C3D1P7060Q

更新时间:2024-09-18 12:53:02
品牌:CREE
描述:Silicon Carbide Schottky Diode

C3D1P7060Q 概述

Silicon Carbide Schottky Diode 碳化硅肖特基二极管

C3D1P7060Q 数据手册

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C3D1P7060Q  
VRRM  
IF; TC<150˚C=ꢀ1.7ꢀA  
Qcꢀ ꢀꢀꢀ=ꢀꢀ 5.6ꢀnC  
=
600 V  
Silicon Carbide Schottky Diode  
Z-Rec RectifieR  
Features  
Package  
•ꢀ 600-VoltꢀSchottkyꢀRectifier  
•ꢀ OptimizedꢀforꢀPFCꢀBoostꢀDiodeꢀApplication  
•ꢀ ZeroꢀReverseꢀRecoveryꢀCurrent  
•ꢀ High-FrequencyꢀOperation  
•ꢀ Temperature-IndependentꢀSwitchingꢀBehavior  
•ꢀ ExtremelyꢀFastꢀSwitching  
•ꢀ PositiveꢀTemperatureꢀCoefficientꢀonꢀVF  
ꢀꢀꢀꢀꢀPowerQFNꢀ3.3x3.3ꢀ ꢀꢀꢀꢀꢀꢀꢀ  
Benefits  
•ꢀ Smallꢀcompactꢀsurfaceꢀmountꢀpackage  
•ꢀ EssentiallyꢀNoꢀSwitchingꢀLosses  
•ꢀ HigherꢀEfficiency  
•ꢀ ReductionꢀofꢀHeatꢀSinkꢀRequirements  
•ꢀ ParallelꢀDevicesꢀWithoutꢀThermalꢀRunaway  
Applications  
Part Number  
Package  
Marking  
C3D1P7060  
•ꢀ SwitchꢀModeꢀPowerꢀSuppliesꢀ  
•ꢀ LEDꢀLightingꢀ  
C3D1P7060Q  
QFNꢀ3.3  
Maximum Ratings  
Symbol Parameter  
Value  
Unit  
Test Conditions  
Note  
VRRM  
VRSM  
VDC  
RepetitiveꢀPeakꢀReverseꢀVoltage  
SurgeꢀPeakꢀReverseꢀVoltage  
DCꢀBlockingꢀVoltage  
600  
600  
600  
V
V
V
1.7  
3
A
A
TC<150˚C,ꢀNoꢀACꢀComponent  
TC<135˚C,ꢀNoꢀACꢀComponent  
See  
Figꢀ3  
IF  
ContinuousꢀForwardꢀCurrent  
7
4.4  
TC=25˚C,ꢀtP=10ꢀms,ꢀHalfꢀSineꢀpulseꢀ  
TC=110˚C,ꢀtP=10ꢀms,ꢀHalfꢀSineꢀpulse  
IFRM  
RepetitiveꢀPeakꢀForwardꢀSurgeꢀCurrent  
Non-RepetitiveꢀPeakꢀForwardꢀSurgeꢀCurrent  
PowerꢀDissipation  
A
A
15  
12  
TC=25˚C,ꢀtP=10ꢀms,ꢀHalfꢀSineꢀpulse  
TC=110˚C,ꢀtP=10ꢀms,ꢀHalfꢀSineꢀpulse  
IFSM  
39  
17  
TC=25˚C  
TC=110˚C  
Ptot  
W
-55 to  
+175  
TJꢀ,ꢀTstg  
OperatingꢀJunctionꢀandꢀStorageꢀTemperature  
MaximumꢀCaseꢀTemperature  
˚C  
˚C  
T
150  
c
Subject to change without notice.  
www.cree.com  
1
Electrical Characteristics  
Symbol Parameter  
Typ.  
Max.  
Unit  
V
Test Conditions  
IFꢀ=ꢀ1.7ꢀAꢀꢀTJ=25°C  
Note  
1.5  
1.8  
1.7  
2.4  
VF  
ForwardꢀVoltage  
ReverseꢀCurrent  
IFꢀ=ꢀ1.7ꢀAꢀꢀTJ=175°C  
10  
20  
50  
100  
VR = 600 V TJ=25°C  
VR = 600 V TJ=175°C  
IR  
μA  
VRꢀ=ꢀ600ꢀV,ꢀIFꢀ=ꢀ1.7A  
di/dtꢀ=ꢀ500ꢀA/μs  
TJꢀ=ꢀ25°C  
QC  
C
TotalꢀCapacitiveꢀCharge  
TotalꢀCapacitance  
5.6  
nC  
pF  
100  
7
6
VRꢀ=ꢀ0ꢀV,ꢀTJꢀ=ꢀ25°C,ꢀfꢀ=ꢀ1ꢀMHz  
VRꢀ=ꢀ200ꢀV,ꢀTJꢀ=ꢀ25˚C,ꢀfꢀ=ꢀ1ꢀMHz  
VRꢀ=ꢀ400ꢀV,ꢀTJꢀ=ꢀ25˚C,ꢀfꢀ=ꢀ1ꢀMHz  
Note:  
1.Thisꢀisꢀaꢀmajorityꢀcarrierꢀdiode,ꢀsoꢀthereꢀisꢀnoꢀreverseꢀrecoveryꢀcharge.  
Thermal Characteristics  
Symbol Parameter  
Typ.  
3.8  
Unit  
RθJC  
PackageꢀThermalꢀResistanceꢀfromꢀJunctionꢀtoꢀCase  
°C/W  
Typical Performance  
10.00  
9.00  
8.00  
7.00  
6.00  
5.00  
4.00  
3.00  
2.00  
1.00  
0.00  
3.5  
3.0  
TJ=-55°C  
TJ=ꢀ25°C  
TJ=ꢀ75°C  
TJꢀ=125°C  
2.5  
TJꢀ=150°C  
2.0  
1.5  
1.0  
0.5  
0.0  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
200  
400  
600  
800  
1000  
1200  
VF (V)  
VR (V)  
Figureꢀ1.ꢀForwardꢀCharacteristics  
