FP1105R1-R12-R [COOPER]
High Current, Low-Profile Power Inductors; 大电流，小尺寸功率电感
| 型号： | FP1105R1-R12-R |
| 厂家： | 
COOPER BUSSMANN, INC. |
| 描述： | High Current, Low-Profile Power Inductors |
| 文件： | 总4页 (文件大小：339K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Current, Low-Profile Power Inductors
FLAT-PAC™ FP1105 Series
Applications
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Portable electronics
• Servers and workstations
• Data networking and storage systems
• Notebook and desktop computers
• Graphics cards and battery power systems
• DCR sensing
SMD Device
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(Range is application specific)
Description
• 125°C maximum total temperature operation
• 11.0 x 8.0 x 4.90mm surface mount package
• Ferrite core material
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 900 parts per reel, 13” dia. reel
• High current carrying capacity
• Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 101nH to 226nH
• Current range from 39 to 81Amps
• Frequency range up to 2MHz
• RoHS compliant
Product Specifications
rms sat sat
Part Number
OCL1 10% (nH) FLL2 Min. (nH)
I
3 (Amps) I 14 @ 25°C (Amps) I 25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6
FP1105R1-R10-R
FP1105R1-R12-R
FP1105R1-R15-R
FP1105R1-R20-R
FP1105R1-R22-R
100
120
150
192
226
72
86
109
138
163
81
66
54
42
39
63
50
42
34
28
467
467
467
467
467
46
0.35 8.6%
1
2
3
Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V , 0.0Adc
rms
4
5
I
I
1: Peak current for approximately 20% rolloff at +25°C.
2: Peak current for approximately 20% rolloff at +125°C.
sat
Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V , I
1
rms sat
sat
I
: DC current for an approximate temperature rise of 40°C without core loss. Derating is
-3
K-factor: Used to determine B for core loss (see graph). B = K L ΔI 10 , B : (Gauss),
* *
p-p p-p
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
rms
6
*
p-p
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
7
Part Number Definition: FP1105Rx-Rxx-R
• FP1105 = Product code and size
• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant
• Rx is the DCR indicator
05-05-08 BU-SB08211
Page 1 of 4
Data Sheet: 4324
Dimensions - mm
A = 11.0 Max.
B = 8.0 Max.
C = 4.9 Max.
Bottom View
D = 2.4 0.2
E = 2.3 0.3
F = 6.2 Typ.
Left View
Schematic
Top View
Recommended Pad Layout
2.8
D
C
b
B
1
E
1
2
2.8
A
F
5.8
1105Rx
Rxx
wwllyy
R
2
a
Nominal DCR is measured from point “a” to point “b.”
Part Marking: Coiltronics Logo
1105Rx (Rx = DCR indicator)
Rxx = inductance value in μH (R = decimal point)
wwllyy = date code
R = revision level
Packaging Information - mm
1.5 dia
A
1.5 dia
4.0
1.75
2.0
SECTION A-A
1
11.5
24.0
+/-0.3
1105Rx
Rxx
11.3
wwllyy
R
2
A
12.0
8.2
5.2
User direction of feed
Supplied in tape-and-reel packaging, 900 parts per reel, 13” diameter reel.
Temperature Rise vs.Total Loss
50
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Total loss (W)
05-05-08 BU-SB08211
Page 2 of 4
Data Sheet: 4324
Inductance Characteristics
OCL vs. I
1
sat
100%
80%
60%
40%
20%
0%
+125°C
+25°C
-40°C
0%
20%
40%
60%
% of I
80%
100%
120%
1
sat
Core Loss
Core Loss vs. B
p-p
1MHz
500kHz
10
1
300kHz
200kHz
100kHz
0.1
0.01
0.001
0.0001
100
1000
10000
B
(Gauss)
p-p
05-05-08 BU-SB08211
Page 3 of 4
Data Sheet: 4324
Solder Reflow Profile
TP
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))
cc
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Volume
Volume
Package
Thickness
<2.5mm
mm3
mm3
_
<350
235°C
220°C
>350
TL
220°C
220°C
Preheat
t
_
>2.5mm
Tsmax
TTaabbllee 22 - LLeeaadd ((PPbb)) FFrreeee SSoolldeerr ((TT ))
cc
Volume
Volume
Volume
mm3
>2000
260°C
245°C
245°C
Tsmin
mm3
mm3
ts
Package
Thickness
<1.6mm
<350
260°C
1.6 – 2.5mm 260°C
>2.5mm 250°C
350 - 2000
260°C
250°C
245°C
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder Lead (Pb) Free Solder
100°C
Preheat and Soak
• Temperature min. (T
)
150°C
smin
• Temperature max. (T
)
150°C
200°C
smax
) (t )
• Time (T
smin
to T
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
smax s
Average ramp up rate T
to T
smax
p
Liquidous temperature (T
Time at liquidous (t )
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
Average ramp-down rate (T to T
c
)
p
Time 25°C to Peak Temperature
smax
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
North America
Europe
Asia Pacific
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Cooper Bussmann
Cooper Electronic Technologies
Cooper (UK) Limited
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Burton-on-the-Wolds
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Tel: +65 278 6151
Fax: +65 270 4160
Fax: +34 937 362 719
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This
bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, with-
out notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any
technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company.
Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in significant injury to the user.
© 2008 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
05-05-08 BU-SB08211
Page 4 of 4
Data Sheet: 4324
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