FP1006R1-R10-R [COOPER]
High Current, High Frequency, Low-Profile Power Inductors; 高电流，高频率，小尺寸功率电感
| 型号： | FP1006R1-R10-R |
| 厂家： | 
COOPER BUSSMANN, INC. |
| 描述： | High Current, High Frequency, Low-Profile Power Inductors |
| 文件： | 总4页 (文件大小：445K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Current, High Frequency, Low-Profile Power Inductors
FLAT-PAC™ FP1006 Series
Applications
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Point-of-load modules
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Notebook regulators
• Graphics cards and battery power systems
• DCR sensing
Environmental Data
SMD Device
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(Range is application specific)
Description
• Halogen free
• Solder reflow temperature: J-STD-020D compliant
Packaging
• 125°C maximum total temperature operation
• 10.2 x 8.0 x 6.0mm surface mount package
• Ferrite core material
• Supplied in tape and reel packaging, 850 parts per reel,
13” diameter reel
• High current carrying capacity, Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 85nH to 220nH
• Current range from 38 to 100 amps
• Frequency range up to 2MHz
• RoHS compliant
Product Specifications
Part Number7
OCL1 1ꢀ0 ꢁ(nH FLL2 Mi(. ꢁ(nH
I
3 ꢁAmpsH I 14 @ 25°C ꢁAmpsH I 25 @ 125°C ꢁAmpsH DCR ꢁmΩH @ 2ꢀ°C K-factor6
rms sat sat
R1 Version
FP1006R1-R08-R
FP1006R1-R10-R
FP1006R1-R12-R
FP1006R1-R16-R
FP1006R1-R22-R
R2 Version
FP1006R2-R08-R
FP1006R2-R10-R
FP1006R2-R12-R
FP1006R2-R16-R
FP1006R2-R22-R
85
100
120
160
220
61
72
86
115
158
100
85
71
55
38
70
64
53
40
28
454
454
454
454
454
53
45
0.27 12%
85
100
120
160
220
61
72
86
115
158
100
85
71
55
38
70
64
53
40
28
454
454
454
454
454
0.36 8.6%
1
2
3
Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V , 0.0Adc
rms
4
5
I
I
1: Peak current for approximately 20% rolloff at +25°C.
2: Peak current for approximately 20% rolloff at +125°C.
sat
Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V , I
1
rms sat
sat
I
: DC current for an approximate temperature rise of 40°C without core loss. Derating is
-3
K-factor: Used to determine B for core loss (see graph). B = K L ΔI 10 , B : (Gauss),
* *
p-p p-p
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
rms
6
*
p-p
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
7
Part Number Definition: FP1006Rx-Rxx-R
• FP1006 = Product code and size
• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant
• Rx is the DCR indicator
1208 BU-SB08861
Page 1 of 4
Data Sheet: 4338
Dimensions - mm
Schematic
Recommended Pad Layout
3.1
Top View
Side View
6.0 max
Bottom View
2.8 0.1
1.92
8.0 max
1
b
1
2
1.52 0.2
6.9 ref
6.56
A
1006Rx
Rxx
wwllyy R
1.52 0.2
2
a
1.92
8.0
Part Number
FP1006R1-R 10.2
FP1006R2-R 10
A
max
The nominal DCR is measured from point “a” to point”b.”
Part Marking: Coiltronics Logo
1006Rx (Rx = DCR Indicator)
Rxx = Inductance value in μH. (R = Decimal point)
wwllyy = Date code
R = Revision level
1.5 dia
Packaging Information - mm
1.5 dia
4.0
A
1.75
2.0
1
11.5
24.0
+/-0.3
1006Rx
Rxx
10.3
wwllyy
R
2
8.1
A
6.1
12.0
User direction of feed
SECTION A-A
Supplied in tape-and-reel packaging, 850 parts per reel, 13” diameter reel.
Temperature Rise vs.Total Loss
60
50
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Total Loss (W)
1208 BU-SB08861
Page 2 of 4
Data Sheet: 4338
Core Loss
Core Loss vs. B
p-p
1MHz
10
1
500kHz
300kHz
200kHz
100kHz
0.1
0.01
0.001
0.0001
0.00001
100
1000
(Gauss)
10,000
B
p-p
Inductance Characteristics
% of OCL vs. % of Isat
1
100%
80%
60%
40%
20%
-40°C
+25°C
+125°C
0%
0%
20%
40%
60%
80%
100%
120%
% of Isat
1
1208 BU-SB08861
Page 3 of 4
Data Sheet: 4338
Solder Reflow Profile
TP
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))
cc
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Volume
Volume
Package
Thick(ess
<2.5mm
mm3
mm3
_
<35ꢀ
235°C
220°C
>35ꢀ
TL
220°C
220°C
Preheat
t
_
>2.5mm
Tsmax
TTaabbllee 22 - LLeeaadd ((PPbb)) FFrreeee SSoolldeerr ((TT ))
cc
Volume
Volume
Volume
mm3
>2ꢀꢀꢀ
260°C
245°C
245°C
Tsmin
mm3
mm3
ts
Package
Thick(ess
<1.6mm
<35ꢀ
260°C
1.6 – 2.5mm 260°C
>2.5mm 250°C
35ꢀ - 2ꢀꢀꢀ
260°C
250°C
245°C
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020D
Profile Feature
Sta(dard S(Pb Solder Lead ꢁPbH Free Solder
100°C
Preheat and Soak
• Temperature min. (T
)
150°C
smin
• Temperature max. (T
)
150°C
200°C
smax
) (t )
• Time (T
smin
to T
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
smax s
Average ramp up rate T
to T
smax
p
Liquidous temperature (T
Time at liquidous (t )
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
Average ramp-down rate (T to T
c
)
p
Time 25°C to Peak Temperature
smax
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
North America
Europe
Asia Pacific
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Cooper Bussmann
Cooper Electronic Technologies
Cooper (UK) Limited
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Burton-on-the-Wolds
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Tel: +65 278 6151
Fax: +65 270 4160
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Fax: +34 937 362 719
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
© 2008 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
1208 BU-SB08861
Page 4 of 4
Data Sheet: 4338
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