XQ-B [CREE]
XLamp XQ-B LED;Product family data sheet
Cree® XLamp® XQ-B LED
PRODUCT DESCRIPTION
FEATURES
TABLE OF CONTENTS
Crꢀꢀ XLamp® XQ-B LeDs rꢀꢁolutionizꢀ
mid-powꢀr LeDs by dꢀliꢁꢀring lighting-
class rꢀliability and a widꢀr sprꢀad of
light than typical plastic packagꢀs. Thꢀ
XQ-B’s innoꢁatiꢁꢀ widꢀ light ꢀmission
ꢀnablꢀs a smooth look in rꢀplacꢀmꢀnt
tubꢀs and panꢀl lights whilꢀ rꢀducing
systꢀm cost by using fꢀwꢀr LeDs.
•ꢀ Crꢀꢀ’s smallꢀst lighting class LeD:
1.6ꢀXꢀ1.6ꢀXꢀ1.6 mm
Charactꢀristics....................................... 2
FluxꢀCharacteristics ............................... 2
Rꢀlatiꢁꢀ Spꢀctral Powꢀr Distribution .... 3
RelativeꢀFluxꢀvs.ꢀJunctionꢀ
•ꢀ Aꢁailablꢀ in whitꢀ, 80-minimum CRI
whitꢀ and 70-minimum CRI cool
whitꢀ
Tꢀmpꢀraturꢀ........................................... 3
elꢀctrical Charactꢀristics....................... 4
RelativeꢀFluxꢀvs.ꢀCurrent ........................ 4
Typical Spatial Distribution.................... 5
Thꢀrmal Dꢀsign...................................... 5
ReflowꢀSolderingꢀCharacteristics.......... 6
Notꢀs ...................................................... 7
Mꢀchanical Dimꢀnsions ........................ 9
Tapꢀ and Rꢀꢀl....................................... 10
Packaging............................................. 11
•ꢀ 300 mAꢀmaximumꢀdriveꢀcurrent
•ꢀ Lowꢀthermalꢀresistance:ꢀ17 °C/W
•ꢀ Wideꢀviewingꢀangle:ꢀ140°
•ꢀ Reflowꢀsolderableꢀ-ꢀJEDECꢀ
J-STD-020Cꢀcompatible
Using Crꢀꢀ’s nꢀwꢀst gꢀnꢀration of
silicon carbidꢀ-basꢀd LeD chips, XQ-B is
optimizꢀd to dramatically lowꢀr systꢀm
cost in non-dirꢀctional and outdoor arꢀa
lighting applications.
•ꢀ Unlimitedꢀfloorꢀlifeꢀatꢀ≤ꢀ30 °C/85%ꢀRH
•ꢀ RoHSꢀandꢀREAChꢀcompliant
•ꢀ UL® rꢀcognizꢀd componꢀnt
(E349212)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
XLamp® XQ-B LED
ChARACTERISTICS
Cꢀaracteristics
Unit
Minimum
Typical
Maximum
Thꢀrmal rꢀsistancꢀ, junction to soldꢀr point
Viewingꢀangleꢀ(FWHM)
°C/W
dꢀgrꢀꢀs.
mV/°C
17
140
Temperatureꢀcoefficientꢀofꢀvoltage
ESDꢀclassificationꢀ(HBMꢀperꢀMil-Std-883D)
DC forward currꢀnt
-2.0
Class 1
80
mA
v
300
-5
Rꢀꢁꢀrsꢀ ꢁoltagꢀ
Forwardꢀvoltageꢀ(@ 80 mA,ꢀ25 °C)
LeD junction tꢀmpꢀraturꢀ
v
3.0
3.4
150
°C
FLUX ChARACTERISTICS (TJ = 25 °C)
Thꢀ following tablꢀ proꢁidꢀs sꢀꢁꢀral basꢀ ordꢀr codꢀs for XLamp XQ-B LeDs. It is important to notꢀ that thꢀ basꢀ ordꢀr codꢀs listꢀd hꢀrꢀ
arꢀ a subsꢀt of thꢀ total aꢁailablꢀ ordꢀr codꢀs for thꢀ product family. For morꢀ ordꢀr codꢀs, as wꢀll as a complꢀtꢀ dꢀscription of thꢀ ordꢀr-
codꢀ nomꢀnclaturꢀ, plꢀasꢀ consult thꢀ XLamp XQ LeD Family Binning and Labꢀling documꢀnt.
