CY62256VNLL-70ZI [CYPRESS]

256K (32K x 8) Static RAM; 256K ( 32K ×8 )静态RAM
CY62256VNLL-70ZI
型号: CY62256VNLL-70ZI
厂家: CYPRESS    CYPRESS
描述:

256K (32K x 8) Static RAM
256K ( 32K ×8 )静态RAM

文件: 总12页 (文件大小:645K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CY62256VN  
256K (32K x 8) Static RAM  
Features  
Functional Description[1]  
• Temperature Ranges  
The CY62256VN family is composed of two high-performance  
CMOS static RAM’s organized as 32K words by 8 bits. Easy  
memory expansion is provided by an active LOW chip enable  
(CE) and active LOW output enable (OE) and tri-state drivers.  
These devices have an automatic power-down feature,  
reducing the power consumption by over 99% when  
deselected.  
— Commercial: 0°C to 70°C  
— Industrial: –40°C to 85°C  
— Automotive-A: –40°C to 85°C  
— Automotive-E: –40°C to 125°C  
• Speed: 70 ns  
An active LOW write enable signal (WE) controls the  
writing/reading operation of the memory. When CE and WE  
inputs are both LOW, data on the eight data input/output pins  
(I/O0 through I/O7) is written into the memory location  
addressed by the address present on the address pins (A0  
through A14). Reading the device is accomplished by selecting  
the device and enabling the outputs, CE and OE active LOW,  
while WE remains inactive or HIGH. Under these conditions,  
the contents of the location addressed by the information on  
address pins are present on the eight data input/output pins.  
• Low voltage range: 2.7V–3.6V  
• Low active power and standby power  
• Easy memory expansion with CE and OE features  
• TTL-compatible inputs and outputs  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
• Available in standard Pb-free and non Pb-free 28-lead  
(300-mil) narrow SOIC, 28-lead TSOP-I and 28-lead  
Reverse TSOP-I packages  
The input/output pins remain in a high-impedance state unless  
the chip is selected, outputs are enabled, and write enable  
(WE) is HIGH.  
Logic Block Diagram  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
3
4
5
6
INPUTBUFFER  
A
A
A
10  
9
8
A
7
6
5
A
32K x 8  
ARRAY  
A
A
A
A
4
3
2
CE  
WE  
POWER  
DOWN  
COLUMN  
DECODER  
I/O  
7
OE  
Note:  
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 001-06512 Rev. *A  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised August 3, 2006  
[+] Feedback  
CY62256VN  
Product Portfolio  
Power Dissipation  
Operating, ICC (mA) Standby, ISB2 (µA)  
VCC Range (V)  
Product  
CY62256VNLL  
CY62256VNLL  
CY62256VNLL  
CY62256VNLL  
Range  
Com’l  
Min.  
2.7  
2.7  
2.7  
2.7  
Typ.[2]  
Max.  
3.6  
Typ.[2]  
Max.  
30  
Typ.[2]  
Max.  
