CY7C0852AV-167AXC [CYPRESS]
FLEx36⢠3.3 V 32 K / 64 K / 128 K / 256 K à 36 Synchronous Dual-Port RAM; FLEx36â ?? ¢ 3.3 V 32 K / 64 K / 128 K / 256 K A ？ 36同步双端口RAM
| 型号： | CY7C0852AV-167AXC |
| 厂家： | 
CYPRESS |
| 描述： | FLEx36⢠3.3 V 32 K / 64 K / 128 K / 256 K à 36 Synchronous Dual-Port RAM |
| 文件： | 总39页 (文件大小：661K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
FLEx36™ 3.3 V 32 K / 64 K / 128 K / 256 K × 36
Synchronous Dual-Port RAM
FLEx36™ 3.3
V 32 K / 64 K / 128 K / 256 K × 36 Synchronous Dual-Port RAM
Features
Functional Description
■ True dual-ported memory cells that allow simultaneous access
of the same memory location
The FLEx36™ family includes 2M, 4M, and 9M pipelined,
synchronous, true dual-port static RAMs that are high-speed,
low-power 3.3 V CMOS. Two ports are provided, permitting
independent, simultaneous access to any location in memory.
The result of writing to the same location by more than one port
at the same time is undefined. Registers on control, address, and
data lines allow for minimal setup and hold time.
■ Synchronous pipelined operation
■ Organization of 2-Mbit, 4-Mbit, and 9-Mbit devices
■ Pipelined output mode allows fast operation
■ 0.18-micron Complimentary metal oxide semiconductor
(CMOS) for optimum speed and power
During a Read operation, data is registered for decreased cycle
time. Each port contains a burst counter on the input address
register. After externally loading the counter with the initial
address, the counter increments the address internally (more
details to follow). The internal Write pulse width is independent
of the duration of the R/W input signal. The internal Write pulse
is self-timed to allow the shortest possible cycle times.
■ High-speed clock to data access
■ 3.3 V low power
❐ Active as low as 225 mA (typ)
❐ Standby as low as 55 mA (typ)
A HIGH on CE0 or LOW on CE1 for one clock cycle powers down
the internal circuitry to reduce the static power consumption. One
cycle with chip enables asserted is required to reactivate the
outputs.
■ Mailbox function for message passing
■ Global master reset
■ Separate byte enables on both ports
■ Commercial and industrial temperature ranges
Additional features include: readback of burst-counter internal
address value on address lines, counter-mask registers to
control the counter wrap-around, counter interrupt (CNTINT)
flags, readback of mask register value on address lines,
retransmit functionality, interrupt flags for message passing,
JTAG for boundary scan, and asynchronous Master Reset
(MRST).
■ IEEE 1149.1-compatible Joint test action group (JTAG)
boundary scan
■ 172-Ball fine-pitch ball grid array (FBGA) (1 mm pitch)
(15 mm × 15 mm)
The CY7C0853V/CY7C0853AV device in this family has limited
features. Please see Address Counter and Mask Register
Operations on page 9 for details.
■ 176-Pin thin quad plastic flatpack (TQFP)
(24 mm × 24 mm × 1.4 mm)
■ Counter wrap around control
❐ Internal mask register controls counter wrap-around
❐ Counter-interrupt flags to indicate wrap-around
❐ Memory block retransmit operation
■ Counter readback on address lines
■ Mask register readback on address lines
■ Dual chip enables on both ports for easy depth expansion
Product Selection Guide
Density
2-Mbit (64 K × 36)
4-Mbit (128 K × 36)
9-Mbit (256 K × 36)
Part number
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Max. speed (MHz)
167
4.0
167
4.0
133
4.7
Max. access time - clock to data (ns)
Typical operating current (mA)
Package
225
225
270
176-pin TQFP, 172-ball FBGA 176-pin TQFP, 172-ball FBGA
172-ball FBGA
Cypress Semiconductor Corporation
Document Number: 38-06070 Rev. *L
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised August 7, 2012
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Logic Block Diagram
The Logic Block Diagram is as follows. [1]
OE
R/W
OE
R/W
L
R
R
L
B0
B1
B2
B3
B0
B1
B2
B3
L
L
L
L
R
R
R
R
CE
CE
CE
CE
0L
1L
0R
1R
9
9
9
9
DQ –DQ
DQ –DQ
27R
27L
35L
26L
35R
26R
17R
DQ –DQ
DQ –DQ
18R
18L
I/O
Control
I/O
Control
9
9
9
9
DQ –DQ
DQ –DQ
9R
9L
17L
DQ –DQ
DQ –DQ
0R 8R
0L
8L
Addr.
Read
Back
Addr.
Read
Back
True
Dual-Ported
RAM Array
18
18
A0L–A17L
CNT/MSKL
ADSL
A0R–A17R
Mask Register
Mask Register
CNT/MSKR
ADS
CNTEN
Counter/
Address
Register
Counter/
Address
Register
Address
Address
Decode
CNTENL
Decode
CNTRSTR
CNTRSTL
CLKL
Mirror Reg
Mirror Reg
CLKR
CNTINTR
CNTINTL
TMS
TDI
TCK
Reset
Logic
Interrupt
Interrupt
JTAG
TDO
MRST
INTR
INTL
Logic
Logic
Note
1. 9M device has 18 address bits, 4M device has 17 address bits, and 2M device has 16 address bits.
Document Number: 38-06070 Rev. *L
Page 2 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Contents
Pin Configurations ...........................................................4
Pin Definitions ..................................................................7
Master Reset .....................................................................8
Mailbox Interrupts ............................................................8
Address Counter and Mask Register Operations ..........9
Counter Reset Operation ............................................9
Counter Load Operation ..............................................9
Counter Readback Operation ......................................9
Counter Increment Operation ......................................9
Counter Hold Operation ..............................................9
Counter Interrupt .......................................................10
Retransmit .................................................................10
Mask Reset Operation ...............................................10
Mask Load Operation ................................................10
Mask Readback Operation ........................................10
Counting by Two .......................................................10
IEEE 1149.1 Serial Boundary Scan (JTAG) ..................13
Performing a TAP Reset ...........................................13
Performing a Pause/Restart ......................................13
Identification Register Definitions ................................13
Scan Registers Sizes .....................................................13
Instruction Identification Codes ....................................13
Maximum Ratings ...........................................................14
Operating Range .............................................................14
Electrical Characteristics ...............................................14
Capacitance ....................................................................15
AC Test Load and Waveforms .......................................15
Switching Characteristics ..............................................16
JTAG Timing ...................................................................18
Switching Waveforms ....................................................19
Ordering Information ......................................................31
256 K × 36 (9 M) 3.3 V Synchronous
CY7C0853V/CY7C0853AV Dual-Port SRAM ...................31
128 K × 36 (4 M) 3.3 V Synchronous
CY7C0852V/CY7C0852AV Dual-Port SRAM ...................31
64 K × 36 (2 M) 3.3 V Synchronous
CY7C0851V/CY7C0851AV Dual-Port SRAM ...................31
Ordering Code Definitions .........................................32
Package Diagrams ..........................................................33
Acronyms ........................................................................36
Document Conventions .................................................36
Units of Measure .......................................................36
Document History Page .................................................37
Sales, Solutions, and Legal Information ......................39
Worldwide Sales and Design Support .......................39
Products ....................................................................39
PSoC Solutions .........................................................39
Document Number: 38-06070 Rev. *L
Page 3 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Pin Configurations
Figure 1. 172-ball BGA pinout (Top View)
1
DQ32L
A0L
2
3
CNTINTL
DQ29L
DQ31L
DQ35L
CE1L
A7L
4
VSS
5
6
7
8
9
10
DQ13R
DQ14R
INTR
11
VSS
12
CNTINTR
DQ29R
DQ31R
DQ35R
CE1R
A7R
13
DQ30R
DQ33R
A1R
14
DQ32R
A0R
DQ30L
DQ33L
A1L
DQ13L
DQ14L
INTL
VDD
DQ11L
DQ9L
DQ10L
VSS
DQ11R
DQ9R
DQ10R
VSS
VDD
A
B
C
D
E
F
DQ17L
DQ27L
DQ34L
B0L
DQ12L
DQ15L
DQ16L
VSS
DQ12R
DQ15R
DQ16R
VDD
DQ17R
DQ27R
DQ34R
B0R
NC
NC
A2L
A3L
DQ28L
VDD
DQ28R
VDD
A3R
A2R
A4L
A5L
A5R
A4R
VDD
A6L
B1L
VDD
VSS
B1R
A6R
VDD
OEL
B2L
B3L
CE0L
CLKL
ADSL
CNTRSTL
DQ26L
DQ18L
DQ6L
VSS
CE0R
CLKR
ADSR
B3R
B2R
OER
G
H
J
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0851AV
VSS
R/WL
A10L
A12L
A13L
A14L
DQ20L
DQ21L
A8L
A8R
R/WR
A10R
A12R
A13R
A14R
DQ20R
DQ21R
VSS
A9L
VSS
VSS
VDD
VDD
VDD
MRST
[2]
A9R
[2]
A11L
CNT/MSKL
A15L
VDD
DQ19L
DQ7L
DQ3L
VDD
VSS
DQ19R
DQ7R
DQ3R
VDD
CNTRSTR A15R
A11R
CNT/MSKR
K
L
CNTENL
DQ22L
DQ8L
DQ25L
TDI
VSS
DQ2L
DQ0L
DQ1L
VSS
DQ25R
TCK
DQ26R
DQ18R
DQ6R
VSS
CNTENR
[2]
[2]