Calculated
Minimum Luminous Flux
Minimum
Luminous Flux
(lm)*
CCT Range
@ 80 mA
Color
Order Code
Min.
Max.
Group
K2
Flux (lm)
30.6
150 mA
52.5
52.5
46
CoolꢀWhite
NeutralꢀWhite
WarmꢀWhite
5000 K
3700 K
2600ꢀK
8300 K
XQBAWT-00-0000-00000L051
XQBAWT-00-0000-00000H0E5
XQBAWT-00-0000-00000HXE5
XQBAWT-00-0000-00000HXE7
K2
30.6
5000 K
3700 K
ꢀJ3
26.8
J3
26.8
46
Notꢀs:
•ꢀ Creeꢀmaintainsꢀaꢀtoleranceꢀofꢀ±7%ꢀonꢀfluxꢀandꢀpowerꢀmeasurements,ꢀ±0.005ꢀonꢀchromaticityꢀ(CCx,ꢀCCy)ꢀmeasurementsꢀandꢀ±2ꢀonꢀCRIꢀ
measurements.ꢀSeeꢀtheꢀMeasurementsꢀsectionꢀ(pageꢀ7).
•ꢀ TypicalꢀCRIꢀforꢀNeutralꢀWhite,ꢀ3700 Kꢀ-ꢀ5000 KꢀCCTꢀisꢀ75.
•ꢀ TypicalꢀCRIꢀforꢀWarmꢀWhite,ꢀ2600 Kꢀ-ꢀ3700 KꢀCCTꢀisꢀ80.
•ꢀ MinimumꢀCRIꢀforꢀ70ꢀCRIꢀMinimumꢀCoolꢀWhiteꢀisꢀ70.
•ꢀ MinimumꢀCRIꢀforꢀ80ꢀCRIꢀMinimumꢀWhiteꢀisꢀ80.
*
Calculatedꢀfluxꢀvaluesꢀatꢀ150 mAꢀareꢀforꢀreferenceꢀonly.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
2
XLamp® XQ-B LED
RELATIvE SPECTRAL POwER DISTRIBUTION
100
80
60
40
20
0
Cool White
Neutral White
Warm White
380
430
480
530
580
630
680
730
780
Wavelength (nm)
RELATIvE FLUX vS. JUNCTION TEMPERATURE (IF = 80 mA)
100
90
80
70
60
50
40
30
20
10
0
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
3
XLamp® XQ-B LED
ELECTRICAL ChARACTERISTICS (TJ = 25 °C)
300
250
200
150
100
50
0
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
Forward Voltage (V)
RELATIvE FLUX vS. CURRENT (TJ = 25 °C)
300
250
200
150
100
50
0
0
50
100
150
200
250
300
Forward Current (mA)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
4
XLamp® XQ-B LED
TꢁPICAL SPATIAL DISTRIBUTION
110
100
90
80
70
60
50
40
30
20
10
0
-90
-70
-50
-30
-10
10
30
50
70
90
Angle (º)
ThERMAL DESIGN
TheꢀmaximumꢀforwardꢀcurrentꢀisꢀdeterminedꢀbyꢀtheꢀthermalꢀresistanceꢀbetweenꢀtheꢀLEDꢀjunctionꢀandꢀambient.ꢀItꢀisꢀcrucialꢀforꢀtheꢀendꢀ
product to bꢀ dꢀsignꢀd in a mannꢀr that minimizꢀs thꢀ thꢀrmal rꢀsistancꢀ from thꢀ soldꢀr point to ambiꢀnt in ordꢀr to optimizꢀ lamp lifꢀ
and optical charactꢀristics.
