific amount of
time specified (as shown in the section Format for Register Write
and Read) for each register write and read operation before the
next bit is transmitted. It is mandatory to check the SCL status (it
should be high) before I2C master initiates any data transfer with
CapSense Express. If the master fails to do so and continues to
communicate, the communication is erroneous.
2
7.2 I C Clock Stretching
“Clock stretching” or “bus stalling” in I2C communication protocol
is a state in which the slave holds the SCL line low to indicate
that it is busy. In this condition, the master is expected to wait
until the SCL is released by the slave.
When an I2C master communicates with the CapSense Express
device, the CapSense Express stalls the I2C bus after the
reception of each byte (that is, just before the ACK/NAK bit) until
processing of the byte is complete and critical internal functions
are executed. Use a fully I2C compliant master to communicate
with the CapSense Express device.
The following diagrams represent the ACK time delays shown in
the Register Map on page 7.
Figure 3. Write ACK Time Representation
Figure 4. Read ACK Time Representation
7.3 Format for Register Write and Read
Register write format.
Start Slave Addr + W
Register read format.
A
Reg Addr
A
Data
A
A
Data
A
. . . . .
Data
Stop
A
Stop
Start
Slave Addr + W
A
Reg Addr
A
A
Stop
Data
Start
Slave Addr + R
A
Data
. . . . .
Data
N
Legends:
Master
Slave
A - ACK
N- NAK
8. Registers
Table 4. Register Conventions
Convention
Description
RW
R
Register have both read and write access
Register have only read access
Write register with pass code
Factory defaults
WPR
FD
Document Number: 001-53516 Rev. *G
Page 7 of 43
[+] Feedback
CY8C20111, CY8C20121
Table 5. Register Map
Name
Factory Default
Values of Registers
(in Hex)
I2C Max
Writable
Only in
Setup
Register
Address
(in Hex)
I2C Max ACK
Time in Normal
Mode (ms)[5]
ACKTimein
Setup
Access
Page No.
Mode
Mode[3]
(ms)[5]
1 Button
2 Button
03
OUTPUT_PORT
CS_ENABLE
04
07
08
11
W
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
R
01
01
01
01
82
01
0.10
10
10
11
11
13
13
13
13
14
14
14
15
15
16
16
16
17
17
17
18
18
18
18
18
19
19
20
20
21
21
21
21
21
21
22
22
Yes
Yes
Yes
03
11
11
11
11
11
11
11
11
11
35
35
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
DIG_ENABLE
03
SET_STRONG_DM
OP_SEL_0
03
1C
1E
21
23
4E
4F
50
51
52
53
54
55
56
5C
5D
66
67
70
71
79
7A
7B
7C
81
82
83
84
85
86
87
88
A0
82
0.12
0.12
0.12
0.12
0.11
0.11
LOGICAL_OPR_INPUT0
OP_SEL_1[4]
LOGICAL_OPR_INPUT1[4]
01
82
02
CS_NOISE_TH
28
64
A0
00
0A
03
14
14
20
00
28
CS_BL_UPD_TH
CS_SETL_TIME
CS_OTH_SET
64
Yes
Yes
A0
00
CS_HYSTERISIS
CS_DEBOUNCE
CS_NEG_NOISE_TH
CS_LOW_BL_RST
CS_FILTERING
0A
03
0.11
0.11
0.11
0.11
0.11
14
14
20
CS_SCAN_POS_0
CS_SCAN_POS_1[4]
CS_FINGER_TH_0
CS_FINGER_TH_1[4]
CS_IDAC_0
Yes
Yes
00
01
64
0A
64
0.14
0.14
0.14
0.14
0.11
0.11
0.11
0.11
0.12
0.12
0.12
0.12
0.12
0.12
0.12
0.12
0.10
64
0A
0A
01
CS_IDAC_1[4]
I2C_ADDR_LOCK
DEVICE_ID
01
11
21
DEVICE_STATUS
I2C_ADDR_DM
R
03
03
RW
RW
R
80
80
CS_READ_BUTTON
CS_READ_BLM
CS_READ_BLL
81
81
NA
NA
NA
NA
NA
NA
NA
00
NA
NA
NA
NA
NA
NA
NA
00
R
CS_READ_DIFFM
CS_READ_DIFFL
CS_READ_RAWM
CS_READ_RAWL
CS_READ_STATUS
COMMAND_REG
R
R
R
R
R
W
Notes
3. These registers are writable only after entering into setup mode. All other registers are available for read and write in normal and setup mode.
4. These registers are available only in CY8C20121 device.
5. The Ack times specified are 1x I2C Ack times.
Document Number: 001-53516 Rev. *G
Page 8 of 43
[+] Feedback
CY8C20111, CY8C20121
Table 6. CapSense Express Commands
Executable
Mode
Duration the Device is NOT Ac-
cessible after ACK (in ms)[5]
Command [6]
Description
W 00 A0 00
W 00 A0 01
W 00 A0 02
W 00 A0 03
W 00 A0 04
W 00 A0 05
W 00 A0 06
W 00 A0 07
W 00 A0 08
W 00 A0 09
W 00 A0 0A
W 00 A0 0B
Get firmware revision
Setup/Normal
Setup/Normal
Setup/Normal
Setup/Normal
Setup/Normal
Setup/Normal
Setup
0
120
120
120
5
Store current configuration to NVM
Restore factory configuration
Write NVM POR defaults
Read NVM POR defaults
Read current configurations (RAM)
Reconfigure device (POR)
Set Normal mode of operation
Set Setup mode of operation
Start scan
5
5
Setup/Normal
Setup/Normal
Setup/Normal
Setup/Normal
Setup/Normal
0
0
10
5
Stop scan
Get CapSense scan status
0
Note
2
6. ‘W’ indicates the write transfer. The next byte of data represents the 7 bit I C address.
Document Number: 001-53516 Rev. *G
Page 9 of 43
[+] Feedback
CY8C20111, CY8C20121
8.1 OUTPUT_STATUS
Output Status Register
OUTPUT_STATUS: 00h
1 Button
Access: FD
Bit Name
7
6
6
5
5
4
4
3
3
2
2
1
1
0
R:01
STS[0]
2 Button
Access: FD
Bit Name
7
0
R:03
STS[1:0]
The Output Status register represents the actual logical levels on the output pins.
Bit
Name
Description
1:0
STS [1:0]
Used to represent the output status
0
1
Output low
Output high
8.2 OUTPUT_PORT
Output Port Register
OUTPUT_PORT: 04h
1 Button
Access: FD
Bit Name
7
6
6
5
5
4
3
3
2
2
1
1
0
W:01
DIG[0]
2 Button
Access: FD
Bit Name
7
4
0
W:03
DIG[1:0]
This register is used to write data to DIG output port. Pins defined as output of combinational logic (in OP_SEL_x register) cannot be
changed using this register.
Bit
Name
Description
1:0
DIG [1:0]
A bit set in this register sets the logic level of the output.
0
1
Logic ‘0’
Logic ‘1’
8.3 CS_ENABLE
Select CapSense Input Register
CS_ENABLE: 07h
(Writable only in Setup mode)
1 Button
Access: FD
Bit Name
7
6
5
5
4
3
3
2
2
1
1
0
RW:01
CS[0]
2 Button
Access: FD
Bit Name
7
6
4
0
RW:03
CS[1:0]
Document Number: 001-53516 Rev. *G
Page 10 of 43
[+] Feedback
CY8C20111, CY8C20121
This register is used to enable CapSense inputs. This register should be set before setting finger threshold (0x66, 0x67) and
IDAC setting (0x70, 0x71) registers.
Bit
Name
Description
1:0
CS [1:0]
These bits are used to enable CapSense inputs.
0
1
Disable CapSense input
Enable CapSense input
8.4 DIG_ENABLE
Select DIG Output Register
GPO_ENABLE: 08h
(Writable only in Setup mode)
1 Button
Access: FD
Bit Name
7
6
6
5
5
4
4
3
3
2
2
1
1
0
RW:01
DIG[0]
2 Button
Access: FD
Bit Name
7
0
RW:03
DIG [1:0]
This register is used to enable DIG (Digital) outputs. If DIG output is enabled, the strong drive mode register (11h) should also be set.
If DIG output is disabled the drive mode of these pins is High Z.
Bit
Name
Description
1:0
DIG [1:0]
These bits are used to enable DIG outputs.
0
1
Disable DIG output
Enable DIG output
8.5 SET_STRONG_DM
Sets Strong Drive Mode for DIG Outputs.