A16L
DQ2R
DQ0R
DQ1R
DQ22R
DQ8R
TMS
A16R
M
N
P
DQ24L
DQ23L
DQ5L
DQ4L
DQ5R
DQ4R
DQ24R
DQ23R
TDO
Note
2. For CY7C0851V/CY7C0851AV, pins M1 and M14 are NC.
Document Number: 38-06070 Rev. *L
Page 4 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Pin Configurations (continued)
Figure 2. 172-ball BGA pinout (Top View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
DQ32L
A0L
DQ30L
DQ33L
A1L
NC
VSS
DQ13L
DQ14L
INTL
VDD
DQ11L
DQ9L
DQ10L
VSS
DQ11R
DQ9R
VDD
DQ13R
VSS
NC
DQ30R DQ32R
A
B
C
D
E
F
DQ29L
DQ31L
DQ35L
VDD
A7L
DQ17L
DQ27L
DQ34L
B0L
DQ12L
DQ15L
DQ16L
VSS
DQ12R DQ14R DQ17R DQ29R DQ33R
A0R
A17R
A2R
A17L
A2L
DQ10R DQ15R
INTR
DQ27R DQ31R
A1R
A3R
A3L
DQ28L
VDD
VSS
DQ16R DQ28R DQ34R DQ35R
A4L
A5L
VDD
VDD
VSS
B0R
B1R
VDD
A7R
A5R
A4R
VDD
OEL
A6L
B1L
VDD
A6R
VDD
OER
VSS
A9R
CY7C0853V/CY7C0853AV
B2L
B3L
VSS
VSS
CLKR
VSS
VDD
B3R
B2R
G
H
J
VSS
R/WL
A10L
A12L
A13L
A14L
DQ20L
DQ21L
A8L
CLKL
VSS
A8R
R/WR
A10R
A12R
A13R
A14R
A9L
VSS
VSS
VDD
MRST
A15R
VSS
A11L
VDD
A16L
DQ24L
DQ23L
A15L
VSS
VDD
VDD
DQ25L
TDI
VDD
DQ19L
DQ7L
DQ3L
VDD
VSS
VDD
A11R
VDD
A16R
K
L
DQ26L
DQ18L
DQ6L
VSS
VSS
VSS
DQ19R DQ25R DQ26R
DQ22L
DQ8L
TDO
DQ2L
DQ0L
DQ1L
DQ2R
DQ0R
DQ1R
DQ7R
DQ3R
VDD
TCK
DQ18R DQ22R
M
N
P
DQ5L
DQ4L
DQ5R
DQ4R
DQ6R
VSS
DQ8R
TMS
DQ20R DQ24R
DQ21R DQ23R
Document Number: 38-06070 Rev. *L
Page 5 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Pin Configurations (continued)
Figure 3. 176-pin TQFP pinout (Top View)
DQ
DQ
NC
34R
35R
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
1
2
DQ
DQ
34L
35L
3
NC
A
0R
4
A
0L
A
1R
5
A
1L
A
2R
6
A
2L
A
V
3R
7
A
V
3L
SS
8
SS
V
DD
9
V
DD
A
A
A
A
4R
5R
6R
7R
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
A
A
A
A
4L
5L
6L
7L
B
0R
1R
B
0L
1L
B
B
CE
1R
CE
1L
B
B
2R
3R
B
B
2L
3L
OE
CE
V
R
OE
L
0R
CE
0L
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
DD
V
DD
V
DD
V
DD
V
SS
V
SS
V
SS
V
SS
R/W
CLK
R
R/W
L
R
CLK
L
MRST
ADS
V
SS
R
ADS
L
CNTEN
R
CNTEN
L
CNTRST
R
CNTRST
L
CNT/MSK
R
CNT/MSK
L
A
A
8R
A
A
8L
9R
9L
A
10R
11R
12R
A
10L
11L
12L
A
A
98
A
A
97
V
SS
96
V
SS
DD
13L
V
A
DD
95
V
A
13R
94
A
A
14R
93
A
14L
15L
16L
[2]
[2]
[2]
15R
92
A
A
[2]
A
16R
91
DQ
DQ
24R
90
DQ
DQ
24L
20L
89
20R
Document Number: 38-06070 Rev. *L
Page 6 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Pin Definitions
Left Port
Right Port
Description
[3]
[3]
A0L–A17L
A0R–A17R
Address inputs.
[4]
[4]
ADSL
ADSR
Address strobe input. Used as an address qualifier. This signal should be asserted LOW for the part
using the externally supplied address on the address pins and for loading this address into the burst
address counter.
[4]
[4]
[4]
CE0L
CE0R
Active LOW chip enable input.
[4]
CE1L
CLKL
CE1R
Active HIGH chip enable input.
CLKR
Clock signal. Maximum clock input rate is fMAX.
[4]
[4]
CNTENL
CNTENR
Counter enable input. Asserting this signal LOW increments the burst address counter of its
respective port on each rising edge of CLK. The increment is disabled if ADS or CNTRST are asserted
LOW.
[4]
[4]
CNTRSTL
CNTRSTR
Counter reset input. Asserting this signal LOW resets to zero the unmasked portion of the burst
address counter of its respective port. CNTRST is not disabled by asserting ADS or CNTEN.
[4]
[4]
CNT/MSKL
CNT/MSKR
Address counter mask register enable input. Asserting this signal LOW enables access to the
mask register. When tied HIGH, the mask register is not accessible and the address counter
operations are enabled based on the status of the counter control signals.
DQ0L–DQ35L DQ0R–DQ35R Data bus input/output.
OEL
OER
Output enable input. This asynchronous signal must be asserted LOW to enable the DQ data pins
during Read operations.
INTL
INTR
Mailbox interrupt flag output. The mailbox permits communications between ports. The upper two
memory locations can be used for message passing. INTL is asserted LOW when the right port writes
to the mailbox location of the left port, and vice versa. An interrupt to a port is deasserted HIGH when
it reads the contents of its mailbox.
[4]
[4]
CNTINTL
CNTINTR
Counter interrupt output. This pin is asserted LOW when the unmasked portion of the counter is
incremented to all “1s.”
R/WL
R/WR
Read/Write enable input. Assert this pin LOW to write to, or HIGH to Read from the dual port memory
array.
B0L–B3L
MRST
B0R–B3R
Byte select inputs. Asserting these signals enables Read and Write operations to the corresponding
bytes of the memory array.
Master reset input. MRST is an asynchronous input signal and affects both ports. Asserting MRST
LOW performs all of the reset functions as described in the text. A MRST operation is required at
power up.
TMS
JTAG test mode select input. It controls the advance of JTAG TAP state machine. State machine
transitions occur on the rising edge of TCK.
TDI
JTAG test data input. Data on the TDI input is shifted serially into selected registers.
JTAG test clock input.
TCK
TDO
JTAG test data output. TDO transitions occur on the falling edge of TCK. TDO is normally
three-stated except when captured data is shifted out of the JTAG TAP.
VSS
VDD
Ground inputs.
Power inputs.
Notes
3. 9M device has 18 address bits, 4M device has 17 address bits, and 2M device has 16 address bits.
4. These pins are not available for CY7C0853V/CY7C0853AV device.
Document Number: 38-06070 Rev. *L
Page 7 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
left port. Table 1 shows that in order to set the INTR flag, a Write
operation by the left port to address 3FFFF asserts INTR LOW.
At least one byte has to be active for a Write to generate an
interrupt. A valid Read of the 3FFFF location by the right port
resets INTR HIGH. At least one byte has to be active in order for
a Read to reset the interrupt. When one port Writes to the other
port’s mailbox, the INT of the port that the mailbox belongs to is
asserted LOW. The INT is reset when the owner (port) of the
mailbox Reads the contents of the mailbox. The interrupt flag is
set in a flow-thru mode (that is it follows the clock edge of the
writing port). Also, the flag is reset in a flow-thru mode (that is it
follows the clock edge of the reading port).