350
300
250
200
150
Rj-a = 20°C/W
100
Rj-a = 25°C/W
Rj-a = 30°C/W
50
Rj-a = 35°C/W
0
0
20
40
60
80
100
120
140
160
Ambient Temperature (ºC)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
5
XLamp® XQ-B LED
REFLOw SOLDERING ChARACTERISTICS
Inꢀtesting,ꢀCreeꢀhasꢀfoundꢀXLampꢀXQ-BꢀLEDsꢀtoꢀbeꢀcompatibleꢀwithꢀJEDECꢀJ-STD-020C,ꢀusingꢀtheꢀparametersꢀlistedꢀbelow.ꢀAsꢀaꢀgeneralꢀ
guideline,ꢀCreeꢀrecommendsꢀthatꢀusersꢀfollowꢀtheꢀrecommendedꢀsolderingꢀprofileꢀprovidedꢀbyꢀtheꢀmanufacturerꢀofꢀtheꢀsolderꢀpasteꢀused.
NoteꢀthatꢀthisꢀgeneralꢀguidelineꢀmayꢀnotꢀapplyꢀtoꢀallꢀPCBꢀdesignsꢀandꢀconfigurationsꢀofꢀreflowꢀsolderingꢀequipment.
tP
Critical Zone
TL to TP
TP
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
IPC/JEDECꢀJ-STD-020C
Time
Profile Feature
Lead-Free Solder
Aꢁꢀragꢀ Ramp-Up Ratꢀ (TsmaxꢀtoꢀTp)
Prꢀhꢀat: Tꢀmpꢀraturꢀ Min (Tsmin)ꢀ
1.2 °C/second
120ꢀ°C
Preheat:ꢀTemperatureꢀMaxꢀ(Tsmax
Prꢀhꢀat: Timꢀ (tsmin to tsmax
)
170ꢀ°C
65-150 sꢀconds
217ꢀ°C
)
Timꢀ Maintainꢀd Aboꢁꢀ: Tꢀmpꢀraturꢀ (TL)
Timꢀ Maintainꢀd Aboꢁꢀ: Timꢀ (tL)
45-90ꢀseconds
Peak/ClassificationꢀTemperatureꢀ(Tp)
235ꢀ-ꢀ245ꢀ°C
TimeꢀWithinꢀ5 °CꢀofꢀActualꢀPeakꢀTemperatureꢀ(tp)
Ramp-Down Ratꢀ
20-40ꢀseconds
1ꢀ-ꢀ6ꢀ°C/second
4ꢀminutesꢀmax.
Timeꢀ25 °CꢀtoꢀPeakꢀTemperature
Notꢀ: All tꢀmpꢀraturꢀs rꢀfꢀr to topsidꢀ of thꢀ packagꢀ, mꢀasurꢀd on thꢀ packagꢀ body surfacꢀ.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
6
XLamp® XQ-B LED
NOTES
Measurements
Theꢀ luminousꢀ flux,ꢀ radiantꢀ power,ꢀ chromaticityꢀ andꢀ CRIꢀ measurementsꢀ inꢀ thisꢀ documentꢀ areꢀ binningꢀ specificationsꢀ onlyꢀ andꢀ solelyꢀ
rꢀprꢀsꢀnt product mꢀasurꢀmꢀnts as of thꢀ datꢀ of shipmꢀnt. Thꢀsꢀ mꢀasurꢀmꢀnts will changꢀ oꢁꢀr timꢀ basꢀd on a numbꢀr of factors
thatꢀareꢀnotꢀwithinꢀCree’sꢀcontrolꢀandꢀareꢀnotꢀintendedꢀorꢀprovidedꢀasꢀoperationalꢀspecificationsꢀforꢀtheꢀproducts.ꢀCalculatedꢀvaluesꢀareꢀ
providedꢀforꢀinformationalꢀpurposesꢀonlyꢀandꢀareꢀnotꢀintendedꢀasꢀspecifications.