5
3.0  
11  
0.1  
Ind’l  
3.0  
3.6  
11  
30  
0.1  
10  
Automotive-A  
Automotive-E  
3.0  
3.6  
11  
30  
0.1  
10  
3.0  
3.6  
11  
30  
0.1  
130  
Pin Configurations  
Narrow SOIC  
Top View  
A
28  
V
CC  
1
2
3
4
5
A
8
9
A
21  
7
6
11  
A
12  
OE  
22  
23  
0
27 WE  
26  
A
6
A
A
20  
A
1
10  
13  
CE  
I/O  
I/O  
A
A
10  
11  
12  
13  
14  
15  
16  
A
7
19  
18  
17  
16  
A
9
A
A7  
A
5
4
3
14  
A
4
24  
7
6
5
4
2
I/O  
I/O  
1
I/O  
GND  
I/O  
I/O  
4
I/O  
A
A
8
0
25  
3
24  
A
3
25  
26  
27  
28  
1
8
I/O  
A
4
A
A
5
6
9
10  
2
TSOP I  
2
I/O  
TSOP I  
Top View  
(not to scale)  
WE  
2
6
A
23  
22  
A
1
I/O  
15  
14  
13  
Reverse Pinout  
A
5
1
28  
3
V
CC  
A
11  
OE  
A
0
CE  
GND  
I/O  
V
A
5
Top View  
3
7
8
9
10  
11  
12  
13  
14  
CC  
A
2
27  
26  
25  
24  
23  
2
3
6
21  
20  
19  
18  
17  
(not to scale)  
A
WE  
12  
12  
11  
17  
18  
I/O  
1
A7  
A
4
5
A
13  
I/O  
A
A
4
5
0
I/O  
6
8
3
10  
9
A
19  
20  
A
A
9
14  
A
2
A
OE  
I/O  
7
I/O  
14  
I/O  
7
A
A
13  
CE  
6
7
10  
I/O  
1
6
0
8
A
12  
A
21  
22  
A
0
11  
I/O  
I/O  
5
1
I/O  
16 I/O  
15  
2
4
3
I/O  
GND  
Pin Definitions  
Pin Number  
Type  
Description  
1–10, 21, 23–26 Input  
A0–A14. Address Inputs  
11–13, 15–19  
Input/Output I/O0–I/O7. Data lines. Used as input or output lines depending on operation  
27  
20  
22  
Input/Control WE. When selected LOW, a WRITE is conducted. When selected HIGH, a READ is conducted  
Input/Control CE. When LOW, selects the chip. When HIGH, deselects the chip  
Input/Control OE. Output Enable. Controls the direction of the I/O pins. When LOW, the I/O pins behave as  
outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data pins  
14  
Ground  
GND. Ground for the device  
28  
Power Supply VCC. Power supply for the device  
Note:  
2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V = V Typ., T = 25°C, and t = 70 ns.  
CC  
CC  
A
AA  
Document #: 001-06512 Rev. *A  
Page 2 of 12  
[+] Feedback  
CY62256VN  
Static Discharge Voltage.......................................... > 2001V  
(per MIL-STD-883, Method 3015)  
Maximum Ratings  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Latch-up Current.................................................... > 200 mA  
Operating Range  
Storage Temperature ................................65°C to + 150°C  
Ambient Temperature with  
Power Applied............................................55°C to + 125°C  
Ambient  
Temperature  
Device  
Range  
(TA)[4]  
VCC  
Supply Voltage to Ground Potential  
CY62256VN Commercial  
Industrial  
0°C to +70°C 2.7V to 3.6V  
(Pin 28 to Pin 14) .......................................... –0.5V to + 4.6V  
40°C to +85°C  
DC Voltage Applied to Outputs  
in High-Z State[3] ....................................–0.5V to VCC + 0.5V  
Automotive-A 40°C to +85°C  
DC Input Voltage[3].................................–0.5V to VCC + 0.5V  
Automotive-E 40°Cto+125°C  
Output Current into Outputs (LOW) .............................20 mA  
Electrical Characteristics Over the Operating Range  
-70  
Parameter  
Description  
Test Conditions  
VCC = 2.7V  
Min.  
Typ.[2]  
Max.  
Unit  
V
VOH  
VOL  
VIH  
VIL  
Output HIGH Voltage  
Output LOW Voltage  
Input HIGH Voltage  
Input Leakage Voltage  
IOH = 1.0 mA  
2.4  
IOL = 2.1 mA  
VCC = 2.7V  
0.4  
VCC + 0.3V  
0.8  
V
2.2  
–0.5  
–1  
V
V
IIX  
Input Leakage Current GND < VIN < VCC  
Com’l/Ind’l/Auto-A  
Auto-E  
+1  
µA  
µA  
µA  
µA  
mA  
–10  
–1  
+10  
IOZ  
Output Leakage Current GND < VIN < VCC, Output  
Disabled  
Com’l/Ind’l/Auto-A  
Auto-E  
+1  
–10  
+10  
ICC  
VCC Operating Supply VCC = 3.6V, IOUT = 0 mA,  
All Ranges  
11  
30  
Current  
f = fMAX = 1/tRC  
ISB1  
Automatic CE  
Power down Current - VIN > VIH or VIN < VIL, f = fMAX  
TTL Inputs  
VCC = 3.6V, CE > VIH,  
All Ranges  
100  
300  
µA  
µA  
ISB2  
Automatic CE  
Power-down Current-  
CMOS Inputs  
VCC = 3.6V, CE > VCC – 0.3V Com’l  
0.1  
5
VIN > VCC – 0.3V or VIN  
<
Ind’l/Auto-A  
Auto-E  
10  
0.3V, f = 0  
130  
Notes:  
