74FCT2374CTSOCTE4 [CONEXANT]
8-BIT REGISTER WITH 3-STATE OUTPUTS; 具有三态输出的8位寄存器
| 型号： | 74FCT2374CTSOCTE4 |
| 厂家： | 
CONEXANT SYSTEMS, INC |
| 描述： | 8-BIT REGISTER WITH 3-STATE OUTPUTS |
| 文件： | 总15页 (文件大小：317K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY74FCT2374T
8-BIT REGISTER
WITH 3-STATE OUTPUTS
SCCS040A – SEPTEMBER 1994 – REVISED OCTOBER 2001
SN74FCT2374T . . . Q OR SO PACKAGE
(TOP VIEW)
Function and Pinout Compatible With FCT
and F Logic
25-Ω Output Series Resistors to Reduce
Transmission-Line Reflection Noise
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE
V
CC
O
D
D
O
O
D
D
O
O
D
0
0
1
1
2
2
3
3
7
Reduced V
Equivalent FCT Functions
(Typically = 3.3 V) Version of
OH
7
6
D
O
O
D
Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
6
5
5
4
D
I
Supports Partial-Power-Down Mode
off
O
Operation
4
GND
CP
Matched Rise and Fall Times
Fully Compatible With TTL Input and
Output Logic Levels
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
3-State Outputs
12-mA Output Sink Current
15-mA Output Source Current
Edge-Triggered D-Type Inputs
250-MHz Typical Switching Rate
description
The CY74FCT2374T is a high-speed, low-power, octal D-type flip-flop featuring separate D-type inputs for each
flip-flop. On-chip termination resistors at the outputs reduce system noise caused by reflections. The
CY74FCT2374T can replace the CY74FCT374T to reduce noise in an existing design. The device has 3-state
outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE) inputs are common to all
flip-flops. The flip-flops in the CY74FCT2374T store the state of their individual data (D) inputs that meet the
setup-time and hold-time requirements on the low-to-high CP transition. When OE is low, the contents of the
flip-flops are available at the outputs. When OE is high, the outputs are in the high-impedance state. The state
of OE does not affect the state of the flip-flops.
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,
off
off
preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY74FCT2374T
8-BIT REGISTER
WITH 3-STATE OUTPUTS
SCCS040A – SEPTEMBER 1994 – REVISED OCTOBER 2001
ORDERING INFORMATION
SPEED
(ns)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
QSOP – Q
SOIC – SO
QSOP – Q
SOIC – SO
Tape and reel
Tube
5.2
5.2
5.2
6.5
6.5
6.5
10
CY74FCT2374CTQCT
CY74FCT2374CTSOC
CY74FCT2374CTSOCT
CY74FCT2374ATQCT
CY74FCT2374ATSOC
CY74FCT2374ATSOCT
CY74FCT2374TSOC
CY74FCT2374TSOCT
FCT2374C
FCT2374C
FCT2374A
FCT2374A
Tape and reel
Tape and reel
Tube
–40°C to 85°C
Tape and reel
Tube
SOIC – SO
FCT2374
Tape and reel
10
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OUTPUT
O
D
H
L
CP
↑
OE
L
H
L
↑
L
X
X
H
Z
H = High logic level, L = Low logic level,
X = Don’t care, Z = High-impedance
state, ↑ = Low-to-high clock transition
logic diagram (positive logic)
1
OE
11
CP
CP
3
2
D
0
D
O
0
Q
To Seven Other Channels
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY74FCT2374T
8-BIT REGISTER
WITH 3-STATE OUTPUTS
SCCS040A – SEPTEMBER 1994 – REVISED OCTOBER 2001
†
absolute maximum rating over operating free-air temperature range (unless otherwise noted)
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Package thermal impedance, θ (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W
JA
SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
Ambient temperature range with power applied, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C
A
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
MIN NOM
MAX
UNIT
V
V
V
V
Supply voltage
4.75
2
5
5.25
CC
High-level input voltage
Low-level input voltage
High-level output current
Low-level output current
Operating free-air temperature
V
IH
0.8
–15
12
V
IL
I
mA
mA
°C
OH
OL
I
T
A
–40
85
NOTE 2: All unused inputs of the device must be held at V
or GND to ensure proper device operation.