SET_STRONG_DM: 11h
(Writable only in Setup mode)
1 Button
Access: FD
Bit Name
7
6
5
5
4
4
3
3
2
2
1
1
0
RW:01
DM [0]
2 Button
Access: FD
Bit Name
7
6
0
RW:03
DM [1:0]
This register sets strong drive mode for DIG (Digital) outputs. To set strong drive mode the pin should be enabled as GP output.
Bit
Name
Description
1:0
DM [1:0]
These bits are used to set the strong drive mode to DIG outputs.
0
1
Strong drive mode not set
Strong drive mode set
Document Number: 001-53516 Rev. *G
Page 11 of 43
[+] Feedback
CY8C20111, CY8C20121
Figure 5. CY8C20111 Digital Logic Diagram
OUTPUT_PORT [0]
LOGICAL_OPR_INPUT0 [0]
A
INVERSION
LOGIC
DIG0
CS0
AND / OR
Logic selection
B
S
OP_SEL_0 [0]
OP_SEL_0 [7]
OP_SEL_0 [1]
Figure 6. CY8C20121 Digital Logic Diagram
LOGICAL_OPR_INPUTx [0]
OUTPUT_PORT [x]
A
CS0
A
INVERSION
LOGIC
DIGx
AND / OR
Logic selection
AND / OR
Logic selection
B
S
LOGICAL_OPR_INPUTx [1]
B
S
CS1
OP_SEL_x [7]
OP_SEL_x [0]
OP_SEL_x [1]
INPUT SELECTION LOGIC
Document Number: 001-53516 Rev. *G
Page 12 of 43
[+] Feedback
CY8C20111, CY8C20121
8.6 OP_SEL_x
Logic Operation Selection Registers
OP_SEL_0: 1Ch
OP_SEL_1: 21h (Not available for 1 Button)
1/2Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW: 0
Op_En
RW: 0
InvOp
RW: 0
Operator
This register is used to enable logic operation on GP outputs. OP_SEL_0 should be configured to get the logic operation output on
DIG0 output and OP_SEL_1 for DIG1 output. Write to these registers during the disable state of respective DIG output pins does not
have any effect.
The input to the logic operation can be selected in LOGIC_OPRX registers. The selected inputs can be ORed or ANDed. The output
of logic operation can also be inverted.
Bit
Name
Description
7
Op_En
This bit enables or disables logic operation.
0
1
Disable logic operation
Enable logic operation
1
0
InvOp
This bit enables or disables logic operation output inversion.
0
1
Logic operation output not inverted
Logic operation output inverted
Operator
This bit selects which operator should be used to compute logic operation.
0
1
Logic operator OR is used on inputs
Logic operator AND is used on inputs
8.7 LOGICAL_OPR_INPUTx
Selects Input for Logic Operation
LOGICAL_OPR_INPUT0: 1Eh LOGICAL_OPR_INPUT1: 23h (Not available for 1 button)
LOGICAL_OPR_INPUT0
1 Button
Access: FD
Bit Name
7
7
6
6
6
5
5
5
4
4
4
3
3
3
2
2
2
1
1
1
0
RW:01
CSL[0]
2 Button
Access: FD
Bit Name
0
RW:01
CSL [1:0]
LOGICAL_OPR_INPUT1
2 Button
Access: FD
Bit Name
7
0
RW:02
CSL [1:0]
These registers are used to give the input to logic operation block. The inputs can be only CapSense input status.
Bit
Name
Description
1:0
CSL [1:0]
These bits selects the input for logic operation block.
Document Number: 001-53516 Rev. *G
Page 13 of 43
[+] Feedback
CY8C20111, CY8C20121
8.8 CS_NOISE_TH
Noise Threshold Register
CS_NOISE_TH: 4Eh
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW:28
NT[7:0]
This register sets the noise threshold value. For individual sensors, count values above this threshold do not update the baseline.
This count is relative to baseline. This parameter is common for all sensors.
The range is 3 to 255 and it should satisfy the equation NT < Min (Finger Threshold – Hysteresis – 5). Recommended value is 40%
of finger threshold.
Bit
Name
Description
7:0
NT [7:0]
These bits are used to set the noise threshold value.
8.9 CS_BL_UPD_TH
Baseline Update Threshold Register
CS_BL_UPD_TH: 4Fh
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW:64
BLUT[7:0]
When the new raw count value is above the current baseline and the difference is below the noise threshold, the difference between
the current baseline and the raw count is accumulated into a “bucket.” When the bucket fills, the baseline increments and the bucket
is emptied. This parameter sets the threshold that the bucket must reach for the baseline to increment. In other words, lower value
provides faster baseline update rate and vice versa. This parameter is common for all sensors.
The range is 0 to 255.
Bit
Name
Description
7:0
BLUT [7:0]
These bits set the threshold that the bucket must reach for baseline to increment.
8.10 CS_SETL_TIME
Settling Time Register
CS_SETL_TIME: 50h
(Writable only in Setup mode)
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW:A0
STLNG_TM[7:0]
The settling time parameter controls the duration of the capacitance-to-voltage conversion phase. The parameter setting controls a
software delay that allows the voltage on the integrating capacitor to stabilize. This parameter is common for all sensors.
This register should be set before setting finger threshold (0x66, 0x67) and IDAC setting (0x70, 0x71) registers.
The range is 2 to 255.
Bit
Name
Description
7:0
STLNG_TM [7:0]
These bits are used to set the settling time value.
Document Number: 001-53516 Rev. *G
Page 14 of 43
[+] Feedback
CY8C20111, CY8C20121
8.11 CS_OTH_SET
CapSense Clock Select, Sensor Auto Reset Register
CS_OTH_SET: 51h
(Writable only in Setup mode)
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW: 00
CS_CLK[1:0]
RW: 0
Sns_Ar
The registers set the CapSense module frequency of operation and enables or disables the sensor auto reset.
CS_CLK bits provides option to select variable clock input for the CapSense block. A sensor design having higher paratactic requires
lower clock for better performance and vice versa.
Sensor Auto Reset determines whether the baseline is updated at all times or only when the signal difference is below the noise
threshold. When set to ‘1’ (enabled), the baseline is updated constantly. This setting limits the maximum time duration of the sensor,
but it prevents the sensors from permanently turning on when the raw count suddenly rises without anything touching the sensor. This
sudden rise can be caused by a large power supply voltage fluctuation, a high energy RF noise source, or a very quick temperature
change. When the parameter is set to ‘0’ (disabled), the baseline is updated only when raw count and baseline difference is below
the noise threshold parameter. This parameter may be enabled unless there is a demand to keep the sensors in the on state for a
long time. This parameter is common for all sensors.
Bit
Name
Description
6:5
CS_CLK[1:0]
These bits selects the CapSense clock.
CS_CLK[1:0]
00
Frequency of Operation
IMO
01
10
11
IMO/2
IMO/4
IMO/8
3
Sns_Ar
This bit is used to enable or disable sensor auto reset.
0
1
Disable Sensor auto reset
Enable Sensor auto reset
8.12 CS_HYSTERISIS
Hysteresis Register
CS_HYSTERISIS: 52h
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
RW:0A
2
1
0
HYS[7:0]
The Hysteresis parameter adds to or subtracts from the finger threshold depending on whether the sensor is currently active or
inactive. If the sensor is off, the difference count must overcome the ‘finger threshold + hysteresis’. If the sensor is on, the difference
count must go below the ‘finger threshold – hysteresis’. It is used to add debouncing and “stickiness” to the finger detection algorithm.
This parameter is common for all sensors.
Possible values are 0 to 255. However, the setting must be lower than the finger threshold parameter setting. Recommended value
for hysteresis is 15 percent of finger threshold.
Bit
Name
Description
7:0
HYS [7:0]
These bits are used to set the hysteresis value.
Document Number: 001-53516 Rev. *G
Page 15 of 43
[+] Feedback
CY8C20111, CY8C20121
8.13 CS_DEBOUNCE
Debounce Register.
CS_DEBOUNCE: 53h
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW:0A
DB[7:0]
The Debounce parameter adds a debounce counter to the ‘sensor active transition’. For the sensor to transition from inactive to active,
the consecutive samples of difference count value must stay above the ‘finger threshold + hysteresis’ for the number specified. This
parameter is common for all sensors.
Possible values are 1 to 255. A setting of ‘1’ provides no debouncing.
Bit
Name
Description
7:0
DB [7:0]
These bits are used to set the debounce value.
8.14 CS_NEG_NOISE_TH
Negative Noise Threshold Register
CS_NEG_NOISE_TH: 54h
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW:0A
NNT[7:0]
This parameter adds a negative difference count threshold. If the current raw count is below the baseline and the difference between
them is greater than this threshold, the baseline is not updated. However, if the current raw count stays in the low state (difference
greater than the threshold) for the number of samples specified by the Low Baseline Reset parameter, the baseline is reset. This
parameter is common for all sensors.