Figureꢀ2.ꢀReverseꢀCharacteristics  
2
C3D1P7060Q Rev. -  
Typical Performance  
40.0  
35.0  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
18  
16  
14  
12  
10  
8
20%ꢀDuty*  
ꢀꢀ30%ꢀDuty*  
ꢀꢀ50%ꢀDuty*  
ꢀꢀ70%ꢀDuty*  
ꢀꢀDC  
6
4
2
0.0  
0
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
TC ˚C  
TC ˚C  
Figureꢀ3.ꢀCurrentꢀDerating  
Figureꢀ4.ꢀPowerꢀDerating  
9
8
7
6
5
4
3
2
1
0
120  
100  
80  
60  
40  
20  
0
0
100  
200  
300  
400  
500  
600  
0.1  
1
10  
VR (V)  
100  
1000  
VR (V)  
ꢀꢀꢀꢀꢀꢀFigureꢀ5.ꢀRecoveryꢀChargeꢀvs.ꢀReverseꢀVoltageꢀ  
Figureꢀ6.ꢀCapacitanceꢀvs.ꢀReverseꢀVoltage  
3
C3D1P7060Q Rev. -  
Typical Performance  
10  
1
0.1  
0.01  
1E-6  
10E-6  
100E-6  
1E-3  
10E-3  
100E-3  
T (Sec)  
Figureꢀ7.ꢀTransientꢀThermalꢀImpedance  
Diode Model  
VfT = VT+If*RT  
T =ꢀ0.99+(TJ*ꢀ-1.5*10-3)  
V
T =ꢀ0.22+(TJ*ꢀ2.6*10-3)  
R
Note: Tj = Diode Junction Temperature In Degrees Celcius  
VT  
RT  
4
C3D1P7060Q Rev. -  
Package Dimensions  
PackageꢀQFNꢀ3.3  
AllꢀDimensionsꢀareꢀinꢀmm  
Tolerancesꢀareꢀ0.05ꢀmmꢀifꢀnotꢀspecified  
NCꢀ=ꢀNoꢀConnect  
5
C3D1P7060Q Rev. -  
Recommended Landing Pattern (All Dimensions are in mm)  
Note:ꢀTheꢀdesignꢀofꢀtheꢀlandꢀpatternꢀandꢀtheꢀsizeꢀofꢀtheꢀthermalꢀpadꢀdependꢀmainlyꢀonꢀtheꢀthermalꢀcharacteristicꢀ  
andꢀpowerꢀdissipation.ꢀInꢀgeneral,ꢀtheꢀsizeꢀofꢀtheꢀthermalꢀpadꢀshouldꢀbeꢀasꢀcloseꢀtoꢀtheꢀexposedꢀpadꢀofꢀtheꢀpackageꢀ  
asꢀpossible,ꢀprovidedꢀthatꢀthereꢀisꢀnoꢀbridgingꢀbetweenꢀtheꢀthermalꢀpadꢀandꢀtheꢀleadꢀpads.  
Theꢀ0.050mmꢀextraꢀlengthꢀandꢀwidthꢀprovidesꢀspaceꢀtoꢀaccommodateꢀtheꢀplacementꢀtoleranceꢀofꢀtheꢀcomponentꢀ  
duringꢀpickꢀandꢀplaceꢀprocess.ꢀTheꢀ0.150mmꢀalongꢀtheꢀperimeterꢀpresentꢀareasꢀforꢀsolderꢀtoꢀformꢀfilletꢀalongꢀtheꢀ  
sideꢀmetalꢀedgesꢀofꢀtheꢀpackage.  
“Theꢀ levelsꢀ ofꢀ environmentallyꢀ sensitive,ꢀ persistentꢀ biologicallyꢀ toxicꢀ (PBT),ꢀ persistentꢀ organicꢀ pollutantsꢀ (POP),ꢀ orꢀ otherwiseꢀ restrictedꢀ materialsꢀ inꢀ  
thisproductarebelowthemaximumconcentrationvalues(alsoreferredtoasthethresholdlimits)permittedforsuchsubstances,orareusedinanꢀ  
exemptedꢀapplication,ꢀinꢀaccordanceꢀwithꢀEUꢀDirectiveꢀ2002/95/ECꢀonꢀtheꢀrestrictionꢀofꢀtheꢀuseꢀofꢀcertainꢀhazardousꢀsubstancesꢀinꢀelectricalꢀandꢀelectronicꢀ  
equipmentꢀ(RoHS),ꢀasꢀamendedꢀthroughꢀAprilꢀ21,ꢀ2006.”  
This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body  
nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited  
to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical  
equipment, aircraft navigation or communication or control systems, air traffic control systems, or weapons systems.  
Cree, Inc.  
4600 Silicon Drive  
Durham, NC 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.313.5451  
www.cree.com/power  
Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the  
Cree logo are registered trademarks and Z-Rec is a trademark of Cree, Inc.  
6
C3D1P7060Q Rev. -  

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