Master Reset
The FLEx36 family devices undergo a complete reset by taking
its MRST input LOW. The MRST input can switch
asynchronously to the clocks. The MRST initializes the internal
burst counters to zero, and the counter mask registers to all ones
(completely unmasked). The MRST also forces the Mailbox
Interrupt (INT) flags and the Counter Interrupt (CNTINT) flags
HIGH. The MRST must be performed on the FLEx36 family
devices after power up.
Mailbox Interrupts
Each port can read the other port’s mailbox without resetting the
interrupt. And each port can write to its own mailbox without
setting the interrupt. If an application does not require message
passing, INT pins should be left open.
The upper two memory locations may be used for message
passing and permit communications between ports. Table 1
shows the interrupt operation for both ports of
CY7C853V/CY7C0853AV. The highest memory location, 3FFFF
is the mailbox for the right port and 3FFFE is the mailbox for the
Table 1. Interrupt Operation Example [5, 6, 7, 8, 9]
Left Port
Right Port
Function
Set right INTR flag
R/WL
CEL
L
A0L–17L
3FFFF
X
INTL
X
R/WR
CER
X
A0R–17R
X
INTR
L
L
X
X
H
X
H
L
Reset right INTR flag
Set left INTL flag
X
X
L
3FFFF
3FFFE
X
H
X
X
L
L
X
Reset left INTL flag
L
3FFFE
H
X
X
X
Table 2. Address Counter and Counter-Mask Register Control Operation (Any Port) [10, 11]
CLK
MRST CNT/MSK CNTRST
ADS
CNTEN
Operation
Description
X
L
X
X
X
X
Master reset
Reset address counter to all 0s and mask
register to all 1s.
H
H
H
H
L
X
L
X
L
Counter reset
Counter load
Reset counter unmasked portion to all 0s.
H
Load counter with external address value
presented on address lines.
H
H
H
L
H
Counter readback Read out counter internal value on address
lines.
H
H
H
H
H
H
H
H
L
Counter increment Internally increment address counter value.
H
Counter hold
Constantly hold the address value for
multiple clock cycles.
H
H
L
L
L
X
L
X
L
Mask reset
Mask load
Reset mask register to all 1s.
H
Load mask register with value presented on
the address lines.
H
H
L
L
H
H
L
H
X
Mask readback
Reserved
Read out mask register value on address
lines.
H
Operation undefined
Notes
5. 9 M device has 18 address bits, 4M device has 17 address bits, and 2M device has 16 address bits.
6. CE is internal signal. CE = LOW if CE = LOW and CE = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and
0
1
can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge.
7. OE is “Don’t Care” for mailbox operation.
8. At least one of B0, B1, B2, or B3 must be LOW.
9. A16x is a NC for CY7C0851V/CY7C0851AV, therefore the Interrupt Addresses are FFFF and EFFF.
10. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW.
11. Counter operation and mask register operation is independent of chip enables.
Document Number: 38-06070 Rev. *L
Page 8 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
will reset the counter and mirror registers to 00000, as will master
reset (MRST).
Address Counter and Mask Register
Operations
Counter Load Operation
This section [12] describes the features only apply to CY7C0851V
/ CY7C0851AV / CY7C0852V / CY7C0852AV devices, but not to
the CY7C0853V/CY7C0853AV device. Each port of these
devices has a programmable burst address counter. The burst
counter contains three registers: a counter register, a mask
register, and a mirror register.
The address counter and mirror registers are both loaded with
the address value presented at the address lines.
Counter Readback Operation
The internal value of the counter register can be read out on the
address lines. Readback is pipelined; the address is valid tCA2
after the next rising edge of the port’s clock. If address readback
occurs while the port is enabled (CE0 LOW and CE1 HIGH), the
data lines (DQs) is three-stated. Figure 4 on page 11 shows a
block diagram of the operation.
The counter register contains the address used to access the
RAM array. It is changed only by the Counter Load, Increment,
Counter Reset, and by master reset (MRST) operations.
The mask register value affects the Increment and Counter
Reset operations by preventing the corresponding bits of the
counter register from changing. It also affects the counter
interrupt output (CNTINT). The mask register is changed only by
the Mask Load and Mask Reset operations, and by the MRST.
The mask register defines the counting range of the counter
register. It divides the counter register into two regions: zero or
more “0s” in the most significant bits define the masked region,
one or more “1s” in the least significant bits define the unmasked
region. Bit 0 may also be “0”, masking the least significant
counter bit and causing the counter to increment by two instead
of one.
Counter Increment Operation
Once the address counter register is initially loaded with an
external address, the counter can internally increment the
address value, potentially addressing the entire memory array.
Only the unmasked bits of the counter register are incremented.
The corresponding bit in the mask register must be a “1” for a
counter bit to change. The counter register is incremented by 1
if the least significant bit is unmasked, and by 2 if it is masked. If
all unmasked bits are “1”, the next increment wraps the counter
back to the initially loaded value. If an Increment results in all the
unmasked bits of the counter being “1s”, a counter interrupt flag
(CNTINT) is asserted. The next Increment returns the counter
register to its initial value, which was stored in the mirror register.
The counter address can instead be forced to loop to 00000 by
externally connecting CNTINT to CNTRST.[13] An increment that
results in one or more of the unmasked bits of the counter being
“0” deasserts the counter interrupt flag. The example in Figure 5
on page 12 shows the counter mask register loaded with a mask
value of 0003Fh unmasking the first 6 bits with bit “0” as the LSB
and bit “16” as the MSB. The maximum value the mask register
can be loaded with is 1FFFFh. Setting the mask register to this
value allows the counter to access the entire memory space. The
address counter is then loaded with an initial value of 8h. The
base address bits (in this case, the 6th address through the 16th
address) are loaded with an address value but do not increment
once the counter is configured for increment operation. The
counter address starts at address 8h. The counter increments its
internal address value till it reaches the mask register value of
3Fh. The counter wraps around the memory block to location 8h
at the next count. CNTINT is issued when the counter reaches
its maximum value.
The mirror register is used to reload the counter register on
increment operations (see “retransmit”, below). It always
contains the value last loaded into the counter register, and is
changed only by the Counter Load operation, and by the MRST.
Table 2 on page 8 summarizes the operation of these registers
and the required input control signals. The MRST control signal
is asynchronous. All the other control signals in Table 2 on page
8 (CNT/MSK, CNTRST, ADS, CNTEN) are synchronized to the
port’s CLK. All these counter and mask operations are
independent of the port’s chip enable inputs (CE0 and CE1).
Counter enable (CNTEN) inputs are provided to stall the
operation of the address input and utilize the internal address
generated by the internal counter for fast, interleaved memory
applications. A port’s burst counter is loaded when the port’s
address strobe (ADS) and CNTEN signals are LOW. When the
port’s CNTEN is asserted and the ADS is deasserted, the
address counter increments on each LOW to HIGH transition of
that port’s clock signal. This will Read/Write one word from/into
each successive address location until CNTEN is deasserted.
The counter can address the entire memory array, and loops
back to the start. Counter reset (CNTRST) is used to reset the
unmasked portion of the burst counter to 0s. A counter-mask
register is used to control the counter wrap.
Counter Hold Operation
The value of all three registers can be constantly maintained
unchanged for an unlimited number of clock cycles. Such
operation is useful in applications where wait states are needed,
or when address is available a few cycles ahead of data in a
shared bus interface.
Counter Reset Operation
All unmasked bits of the counter are reset to “0.” All masked bits
remain unchanged. The mirror register is loaded with the value
of the burst counter. A Mask Reset followed by a Counter Reset
Notes
12. This section describes the CY7C0852V/CY7C0852AV, which have 17 address bits and a maximum address value of 1FFFF. The CY7C0851V/CY7C0851AV has 16
address bits, register lengths of 16 bits, and a maximum address value of FFFF.
13. CNTINT and CNTRST specs are guaranteed by design to operate properly at speed grade operating frequency when tied together.
Document Number: 38-06070 Rev. *L
Page 9 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Counter Interrupt
Mask Load Operation
The counter interrupt (CNTINT) is asserted LOW when an
increment operation results in the unmasked portion of the
counter register being all “1s.” It is deasserted HIGH when an
Increment operation results in any other value. It is also
de-asserted by Counter Reset, Counter Load, Mask Reset and
Mask Load operations, and by MRST.
The mask register is loaded with the address value presented at
the address lines. Not all values permit correct increment
operations. Permitted values are of the form 2n – 1 or 2n – 2.