Bit
Name
Description
7:0
NNT [7:0]
These bits are used to set the negative noise value.
8.15 CS_LOW_BL_RST
Low Baseline Reset Register
CS_LOW_BL_RST: 55h
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW:0A
LBR[7:0]
This parameter works together with the Negative Noise Threshold parameter. If the sample count values are below the baseline minus
the negative noise threshold for the specified number of samples, the baseline is set to the new raw count value. It essentially counts
the number of abnormally low samples required to reset the baseline. It is generally used to correct the finger-on-at-startup condition.
This parameter is common for all sensors.
Bit
Name
Description
7:0
LBR [7:0]
These bits are used to set the Low Baseline Reset value.
Document Number: 001-53516 Rev. *G
Page 16 of 43
[+] Feedback
CY8C20111, CY8C20121
8.16 CS_FILTERING
CapSense Filtering Register
CS_FILTERING: 56h
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW: 0
RstBl
RW: 1
I2C_DS
RW: 0
Avg_En
RW: 00
Avg_Order[1:0]
This register provides an option for forced baseline reset and to enable and configure two different types of software filters.
Bit
Name
Description
7
RstBl
This bit resets all the baselines and it is auto cleared to ‘0’.
0
1
All Baselines are not reset
All baselines are reset
5
I2C_DS
Avg_En
When this bit is set to ‘1’ the CapSense scan sample is dropped if I2C communication
was active during scanning.
0
1
Disable the I2C drop sample filer
Enable the I2C drop sample filter
4
This bit enables average filter on raw counts.
0
1
Disable the average filter
Enable the average filter
[1:0]
Avg_Order[1:0]
These bits are used to select the number of CapSense samples to average:
Avg_Order[1:0] in Hex
Samples to Average
00
01
10
11
2
4
8
16
8.17 CS_SCAN_POS_x
Scan Position Registers
CS_SCAN_POS_0: 5Ch
(Writable only in Setup mode)
1/2 Button
Access: FD
Bit Name
7
6
5
4
4
3
3
2
2
1
1
0
RW: 0
Scan_Pstn
CS_SCAN_POS_1: 5Dh (Not available for 1 Button)
(Writable only in Setup mode)
2 Button
Access: FD
Bit Name
7
6
5
0
RW: 1
Scan_Pstn
This register is used to set the position of the sensors in the switch table for proper scanning sequence because the CapSense sensors
are scanned in sequence.
This register should be set after setting 0x07, 0x50, and 0x51 registers.
Bit
Name
Description
0
Scan_Pstn
This bit sets the scan position.
Document Number: 001-53516 Rev. *G
Page 17 of 43
[+] Feedback
CY8C20111, CY8C20121
8.18 CS_FINGER_TH_x
Finger Threshold Registers
CS_FINGER_TH_0: 66h
CS_FINGER_TH_1: 67h (Not available in 1 Button)
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW: 64
FT[7:0]
This register sets the finger threshold value for CapSense inputs. Possible values are 3 to 255. This parameter should be configured
individually for each CapSense inputs.
This register should be set after setting 0x07, 0x50, and 0x51 registers.
Bit
Name
Description
[7:0]
FT [7:0]
These bit set the finger threshold for CapSense inputs.
8.19 CS_IDAC_x
IDAC Setting Registers
CS_IDAC_0: 70h CS_IDAC_1: 71h (Not available in 1 Button)
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW: 0A
IDAC[7:0]
The IDAC register controls the sensitivity of the CapSense algorithm. This register is used to tune the CapSense input for specific
design or overlays. Decreasing the value of this register increases the sensitivity of the CapSense buttons and vice versa. Decreasing
the value of IDAC increases noise and vice versa.
Possible values are 1 to 255. If the value is set to 0 then the value is reset to default value 10.
The recommended value is greater than 4. Setting value ≤ 4 creates excessive amount of noise.
This register should be set after setting 0x07, 0x50, and 0x51 registers.
Bit
Name
Description
[7:0]
IDAC [7:0]
These bit set the IDAC values.
8.20 I2C_ADDR_LOCK
I2C Address Lock Registers
I2C_ADDR_LOCK: 79h
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
WPR: 0
I2CAL
This register is used to unlock and lock the I2C address register (7Ch) access. The device I2C address should be modified by writing
new address to register 7Ch after unlocking the access using this register. Write to the 7C register during the locked state does not
have any effect and the new address take effect only after the access is locked.
To lock or unlock the I2C AL bit, the following three bytes must be written to register 79h:
■ unlock I2CAL: 3Ch A5h 69h
■ lock I2CAL: 96h 5Ah C3h
Reading the I2CAL bit from register 79h indicates the current access state.
Bit
0
Name
I2CAL
Description
This bit gives the lock/unlock status of I2C address.
0
1
Unlocked
Locked
Document Number: 001-53516 Rev. *G
Page 18 of 43
[+] Feedback
CY8C20111, CY8C20121
8.21 DEVICE_ID
Device ID Register
DEVICE_ID: 7Ah
1 Button
7
6
6
5
5
4
3
2
2
1
1
0
0
Access: FD
Bit Name
R: 11
DEV_ID[7:0]
2 Button
Access: FD
Bit Name
7
4
3
R: 21
DEV_ID[7:0]
This register contains the device and product ID. The device and product ID corresponds to “xx” in CY8C201xx.
Bit
Name
Description
7:0
DEV_ID [7:0]
These bits contain the device and product ID.
Part No
Device/Product ID
CY8C20111
CY8C20121
11
21
8.22 DEVICE_STATUS
Device Status Register
DEVICE_STATUS: 7Bh
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
R : 00
R: 0
IRES
R : 0
R: 0
R: 0
CSE
R: 0
Ip_Volt[1:0]
Load_FD
No_NVM_Wr
DIGE
This register contains the device status.
Bit
Name
Description
7:6
Ip_Volt [1:0]
Supply voltage is automatically detected and these bits are set accordingly.
Ip_Volt[1:0]
Supply Voltage
00
01
10
5
3.3
2.7
5
4
IRES
When set to ‘1’, this bit indicates that an internal reset occurred.
0
1
indicates the last system reset was not internal reset
indicates the last system reset was internal reset
This bit indicates whether factory defaults are loaded during power-up.
Load_FD
0
1
User default configuration is loaded during power-up
Factory default configuration is loaded during power-up
3
1
No_NVM_Wr
CSE
When set to ‘1’, this bit indicates that the supply voltage applied to the device Is too
low for a write to nonvolatile memory operation, and no write is performed. This bit
must be checked before any Store or Write POR command.
This bit indicates whether CapSense function is enabled or disabled.
0
1
Functionality of CapSense block is disabled
Functionality of CapSense block is enabled
0
DIGE
This bit indicates whether GP Output function is enabled or disabled.
0
1
Functionality of Digital output block is disabled
Functionality of Digital output block is enabled
Document Number: 001-53516 Rev. *G
Page 19 of 43
[+] Feedback
CY8C20111, CY8C20121
8.23 I2C_ADDR_DM
Device I2C Address and I2C Pin Drive Mode Register
I2C_ADDR_DM: 7Ch
1 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
RW: 0
RW: 00
I2CIP_EN
I2C_ADDR[6:0]
This register sets the drive mode of I2C pins and I2C slave address. To write to this register, register 79h must first be unlocked. The
value written to register 7Ch is applied only after locking register 79h again.
Bit
7
Name
I2CIP_EN
Description
This bit is used to set the I2C pins drive mode.
0
1
Internal pull-up enabled
Internal pull-up disabled
6:0
I2C_ADDR [6:0]
Used to set the device I2C address.
8.24 CS_READ_BUTTON
Button Select Register
I2C_ADDR_DM: 81h
1 Button
Access: FD
Bit Name
7
6
6
5
5
4
4
3
3
2
2
1
1
0
RW: 0
RD_EN
RW: 0
CSBN[0]
2 Button
Access: FD
Bit Name
7
0
RW: 0
RD_EN
RW: 00
CSBN[1:0]
The scan result of a CapSense input (raw count, difference count, and baseline) can be read only for one input at a time using 82h-87h
registers. This register is used to select a CapSense input to read the raw count, difference count, and baseline. Only the pins defined
as CapSense inputs in register 07h can be used with this register. Trying to select other pins not defined as CapSense does not have
any change.
Bit
Name
Description
7
RD_EN
This bit enables the CapSense raw data reading.
0
1
Disable CapSense scan result reading
Enable CapSense scan result reading
1:0
CSBN [1:0]
These bits decide which CapSense button scan result are read. When writing to this
register, the bitmask must contain only one bit set to ’1’, otherwise the data is
discarded.