3. V (min.) = –2.0V for pulse durations of less than 20 ns.  
IL  
4. T is the “Instant-On” case temperature  
A
Document #: 001-06512 Rev. *A  
Page 3 of 12  
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CY62256VN  
Capacitance[5]  
Parameter  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
TA = 25°C, f = 1 MHz,  
CC = 3.0V  
Max.  
Unit  
pF  
CIN  
6
8
V
COUT  
pF  
Thermal Resistance[5]  
Parameter  
Description  
Test Conditions  
SOIC  
TSOPI  
RTSOPI  
Unit  
ΘJA  
Thermal Resistance  
(Junction to Ambient)  
Still Air, soldered on a 3 × 4.5 inch,  
two-layer printed circuit board  
68.45  
87.62  
87.62  
°C/W  
ΘJC  
Thermal Resistance  
(Junction to Case)  
26.94  
23.73  
23.73  
°C/W  
AC Test Loads and Waveforms  
R1  
VCC  
ALL INPUT PULSES  
90%  
OUTPUT  
VCC  
90%  
10%  
10%  
R2  
50 pF  
GND  
< 5 ns  
< 5 ns  
INCLUDING  
JIG AND  
SCOPE  
Equivalent to:  
THÉVENIN EQUIVALENT  
Rth  
OUTPUT  
Vth  
Parameter  
R1  
Value  
1100  
1500  
645  
Units  
Ohms  
Ohms  
Ohms  
Volts  
R2  
RTH  
VTH  
1.750  
Data Retention Characteristics (Over the Operating Range)  
Parameter  
VDR  
ICCDR  
Description  
Conditions[6]  
Min.  
Typ.[2]  
Max.  
Unit  
V
VCC for Data Retention  
Data Retention Current  
1.4  
VCC = 1.4V,  
Com’l  
0.1  
3
6
µA  
CE > VCC – 0.3V,  
VIN > VCC – 0.3V  
or VIN < 0.3V  
Ind’l/Auto-A  
Auto-E  
50  
[6]  
tCDR  
Chip Deselect to Data  
Retention Time  
0
ns  
ns  
[5]  
tR  
Operation Recovery Time  
tRC  
Data Retention Waveform  
DATA RETENTION MODE  
> 1.4V  
1.8V  
1.8V  
V
V
CC  
DR  
t
t
R
CDR  
CE  
Note:  
5. Tested initially and after any design or process changes that may affect these parameters.  
6. No input may exceed V + 0.3V.  
CC  
Document #: 001-06512 Rev. *A  
Page 4 of 12  
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CY62256VN  
Switching Characteristics Over the Operating Range[7]  
CY62256VN-70  
Parameter  
Read Cycle  
Description  
Min.  
Max.  
Unit  
tRC  
Read Cycle Time  
70  
10  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tAA  
Address to Data Valid  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low-Z[8]  
OE HIGH to High-Z[8, 9]  
CE LOW to Low-Z[8]  
CE HIGH to High-Z[8, 9]  
CE LOW to Power-up  
CE HIGH to Power-down  
70  
tOHA  
tACE  
70  
35  
tDOE  
tLZOE  
5
10  
0
tHZOE  
25  
25  
70  
tLZCE  
tHZCE  
tPU  
tPD  
Write Cycle[10, 11]  
tWC  
tSCE  
tAW  
Write Cycle Time  
70  
60  
60  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CE LOW to Write End  
Address Set-up to Write End  
Address Hold from Write End  
Address Set-up to Write Start  
WE Pulse Width  
tHA  
tSA  
0
tPWE  
tSD  
50  
30  
0
Data Set-up to Write End  
Data Hold from Write End  
WE LOW to High-Z[8, 9]  
WE HIGH to Low-Z[8]  
tHD  
tHZWE  
25  
tLZWE  
10  
Notes:  
7. Test conditions assume signal transition time of 5 ns or less timing reference levels of V /2, input pulse levels of 0 to V , and output loading of the specified  
CC  
CC  
I
/I and 100-pF load capacitance.  
