CTL0503NS-R3 [CTMICRO]

N-Channel Enhancement MOSFET;
CTL0503NS-R3
型号: CTL0503NS-R3
厂家: CT Micro International Corporation    CT Micro International Corporation
描述:

N-Channel Enhancement MOSFET

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中文:  中文翻译
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CTL0503NS-R3  
N-Channel Enhancement MOSFET  
Features  
Description  
The CTL0503NS-R3 uses high performance Trench  
Technology to provide excellent RDS(ON) and low gate  
charge which is suitable for most of the synchronous  
buck converter applications .  
Drain-Source Breakdown Voltage VDSS 30 V  
Drain-Source On-Resistance  
R
DS(ON) 26.5m  
, at VGS= 10V, IDS= 6.0A  
, at VGS= 4.5V, IDS= 5.0A  
, at VGS= 2.5V, IDS= 4.0A  
RDS(ON) 28.5m  
RDS(ON) 38.5m  
Continuous Drain Current at TA=25 ID = 5.0A  
Advanced high cell density Trench Technology  
RoHS Compliance & Halogen Free  
ESD protection  
Applications  
Power Management  
Portable Equipment  
Load Switch  
Package Outline  
Schematic  
Drain  
Drain  
Gate  
Source  
Gate  
Source  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 1  
CTL0503NS-R3  
N-Channel Enhancement MOSFET  
Absolute Maximum Rating at 25oC  
Symbol  
VDS  
VGS  
ID  
Parameters  
Ratings  
30  
Units  
V
Notes  
Drain-Source Voltage  
Gate-Source Voltage  
12  
V
Continuous Drain Current @TA=25  
5.0  
A
1
1
2
Pulsed Drain Current  
15  
A
IDM  
Total Power Dissipation @TA=25  
1.4  
W
PD  
Storage Temperature Range  
-55 to 150  
-55 to 150  
oC  
oC  
TSTG  
TJ  
Operating Junction Temperature Range  
Thermal Characteristics  
Symbol  
Parameters  
Test Conditions  
Min  
Typ  
Max  
Units Notes  
Thermal Resistance  
Junction-Ambient (t=10s)  
-
175  
-
oC /W  
1,4  
RӨ  
JA  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 2  
CTL0503NS-R3  
N-Channel Enhancement MOSFET  
Electrical Characteristics TA = 25°C (unless otherwise specified)  
Static Characteristics  
Symbol  
BVDSS  
IDSS  
Parameters  
Test Conditions  
VGS=0V, ID= 250µA  
VDS = 30V, VGS = 0V  
VGS = 16V, VDS = 0V  
Min  
Typ  
Max  
Units Notes  
Drain-Source Breakdown Voltage  
Drain-Source Leakage Current  
Gate-Source Leakage Current  
30  
-
-
-
-
-
V
1
µA  
µA  
IGSS  
-
10  
On Characteristics  
Symbol  
RDS(ON)  
VGS(TH)  
Parameters  
Test Conditions  
VGS = 10V, ID = 6.0A  
VGS = 4.5V, ID = 5.0A  
VGS = 2.5V, ID = 4.0A  
VGS = VDS, ID =250µA  
Min  
Typ  
26.5  
28.5  
38.5  
-
Max  
35  
Units  
mΩ  
mΩ  
mΩ  
V
Notes  
-
-
Drain-Source On-Resistance  
Gate-Source Threshold Voltage  
40  
3
3
-
45  
0.7  
1.4  
Dynamic Characteristics  
Symbol  
Parameters  
Input Capacitance  
Test Conditions  
VDS = 10V ,  
VGS = 0V,  
Min  
Typ  
600  
61  
Max  
Units  
Notes  
-
-
-
-
-
-
CISS  
Output Capacitance  
pF  
COSS  
CRSS  
f=1MHz  
Reverse Transfer Capacitance  
50  
Switching Characteristics  
Symbol  
TD(ON)  
TR  
Parameters  
Turn-On Delay Time  
Rise Time  
Test Conditions  
Min  
Typ  
2
Max  
Units  
Notes  
-
-
-
-
-
-
-
-
-
-
31.2  
16.7  
6.7  
70  
V
DS = 10V , VGS = 4.5V,  
ns  
RG = 6, ID =5.0A  
Turn-Off Delay Time  
Fall Time  
TD(OFF)  
TF  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain (Miller) Charge  
-
-
-
QG  
VDS = 10V , VGS = 4.5V,  
ID = 5.0A  
1.5  
2
nC  
QGS  
QGD  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 3  
CTL0503NS-R3  
N-Channel Enhancement MOSFET  
Drain-Source Diode Characteristics  
Symbol  
Parameters  
Test Conditions  
Min  
Typ  
Max  
1.2  
Units  
Notes  
Body Diode Forward Voltage  
Body Diode Continuous Current  
VGS = 0V, ID = 5.0A  
V
A
VSD  
5.0  
1
ISD  
Note:  
1. The power dissipation is limited by 150  
2. Device mounted on a glass-epoxy board  
junction temperature.  
FR-4  
25.4 × 25.4 mm .  
2 Oz Copper  
Actual Size  
3. The data tested by pulsed , pulse width  
4. Thermal Resistance follow JESD51-3.  
300 s , duty cycle  
2%  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 4  
CTL0503NS-R3  
N-Channel Enhancement MOSFET  
Typical Characteristic Curves  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 5  
CTL0503NS-R3  
N-Channel Enhancement MOSFET  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 6  
CTL0503NS-R3  
N-Channel Enhancement MOSFET  
Test Circuits & Waveforms  
Figure 12: Gate Charge Test Circuit  
Figure 13: Gate Charge Waveform  
Figure 14: Switching Time Test Circuit  
Figure 15: Switching Time Waveform  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 7  
CTL0503NS-R3  
N-Channel Enhancement MOSFET  
Package Dimension (SC-59)  
Recommended pad layout for surface mount leadform  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 8  
CTL0503NS-R3  
N-Channel Enhancement MOSFET  
Marking Information  
0 5 0 3  
0503  
: Device Number  
Ordering Information  
Part Number  
Description  
Quantity  
CTL0503NS-R3  
SC-59 Reel  
3000 pcs  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 9  
CTL0503NS-R3  
N-Channel Enhancement MOSFET  
Reflow Profile  
Profile Feature  
Pb-Free Assembly Profile  
150°C  
Temperature Min. (Tsmin)  
Temperature Max. (Tsmax)  
Time (ts) from (Tsmin to Tsmax)  
Ramp-up Rate (tL to tP)  
200°C  
60-120 seconds  
3°C/second max.  
217°C  
Liquidous Temperature (TL)  
Time (tL) Maintained Above (TL)  
Peak Body Package Temperature  
Time (tP) within 5°C of 260°C  
Ramp-down Rate (TP to TL)  
Time 25°C to Peak Temperature  
60 – 150 seconds  
260°C +0°C / -5°C  
30 seconds  
6°C/second max  
8 minutes max.  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 10  
CTL0503NS-R3  
N-Channel Enhancement MOSFET  
DISCLAIMER  
CT MICRO RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. CT MICRO DOES NOT ASSUME ANY LIABILITY  
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
______________________________________________________________________________________  
CT MICROELECTRONICS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT EXPRESS WRITTTEN APPROVAL OF CT MICROELECTRONICS LTD.  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical  
implant into the body, or (b) support or sustain life,  
or (c) whose failure to perform when properly used  
in accordance with instruction for use provided in  
the labelling, can be reasonably expected to result  
in significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 11  

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