CSBN [1:0]
01
10
CapSense Button No
1
2
Document Number: 001-53516 Rev. *G
Page 20 of 43
[+] Feedback
CY8C20111, CY8C20121
8.25 CS_READ_BLx
Baseline Value MSB/LSB Registers
CS_READ_BLM: 82h
CS_READ_BLL: 83h
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
0
0
0
R: 00
BL [7:0]
Reading from this register returns the 2-byte current baseline value for the selected CapSense input.
Bit
Name
Description
7:0
BL [7:0]
These bits represent the baseline value.
8.26 CS_READ_DIFFx
Difference Count Value MSB/LSB Registers
CS_READ_DIFFM: 82h
CS_READ_DIFFL: 83h
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
R: 00
DIF [7:0]
Reading from this register returns the 2-byte current difference count for the selected CapSense input.
Bit
Name
Description
These bits represent the sensor difference count.
7:0
DIF [7:0]
8.27 CS_READ_RAWx
Difference Count Value MSB/LSB Registers
CS_READ_RAWM: 82h
CS_READ_RAWL: 83h
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
2
1
R: 00
RC [7:0]
Reading from this register returns the 2-byte current raw count value for the selected CapSense input.
Bit
Name
Description
7:0
RC [7:0]
These bits represent the raw count value.
Document Number: 001-53516 Rev. *G
Page 21 of 43
[+] Feedback
CY8C20111, CY8C20121
8.28 CS_READ_STATUS
Sensor On Status Register
CS_READ_STATUS: 88h
1 Button
Access: FD
Bit Name
7
6
6
5
5
4
4
3
3
2
2
1
1
0
R: 0
BT_ST[0]
2 Button
Access: FD
Bit Name
7
0
R: 00
BT_ST[1:0]
This register gives the sensor ON/OFF status. A bit ‘1’ indicates sensor is ON and ‘0’ indicates sensor is OFF.
Bit
Name
Description
1:0
BT_ST [1:0]
These bits used to represent sensor status.
0
1
Sensor OFF
Sensor ON
8.29 COMMAND_REG
Command Register
COMMAND_REG: A0h
1/2 Button
Access: FD
Bit Name
7
6
5
4
3
W: 00
2
1
0
Cmnd [7:0]
Commands are executed by writing the command code to the command register.
Bit
Name
Description
7:0
Cmnd [7:0]
Refer to the following table for command register opcodes.
Command
Code
Name
Description
00h
Get Firmware Revision The I2C buffer is loaded with the one byte firmware revision value. Reading one byte
after writing this command returns the firmware revision. The upper nibble of the
firmware revision byte is the major revision number and the lower nibble is the minor
revision number.
01h
02h
03h
Store Current Configu-
ration to NVM
The current register settings are saved in nonvolatile memory (flash). This setting is
automatically loaded after the next device reset/power-up or if the Reconfigure Device
(06h) command is issued.
Restore Factory
Configuration
Replaces the saved user configuration with the factory default configuration. Current
settings are unaffected by this command. New settings are loaded after the next device
reset/power-up or if the 06h command is issued.
Write POR Defaults
Sends new power-up defaults to the CapSense controller without changing current
settings unless the 06h command is issued afterwards. This command is followed by
123 data bytes according to the POR Default Data Structure table. The CRC is calculated
as the XOR of the 122 data bytes (00h-79h). If the CRC check fails or an incomplete
block is sent, the slave responds with an ACK and the data is NOT saved to flash.
To define new POR defaults:
■ Write command 03h
■ Write 122 data bytes with new values of registers (use the _flash.iic file generated
from s/w tool)
■ Write one CRC byte calculated as XOR of previous 122 data bytes
Document Number: 001-53516 Rev. *G
Page 22 of 43
[+] Feedback
CY8C20111, CY8C20121
Command
Code
Name
Description
04h
Read POR Defaults
Reads the POR settings stored in the nonvolatile memory. To read POR defaults:
■ Write command 04h
■ Read 122 data bytes
■ Read one CRC byte
05h
Read Device Configu-
ration (RAM)
Reads the current device configuration. Gives the user "flat-address-space" access to
all device settings. To read device configuration:
■ Write command 05h
■ Read 122 data bytes
■ Read one CRC byte
06h
07h
Reconfigure Device
(POR)
Immediately reconfigures the device with actual POR defaults from flash. Has the same
effect on the registers as a POR. This command can only be executed in setup operation
mode (command code 08).
Set Normal Operation
Mode
Sets the device in normal operation mode. In this mode, CapSense pin assignments
cannot be modified; settling time, IDAC setting, external capacitor, and sensor
auto-reset also cannot be modified.
08h
09h
Set Setup Operation
Mode
Sets the device in setup operation mode. In this mode, CapSense pin assignments can
be changed along with other parameters.
Start CapSense
Scanning
Allows the user to start CSA scanning after it has been stopped using command 0x0A.
Note that at POR, scanning is enabled and started by default if one or more sensors are
enabled.
0Ah
Stop CapSense
Scanning
Allows the user to stop CSA scanning. A system host controller might initiate this
command before powering down the device to make sure that during power-down no
CapSense touches are detected.
When CSA scanning is stopped by the user and the device is still in the valid VCC
operating range, the following behavior is supported:
■ Any change to configuration can still be done (as long as VCC is in operating range).
■ Command code 0x06 overrides the status of stop/scan by enabling and starting CSA
scanning if one or more sensors are enabled.
■ CapSense read-back values return 0x00.
0Bh
Returns CapSense
Scanning Status
The I2C buffer is loaded with the one-byte CSA scanning status value. After writing the
value 0Bh to the A0h register, reading one byte returns the CSA scanning status. It
returns the LVD_STOP_SCAN and STOP_SCAN bits.
LVD_STOP_SCAN is bit 3 - Set when CSA is stopped because VCC is outside the valid
operating range. STOP_SCAN is bit 2 - Set when CSA is stopped by the user by writing
command 0x0A.
Document Number: 001-53516 Rev. *G
Page 23 of 43
[+] Feedback
CY8C20111, CY8C20121
9. Layout Guidelines and Best Practices
Sl.
Category
Button Shape
Min
Max
Recommendations/Remarks
No.
1
Solid round pattern, round with LED hole, rectangle with
round corners
2
3
Button Size
5 mm
15 mm
10 mm
8 mm
Button Button Spacing
= Button
Ground
Clearance
4
5
6
7
Button Ground Clearance
Ground Flood - Top Layer
Ground Flood - Bottom Layer
0.5 mm
2 mm
Button ground clearance = Overlay Thickness
Hatched ground 7 mil trace and 45 mil grid (15% filling)
Hatched ground 7 mil trace and 70 mil grid (10% filling)
< 100 mm.
Trace Length from Sensor to
PSoC - Buttons
200 mm
0.20 mm
8
9
Trace Width
0.17 mm
0.17 mm (7 mil)
Trace Routing
Traces should be routed on the non sensor side. If any non
CapSense trace crosses CapSense trace, ensure that inter-
section is orthogonal.
10
Via Position for the Sensors
Via should be placed near the edge of the button/slider to
reduce trace length thereby increasing sensitivity.
11
12
13
Via Hole Size for Sensor Traces
No. of Via on Sensor Trace
10 mil
1
1
2
CapSense Series Resistor
Placement
10mm
Place CapSense series resistors close to PSoC for noise
suppression.CapSense resistors have highest priority place
them first.
14
15
Distance between any
CapSense Trace to Ground
Flood
10 mil
20 mil
20 mil
Device Placement
Mount the device on the layer opposite to sensor. The
CapSense trace length between the device and sensors
should be minimum
16
17
Placement of Components in 2
Layer PCB
Top layer-sensor pads and bottom layer-PSoC, other compo-
nents and traces.
Placement of Components in 4
Layer PCB
Top layer-sensor pads, second layer – CapSense traces,
third layer-hatched ground, bottom layer- PSoC, other
components and non CapSense traces
18
19
Overlay Material
Should to be non conductive material. Glass, ABS Plastic,
Formica
Overlay Adhesives
Adhesive should be non conductive and dielectrically homog-
enous. 467MP and 468MP adhesives made by 3M are
recommended.
20
21
LED Back Lighting
Board Thickness
Cut a hole in the sensor pad and use rear mountable LEDs.
Refer Example PCB Layout Design with Two CapSense
Buttons and Two LEDs on page 26.
Standard board thickness for CapSense FR4 based designs
is 1.6 mm.
The Recommended maximum overlay thickness is 2 mm. For more details refer to AN53490, section The Integrating Capacitor.