Pre‑Release Qualification Testing
Plꢀasꢀ rꢀad thꢀ LeD Rꢀliability OꢁꢀrꢁiꢀwꢀforꢀdetailsꢀofꢀtheꢀqualificationꢀprocessꢀCreeꢀappliesꢀtoꢀensureꢀlong-termꢀreliabilityꢀforꢀXLampꢀ
LEDsꢀandꢀdetailsꢀofꢀCree’sꢀpre-releaseꢀqualificationꢀtestingꢀforꢀXLampꢀLEDs.
Lumen Maintenance
CreeꢀnowꢀusesꢀstandardizedꢀIESꢀLM-80-08ꢀandꢀTM-21-11ꢀmethodsꢀforꢀcollectingꢀlong-termꢀdataꢀandꢀextrapolatingꢀLEDꢀlumenꢀmaintenance.ꢀ
ForꢀinformationꢀonꢀtheꢀspecificꢀLM-80ꢀdataꢀsetsꢀavailableꢀforꢀthisꢀLED,ꢀreferꢀtoꢀtheꢀpublicꢀLM-80 rꢀsults documꢀnt.
Plꢀasꢀ rꢀad thꢀ Long-Tꢀrm Lumꢀn Maintꢀnancꢀ application notꢀ for morꢀ dꢀtails on Crꢀꢀ’s lumꢀn maintꢀnancꢀ tꢀsting and forꢀcasting.
Plꢀasꢀ rꢀad thꢀ Thꢀrmal Managꢀmꢀnt application notꢀ for dꢀtails on how thꢀrmal dꢀsign, ambiꢀnt tꢀmpꢀraturꢀ, and driꢁꢀ currꢀnt affꢀct
thꢀ LeD junction tꢀmpꢀraturꢀ.
Moisture Sensitiꢂity
CreeꢀrecommendsꢀkeepingꢀXLampꢀLEDsꢀinꢀtheꢀprovided,ꢀresealableꢀmoisture-barrierꢀpackagingꢀ(MBP)ꢀuntilꢀimmediatelyꢀpriorꢀtoꢀsoldering.ꢀ
Unopꢀnꢀd MBPs that contain XLamp LeDs do not nꢀꢀd spꢀcial storagꢀ for moisturꢀ sꢀnsitiꢁity.
OnceꢀtheꢀMBPꢀisꢀopened,ꢀXLampꢀXQ-BꢀLEDsꢀmayꢀbeꢀstoredꢀasꢀMSLꢀ1ꢀperꢀJEDECꢀJ-STD-033,ꢀmeaningꢀtheyꢀhaveꢀunlimitedꢀfloorꢀlifeꢀinꢀ
conditionsꢀofꢀ≤ꢀ30ꢀºC/85%ꢀrelativeꢀhumidityꢀ(RH).ꢀRegardlessꢀofꢀstorageꢀcondition,ꢀCreeꢀrecommendsꢀsealingꢀanyꢀunsolderedꢀLEDsꢀinꢀtheꢀ
original MBP.
RohS Compliance
TheꢀlevelsꢀofꢀRoHSꢀrestrictedꢀmaterialsꢀinꢀthisꢀproductꢀareꢀbelowꢀtheꢀmaximumꢀconcentrationꢀvaluesꢀ(alsoꢀreferredꢀtoꢀasꢀtheꢀthresholdꢀ
limits)ꢀpermittedꢀforꢀsuchꢀsubstances,ꢀorꢀareꢀusedꢀinꢀanꢀexemptedꢀapplication,ꢀinꢀaccordanceꢀwithꢀEUꢀDirectiveꢀ2011/65/ECꢀ(RoHS2),ꢀasꢀ
implementedꢀJanuaryꢀ2,ꢀ2013.ꢀRoHSꢀDeclarationsꢀforꢀthisꢀproductꢀcanꢀbeꢀobtainedꢀfromꢀyourꢀCreeꢀrepresentativeꢀorꢀfromꢀtheꢀProductꢀ
Documꢀntation sꢀctions of www.crꢀꢀ.com.