OL OH  
8. At any given temperature and voltage condition, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any given device.  
HZCE  
LZCE HZOE  
LZOE  
HZWE  
LZWE  
9. t  
, t  
, and t  
are specified with C = 5 pF as in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.  
HZOE HZCE  
HZWE L  
10. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can  
terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.  
11. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of t  
and t  
.
HZWE  
SD  
Document #: 001-06512 Rev. *A  
Page 5 of 12  
[+] Feedback  
CY62256VN  
Switching Waveforms  
Read Cycle No. 1[12, 13]  
t
RC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
Read Cycle No. 2[13, 14]  
t
RC  
CE  
OE  
t
t
ACE  
t
HZOE  
t
DOE  
t
HZCE  
LZOE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
DATA VALID  
t
LZCE  
t
PD  
t
PU  
VCC  
SUPPLY  
CURRENT  
ICC  
ISB  
50%  
50%  
Write Cycle No. 1 (WE Controlled)[10, 15, 16]  
t
WC  
ADDRESS  
CE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
OE  
t
SD  
t
HD  
NOTE 17  
DATA VALID  
DATA I/O  
IN  
t
HZOE  
Notes:  
12. Device is continuously selected. OE, CE = V .  
IL  
13. WE is HIGH for read cycle.  
14. Address valid prior to or coincident with CE transition LOW.  
15. Data I/O is high impedance if OE = V  
.
IH  
16. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.  
17. During this period, the I/Os are in output state and input signals should not be applied.  
Document #: 001-06512 Rev. *A  
Page 6 of 12  
[+] Feedback  
CY62256VN  
Switching Waveforms (continued)  
Write Cycle No. 2 (CE Controlled)[10, 15, 16]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
t
HA  
AW  
WE  
t
t
HD  
SD  
DATA I/O  
DATA VALID  
IN  
Write Cycle No. 3 (WE Controlled, OE LOW)[11, 16]  
t
WC  
ADDRESS  
CE  
t
t
HA  
AW  
t
SA  
WE  
t
t
HD  
SD  
DATA I/O  
NOTE 17  
DATA VALID  
IN  
t
t
LZWE  
HZWE  
Document #: 001-06512 Rev. *A  
Page 7 of 12  
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CY62256VN  
Typical DC and AC Characteristics  
STANDBY CURRENT  
NORMALIZED SUPPLY CURRENT  
vs. AMBIENT TEMPERATURE  
NORMALIZED SUPPLY CURRENT  
vs. SUPPLY VOLTAGE  
vs. AMBIENT TEMPERATURE  
1.8  
3.0  
2.5  
2.0  
1.5  
1.0  
1.4  
V
= 3.0V  
CC  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
1.2  
1.0  
0.8  
TA= 25°C  
0.6  
0.4  
0.2  
0.5  
0.4  
ISB  
0.0  
0.2  
0.0  
–0.5  
55  
25  
105  
55  
25  
125  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
SUPPLY VOLTAGE (V)  
NORMALIZED ACCESS TIME  
vs. AMBIENT TEMPERATURE  
OUTPUT SINK CURRENT  
vs. OUTPUT VOLTAGE  
NORMALIZED ACCESS TIME  
vs. SUPPLY VOLTAGE  
14  
12  
10  
8
2.5  
2.0  
1.6  
1.4  
V
= 3.0V  
CC  
1.2  
1.0  
1.5  
6
TA = 25°C  
1.0  
0.5  
4
2
T
= 25°C  
A
0.8  
0
0.0  
0.6  
55  
0.0  
1.65  
2.0  
OUTPUT VOLTAGE (V)  
3.0  
1.0  
25  
125  
2.1  
2.6  
3.1  
3.6  
AMBIENT TEMPERATURE (°C)  
SUPPLY VOLTAGE (V)  
OUTPUT SOURCE CURRENT  
vs. OUTPUT VOLTAGE  
–14  
–12  
–10  
–8  
–6  
T
= 25°C  