Document Number: 001-53516 Rev. *G
Page 24 of 43
[+] Feedback
CY8C20111, CY8C20121
Figure 7. Button Shapes
Figure 8. Button Layout Design
X: Button to ground clearance
Y: Button to button clearance
Figure 9. Recommended Via-hole Placement
Document Number: 001-53516 Rev. *G
Page 25 of 43
[+] Feedback
CY8C20111, CY8C20121
9.1 Example PCB Layout Design with Two CapSense Buttons and Two LEDs
Figure 10. Top Layer
Figure 11. Bottom Layer
Document Number: 001-53516 Rev. *G
Page 26 of 43
[+] Feedback
CY8C20111, CY8C20121
10. Operating Voltages
For details on I2C 1x Ack time, refer Register Map on page 7 and CapSense Express Commands on page 8. I2C 4x Ack time is
approximately four times the values mentioned in these tables.
11. CapSense Constraints
Parameter
Min
Typ
Max
Units
Notes
Parasitic Capacitance (CP) of the
CapSense Sensor
30
pF
Supply Voltage Variation (VDD
)
± 5%
Document Number: 001-53516 Rev. *G
Page 27 of 43
[+] Feedback
CY8C20111, CY8C20121
12. Electrical Specifications
12.1 Absolute Maximum Ratings
Parameter
Description
Storage temperature
Min
Typ
Max
Unit
Notes
TSTG
–55
25
+100
°C Higher storage temperatures reduce data
retention time. Recommended storage
temperature is +25 °C ± 25 °C (0 °C to
50 °C). Extended duration storage tempera-
tures above 65 °C degrade reliability
TBAKETEMP Bake Temperature
tBAKETIME Bake Time
–
125
–
See
Package
label
°C
See
package
label
72
Hours
TA
Ambient temperature with power
applied
–40
–
+85
°C
VDD
VIO
Supply voltage on VDD relative to VSS
DC input voltage
–0.5
VSS – 0.5
VSS – 0.5
–25
–
–
–
–
–
–
+6.0
VDD + 0.5
VDD + 0.5
+50
V
V
VIOZ
IMIO
ESD
LU
DC voltage applied to tri-state
Maximum current into any GPIO pin
Electro static discharge voltage
Latch up current
V
mA
V
2000
–
Human body model ESD
–
200
mA
12.2 Operating Temperature
Parameter
Description
Min
–40
–40
Typ
–
Max
+85
Unit
°C
Notes
TA
TJ
Ambient temperature
Junction temperature
–
+100
°C
13. DC Electrical Characteristics
13.1 DC Chip Level Specifications
Parameter
VDD
Description
Supply voltage
Supply current
Min
2.40
–
Typ
–
Max
5.25
2.5
Unit
Notes
V
IDD
1.5
mA Conditions are VDD = 3.10 V, TA = 25 °C
Document Number: 001-53516 Rev. *G
Page 28 of 43
[+] Feedback
CY8C20111, CY8C20121
13.2 DC GPIO Specifications
13.2.1 5-V and 3.3-V DC GPIO Specifications
This table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ TA ≤ 85 °C, 3.10 V to 3.6 V –40 °C ≤ TA ≤ 85 °C. Typical parameters apply to 5 V and 3.3 V at 25 °C and are for design
guidance only.
Parameter
Description
High output voltage
Min
Typ
–
Max
–
Unit
V
Notes
V
V
V
– 0.2
I
I
I
≤ 10 µA/pin, V ≥ 3.10 V
OH1
OH2
OL
DD
DD
OH
OH
OL
DD
V
V
High output voltage
Low output voltage
– 0.9
–
–
V
= 1 mA/pin, V ≥ 3.10 V
DD
–
–
0.75
V
= 20 mA/pin, V > 3.10 V, maximum of 40
DD
mA sink current
I
High output current
0.01
–
–
–
1
10
5
mA
mA
pF
V
≥ 3.1 V
OH
DD
DD
I
Low output current on Port 0 pins
Capacitive load on pins as output
V
≥ 3.1 V, maximum of 40 mA sink current
OL1
C
0.5
1.7
Package and pin dependent.
Temp = 25 °C.
OUT
13.2.2 2.7-V DC GPIO Specifications
This table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 2.4 V to 2.90 V and
–40 °C < TA < 85 °C, respectively. Typical parameters apply to 2.7 V at 25 °C and are for design guidance only.
Parameter
Description
High output voltage
Min
Typ
–
Max
–
Unit
V
Notes
V
V
V
– 0.2
I
I
I
≤ 10 µA/pin
OH1
OH2
OL
DD
DD
OH
OH
OL
V
V
High output voltage
Low output voltage
– 0.5
–
–
V
= 0.2 mA/pin
–
–
0.75
V
= 10 mA/pin, maximum of 20 mA sink
current
I
High output current
0.01
–
–
–
0.2
10
5
mA
mA
pF
V
V
≤ 2.9 V
OH
DD
DD
I
Low output current on Port 0 pins
Capacitive load on pins as output
≤ 2.9 V, maximum of 20 mA sink current
OL1
C
0.5
1.7
Package and pin dependent.
Temp = 25 °C.
OUT
13.3 DC POR and LVD Specifications
Parameter
Description
Min
Typ
Max
Unit
Notes
V
V
V
Value for PPOR Trip
= 2.7 V
= 3.3 V, 5 V
V
must be greater than or equal to 2.5 V
DD
DD
DD
DD
V
V
–
–
2.36
2.60
2.40
2.65
V
V
during startup or reset from watchdog.
PPOR0
PPOR1
13.4 DC Flash Write Specifications
This table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40
°C < TA < 85 °C, 3.10 V to 3.6 V and –40 °C < TA < 85 °C or 2.4 V to 2.90 V and –40 °C < TA < 85 °C, respectively. Typical parameters
apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only. Flash Endurance and Retention specifications are valid only
within the range: 25 °C±20 °C during the flash write operation. It is at the user’s own risk to operate out of this temperature range. If
flash writing is done out of this temperature range, the endurance and data retention reduces.
Symbol
Description
Supply Voltage for Flash Write Operations
Supply Current for Flash Write Operations
Flash Endurance
Min
2.7
Typ
–
Max
–
Units
V
Notes
[7]
V
DDIWRITE
DDP
I
–
5
25
–
mA
–
Flash
Flash
50,000
10
–
Erase/write cycles
ENPB
DR
Flash Data Retention
–
–
Years
Note
7. Commands involving flash writes (0x01, 0x02, 0x03) and flash read (0x04) must be executed only within the same V voltage range detected at POR (power on, or
CC
command 0x06) and above 2.7 V.
Document Number: 001-53516 Rev. *G
Page 29 of 43
[+] Feedback
CY8C20111, CY8C20121
2
13.5 DC I C Specifications
This table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C < TA < 85 °C, 3.10 V to 3.6 V and –40 °C < TA < 85 °C or 2.4 V to 2.90 V and –40 °C < TA < 85 °C, respectively. Typical
parameters apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 7. DC I2C Specifications[9]
Symbol
Description
Min
Typ
–
Max
Units
Notes
V
Input low level
Input high level
–
0.3 × V
V
V
V
V
2.4 V ≤ V ≤ 3.6 V
ILI2C
DD
DD
–
0.7 × V
–
–
0.25 × V
4.75 V ≤ V ≤ 5.25 V
DD
DD
V
V
–
–
2.4 V ≤ V ≤ 5.25 V
IHI2C
DD
DD
Low output voltage
–
0.4
I
=5 mA/pin, maximum of 10 mA
OLP
OL
device sink current
2.4 ≤ V ≤ 2.9 V and 3.1 ≤ V ≤ 3.6
DD
DD
V.
2
C
R
Capacitive load on I C pins
0.5
4
1.7
5.6
5
8
pF Package and pin dependent.
Temp = 25 °C.
I2C
PU
Pull-up resistor
kΩ
13.6 CapSense Electrical Characteristics
Max (V)
Typ (V)
Min (V)
Conditions for Supply Voltage
Result
3.6
3.3
3.1
< 2.9
The device automatically reconfigures itself to work in 2.7 V
mode of operation.
> 2.9 or < 3.10
< 2.45 V
This range is not recommended for CapSense usage.
2.90
5.25
2.7
5.0
2.45
4.75
The scanning for CapSense parameters shuts down until the
voltage returns to over 2.45 V.
> 3.10
The device automatically reconfigures itself to work in 3.3 V
mode of operation.
< 2.4 V
The device goes into reset.
< 4.73 V
The scanning for CapSense parameters shuts down until the
voltage returns to over 4.73 V.
Notes
8. A maximum of 36 × 50,000 block endurance cycles is allowed. This is balanced between operations on 36 × 1 blocks of 50,000 maximum cycles each, 36 × 2 blocks
of 25,000 maximum cycles each, or 36 × 4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36 × 50,000 and that no single block ever sees
more than 50,000 cycles).