From the most significant bit to the least significant bit, permitted
values have zero or more “0s”, one or more “1s”, or one “0”. Thus
1FFFF, 003FE, and 00001 are permitted values, but 1F0FF,
003FC, and 00000 are not.
Retransmit
Mask Readback Operation
Retransmit is a feature that allows the Read of a block of memory
more than once without the need to reload the initial address.
This eliminates the need for external logic to store and route
data. It also reduces the complexity of the system design and
saves board space. An internal “mirror register” is used to store
the initially loaded address counter value. When the counter
unmasked portion reaches its maximum value set by the mask
register, it wraps back to the initial value stored in this “mirror
register”. If the counter is continuously configured in increment
mode, it increments again to its maximum value and wraps back
to the value initially stored into the “mirror register”. Thus, the
repeated access of the same data is allowed without the need
for any external logic.
The internal value of the mask register can be read out on the
address lines. Readback is pipelined; the address is valid tCM2
after the next rising edge of the port’s clock. If mask readback
occurs while the port is enabled (CE0 LOW and CE1 HIGH), the
data lines (DQs) is three-stated. Figure 4 on page 11 shows a
block diagram of the operation.
Counting by Two
When the least significant bit of the mask register is “0,” the
counter increments by two. This may be used to connect the
CY7C0851V/CY7C0851AV/CY7C0852V/CY7C0852AV as
a
72-bit single port SRAM in which the counter of one port counts
even addresses and the counter of the other port counts odd
addresses. This even-odd address scheme stores one half of the
72-bit data in even memory locations, and the other half in odd
memory locations.
Mask Reset Operation
The mask register is reset to all “1s”, which unmasks every bit of
the counter. Master reset (MRST) also resets the mask register
to all “1s”.
Document Number: 38-06070 Rev. *L
Page 10 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Figure 4. Counter, Mask, and Mirror Logic Block Diagram [14]
CNT/MSK
CNTEN
ADS
Decode
Logic
CNTRST
MRST
Bidirectional
Address
Lines
Mask
Register
Counter/
Address
Register
Address
Decode
RAM
Array
CLK
Load/Increment
17
17
From
Address
Lines
Mirror
Counter
To Readback
and Address
Decode
1
0
1
0
From
Mask
Register
Increment
Logic
17
Wrap
17
17
17
Bit 0
From
Mask
From
Counter
+1
+2
Wrap
Detect
Wrap
1
0
17
1
0
To Counter
Note
14. 9M device has 18 address bits, 4M device has 17 address bits, and 2M device has 16 address bits.
Document Number: 38-06070 Rev. *L
Page 11 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Figure 5. Programmable Counter-Mask Register Operation [15, 16]
CNTINT
Example:
Load
Counter-Mask
Register = 3F
H
0
0
0s
0
1
1
1
1
1
1
216 215
26 25 24 23 22 21 20
Unmasked Address
Mask
Register
bit-0
Masked Address
Load
Address
Counter = 8
H
L
X
X
Xs
Xs
Xs
X
0
0
1
0
0
0
216 215
26 25 24 23 22 21 20
Address
Counter
bit-0
Max
Address
Register
X
X
X
1
1
1
1
1
1
216 215
26 25 24 23 22 21 20
Max + 1
Address
Register
H
X
X
X
0
0
1
0
0
0
216 215
26 25 24 23 22 21 20
Notes
15. 9M device has 18 address bits, 4M device has 17 address bits, and 2M device has 16 address bits.
16. The “X” in this diagram represents the counter upper bits.
Document Number: 38-06070 Rev. *L
Page 12 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Performing a TAP Reset
IEEE 1149.1 Serial Boundary Scan (JTAG)
A reset is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This reset does not affect the operation of the
devices, and may be performed while the devices are operating.
An MRST must be performed on the devices after power-up.
The CY7C0851V / CY7C0851AV / CY7C0852V / CY7C0852AV /
CY7C0853V / CY7C0853AV incorporates an IEEE 1149.1 serial
[17]
boundary scan
test access port (TAP). The TAP controller
functions in a manner that does not conflict with the operation of
other devices using 1149.1-compliant TAPs. The TAP operates
using JEDEC-standard 3.3 V I/O logic levels. It is composed of
three input connections and one output connection required by
the test logic defined by the standard.
Performing a Pause/Restart
When a SHIFT-DR PAUSE-DR SHIFT-DR is performed the scan
chain outputs the next bit in the chain twice. For example, if the
value expected from the chain is 1010101, the device outputs a
11010101. This extra bit causes some testers to report an
erroneous failure for the devices in a scan test. Therefore the
tester should be configured to never enter the PAUSE-DR state.
Identification Register Definitions
Instruction Field
Revision number (31:28)
Cypress device ID (27:12)
Value
0h
Description
Reserved for version number.
C001h
C002h
Defines Cypress part number for the CY7C0851V/CY7C0851AV
Defines Cypress part number for the CY7C0852V/CY7C0852AV and
CY7C0853V/CY7C0853AV
Cypress JEDEC ID (11:1)
ID register presence (0)
034h
1
Allows unique identification of the DP family device vendor.
Indicates the presence of an ID register.
Scan Registers Sizes
Register Name
Bit Size
Instruction
Bypass
4
1
Identification
Boundary Scan
32
n[18]
Instruction Identification Codes
Instruction
EXTEST
Code
0000
1111
1011
0111
Description
Captures the Input/Output ring contents. Places the BSR between the TDI and TDO.
Places the BYR between TDI and TDO.
BYPASS
IDCODE
HIGHZ
Loads the IDR with the vendor ID code and places the register between TDI and TDO.
Places BYR between TDI and TDO. Forces all CY7C0851AV / CY7C0852AV /
CY7C0853AV output drivers to a High Z state.
CLAMP
0100
1000
1100
Controls boundary to 1/0. Places BYR between TDI and TDO.
SAMPLE/PRELOAD
NBSRST
Captures the input/output ring contents. Places BSR between TDI and TDO.
Resets the non-boundary scan logic. Places BYR between TDI and TDO.
RESERVED
All other codes Other combinations are reserved. Do not use other than the above.
Notes
17. Boundary scan is IEEE 1149.1-compatible. See “Performing a Pause/Restart” for deviation from strict 1149.1 compliance.
18. See details in the device BSDL files.
Document Number: 38-06070 Rev. *L
Page 13 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
DC input voltage ........................... –0.5 V to VDD + 0.5 V [20]
Output current into outputs (LOW) ............................. 20 mA
Maximum Ratings
Exceeding maximum ratings [19] may impair the useful life of the
device. These user guidelines are not tested.
Static discharge voltage
(JEDEC JESD22-A114-2000B) ..............................> 2000 V
Storage temperature .............................. –65 °C to + 150 °C
Latch-up current ....................................................> 200 mA
Ambient temperature with
Power applied ......................................... –55 °C to + 125 °C
Operating Range
Supply voltage to ground potential .............–0.5 V to + 4.6 V
Range
Commercial
Industrial
Ambient Temperature
0 °C to +70 °C
VDD
DC voltage applied to
Outputs in High Z state ....................... –0.5 V to VDD + 0.5 V
3.3 V ± 165 mV
3.3 V ± 165 mV
–40 °C to +85 °C
Electrical Characteristics
Over the Operating Range
-167
-133
-100
Parameter
VOH
Description
Unit
Min Typ Max Min Typ Max Min Typ Max
Output HIGH voltage (VDD = Min., IOH= –4.0 mA)
Output LOW voltage (VDD = Min., IOL= +4.0 mA)
Input HIGH voltage
2.4
–
–
–
–
–
–
–
–
–
2.4
–
–
–
–
–
–
–
–
–
2.4
–
–
–
–
–
–
–
–
–
–
0.4
–
V
V
VOL
VIH
VIL
0.4
–
0.4
–
2.0
–
2.0
–
2.0
–
V
Input LOW voltage
0.8
0.8
0.8
10
10
1.0
–
V
IOZ
IIX1
IIX2
ICC
Output leakage current
–10
–10
–0.1
–
10 –10
10 –10
1.0 –0.1
10 –10
10 –10
1.0 –0.1
A
A
mA
mA
Input leakage current except TDI, TMS, MRST
Input leakage current TDI, TMS, MRST
Operating current for
(VDD = Max.,IOUT = 0 mA),
Outputs disabled
CY7C0851V /
CY7C0851AV /
CY7C0852V /
CY7C0852AV
225 300
–
225 300
–
CY7C0853V /
CY7C0853AV
–
–
–
–
–
–
–
–
–
–
–
–
–
–
270 400
90 115
160 210
–
–
–
–
–
–
200 310
[21]
[21]
[21]
[21]
ISB1
ISB2
ISB3
ISB4
ISB5
Standby current (both ports TTL level)
90 115
160 210
90 115 mA
160 210 mA
CEL and CER VIH, f = fMAX
Standby current (one port TTL level)
CEL | CER VIH, f = fMAX
Standby current (both ports CMOS level)
55
75
55
75
55
75
mA
CEL and CER VDD – 0.2 V, f = 0
Standby current (one port CMOS level)
160 210
160 210
70 100
160 210 mA
70 100 mA
CEL | CER VIH, f = fMAX
Operating current
(VDD = Max, IOUT = 0 mA, f = 0)
CY7C0853V /
CY7C0853AV
–
–
Outputs disabled
Notes
19. The voltage on any input or I/O pin can not exceed the power pin during power up.
20. Pulse width < 20 ns.
21. I
, I
, I
and I
are not applicable for CY7C0853V / CY7C0853AV because it can not be powered down by using chip enable pins.
