HSE-B18508-035H-03 [CUI]
HEAT SINK, EXTRUSION, TO-218, 50;
| 型号： | HSE-B18508-035H-03 |
| 厂家： | 
CUI INC |
| 描述： | HEAT SINK, EXTRUSION, TO-218, 50 |
| 文件： | 总8页 (文件大小：547K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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3D Model
date 08/17/2020
page 1 of 8
SERIES: HSE-BX-035H │ DESCRIPTION: HEAT SINK
FEATURES
• TO-218 package
• placement pins for secure PCB attachment
• clip on style for component attachment
• multiple available cut lengths
thermal resistance1
power
MODEL
dissipation1
length
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
(mm)
25.4
31.75
38.1
50.8
63.5
HSE-B18254-035H-00
HSE-B18317-035H-01
HSE-B18381-035H-02
HSE-B18508-035H-03
HSE-B18635-035H-04
7.50
7.50
6.25
5.77
4.97
8.51
10.49
9.81
8.94
7.90
4.03
4.33
3.79
3.44
2.38
2.09
2.50
2.60
2.09
1.66
10.00
10.00
12.00
13.00
15.10
Note:
1. See performance curves for full thermal resistance details.
2. Custom cut to length options available. Thermal data not available on custom lengths.
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3D Model
CUI Devices │ SERIES: HSE-BX-035H │ DESCRIPTION: HEAT SINK
date 08/17/2020│ page 2 of 8
PERFORMANCE CURVES
HSE-B18254-035H-00
100
90
Without Airflow
200 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
400 LFM
80
Power
(W)
Natural
Conv.
200 LFM
400 LFM
70
0
1
0
0
0
8.51
4.03
2.09
60
50
40
30
20
2
17.71
25.98
33.43
41.33
48.00
55.82
62.87
69.51
75.10
82.03
88.82
95.84
103.36
109.24
8.25
4.19
3
11.41
14.51
17.65
20.68
23.05
26.42
29.15
32.19
34.47
37.70
40.70
43.79
46.92
6.31
4
8.46
5
10.72
12.91
15.08
17.23
19.61
21.76
24.00
26.09
28.34
30.54
32.70
6
7
8
10
0
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Dissipated Power (W)
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
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3D Model
CUI Devices │ SERIES: HSE-BX-035H │ DESCRIPTION: HEAT SINK
date 08/17/2020│ page 3 of 8
PERFORMANCE CURVES (CONTINUED)
HSE-B18317-035H-01
100
90
Without Airflow
200 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
400 LFM
80
Power
(W)
Natural
Conv.
200 LFM
400 LFM
70
0
1
0
0
0
60
50
40
30
10.49
20.11
27.82
35.65
42.56
49.31
56.42
62.46
68.54
74.96
80.66
86.72
92.47
97.61
103.34
4.33
2.50
2
8.77
5.33
3
13.00
17.48
21.57
25.42
29.92
34.18
38.43
42.08
46.41
50.78
54.93
58.30
62.54
8.38
4
10.70
13.86
17.23
19.64
22.78
26.07
28.67
31.77
34.93
37.27
40.39
43.64
5
20
10
0
6
7
8
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Dissipated Power (W)
9
10
11
12
13
14
15
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
cuidevices.com
Additional Resources: Product Page
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3D Model
CUI Devices │ SERIES: HSE-BX-035H │ DESCRIPTION: HEAT SINK
date 08/17/2020│ page 4 of 8
PERFORMANCE CURVES (CONTINUED)
HSE-B18381-035H-02
100
90
Without Airflow
200 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
400 LFM
80
Power
(W)
Natural
Conv.