2
9. All GPIO meet the DC GPIO V and V specifications found in the DC GPIO Specifications sections. The I C GPIO pins also meet the above specs.
IL
IH
Document Number: 001-53516 Rev. *G
Page 30 of 43
[+] Feedback
CY8C20111, CY8C20121
14. AC Electrical Specifications
14.1 AC Chip-Level Specifications
14.1.1 5-V and 3.3-V AC Chip-Level Specifications
Parameter Description
Min
Typ
Max
Units
Notes
F
Internal low-speed oscillator (ILO) frequency
15
32
64
kHz
Calculations during sleep operations are
done based on ILO frequency.
32K1
t
t
External reset pulse width
10
–
–
–
–
Us
ms
XRST
Time from end of POR to CPU executing
code
150
POWERUP
SR
Power supply slew rate
–
–
250
V/ms
POWER_
UP
14.1.2 2.7-V AC Chip-Level Specifications
Parameter Description
Min
Typ
Max
Units
Notes
F
Internal low-speed oscillator (ILO) frequency
8
32
96
kHz
Calculations during sleep operations are
done based on ILO frequency.
32K1
t
t
External reset pulse width
10
–
–
–
–
Us
ms
XRST
Time from end of POR to CPU executing
code
600
POWERUP
SR
Power supply slew rate
–
–
250
V/ms
POWER_
UP
14.2 AC GPIO Specifications
14.2.1 5-V and 3.3-V AC GPIO Specifications
Parameter
Description
Min
Max
Unit
Notes
t
t
Rise time, strong mode,
15
80
ns
V
= 3.10 V to 3.6 V and 4.75 V to 5.25
DD
Rise
Cload = 50 pF
V, 10% to 90%
V = 3.10 V to 3.6 V and 4.75 V to 5.25
DD
Fall time, strong mode,
Cload = 50 pF
10
50
ns
Fall
V, 10% to 90%
14.2.2 2.7-V AC GPIO Specifications
Parameter Description
Min
Max
Unit
Notes
t
Rise time, strong mode,
15
100
ns
V
V
= 2.4 V to 2.90 V, 10% to 90%
Rise
DD
DD
Cload = 50 pF
t
Fall time, strong mode,
Cload = 50 pF
10
70
ns
= 2.4 V to 2.90 V, 10% to 90%
Fall
2
14.3 AC I C Specifications
Standard
Mode
Fast Mode
Parameter
Description
Units
Notes
Min Max Min
Max
F
SCL clock frequency
0
100
0
400
kbps Fast mode not supported for
< 3.0 V
SCLI2C
V
DD
t
Hold time (repeated) START condition. After
this period, the first clock pulse is generated
4.0
–
0.6
–
µs
HDSTAI2C
t
t
t
LOW period of the SCL clock
4.7
4.0
4.7
–
–
–
1.3
0.6
0.6
–
–
–
µs
µs
µs
LOWI2C
HIGH period of the SCL clock
HIGHI2C
SUSTAI2C
Setup time for a repeated START condition
Document Number: 001-53516 Rev. *G
Page 31 of 43
[+] Feedback
CY8C20111, CY8C20121
2
14.3 AC I C Specifications (continued)
Standard
Mode
Fast Mode
Parameter
Description
Units
Notes
Min Max Min
Max
t
Data hold time
Data setup time
0
–
–
–
–
0
–
–
–
–
µs
ns
µs
µs
HDDATI2C
SUDATI2C
SUSTOI2C
BUFI2C
t
t
t
250
4.0
4.7
100
0.6
1.3
Setup time for STOP condition
BUS free time between a STOP and START
condition
t
Pulse width of spikes suppressed by the input
filter
–
–
0
50
ns
SPI2C
Figure 12. Definition of Timing for Fast/Standard Mode on the I2C Bus
I2C_SDA
I2C_SCL
TSUDATI2C
TSPI2C
TSUSTAI2C
TBUFI2C
THDDATI2C
THDSTAI2C
THIGHI2C TLOWI2C
TSUSTOI2C
P
S
S
Sr
Repeated START Condition
STOP Condition
START Condition
Document Number: 001-53516 Rev. *G
Page 32 of 43
[+] Feedback
CY8C20111, CY8C20121
2
15. Examples of Frequently Used I C Commands
2
[10]
Sl. No.
Requirement
Enter into setup mode
Enter into normal mode
I C Commands
W 00 A0 08
Comment
1
2
3
W 00 A0 07
W 00 A0 02
Load factory defaults to RAM
registers
4
Do a software reset
W 00 A0 08
W 00 A0 06
; Enter into setup mode
; Do software reset
5
6
Save current configuration to flash
W 00 A0 01
Load factory defaults to RAM
registers and save as user configu-
ration
W 00 A0 08
W 00 A0 02
W 00 A0 01
W 00 A0 06
; Enter into setup mode
; Load factory defaults to SRAM
; Save the configuration to flash. Wait for time specified in
Table 6.
; Do software reset
7
Disable combinational logic output to
DIG0
W 00 1C 00
W 00 21 00
W 00 04 00
W 00 04 01
W 00 04 02
W 00 04 03
8
Disable combinational logic output to
DIG1
9
Clearing (logic 0) the both DIG0 and
DIG1 outputs
Combinational logic output on DIG0 and DIG1 should be
disabled before dong this operation (SL# 7 and 8)
10
11
12
13
Setting (logic 1) the DIG0 and
clearing (Logic 0) the DIG1 outputs
Clearing (logic 0) the DIG0 and
Setting (Logic 1) the DIG1 outputs
Setting (logic 1) the both DIG0 and
DIG1 outputs
Change CapSense clock to IMO/2
W 00 A0 08
W 00 51 20
W 00 A0 07
; Enter into setup mode
; CapSense clock is set as IMO/2
; Enter into normal mode
14
15
16
Change value of IDAC0 to ‘x’h
Change value of IDAC1 to ‘y’h
W 00 70 x
W 00 71 y
W 00 70 x y
‘x’ represents new value of IDAC register
‘y’ represents new value of IDAC register
‘x’ and ‘y’ represents new value of IDAC register
Change value of IDAC0 and IDAC1
to ‘x’h and ‘y’h
17
18
19
Change the value FT0 to ‘x’h
Change the value FT1 to ‘y’h
W 00 66 x
W 00 67 y
W 00 66 x y
‘x’ represents new value of FT register
‘y’ represents new value of FT register
‘x’ and ‘y’ represents new value of FT registers
Change thevalue FT0andFT1 to ‘x’h
and ‘y’h
20
21
Change noise threshold to ‘x’h
W 00 4E x
Read CapSense button CS0 scan
results
W 00 81 81
W 00 82
; Select CapSense button for reading scan result
; Set the read point to 82h
; Consecutive 6 reads gets baseline, difference count and
raw count (all two byte each)
R
00 RD RD RD RD
RD RD
22
Read CapSense button status
register
W 00 88
; Set the read pointer to 88
; Reading a byte gets status CapSense inputs
R
00 RD
Note
10. The ‘W’ indicates the write transfer and the next byte of data represents the 7-bit I2C address. The I2C address is assumed to be ‘0’ in the above examples.
Similarly ‘R’ indicates the read transfer followed by 7-bit address and data byte read operations.
Document Number: 001-53516 Rev. *G
Page 33 of 43
[+] Feedback
CY8C20111, CY8C20121
16. Ordering Information
Package
Ordering Code
Operating
Temperature
CapSense CapSense
Digital
Outputs
XRES
Pin
Package Type
Diagram
Blocks
Inputs
CY8C20111-SX1I
CY8C20111-SX1IT
CY8C20121-SX1I
CY8C20121-SX1IT
51-85066 8-Pin SOIC
Industrial
Industrial
Industrial
Industrial
Yes
1
1
2
2
1
1
2
2
No
No
No
No
51-85066 8-Pin SOIC (tape and reel)
51-85066 8-Pin SOIC
Yes
Yes
51-85066 8-Pin SOIC (tape and reel)
Yes
Note For Die sales information, contact a local Cypress sales office or Field Applications Engineer (FAE).
16.1 Ordering Code Definitions
CY 8 C 201
xx - SX 1 I T
Tape and Reel
Thermal Rating : Industrial
8 pin pinout
Package Type : SOIC Pb- Free
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress Semiconductors
Company ID: CY = Cypress
Thermal Impedances
Solder Reflow Specifications
Table 16-1. Thermal Impedance by Package
Table 16-2. Solder Reflow Specifications
[11]
Package
Typical θJA
Maximum Peak
Temperature (TC)
Maximum Time
above TC – 5 °C
Package
8-Pin SOIC
127.22 °C/W
8-Pin SOIC
260 °C
30 seconds
Note
11. T = T + Power x θ
J
A
JA.