SB1 SB2 SB3
SB4
Document Number: 38-06070 Rev. *L
Page 14 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Capacitance
Part Number [22]
Parameter
Description
Input capacitance
Test Conditions
Max
13
Unit
pF
CY7C0851V / CY7C0851AV / CIN
CY7C0852V / CY7C0852AV
TA = 25 °C, f = 1 MHz,
DD = 3.3 V
V
COUT
Output capacitance
Input capacitance
Output capacitance
10
pF
CY7C0853V / CY7C0853AV CIN
COUT
22
pF
20
pF
AC Test Load and Waveforms
Figure 6. AC Test Load and Waveforms
3.3 V
Z0 = 50
R = 50
OUTPUT
R1 = 590
R2 = 435
OUTPUT
C = 10 pF
C = 5 pF
VTH = 1.5 V
(a) Normal Load (Load 1)
(b) Three-state Delay (Load 2)
3.0 V
90%
10%
90%
10%
ALL INPUT PULSES
VSS
< 2 ns
< 2 ns
Note
22. C
also references C
.
I/O
OUT
Document Number: 38-06070 Rev. *L
Page 15 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Characteristics
Over the Operating Range
-167
-133
-100
CY7C0851V /
CY7C0851V /
CY7C0851AV / CY7C0851AV /
CY7C0853V /
CY7C0853AV
CY7C0853V /
CY7C0853AV
Parameter
Description
Unit
CY7C0852V /
CY7C0852AV
CY7C0852V /
CY7C0852AV
Min
–
Max
167
–
Min
–
Max
133
–
Min
–
Max
133
–
Min
–
Max
100
–
fMAX2
Maximum operating frequency
Clock cycle time
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tCYC2
tCH2
tCL2
6.0
2.7
2.7
–
7.5
3.0
3.0
–
7.5
3.0
3.0
–
10.0
4.0
4.0
–
Clock HIGH time
–
–
–
–
Clock LOW time
–
–
–
–
[23]
tR
Clock rise time
2.0
2.0
–
2.0
2.0
–
2.0
2.0
–
3.0
3.0
–
[23]
tF
Clock fall time
–
–
–
–
tSA
Address setuptime
Address hold time
Byte select setup time
Byte select hold time
Chip enable setup time
Chip enable hold time
R/W setup time
2.3
0.6
2.3
0.6
2.3
0.6
2.3
0.6
2.3
0.6
2.3
0.6
2.3
0.6
2.3
0.6
2.3
0.6
–
2.5
0.6
2.5
0.6
2.5
0.6
2.5
0.6
2.5
0.6
2.5
0.6
2.5
0.6
2.5
0.6
2.5
0.6
–
2.5
0.6
2.5
0.6
NA
NA
2.5
0.6
2.5
0.6
NA
NA
NA
NA
NA
NA
NA
NA
–
3.0
0.6
3.0
0.6
NA
NA
3.0
0.6
3.0
0.6
NA
NA
NA
NA
NA
NA
NA
NA
–
tHA
–
–
–
–
tSB
–
–
–
–
tHB
–
–
–
–
tSC
–
–
–
–
tHC
–
–
–
–
tSW
tHW
tSD
–
–
–
–
R/W hold time
–
–
–
–
Input data setup time
Input data hold time
ADS setup time
–
–
–
–
tHD
–
–
–
–
tSAD
tHAD
tSCN
tHCN
tSRST
tHRST
tSCM
tHCM
tOE
–
–
–
–
ADS hold time
–
–
–
–
CNTEN setup time
CNTEN hold time
CNTRST setup time
CNTRST hold time
CNT/MSK setup time
CNT/MSK hold time
Output enable to data valid
OE to Low Z
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
4.0
–
4.4
–
4.7
–
5.0
–
[24, 25]
tOLZ
tOHZ
tCD2
tCA2
tCM2
0
0
0
0
[24, 25]
OE to High Z
0
4.0
4.0
4.0
4.0
0
4.4
4.4
4.4
4.4
0
4.7
4.7
NA
NA
0
5.0
5.0
NA
NA
Clock to data valid
Clock to counter address valid
–
–
–
–
–
–
–
–
Clock to mask register readback
valid
–
–
–
–
tDC
Data output hold after clock HIGH
1.0
–
1.0
–
1.0
–
1.0
–
ns
Note
23. Except JTAG signals (t and t < 10 ns [max.]).
r
f
24. This parameter is guaranteed by design, but it is not production tested.
25. Test conditions used are Load 2.
Document Number: 38-06070 Rev. *L
Page 16 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Characteristics (continued)
Over the Operating Range
-167
-133
-100
CY7C0851V /
CY7C0851V /
CY7C0851AV / CY7C0851AV /
CY7C0853V /
CY7C0853AV
CY7C0853V /
CY7C0853AV
Parameter
Description
Unit
CY7C0852V /
CY7C0852AV
CY7C0852V /
CY7C0852AV
Min
0
Max
4.0
4.0
6.7
6.7
5.0
5.0
Min
0
Max
4.4
4.4
7.5
7.5
5.7
5.7
Min
0
Max
4.7
4.7
7.5
7.5
NA
NA
Min
0
Max
5.0
5.0
10
[26, 27]
tCKHZ
Clock HIGH to output High Z
Clock HIGH to output Low Z
Clock to INT set time
ns
ns
ns
ns
ns
ns
[26, 27]
tCKLZ
tSINT
tRINT
1.0
0.5
0.5
0.5
0.5
1.0
0.5
0.5
0.5
0.5
1.0
0.5
0.5
NA
NA
1.0
0.5
0.5
NA
NA
Clock to INT reset time
10
tSCINT
tRCINT
Clock to CNTINT set time
Clock to CNTINT reset time
NA
NA
Port to Port Delays
tCCS
Clock to clock skew
5.2
–
6.0
–
6.0
–
8.0
–
ns
Master Reset Timing
tRS
Master reset pulse width
7.0
6.0
6.0
–
–
–
7.5
6.0
7.5
–
–
–
7.5
6.0
7.5
–
–
–
10.0
8.5
10.0
–
–
–
ns
ns
ns
ns
ns
tRSS
Master reset setup time
tRSR
Master reset recovery time
Master reset to outputs inactive
–
–
–
–
tRSF
10.0
10.0
10.0
10.0
10.0
NA
10.0
NA
tRSCNTINT
Master reset to counter interrupt
flag reset time
–
–
–
–
Notes
26. This parameter is guaranteed by design, but it is not production tested.
27. Test conditions used are Load 2.
Document Number: 38-06070 Rev. *L
Page 17 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
JTAG Timing
167/133/100
Unit
Parameter
Description
Min
–
Max
10
–
fJTAG
tTCYC
tTH
Maximum JTAG TAP controller frequency
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
TCK clock cycle time
100
40
40
10
10
10
10
–
TCK clock HIGH time
–
tTL
TCK clock LOW Time
–
tTMSS
tTMSH
tTDIS
tTDIH
tTDOV
tTDOX
TMS setup to TCK clock rise
TMS hold after TCK clock rise
TDI setup to TCK clock rise
TDI hold after TCK clock rise
TCK clock LOW to TDO valid
TCK clock LOW to TDO invalid
–
–
–
–
30
–
0
Figure 7. JTAG Switching Waveform
tTH
tTL
Test Clock
TCK
tTCYC
tTMSS
tTMSH
Test Mode Select
TMS
tTDIS
tTDIH
Test Data-In
TDI
Test Data-Out
TDO
tTDOX
tTDOV
Document Number: 38-06070 Rev. *L
Page 18 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms
Figure 8. Master Reset
tRS
MRST
tRSF
ALL
ADDRESS/
DATA
tRSS
INACTIVE
LINES
tRSR
ALL
OTHER
INPUTS
ACTIVE
TMS
CNTINT
INT
TDO
Figure 9. Read Cycle [28, 29, 30, 31, 32]
tCYC2
tCH2
tCL2
CLK
CE
tSC
tHC
tSC
tHC
tSB
tHB
B0–B3
R/W
tSW
tSA
tHW
tHA
ADDRESS
DATAOUT
An
An+1
An+2
An+3
tDC
1 Latency
tCD2
Qn
Qn+1
Qn+2
tOHZ
tCKLZ
tOLZ
OE
t
OE
Notes
28. CE is internal signal. CE = LOW if CE = LOW and CE = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and
0
1
can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge.