CC
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY74FCT2374T
8-BIT REGISTER
WITH 3-STATE OUTPUTS
SCCS040A – SEPTEMBER 1994 – REVISED OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
PARAMETER
TEST CONDITIONS
MIN
2.4
20
TYP
MAX
UNIT
V
V
V
V
V
V
V
V
= 4.75 V,
= 4.75 V,
= 4.75 V,
= 4.75 V,
I
I
I
I
= –18 mA
–0.7
3.3
0.3
25
–1.2
IK
CC
CC
CC
CC
IN
= –15 mA
= 12 mA
= 12 mA
V
OH
OL
OH
OL
OL
0.55
40
V
R
Ω
OUT
hys
V
All inputs
0.2
V
I
I
I
I
I
I
I
I
V
V
V
V
V
V
V
V
V
V
= 5.25 V,
= 5.25 V,
= 5.25 V,
= 5.25 V,
= 5.25 V,
= 5.25 V,
= 0 V,
V
V
V
V
V
V
V
V
= V
CC
5
±1
µA
µA
µA
µA
µA
mA
µA
mA
mA
I
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
IN
IN
IN
= 2.7 V
= 0.5 V
IH
±1
IL
= 2.7 V
= 0.5 V
= 0 V
10
OZH
OZL
OUT
OUT
OUT
OUT
–10
–225
±1
‡
–60
–120
OS
= 4.5 V
off
= 5.25 V,
≤ 0.2 V,
V ≥ V
IN CC
– 0.2 V
0.1
0.5
0.2
2
CC
IN
§
∆I
= 5.25 V, V = 3.4 V , f = 0, Outputs open
IN
CC
1
= 5.25 V, Outputs open, One input switching at 50% duty cycle,
– 0.2 V
mA/
MHz
¶
I
0.06
0.12
CCD
OE = GND, V ≤ 0.2 V or V ≥ V
IN IN CC
V
V
≤ 0.2 V or
One bit switching
IN
IN
0.7
1.2
1.6
1.4
3.4
≥ V
CC
– 0.2V
at f = 5 MHz
1
V
= 5.25 V,
CC
Outputs open,
= 10 MHz,
at 50% duty cycle
Eight bits switching
V
IN
= 3.4 V or GND
#
I
C
mA
f
0
V
IN
V
IN
≤ 0.2 V or
||
||
3.2
OE = GND
≥ V
– 0.2 V
at f = 2.5 MHz
1
at 50% duty cycle
CC
V
IN
= 3.4 V or GND
3.9
5
12.2
C
C
10
12
pF
pF
i
9
o
†
‡
Typical values are at V
CC
= 5 V, T = 25°C.
A
Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus
and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise,
prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In
any sequence of parameter tests, I
tests should be performed last.
OS
§
¶
#
Per TTL-driven input (V = 3.4 V); all other inputs at V
or GND
IN CC
This parameter is derived for use in total power-supply calculations.
= I + ∆I × D × N + I (f /2 + f × N )
I
C
CC
CC
H
T
CCD
0
1
1
Where:
I
I
∆I
D
N
= Total supply current
= Power-supply current with CMOS input levels
C
CC
CC
H
T
= Power-supply current for a TTL high input (V = 3.4 V)
IN
= Duty cycle for TTL inputs high
= Number of TTL inputs at D
H
I
f
f
= Dynamic current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
= Input signal frequency
CCD
0
1
N
= Number of inputs changing at f
1
1
All currents are in milliamperes and all frequencies are in megahertz.
||
Values for these conditions are examples of the I
CC
formula.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY74FCT2374T
8-BIT REGISTER
WITH 3-STATE OUTPUTS
SCCS040A – SEPTEMBER 1994 – REVISED OCTOBER 2001
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
CY74FCT2374T CY74FCT2374AT CY74FCT2374CT
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
t
w
t
su
t
h
Pulse duration, CP
7
5
4
ns
ns
ns
Setup time, data before CP↑
Hold time, data after CP↑
2
2
1.5
1
1.5
1.5
switching characteristics over operating free-air temperature range (see Figure 1)
CY74FCT2374T CY74FCT2374AT CY74FCT2374CT
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
MIN
2
MAX
10
MIN
2
MAX
6.5
6.5
6.5
6.5
5.5
5.5
MIN
2
MAX
5.2
5.2
6.2
6.2
5
t
t
t
t
t
t
PLH
PHL
PZH
PZL
PHZ
PLZ
CP
OE
OE
O
O
O
2
10
2
2
1.5
1.5
1.5
1.5
12.5
12.5
8
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
ns
ns
8
5
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY74FCT2374T
8-BIT REGISTER
WITH 3-STATE OUTPUTS
SCCS040A – SEPTEMBER 1994 – REVISED OCTOBER 2001
PARAMETER MEASUREMENT INFORMATION
7 V
Open
GND
S1
500 Ω