Document Number: 001-53516 Rev. *G
Page 34 of 43
[+] Feedback
CY8C20111, CY8C20121
17. Package Diagram
Figure 13. 8-Pin (150-Mil) SOIC (51-85066)
51-85066 *E
Document Number: 001-53516 Rev. *G
Page 35 of 43
[+] Feedback
CY8C20111, CY8C20121
18. Acronyms
18.1 Acronyms Used
Table 8 lists the acronyms that are used in this document.
Table 8. Acronyms Used in this Datasheet
Acronym
AC
Description
alternating current
Acronym
LVD
Description
low voltage detect
CMOS
CRC
complementary metal oxide semiconductor
cyclic redundancy check
PCB
printed circuit board
PGA
programmable gain amplifier
power on reset
CSA
capsense successive approximation
capsense sigma delta
POR
CSD
PPOR
PSoC®
PWM
precision power on reset
Programmable System-on-Chip
pulse width modulator
DC
direct current
EEPROM
electrically erasable programmable read-only
memory
EMC
GPIO
I/O
electromagnetic compatibility
general-purpose I/O
input/output
QFN
quad flat no leads
SLIMO
SPITM
SRAM
SROM
SSOP
USB
slow IMO
serial peripheral interface
static random access memory
supervisory read only memory
shrink small-outline package
universal serial bus
IDAC
ILO
current DAC
internal low speed oscillator
internal main oscillator
liquid crystal display
low dropout regulator
light-emitting diode
least-significant bit
IMO
LCD
LDO
LED
LSB
WDT
watchdog timer
WLCSP
XRES
wafer level chip scale package
external reset
19. Document Conventions
19.1 Units of Measure
Table 9 lists the units of measures.
Table 9. Units of Measure
Symbol
Unit of Measure
Symbol
Unit of Measure
millimeter
°C
degree Celsius
kilo bits per second
kilohertz
mm
kbps
kHz
kΩ
ms
nA
ns
%
millisecond
nanoampere
nanosecond
percent
kilohm
LSB
µA
least significant bit
microampere
microsecond
milliampere
pF
V
picofarad
µs
volts
mA
W
watt
19.2 Numeric Conventions
Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’).
Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended
lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’ or ‘b’ are decimals.
Document Number: 001-53516 Rev. *G
Page 36 of 43
[+] Feedback
CY8C20111, CY8C20121
20. Glossary
active high
1. A logic signal having its asserted state as the logic 1 state.
2. A logic signal having the logic 1 state as the higher voltage of the two states.
analog blocks
The basic programmable opamp circuits. These are SC (switched capacitor) and CT (continuous
time) blocks. These blocks can be interconnected to provide ADCs, DACs, multi-pole filters, gain
stages, and much more.
analog-to-digital A device that changes an analog signal to a digital signal of corresponding magnitude. Typically,
(ADC)
an ADC converts a voltage to a digital number. The digital-to-analog (DAC) converter performs
the reverse operation.
Application
programming
interface (API)
A series of software routines that comprise an interface between a computer application and
lower level services and functions (for example, user modules and libraries). APIs serve as
building blocks for programmers that create software applications.
asynchronous
A signal whose data is acknowledged or acted upon immediately, irrespective of any clock signal.
Bandgap
reference
A stable voltage reference design that matches the positive temperature coefficient of VT with
the negative temperature coefficient of VBE, to produce a zero temperature coefficient (ideally)
reference.
bandwidth
bias
1. The frequency range of a message or information processing system measured in hertz.
2. The width of the spectral region over which an amplifier (or absorber) has substantial gain (or
loss); it is sometimes represented more specifically as, for example, full width at half maximum.
1. A systematic deviation of a value from a reference value.
2. The amount by which the average of a set of values departs from a reference value.
3. The electrical, mechanical, magnetic, or other force (field) applied to a device to establish a
reference level to operate the device.
block
buffer
1. A functional unit that performs a single function, such as an oscillator.
2. A functional unit that may be configured to perform one of several functions, such as a digital
PSoC block or an analog PSoC block.
1. A storage area for data that is used to compensate for a speed difference, when transferring
data from one device to another. Usually refers to an area reserved for I/O operations, into
which data is read, or from which data is written.
2. A portion of memory set aside to store data, often before it is sent to an external device or as
it is received from an external device.
3. An amplifier used to lower the output impedance of a system.
bus
1. A named connection of nets. Bundling nets together in a bus makes it easier to route nets
with similar routing patterns.
2. A set of signals performing a common function and carrying similar data. Typically represented
using vector notation; for example, address[7:0].
3. One or more conductors that serve as a common connection for a group of related devices.
clock
The device that generates a periodic signal with a fixed frequency and duty cycle. A clock is
sometimes used to synchronize different logic blocks.
comparator
An electronic circuit that produces an output voltage or current whenever two input levels simultaneously
satisfy predetermined amplitude requirements.
Document Number: 001-53516 Rev. *G
Page 37 of 43
[+] Feedback
CY8C20111, CY8C20121
20. Glossary (continued)
compiler
A program that translates a high level language, such as C, into machine language.
configuration
space
In PSoC devices, the register space accessed when the XIO bit, in the CPU_F register, is set to
‘1’.
crystal oscillator An oscillator in which the frequency is controlled by a piezoelectric crystal. Typically a piezoelectric
crystal is less sensitive to ambient temperature than other circuit components.
cyclicredundancy A calculation used to detect errors in data communications, typically performed using a linear
check (CRC)
data bus
feedback shift register. Similar calculations may be used for a variety of other purposes such as
data compression.
A bi-directional set of signals used by a computer to convey information from a memory location
to the central processing unit and vice versa. More generally, a set of signals used to convey
data between digital functions.
debugger
A hardware and software system that allows you to analyze the operation of the system
under development. A debugger usually allows the developer to step through the firmware one
step at a time, set break points, and analyze memory.
dead band
A period of time when neither of two or more signals are in their active state or in transition.
digital blocks
The 8-bit logic blocks that can act as a counter, timer, serial receiver, serial transmitter, CRC
generator, pseudo-random number generator, or SPI.
digital-to-analog A device that changes a digital signal to an analog signal of corresponding magnitude. The analog-
(DAC)
to-digital (ADC) converter performs the reverse operation.
duty cycle
emulator
The relationship of a clock period high time to its low time, expressed as a percent.
Duplicates (provides an emulation of) the functions of one system with a different system, so that
the second system appears to behave like the first system.
External Reset
(XRES)
An active high signal that is driven into the PSoC device. It causes all operation of the CPU and
blocks to stop and return to a pre-defined state.
Flash
An electrically programmable and erasable, non-volatile technology that provides you the
programmability and data storage of EPROMs, plus in-system erasability. Non-volatile means
that the data is retained when power is OFF.
Flash block
The smallest amount of Flash ROM space that may be programmed at one time and the smallest
amount of Flash space that may be protected. A Flash block holds 64 bytes.
frequency
gain
The number of cycles or events per unit of time, for a periodic function.
The ratio of output current, voltage, or power to input current, voltage, or power, respectively.
Gain is usually expressed in dB.
I2C
A two-wire serial computer bus by Philips Semiconductors (now NXP Semiconductors). I2C is an
Inter-Integrated Circuit. It is used to connect low-speed peripherals in an embedded system. The
original system was created in the early 1980s as a battery control interface, but it was later used
as a simple internal bus system for building control electronics. I2C uses only two bi-directional
pins, clock and data, both running at +5V and pulled high with resistors. The bus operates at 100
kbits/second in standard mode and 400 kbits/second in fast mode.
Document Number: 001-53516 Rev. *G
Page 38 of 43
[+] Feedback
CY8C20111, CY8C20121
20. Glossary (continued)
ICE
The in-circuit emulator that allows you to test the project in a hardware environment, while
viewing the debugging device activity in a software environment (PSoC Designer).
input/output (I/O) A device that introduces data into or extracts data from a system.
interrupt
A suspension of a process, such as the execution of a computer program, caused by an event
external to that process, and performed in such a way that the process can be resumed.
interrupt service A block of code that normal code execution is diverted to when the M8C receives a hardware
routine (ISR)
interrupt. Many interrupt sources may each exist with its own priority and individual ISR code
block. Each ISR code block ends with the RETI instruction, returning the device to the point in
the program where it left normal program execution.
jitter
1. A misplacement of the timing of a transition from its ideal position. A typical form of corruption that occurs on
serial data streams.