29. OE is asynchronously controlled; all other inputs (excluding MRST and JTAG) are synchronous to the rising clock edge.
30. ADS = CNTEN = LOW, and MRST = CNTRST = CNT/MSK = HIGH.
31. The output is disabled (high-impedance state) by CE = V following the next rising edge of the clock.
IH
32. Addresses do not have to be accessed sequentially since ADS = CNTEN = V with CNT/MSK = V constantly loads the address on the rising edge of the CLK.
IL
IH
Numbers are for reference only.
Document Number: 38-06070 Rev. *L
Page 19 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms (continued)
Figure 10. Bank Select Read [33, 34]
t
CYC2
t
t
CL2
CH2
CLK
t
t
t
HA
SA
A
A
4
ADDRESS
A
5
A
A
A
3
(B1)
0
1
2
t
HC
SC
CE
(B1)
t
t
t
t
CKHZ
t
t
t
CD2
CD2
CD2
HC
CKHZ
SC
Q
Q
Q
1
3
DATA
0
OUT(B1)
t
t
HA
SA
t
t
t
CKLZ
DC
DC
A
A
4
A
ADDRESS
A
0
A
A
3
5
(B2)
1
2
t
t
HC
SC
CE
(B2)
t
t
t
CD2
t
CD2
CKHZ
t
SC
HC
DATA
OUT(B2)
Q
Q
4
2
t
t
CKLZ
CKLZ
Figure 11. Read-to-Write-to-Read (OE = LOW) [32, 35, 36, 37, 38]
tCYC2
tCH2
tCL2
CLK
CE
tSC
tHC
tSW
tHW
R/W
tSW
tHW
An
An+1
An+2
An+2
An+3
An+4
ADDRESS
DATAIN
tSD tHD
tSA
tHA
Dn+2
tCD2
tCD2
tCD2
tCKHZ
Qn
Qn+3
Qn+1
DATAOUT
tCKLZ
WRITE
READ
NO OPERATION
READ
Notes
33. In this depth-expansion example, B1 represents Bank #1 and B2 is Bank #2; each bank consists of one Cypress CY7C0851V/CY7C0851AV/CY7C0852V/CY7C0852AV
device from this data sheet. ADDRESS = ADDRESS
.
(B2)
(B1)
34. ADS = CNTEN= B0 – B3 = OE = LOW; MRST = CNTRST = CNT/MSK = HIGH.
35. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals.
36. During “No Operation,” data in memory at the selected address may be corrupted and should be rewritten to ensure data integrity.
37. CE = OE = B0 – B3 = LOW; CE = R/W = CNTRST = MRST = HIGH.
0
1
38. CE = B0 – B3 = R/W = LOW; CE = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, since OE = LOW, the Write operation cannot be completed
0
1
(labelled as no operation). One clock cycle is required to three-state the I/O for the Write operation on the next rising edge of CLK.
Document Number: 38-06070 Rev. *L
Page 20 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms (continued)
Figure 12. Read-to-Write-to-Read (OE Controlled) [39, 40, 41, 42]
tCYC2
tCH2
tCL2
CLK
CE
tSC
tHC
tHW
tSW
R/W tSW
tHW
An
An+1
An+2
An+3
An+4
An+5
ADDRESS
tSA
tHA
tSD tHD
Dn+2
DATAIN
Dn+3
tCD2
tCD2
tCD2
DATAOUT
Qn
Qn+4
Qn+1
tOHZ
OE
READ
WRITE
READ
Figure 13. Read with Address Counter Advance [41]
tCYC2
tCL2
tCH2
CLK
tSA
tHA
ADDRESS
An
tSAD
tHAD
ADS
tSAD
tHAD
CNTEN
tSCN
tHCN
tSCN
tHCN
tCD2
Qx–1
Qx
tDC
Qn
Qn+1
COUNTER HOLD
Qn+2
DATAOUT
Qn+3
READ
READ WITH COUNTER
READ WITH COUNTER
EXTERNAL
ADDRESS
Notes
39. Addresses do not have to be accessed sequentially since ADS = CNTEN = V with CNT/MSK = V constantly loads the address on the rising edge of the CLK.
IL
IH
Numbers are for reference only
40. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals.
41. CE = OE = B0 – B3 = LOW; CE = R/W = CNTRST = MRST = HIGH.
0
1
42. CE = B0 – B3 = R/W = LOW; CE = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, since OE = LOW, the Write operation cannot be completed
0
1
(labelled as no operation). One clock cycle is required to three-state the I/O for the Write operation on the next rising edge of CLK.
Document Number: 38-06070 Rev. *L
Page 21 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms (continued)
Figure 14. Write with Address Counter Advance [43]
tCYC2
tCL2
tCH2
CLK
tSA
tHA
An
ADDRESS
INTERNAL
ADDRESS
An
An+1
An+2
An+3
An+4
tSAD
tHAD
ADS
CNTEN
DATAIN
tSCN
tHCN
Dn
Dn+1
Dn+1
Dn+2
Dn+3
Dn+4
tSD
tHD
WRITE EXTERNAL
ADDRESS
WRITE WITH WRITE COUNTER
COUNTER HOLD
WRITE WITH COUNTER
Figure 15. Disabled to Read-to-Read to Read-to-Write
tCYC2
tCL2
tCH2
CLK
tSC
tHC
CE
tSW
tHW
R/W
tSW tHW
tHA
tHA
tSA
tSA
An+4
An
An+3
An+1
An+2
ADDRESS
OE
tHD
tSD
DATAIN
Dn+3
tCD2
DATAOUT
Qn+1
Qn
Qn+2
DISABLED
READ
READ
READ
WRITE
READ
Note
43. CE = B0 – B3 = R/W = LOW; CE = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, since OE = LOW, the Write operation cannot be completed
0
1
(labelled as no operation). One clock cycle is required to three-state the I/O for the Write operation on the next rising edge of CLK.
Document Number: 38-06070 Rev. *L
Page 22 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms (continued)
Figure 16. Disabled to Write- to- Read to Write-to-Read
tCYC2
tCH2
tCL2
CLK
tSC
tHC
CE
tSW tHW
R/W
tSA
tHA
An+4
An+3
An+2
ADDRESS
OE
An
An+1
tOE
tHD
tSD
Dn
DATAIN
Dn+2
tCD2
Qn+3
Qn+1
DATAOUT
DISABLED
WRITE
READ
READ
READ
WRITE
Figure 17. Disabled-to-Read to Disabled-to-Write
t
CYC2
t
t
CL2
CH2
CLK
CE
t
t
HC
SC
R/W
t
t
HW
SW
A
A
ADDRESS
A
n+2
A
A
n+4
n+3
n+1
n
t
t
HA
SA
t
OE
OE
t
OHZ
t
t
HD
SD
DATAIN
D
n+2
t
CD2
DATAOUT
Qn+3
Q
n
DISABLED
READ
DISABLED
WRITE
READ
READ
Document Number: 38-06070 Rev. *L
Page 23 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms (continued)
Figure 18. Read-to-Readback to Read-to-Read (R/W = HIGH)
tCYC2
tCH2
tCL2
CLK
ADS
tHAD
tSAD
CNTEN
tSCN
tHCN
tSA
tHA
An+1
ADDRESS
COUNTER
INTERNAL
ADDRESS
An
An+1
An+2
An+3
An+4
OE
DATAOUT
Qn+1
Qn+3
Qn+2
READ
INCREMENT
NO OPERATION
READ
READ
READ
READBACK
INCREMENT
INCREMENT
INCREMENT
Document Number: 38-06070 Rev. *L
Page 24 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms (continued)
Figure 19. Counter Reset [44, 45, 46]
tCYC2
tCH2 tCL2
CLK
tHA
Am
tSA
Ap
An
ADDRESS
INTERNAL
Ax
Ap
An
1
0
Am
ADDRESS
tHW
tSW
R/W
ADS
CNTEN
CNTRST
tHRST
tSRST
tHD
tSD
DATAIN
D0
tCD2
tCD2
[46]
DATAOUT
Q0
Qn
Q1
tCKLZ
READ
ADDRESS 0
READ
ADDRESS 1
READ
ADDRESS An
COUNTER
RESET
WRITE
ADDRESS 0
READ
ADDRESS Am
Notes
44. CE = B –B = LOW; CE = MRST = CNT/MSK = HIGH.
0
0
3
1
45. No dead cycle exists during counter reset. A Read or Write cycle may be coincidental with the counter reset.
46. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value.