From Output
Under Test
From Output
Under Test
Test
Point
TEST
S1
t
/t
Open
7 V
PLH PHL
t /t
C
= 50 pF
C
= 50 pF
L
L
500 Ω
500 Ω
PLZ PZL
/t
(see Note A)
(see Note A)
t
Open
PHZ PZH
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
LOAD CIRCUIT FOR
3-STATE OUTPUTS
3 V
0 V
1.5 V
Timing Input
Data Input
t
w
t
h
t
3 V
su
3 V
0 V
1.5 V
Input
1.5 V
1.5 V
1.5 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3 V
0 V
3 V
0 V
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
Input
t
t
t
t
t
t
PLH
PHL
PLH
PZL
PZH
PLZ
≈3.5 V
V
Output
Waveform 1
(see Note B)
OH
In-Phase
Output
1.5 V
1.5 V
1.5 V
1.5 V
V
V
+ 0.3 V
OL
V
OL
V
OL
t
t
PHL
PHZ
V
V
V
OH
OH
Output
Waveform 2
(see Note B)
Out-of-Phase
Output
– 0.3 V
OH
1.5 V
1.5 V
≈0 V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
74FCT2374ATSOCTE4
74FCT2374ATSOCTG4
74FCT2374CTSOCTE4
74FCT2374CTSOCTG4
74FCT2574ATQCTE4
74FCT2574ATSOCTE4
74FCT2574ATSOCTG4
74FCT2574CTSOCTE4
74FCT2574CTSOCTG4
CY74FCT2374ATQCT
CY74FCT2374ATQCTE4
CY74FCT2374ATQCTG4
CY74FCT2374ATSOC
CY74FCT2374ATSOCE4
CY74FCT2374ATSOCG4
CY74FCT2374ATSOCT
CY74FCT2374CTQCT
CY74FCT2374CTQCTE4
CY74FCT2374CTQCTG4
CY74FCT2374CTSOC
CY74FCT2374CTSOCE4
CY74FCT2374CTSOCG4
CY74FCT2374CTSOCT
CY74FCT2374TSOC
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
DW
DW
DW
DBQ
DW
DW
DW
DW
DBQ
DBQ
DBQ
DW
DW
DW
DW
DBQ
DBQ
DBQ
DW
DW
DW
DW
DW
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT2374TSOCE4
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
Orderable Device
CY74FCT2374TSOCG4
CY74FCT2374TSOCT
CY74FCT2374TSOCTE4
CY74FCT2374TSOCTG4
CY74FCT2574ATQCT
CY74FCT2574ATQCTG4
CY74FCT2574ATSOC
CY74FCT2574ATSOCE4
CY74FCT2574ATSOCG4
CY74FCT2574ATSOCT
CY74FCT2574CTQCT
CY74FCT2574CTQCTE4
CY74FCT2574CTQCTG4
CY74FCT2574CTSOC
CY74FCT2574CTSOCE4
CY74FCT2574CTSOCG4
CY74FCT2574CTSOCT
CY74FCT2574TSOC
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
DW
DW
DW
DBQ
DBQ
DW
DW
DW
DW
DBQ
DBQ
DBQ
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT2574TSOCE4
CY74FCT2574TSOCG4
CY74FCT2574TSOCT
CY74FCT2574TSOCTE4
CY74FCT2574TSOCTG4
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
330
330
330
330
330
330
(mm)
16
CY74FCT2374ATQCT
CY74FCT2374ATSOCT
CY74FCT2374CTQCT
CY74FCT2374CTSOCT
CY74FCT2374TSOCT
CY74FCT2574ATQCT
CY74FCT2574ATSOCT
CY74FCT2574CTQCT
CY74FCT2574CTSOCT
CY74FCT2574TSOCT
DBQ
DW
20
20
20
20
20
20
20
20
20
20
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
6.5
10.8
6.5
9.0
13.0
9.0
2.1
2.7
2.1
2.7
2.7
2.1
2.7
2.1
2.7
2.7
8
12
8
16
24
16
24
24
16
24
16
24
24
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
24
DBQ
DW
16
24
10.8
10.8
6.5
13.0
13.0
9.0
12
12
8
DW
24
DBQ
DW
16
24
10.8
6.5
13.0
9.0
12
8
DBQ
DW
16
24
10.8
10.8
13.0
13.0
12
12
DW
24
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
CY74FCT2374ATQCT
CY74FCT2374ATSOCT
CY74FCT2374CTQCT
CY74FCT2374CTSOCT
CY74FCT2374TSOCT
CY74FCT2574ATQCT
CY74FCT2574ATSOCT
CY74FCT2574CTQCT
CY74FCT2574CTSOCT
CY74FCT2574TSOCT
DBQ
DW
20
20
20
20
20
20
20
20
20
20
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
0.0
333.2
0.0
0.0
333.2
0.0
0.0
31.75
0.0
DBQ
DW
333.2
333.2
0.0
333.2
333.2
0.0
31.75
31.75
0.0
DW
DBQ
DW
333.2
0.0
333.2
0.0
31.75
0.0
DBQ
DW
333.2
333.2
333.2
333.2
31.75
31.75
DW
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
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Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
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