2. The abrupt and unwanted variations of one or more signal characteristics, such as the interval between
successive pulses, the amplitude of successive cycles, or the frequency or phase of successive cycles.
low-voltagedetect A circuit that senses VDD and provides an interrupt to the system when VDD falls lower than a selected threshold.
(LVD)
M8C
An 8-bit Harvard-architecture microprocessor. The microprocessor coordinates all activity inside
a PSoC by interfacing to the Flash, SRAM, and register space.
master device
A device that controls the timing for data exchanges between two devices. Or when devices are
cascaded in width, the master device is the one that controls the timing for data exchanges
between the cascaded devices and an external interface. The controlled device is called the
slave device.
microcontroller
An integrated circuit chip that is designed primarily for control systems and products. In addition
to a CPU, a microcontroller typically includes memory, timing circuits, and I/O circuitry. The reason
for this is to permit the realization of a controller with a minimal quantity of chips, thus
achieving maximal possible miniaturization. This in turn, reduces the volume and the cost of
the controller. The microcontroller is normally not used for general-purpose computation as is a
microprocessor.
mixed-signal
modulator
noise
The reference to a circuit containing both analog and digital techniques and components.
A device that imposes a signal on a carrier.
1. A disturbance that affects a signal and that may distort the information carried by the signal.
2. The random variations of one or more characteristics of any entity such as voltage, current, or data.
oscillator
parity
A circuit that may be crystal controlled and is used to generate a clock frequency.
A technique for testing transmitting data. Typically, a binary digit is added to the data to make the
sum of all the digits of the binary data either always even (even parity) or always odd (odd parity).
Phase-locked
loop (PLL)
An electronic circuit that controls an oscillator so that it maintains a constant phase angle relative
to a reference signal.
pinouts
The pin number assignment: the relation between the logical inputs and outputs of the PSoC
device and their physical counterparts in the printed circuit board (PCB) package. Pinouts
involve pin numbers as a link between schematic and PCB design (both being computer generated
files) and may also involve pin names.
Document Number: 001-53516 Rev. *G
Page 39 of 43
[+] Feedback
CY8C20111, CY8C20121
20. Glossary (continued)
port
A group of pins, usually eight.
Power on reset
(POR)
A circuit that forces the PSoC device to reset when the voltage is lower than a pre-set level. This is a type of
hardware reset.
PSoC®
Cypress Semiconductor’s PSoC® is a registered trademark and Programmable System-on-Chip™ is a trademark
of Cypress.
PSoC Designer™ The software for Cypress’ Programmable System-on-Chip technology.
pulse width
An output in the form of duty cycle which varies as a function of the applied measurand
modulator (PWM)
RAM
An acronym for random access memory. A data-storage device from which data can be read out
and new data can be written in.
register
reset
A storage device with a specific capacity, such as a bit or byte.
A means of bringing a system back to a know state. See hardware reset and software reset.
ROM
An acronym for read only memory. A data-storage device from which data can be read out, but
new data cannot be written in.
serial
1. Pertaining to a process in which all events occur one after the other.
2. Pertaining to the sequential or consecutive occurrence of two or more related activities in a single device or
channel.
settling time
shift register
slave device
The time it takes for an output signal or value to stabilize after the input has changed from one
value to another.
A memory storage device that sequentially shifts a word either left or right to output a stream of
serial data.
A device that allows another device to control the timing for data exchanges between two
devices. Or when devices are cascaded in width, the slave device is the one that allows another
device to control the timing of data exchanges between the cascaded devices and an external
interface. The controlling device is called the master device.
SRAM
SROM
An acronym for static random access memory. A memory device where you can store and
retrieve data at a high rate of speed. The term static is used because, after a value is loaded into an SRAM cell,
it remains unchanged until it is explicitly altered or until power is removed from the device.
An acronym for supervisory read only memory. The SROM holds code that is used to boot the
device, calibrate circuitry, and perform Flash operations. The functions of the SROM may be
accessed in normal user code, operating from Flash.
stop bit
A signal following a character or block that prepares the receiving device to receive the next
character or block.
synchronous
1. A signal whose data is not acknowledged or acted upon until the next active edge of a clock signal.
2. A system whose operation is synchronized by a clock signal.
Document Number: 001-53516 Rev. *G
Page 40 of 43
[+] Feedback
CY8C20111, CY8C20121
20. Glossary (continued)
tri-state
A function whose output can adopt three states: 0, 1, and Z (high-impedance). The function does
not drive any value in the Z state and, in many respects, may be considered to be disconnected
from the rest of the circuit, allowing another output to drive the same net.
UART
A UART or universal asynchronous receiver-transmitter translates between parallel bits of data
and serial bits.
user modules
Pre-build, pre-tested hardware/firmware peripheral functions that take care of managing and
configuring the lower level Analog and Digital PSoC Blocks. User Modules also provide high
level API (Application Programming Interface) for the peripheral function.
user space
VDD
The bank 0 space of the register map. The registers in this bank are more likely to be modified
during normal program execution and not just during initialization. Registers in bank 1 are most
likely to be modified only during the initialization phase of the program.
A name for a power net meaning "voltage drain." The most positive power supply signal. Usually
5 V or 3.3 V.
VSS
A name for a power net meaning "voltage source." The most negative power supply signal.
watchdog timer
A timer that must be serviced periodically. If it is not serviced, the CPU resets after a specified
period of time.
Document Number: 001-53516 Rev. *G
Page 41 of 43
[+] Feedback
CY8C20111, CY8C20121
21. Document History Page
Document Title: CY8C20111, CY8C20121 CapSense® Express™ - One Button and Two Button Capacitive Controllers
Document Number: 001-53516
Orig. of
Change
Submission
Date
Rev.
ECN No.
Description of Change
**
2709248
2821828
SLAN/PYRS
SSHH/FSU
See ECN New data sheet
12/4/2009 - Added Contents
*A
- Changed values in the Registers table.
- Added the OUTPUT_STATUS register.
- The note about flash writes must be performed at POR voltage also applies
to flash reads.
- Added new electrical specs including Tpowerup and output current.
*B
*C
2868929
2892629
SLAN
NJF
01/28/2010 Converted from Preliminary to Final.
Updated package diagram.
03/15/2010 Added TBAKETEMP and TBAKETIME parameters in Absolute Maximum
Ratings.
Added the following tables: Thermal Impedance by Package and Solder
Reflow Specifications.
*D
*E
3043236
3087790
ARVM
NJF
09/30/10 Removed F32ku and tpowerup rows from Absolute Maximum Ratings table.
Included “AC Chip-Level Specifications” section under
“AC Electrical Specifications” section
11/16/10 Removed section “2.7-V DC Spec for I2C Line with 1.8 V External Pull-up”.
Added DC I2C Specifications table and DC Programming Specifications.
Updated Units of Measure, Acronyms, and Glossary sections.
Updated solder reflow specifications.
No specific changes were made to I2C Timing Diagram. Updated for clearer
understanding.
Template and styles update.
*F
3148656
3287607
ARVM
ARVM
01/20/11 In table under 9th section, deleted the 18th row (Overlay thickness-buttons)
In “CapSense Constraints” table, deleted the 2nd row (Overlay thickness)
Added following statement after table under 9th section - “The Recom-
mended maximum overlay thickness is 2 mm. For more details refer to
AN53490, section: The Integrating Capacitor.”
Updated Solder reflow specifications.
*G
06/20/11 Posting to external web.
Document Number: 001-53516 Rev. *G
Page 42 of 43
[+] Feedback
CY8C20111, CY8C20121
22. Sales, Solutions, and Legal Information
22.1 Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
Automotive
cypress.com/go/automotive
cypress.com/go/clocks
cypress.com/go/interface
cypress.com/go/powerpsoc
cypress.com/go/plc
PSoC Solutions
Clocks & Buffers
Interface
psoc.cypress.com/solutions
PSoC 1 | PSoC 3 | PSoC 5
Lighting & Power Control
Memory
cypress.com/go/memory
cypress.com/go/image
cypress.com/go/psoc
Optical & Image Sensing
PSoC
Touch Sensing
USB Controllers
Wireless/RF
cypress.com/go/touch
cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2009-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-53516 Rev. *G
Revised June 24, 2011
Page 43 of 43
CapSense Express™, PSoC Designer™, and Programmable System-on-Chip™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered
2
trademarks referenced herein are property of the respective corporations. Purchase of I C components from Cypress or one of its sublicensed Associated Companies conveys a license under the
2
2
2
Philips I C Patent Rights to use these components in an I C system, provided that the system conforms to the I C Standard Specification as defined by Philips. All products and company names
mentioned in this document may be the trademarks of their respective holders.
[+] Feedback
相关型号：
©2020 ICPDF网 联系我们和版权申明