Document Number: 38-06070 Rev. *L
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CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms (continued)
Figure 20. Readback State of Address Counter or Mask Register [47, 48, 49, 50]
tCYC2
tCH2 tCL2
CLK
tCA2 or tCM2
tSA
tHA
EXTERNAL
An*
An
ADDRESS
A0–A16
INTERNAL
ADDRESS
An+4
An+1
An+2
An+3
An
tSAD
tHAD
ADS
CNTEN
tSCN
tHCN
tCD2
tCKHZ
Qn
tCKLZ
DATAOUT
Qn+1
Qx-1
Qn+2
Qx-2
Q
n+3
LOAD
EXTERNAL
ADDRESS
READBACK
COUNTER
INTERNAL
ADDRESS
INCREMENT
Notes
47. CE = OE = B0 – B3 = LOW; CE = R/W = CNTRST = MRST = HIGH.
0
1
48. Address in output mode. Host must not be driving address bus after t
in next clock cycle.
CKLZ
49. Address in input mode. Host can drive address bus after t
.
CKHZ
50. An * is the internal value of the address counter (or the mask register depending on the CNT/MSK level) being Read out on the address lines.
Document Number: 38-06070 Rev. *L
Page 26 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms (continued)
Figure 21. Left_Port (L_Port) Write to Right_Port (R_Port) Read [51, 52, 53]
tCYC2
tCL2
tCH2
CLKL
tHA
tSA
L_PORT
ADDRESS
An
tSW
tHW
R/WL
tCKHZ
tSD
tHD
tCKLZ
L_PORT
DATAIN
Dn
tCCS
tCYC2
tCL2
CLKR
tCH2
tSA
tHA
R_PORT
ADDRESS
An
R/WR
tCD2
R_PORT
DATAOUT
Qn
tDC
Notes
51. CE = OE = ADS = CNTEN = B0 – B3 = LOW; CE = CNTRST = MRST = CNT/MSK = HIGH.
0
1
52. This timing is valid when one port is writing, and other port is reading the same location at the same time. If t
is violated, indeterminate data is Read out.
CCS
53. If t
< minimum specified value, then R_Port is Read the most recent data (written by L_Port) only (2 * t
+ t
) after the rising edge of R_Port's clock.
CCS
CCS
CYC2
CD2
If t
> minimum specified value, then R_Port is Read the most recent data (written by L_Port) (t
+ t
) after the rising edge of R_Port's clock.
CD2
CYC2
Document Number: 38-06070 Rev. *L
Page 27 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms (continued)
Figure 22. Counter Interrupt and Retransmit [54, 55, 56, 57, 58]
tCYC2
tCL2
tCH2
CLK
tSCM
tHCM
CNT/MSK
ADS
CNTEN
COUNTER
INTERNAL
ADDRESS
1FFFE
tSCINT
1FFFC
Last_Loaded
1FFFD
1FFFF
tRCINT
Last_Loaded +1
CNTINT
Notes
54. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value
55. CE = OE = B –B = LOW; CE = R/W = CNTRST = MRST = HIGH.
0
0
3
1
56. CNTINT is always driven.
57. CNTINT goes LOW when the unmasked portion of the address counter is incremented to the maximum value.
58. The mask register assumed to have the value of 1FFFFh.
Document Number: 38-06070 Rev. *L
Page 28 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Switching Waveforms (continued)
Figure 23. MailBox Interrupt Timing [59, 60, 61, 62, 63]
tCYC2
tCL2
tCH2
CLKL
tSA tHA
3FFFF
L_PORT
ADDRESS
An+1
An
An+2
An+3
tSINT
tRINT
INTR
tCYC2
tCL2
tCH2
CLKR
tSA tHA
Am
R_PORT
ADDRESS
Am+1
3FFFF
Am+3
Am+4
Notes
59. CE = OE = ADS = CNTEN = LOW; CE = CNTRST = MRST = CNT/MSK = HIGH.
0
1
60. Address “3FFFF” is the mailbox location for R_Port of a 9M device.
61. L_Port is configured for Write operation, and R_Port is configured for Read operation.
62. At least one byte enable (B0 – B3) is required to be active during interrupt operations.
63. Interrupt flag is set with respect to the rising edge of the Write clock, and is reset with respect to the rising edge of the Read clock.
Document Number: 38-06070 Rev. *L
Page 29 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Table 3. Read/Write and Enable Operation (Any Port) [66, 67, 64, 65]
Inputs
Outputs
DQ0–DQ35
High Z
Operation
OE
CLK
CE0
CE1
R/W
X
H
X
X
Deselected
Deselected
Write
X
X
L
X
L
L
L
L
X
L
High Z
DIN
H
H
H
H
X
DOUT
High Z
Read
H
X
Outputs disabled
Notes
64. OE is an asynchronous input signal.
65. When CE changes state, deselection and Read happen after one cycle of latency.
66. 9 M device has 18 address bits, 4M device has 17 address bits, and 2 M device has 16 address bits.
67. “X” = “Don’t Care”, “H” = HIGH, “L” = LOW.
Document Number: 38-06070 Rev. *L
Page 30 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Ordering Information
Cypress offers other versions of this type of product in many different configurations and features. The following table contains only
the list of parts that are currently available. For a complete listing of all options, visit the Cypress website at http://www.cypress.com
and refer to the product summary page at http://www.cypress.com/products or contact your local sales representative.
Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives and distributors. To find the office
closest to you, visit us at http://www.cypress.com/go/datasheet/offices.
256 K
×
36 (9 M) 3.3 V Synchronous CY7C0853V/CY7C0853AV Dual-Port SRAM
Package
Speed
(MHz)
Operating
Range
Ordering Code
Package Type
Diagram
133 CY7C0853V-133BBI
CY7C0853V-133BBXI
CY7C0853V-133BBC
51-85146 172-ball BGA (15 × 15 × 1.6 mm) with 1 mm pitch
172-ball BGA (15 × 15 × 1.6 mm) with 1 mm pitch (Pb-free)
172-ball BGA (15 × 15 × 1.6 mm) with 1 mm pitch
Industrial
Commercial
Industrial
100 CY7C0853AV-100BBI
CY7C0853V-100BBC
51-85146 172-ball BGA (15 × 15 × 1.6 mm) with 1 mm pitch
172-ball BGA (15 × 15 × 1.6 mm) with 1 mm pitch
Commercial
128 K
× 36 (4 M) 3.3 V Synchronous CY7C0852V/CY7C0852AV Dual-Port SRAM
Speed
(MHz)
Package
Operating
Range
Ordering Code
Package Type
Diagram
167 CY7C0852V-167BBC
CY7C0852AV-167AXC
133 CY7C0852AV-133AXC
CY7C0852AV-133BBI
CY7C0852AV-133AXI
CY7C0852V-133BBC
51-85114 172-ball BGA (15 × 15 × 1.25 mm) with 1 mm pitch
51-85132 176-pin TQFP (24 × 24 × 1.4 mm) (Pb-free)
51-85132 176-pin TQFP (24 × 24 × 1.4 mm) (Pb-free)
51-85114 172-ball BGA (15 × 15 × 1.25 mm) with 1 mm pitch
51-85132 176-pin TQFP (24 × 24 × 1.4 mm) (Pb-free)
51-85114 172-ball BGA (15 × 15 × 1.25 mm) with 1 mm pitch
172-ball BGA (15 × 15 × 1.25 mm) with 1 mm pitch
Commercial
Industrial
Commercial
Industrial
CY7C0852V-133BBI
64 K
× 36 (2 M) 3.3 V Synchronous CY7C0851V/CY7C0851AV Dual-Port SRAM
Speed
(MHz)
Package
Diagram
Operating
Range
Ordering Code
Package Type
167 CY7C0851V-167BBC
CY7C0851AV-167BBXC
133 CY7C0851AV-133AXI
CY7C0851AV-133BBI
51-85114 172-ball BGA (15 × 15 × 1.25 mm) with 1 mm pitch
172-ball BGA (15 × 15 × 1.25 mm) with 1 mm pitch (Pb-free)
51-85132 176-pin TQFP (24 × 24 × 1.4 mm) (Pb-free)
Commercial
Industrial
51-85114 172-ball BGA (15 × 15 × 1.25 mm) with 1 mm pitch
Document Number: 38-06070 Rev. *L
Page 31 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Ordering Code Definitions
CY
7
C
0
8
5
X
X - XXX XX
X
X
Temperature Range: X = I or C
I = Industrial; C = Commercial
X = Pb-free (RoHS Compliant)
Package Type: X = BB or A
BB = 172-ball BGA
A = 176-pin TQFP
Speed Grade: XXX = 100 MHz or 133 MHz or 167 MHz
X = V or AV
V or AV = 3.3 V
Depth: X = 1 or 2 or 3
1 = 64 K
2 = 128 K
3 = 256 K
Width: 5 = × 36
Family Code: 8 = Synchronous
Port: 0 = Dual Port
Technology Code: C = CMOS
Marketing Code: 7 = SRAM
Company ID: CY = Cypress
Document Number: 38-06070 Rev. *L
Page 32 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Package Diagrams
Figure 24. 172-ball FBGA (15 × 15 × 1.6 mm) BB172SD (For Single or Stacked Die) Package Outline, 51-85146
51-85146 *D
Document Number: 38-06070 Rev. *L
Page 33 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Package Diagrams (continued)
Figure 25. 172-ball FBGA (15 × 15 × 1.25 mm) BB172 Package Outline, 51-85114
51-85114 *D
Document Number: 38-06070 Rev. *L
Page 34 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Package Diagrams (continued)
Figure 26. 176-pin TQFP (24 × 24 × 1.4 mm) A176S Package Outline, 51-85132
51-85132 *B
Document Number: 38-06070 Rev. *L
Page 35 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Acronyms
Document Conventions
Units of Measure
Symbol
Acronym
Description
CMOS
FBGA
I/O
complementary metal oxide semiconductor
fine-pitch ball grid array
input/output
Unit of Measure
°C
degree Celsius
MHz
µA
mA
mV
ns
megahertz
microampere
milliampere
millivolt
JTAG
SRAM
TCK
joint test action group
static random access memory
test clock input
TDI
test data input
nanosecond
ohm
TDO
TQFP
test data output
thin quad flat pack
pF
V
picofarad
volt
W
watt
Document Number: 38-06070 Rev. *L
Page 36 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Document History Page
Document Title: CY7C0851V/CY7C0851AV/CY7C0852V/CY7C0852AV/CY7C0853V/CY7C0853AV,
FLEx36™ 3.3 V 32 K / 64 K / 128 K / 256 K × 36 Synchronous Dual-Port RAM
Document Number: 38-06070
Submission
Date
Orig. of
Change
Rev.