200 LFM
400 LFM
70
0
1
0
0
0
60
50
40
30
9.81
3.79
2.60
2
17.47
25.07
31.22
37.72
42.95
49.17
54.78
60.08
65.42
70.48
75.24
79.80
85.06
89.64
7.41
5.09
3
11.15
14.91
18.35
21.94
25.41
28.73
32.32
35.58
39.62
43.44
46.88
50.16
53.54
7.61
4
10.12
12.61
15.16
17.64
20.17
22.72
25.29
27.97
30.30
32.78
35.09
37.66
5
20
10
0
6
7
8
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Dissipated Power (W)
9
10
11
12
13
14
15
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
cuidevices.com
Additional Resources: Product Page
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3D Model
CUI Devices │ SERIES: HSE-BX-035H │ DESCRIPTION: HEAT SINK
date 08/17/2020│ page 5 of 8
PERFORMANCE CURVES (CONTINUED)
HSE-B18508-035H-03
100
90
Without Airflow
200 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
400 LFM
80
Power
(W)
Natural
Conv.
200 LFM
400 LFM
70
0
1
0
0
0
8.94
3.44
2.09
60
50
40
30
2
16.03
22.45
27.78
34.40
39.38
45.53
50.65
55.79
60.58
65.31
70.60
75.69
80.29
84.24
6.78
4.27
3
10.09
13.89
17.53
20.70
23.64
27.50
30.96
34.44
37.84
40.46
43.35
46.18
49.24
6.51
4
8.83
5
11.11
13.45
15.79
18.11
20.36
22.57
25.05
27.26
29.49
31.74
34.05
6
20
10
0
7
8
9
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
10
11
12
13
14
15
Dissipated Power (W)
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
cuidevices.com
Additional Resources: Product Page
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3D Model
CUI Devices │ SERIES: HSE-BX-035H │ DESCRIPTION: HEAT SINK
date 08/17/2020│ page 6 of 8
PERFORMANCE CURVES (CONTINUED)
HSE-B18635-035H-04
100
90
Without Airflow
200 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
400 LFM
80
Power
(W)
Natural
Conv.
200 LFM
400 LFM
70
0
1
0
0
0
60
50
40
30
20
7.90
2.38
1.66
2
14.77
20.74
26.09
31.33
36.21
41.13
45.64
50.06
55.04
59.16
63.79
67.33
70.81
74.62
78.52
81.87
85.40
89.13
92.50
5.01
3.29
3
7.86
5.00
4
10.53
12.95
15.76
18.39
21.04
23.72
26.59
29.04
31.69
34.48
37.15
39.59
41.91
44.42
46.92
49.57
52.19
6.72
5
8.40
6
10.10
11.96
13.63
15.39
17.14
18.78
20.63
22.54
23.69
25.98
27.94
29.96
31.91
33.56
34.89
7
8
10
0
9
10
11
12
13
14
15
16
17
18
19
20
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20
Dissipated Power (W)
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
cuidevices.com
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3D Model
CUI Devices │ SERIES: HSE-BX-035H │ DESCRIPTION: HEAT SINK
date 08/17/2020│ page 7 of 8
MECHANICAL DRAWING
units: mm
tolerance: ±0.5 mm
MATERIAL
AL 6063-T5
black anodized
steel
FINISH
PIN MATERIAL
PIN PLATING
tin
LENGTH, L
(mm)
WEIGHT
MODEL NO.
(g)
HSE-B18254-035H-00
HSE-B18317-035H-01
HSE-B18381-035H-02
HSE-B18508-035H-03
HSE-B18635-035H-04
25.4
31.75
38.1
50.8
63.5
20
23
28.34
37.8
50
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3D Model
CUI Devices │ SERIES: HSE-BX-035H │ DESCRIPTION: HEAT SINK
date 08/17/2020│ page 8 of 8
REVISION HISTORY
rev.
description
date
1.0
initial release
brand update
05/12/2017
02/10/2020
08/17/2020
1.01
1.02
added pin dimensions
The revision history provided is for informational purposes only and is believed to be accurate.
CUI Devices offers a one (1) year limited warranty. Complete warranty information is listed on our website.
CUI Devices reserves the right to make changes to the product at any time without notice. Information provided by CUI Devices is believed to be accurate and reliable. However, no
responsibility is assumed by CUI Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use.
CUI Devices products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any
component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
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