1.0  
A
–4  
0
0.5  
1.5  
0.0  
2
2.5  
OUTPUT VOLTAGE (V)  
Document #: 001-06512 Rev. *A  
Page 8 of 12  
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CY62256VN  
Typical DC and AC Characteristics (continued)  
TYPICAL ACCESS TIME CHANGE  
vs. OUTPUT LOADING  
30.0  
NORMALIZED ICC vs. CYCLE TIME  
1.25  
1.00  
0.75  
0.50  
V
= 3.0V  
CC  
25.0  
TA = 25°C  
VCC = 3V  
20.0  
TA = 25°C  
VIN = 0.5V  
15.0  
10.0  
5.0  
0.0  
20  
30  
10  
1
0
200 400  
600 800 1000  
CYCLE FREQUENCY (MHz)  
CAPACITANCE (pF)  
Truth Table  
CE  
WE  
OE  
Inputs/Outputs  
Mode  
Power  
Standby (ISB  
H
X
H
L
X
High-Z  
Data Out  
Data In  
High-Z  
Deselect/Power-down  
)
L
L
L
L
X
H
Read  
Active (ICC  
Active (ICC  
Active (ICC  
)
)
)
Write  
H
Deselect, Output Disabled  
Ordering Information  
Speed  
Package  
Diagram  
Operating  
(ns)  
Ordering Code  
CY62256VNLL-70SNC  
Package Type  
Range  
70  
51-85092 28-lead (300-mil) Narrow SOIC  
28-lead (300-mil) Narrow SOIC (Pb-Free)  
51-85071 28-lead TSOP I  
Commercial  
CY62256VNLL-70SNXC  
CY62256VNLL-70ZC  
CY62256VNLL-70ZXC  
CY62256VNLL-70SNXI  
CY62256VNLL-70ZI  
28-lead TSOP I (Pb-Free)  
51-85092 28-lead (300-mil) Narrow SOIC (Pb-Free)  
51-85071 28-lead TSOP I  
Industrial  
CY62256VNLL-70ZXI  
CY62256VNLL-70ZRI  
CY62256VNLL-70ZRXI  
CY62256VNLL-70ZXA  
CY62256VNLL-70SNXE  
CY62256VNLL-70ZXE  
CY62256VNLL-70ZRXE  
28-lead TSOP I (Pb-Free)  
51-85074 28-lead Reverse TSOP I  
28-lead Reverse TSOP I (Pb-Free)  
51-85071 28-lead TSOP I (Pb-Free)  
51-85092 28-lead (300-mil) Narrow SOIC (Pb-Free)  
51-85071 28-lead TSOP I (Pb-Free)  
51-85074 28-lead Reverse TSOP I (Pb-Free)  
Automotive-A  
Automotive-E  
Please contact your local Cypress sales representative for availability of other parts  
Document #: 001-06512 Rev. *A  
Page 9 of 12  
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CY62256VN  
Package Diagrams  
28-lead (300-mil) SNC (Narrow Body) (51-85092)  
51-85092-*B  
28-lead TSOP 1 (8 × 13.4 mm) (51-85071)  
51-85071-*G  
Document #: 001-06512 Rev. *A  
Page 10 of 12  
[+] Feedback  
CY62256VN  
Package Diagrams (continued)  
28-lead Reverse TSOP 1 (8 × 13.4 mm) (51-85074)  
51-85074-*F  
All product and company names mentioned in this document are the trademarks of their respective holders.  
Document #: 001-06512 Rev. *A  
Page 11 of 12  
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be  
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its  
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
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CY62256VN  
Document History Page  
Document Title: CY62256VN 256K (32K x 8) Static RAM  
Document Number: 001-06512  
Orig. of  
REV.  
**  
ECN NO. Issue Date Change  
Description of Change  
426504  
488954  
See ECN  
See ECN  
NXR  
NXR  
New Data Sheet  
*A  
Added Automotive product  
Updated ordering Information table  
Document #: 001-06512 Rev. *A  
Page 12 of 12  
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