ECN No.
Description of Change
**
127809
08/04/03
SPN
This data sheet has been extracted from another data sheet: The 2 M / 4 M /
9 M data sheet. The following changes have been made from the original as
pertains to this device:
Updated capacitance values
Updated “Read-to-Write-to-Read (OE Controlled)” waveform
Revised static discharge voltage
Corrected 0853 pins L3 and L12
Added discussion of Pause/Restart for JTAG boundary scan
Power up requirements added to Maximum Ratings information
Revised tCD2, tOE, tOHZ, tCKHZ, tCKLZ for the CY7C0853V to 4.7 ns
Updated ICC numbers
Updated tHA, tHB, tHD for -100 speed
Separated out from the 4 M data sheet
Added 133 MHz Industrial device to Ordering Information table
*A
*B
210948
216190
See ECN
See ECN
YDT
Changed mailbox addresses from 1FFFE and 1FFFF to 3FFFE and 3FFFF.
Corrected Revision of Document. CMS does not reflect this rev change.
YDT /
DCON
*C
*D
231996
238938
See ECN
See ECN
YDT
Updated Functional Description (Removed “A particular port can write to a
certain location while another port is reading that location.”).
WWZ
Merged 0853 (9 M × 36) with 0852 (4 M × 36) and 0851 (2 M × 36), add 0850
(1 M × 36), to the data sheet.
Added Product Selection Guide.
Added JTAG ID code for 1 M device.
Updated Scan Registers Sizes (Added Note 18 and referred the same note in
the Bit Size ‘n’ of Bondary Scan).
Updated boundary scan section.
Updated function description for the merge and addition.
*E
*F
329122
389877
See ECN
See ECN
SPN
KGH
Updated Ordering Information (Updated Marketing part numbers).
Updated Read-to-Write-to-Read timing diagram to reflect accurate bus
turnaround scheme.
Added ISB5
Changed tRSCNTINT to 10 ns
Changed tRSF to 10 ns
Added figure Disabled-to-Read-to-Read-to-Read-to-Write
Added figure Disabled-to-Write-to-Read-to-Write-to-Read
Added figure Disabled-to-Read-to-Disabled-to-Write
Added figure Read-to-Readback-to-Read-to-Read (R/W = HIGH)
Updated Read-to-Write-to-Read timing diagram to correct the data out
schemes
Updated Disabled-to-Read-to-Read-to-Read-to-Write timing diagram to
correct the chip enable, data in, and data out schemes
Updated Disabled-to-Write-to-Read-to-Write-to-Read timing diagram to
correct the chip enable and output enable schemes
Updated Disabled-to-Read-to-Disabled-to-Write timing diagram to correct the
chip enable and output enable schemes
*G
*H
391597
See ECN
07/29/08
SPN
Updated counter reset section to reflect mirror register behavior
2544945
VKN /
AESA
Updated Ordering Information (Updated part numbers).
Updated in new template.
Document Number: 38-06070 Rev. *L
Page 37 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Document History Page (continued)
Document Title: CY7C0851V/CY7C0851AV/CY7C0852V/CY7C0852AV/CY7C0853V/CY7C0853AV,
FLEx36™ 3.3 V 32 K / 64 K / 128 K / 256 K × 36 Synchronous Dual-Port RAM
Document Number: 38-06070
Submission
Date
Orig. of
Change
Rev.
ECN No.
Description of Change
*I
2897087
03/22/10
RAME
Updated Ordering Information (Removed obsolete parts from ordering
information table).
Updated Package Diagrams.
*J
3093275
11/23/2010
ADMU
Added information for parts CY7C0851V/CY7C0852V/CY7C0853V across the
document.
Added Contents.
Updated Ordering Information (Added new part CY7C0851AV-133BBI in the
ordering information table) and added Ordering Code Definitions.
Added Acronyms and Units of Measure.
Updated as per new template.
*K
*L
3402163
3698945
10/12/2011
08/07/2012
ADMU
SMCH
Updated Ordering Information (Removed pruned parts
CY7C0853AV-100BBC, CY7C0853AV-133BBC).
Updated Package Diagrams.
Updated title to read as “CY7C0851V/CY7C0851AV/CY7C0852V/
CY7C0852AV/CY7C0853V/CY7C0853AV,
FLEx36™ 3.3 V 32 K / 64 K / 128 K / 256 K × 36 Synchronous Dual-Port RAM”.
Updated Features (Removed CY7C0850AV related information).
Updated Functional Description (Removed CY7C0850AV related information).
Updated Product Selection Guide (Removed CY7C0850AV related
information).
Updated Pin Configurations (Removed CY7C0850AV related information).
Updated Pin Definitions (Removed CY7C0850AV related information).
Updated Mailbox Interrupts (Removed CY7C0850AV related information).
Updated Address Counter and Mask Register Operations (Removed
CY7C0850AV related information).
Updated IEEE 1149.1 Serial Boundary Scan (JTAG) (Removed CY7C0850AV
related information).
Updated Identification Register Definitions (Removed CY7C0850AV related
information).
Updated Electrical Characteristics (Removed CY7C0850AV related
information).
Updated Capacitance (Removed CY7C0850AV related information).
Updated Switching Characteristics (Removed CY7C0850AV related
information).
Updated Package Diagrams (Added another spec 51-85146 for 172-ball BGA
package, spec 51-85132 for 176-pin TQFP package (Changed revision from
*A to *B)).
Document Number: 38-06070 Rev. *L
Page 38 of 39
CY7C0851V/CY7C0851AV
CY7C0852V/CY7C0852AV
CY7C0853V/CY7C0853AV
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
Automotive
cypress.com/go/automotive
cypress.com/go/clocks
cypress.com/go/interface
cypress.com/go/powerpsoc
cypress.com/go/plc
PSoC Solutions
Clocks & Buffers
Interface
psoc.cypress.com/solutions
PSoC 1 | PSoC 3 | PSoC 5
Lighting & Power Control
Memory
cypress.com/go/memory
cypress.com/go/psoc
PSoC
Touch Sensing
USB Controllers
Wireless/RF
cypress.com/go/touch
cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2008-2012. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 38-06070 Rev. *L
Revised August 7, 2012
Page 39 of 39
All products and company names mentioned in this document may be the trademarks of their respective holders.
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