REACꢀ Compliance
REAChꢀsubstancesꢀofꢀveryꢀhighꢀconcernꢀ(SVHCs)ꢀinformationꢀisꢀavailableꢀforꢀthisꢀproduct.ꢀSinceꢀtheꢀEuropeanꢀChemicalꢀAgencyꢀ(ECHA)ꢀ
hasꢀpublishedꢀnoticeꢀofꢀtheirꢀintentꢀtoꢀfrequentlyꢀreviseꢀtheꢀSVHCꢀlistingꢀforꢀtheꢀforeseeableꢀfuture,ꢀpleaseꢀcontactꢀaꢀCreeꢀrepresentativeꢀtoꢀ
insureꢀyouꢀgetꢀtheꢀmostꢀup-to-dateꢀREAChꢀSVHCꢀDeclaration.ꢀREAChꢀbannedꢀsubstanceꢀinformationꢀ(REAChꢀArticleꢀ67)ꢀisꢀalsoꢀavailableꢀ
uponꢀrequest.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
7
XLamp® XQ-B LED
NOTES - CONTINUED
UL® Recognized Component
Levelꢀ1ꢀenclosureꢀconsideration.ꢀTheꢀLEDꢀpackageꢀorꢀaꢀportionꢀthereofꢀhasꢀnotꢀbeenꢀinvestigatedꢀasꢀaꢀfireꢀenclosureꢀorꢀaꢀfireꢀandꢀelectricalꢀ
enclosureꢀperꢀANSI/ULꢀ8750.
vision Adꢂisory
WARNING:ꢀDoꢀnotꢀlookꢀatꢀexposedꢀlampꢀinꢀoperation.ꢀEyeꢀinjuryꢀcanꢀresult.ꢀForꢀmoreꢀinformationꢀaboutꢀLEDsꢀandꢀeyeꢀsafety,ꢀpleaseꢀreferꢀ
to thꢀ LeD eyꢀ Safꢀty application notꢀ.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
8
XLamp® XQ-B LED
MEChANICAL DIMENSIONS
All dimꢀnsions in mm.
Measurementꢀtolerancesꢀunlessꢀindicatedꢀotherwise:ꢀ±13 mm
1.60
.600
.600
NOTCH IS ON
CATHODE (-) SIDE
1.41
1.500
1.60
1.60± .05
.300
1.500
.300
.65
SOLDER PAD
REFERENCE
.30
3.300
1.60
1.60
Recommended PCB solder pad
3.300
Recommended trace layout
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
9
XLamp® XQ-B LED
TAPE AND REEL
AllꢀCreeꢀcarrierꢀtapesꢀconformꢀtoꢀEIA-481D,ꢀAutomatedꢀComponentꢀHandlingꢀSystemsꢀStandard.
Unlꢀss othꢀrwisꢀ indicatꢀd, all dimꢀnsions in mm.
Measurementꢀtolerancesꢀunlessꢀindicatedꢀotherwise:ꢀ.xxꢀ=ꢀ±.25 mm,ꢀ.xxxꢀ=ꢀ.ꢀ±ꢀ125 mm
1.500
+.10
4.000
-.00
CATHODE SIDE
1.750
A
1.65
8.000
NOMINAL
8.30
MAX
1.85
1.000
A
3.50 ±.10
.30 ± .10
2.000
ANODE SIDE
User Feed Direction
END
START
Loaded Pockets
(2,000 Lamps)
Trailer
Leader
160 mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
400 mm (min) of
empty pockets with
at least 100 mm
sealed by tape
(50 empty pockets min.)
User Feed Direction
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
10
XLamp® XQ-B LED
PACkAGING
Thꢀ diagrams bꢀlow show thꢀ packaging and labꢀls Crꢀꢀ usꢀs to ship XLamp XQ-B LeDs. XLamp XQ-B LeDs arꢀ shippꢀd in tapꢀ loadꢀd
onꢀaꢀreel.ꢀEachꢀboxꢀcontainsꢀonlyꢀoneꢀreelꢀinꢀaꢀmoistureꢀbarrierꢀbag.
Unpackaged Reel
Label with Cree Bin Code,
Quantity, Reel ID
Packaged Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
11
相关型号:
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