CPC1977_11 [CLARE]
i4-PAC⢠Power; 6-14 PACA ?? ¢电源
| 型号： | CPC1977_11 |
| 厂家： | 
CLARE |
| 描述： | i4-PAC⢠Power |
| 文件： | 总7页 (文件大小：901K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CPC1977
i4-PAC™ Power
Relay
Characteristics
Description
®
Clare and IXYS have combined to bring OptoMOS
technology, reliability and compact size to a new family
of high-power Solid State Relays.
Parameter
Rating
Units
VP
Blocking Voltage
600
Load Current, TA=25°C:
As part of this family, the CPC1977 single-pole
normally open (1-Form-A) Solid State Power Relay is
With 5°C/W Heat Sink
No Heat Sink
3.1
1.25
1
A
rms
rated for up to 3.1A
continuous load current with a
rms
On-Resistance
Ω
5°C/W heat sink.
R
0.35
°C/W
θJC
The CPC1977 employs optically coupled MOSFET
technology to provide 2500V of input to output
rms
Features
isolation. The output, constructed with efficient
MOSFET switches and photovoltaic die, uses Clare’s
patented OptoMOS architecture while the input, a
highly efficient GaAlAs infrared LED, provides the
optically coupled control. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
• 3.1A
Load Current with 5°C/W Heat Sink
rms
• Low 1Ω On-Resistance
• 600V Blocking Voltage
• 2500V
• Low Thermal Resistance (0.35 °C/W)
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
P
Input/Output Isolation
rms
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
power modules, not only provides 2500V
but also very low thermal resistance (0.35 °C/W).
isolation
rms
• Data Acquisition
• Electronic Switching
Ordering Information
• I/O Subsystems
Part
Description
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
CPC1977J
i4-PAC Package (25 per tube)
Switching Characteristics
Approvals
• UL 508 Recognized Component: File E69938
Form-A
Pin Configuration
IF
90%
10%
ILOAD
t
t
on
off
RoHS
2002/95/EC
3
DS-CPC1977 - R06
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1
CPC1977
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Symbol
Blocking Voltage
Ratings
Units
600
5
VP
Reverse Input Voltage
Input Control Current
Peak (10ms)
V
mA
A
100
1
Input Power Dissipation
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
150
mW
Vrms
°C
2500
-40 to +85
-40 to +125
°C
1.2 Electrical Characteristics @ 25°C
Parameter
Conditions
Symbol
Minimum
Typical Maximum Units
Output Characteristics
1
Load Current
Peak
t≤10ms
No Heat Sink
AP
15
Continuous
Continuous
Continuous
IL
1.25
-
-
T =25°C
C
Arms
12.25
1.4
1
T =99°C
C
IL(99)
RON
2
I =10mA, I =1A
L
On-Resistance
F
-
-
0.57
-
Ω
V =600V
L
Off-State Leakage Current
Switching Speeds
Tur n-On
ILEAK
P
1
μA
ton
toff
-
-
-
7.5
20
5
I =20mA, V =10V
L
ms
pF
F
Tur n-Off
0.085
2450
V =25V, f=1MHz
L
Output Capacitance
Input Characteristics
Cout
-
3
I =1A
L
IF
IF
Input Control Current
-
-
-
10
-
mA
mA
V
Input Dropout Current
-
0.6
0.9
-
I =5mA
F
Input Voltage Drop
VF
IR
1.2
-
1.4
10
V =5V
R
Reverse Input Current
μA
Input/Output Characteristics
Capacitance, Input-to-Output
-
C
-
1
-
pF
I/O
1 Higher load currents possible with proper heat sinking.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (TC > 60ºC) a LED drive current of 20mA is recommended.
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2
CPC1977
2 Thermal Characteristics
Parameter
Conditions
Symbol
RθJC
Minimum
Typical Maximum Units
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
-
-
-
-
33
-
0.35
-
°C/W
°C/W
°C
Free Air
-
RθJA
T
-40
100
J
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
2
(TJ - TA) IL(99)
RθCA
=
- RθJC
IL2 • PD(99)
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
I
L(99) = Load Current with Case Temperature @ 99°C (ADC)
IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD(99) = Maximum power dissipation with case temperature held at 99ºC = 2.86W
* Elevated junction temperature reduces semiconductor lifetime.
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CPC1977
3 Performance Data
Typical Turn-Off Time
(N=50, IF=10mA, IL=1ADC, TA=25ºC)
Typical LED Forward Voltage Drop
(N=50, IF=10mA,TA=25ºC)
Typical Turn-On Time
(N=50, IF=10mA, IL=1ADC, TA=25ºC)
35
30
25
20
15
10
5
25
20
15
10
5
25
20
15
10
5
0
0
0
1.30
1.31
1.32
1.33
1.34
0.04
0.06
0.08
0.09
0.10
0.11
6.5
7.0
7.5
8.0
8.5
9.0
Turn-Off (ms)
Turn-On (ms)
LED Forward Voltage (V)
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=1ADC, TA=25ºC)
Typical Blocking Voltage Distribution
(N=50,TA=25ºC)
35
30
25
20
15
10
5
35
30
25
20
15
10
5
0
0
0.54
0.55
0.56
0.57
0.58
0.59
815
820
825
830
835
840
On-Resistance (Ω)
Blocking Voltage (VP)
Typical Turn-Off
vs. LED Forward Current
(IL=1ADC, TA=25ºC)
Typical Turn-On
vs. LED Forward Current
(IL=1ADC, TA=25ºC)
Typical LED Forward Voltage Drop
vs.Temperature
0.18
0.17
0.16
0.15
0.14
0.12
0.12
0.10
0.08
0
1.8
1.6
1.4
1.2
1.0
0.8
18
16
14
12
10
8
IF=50mA
6
I =20mA
IFF=10mA
4
2
1
0
0
5
10 15 20 25 30 35 40 45 50
-40 -20
0
20
40
60
80 100 120
0
5
10 15 20 25 30 35 40 45 50
LED Forward Current (mA)
Temperature (ºC)
LED Forward Current (mA)
Typical IF for Switch Operation
vs.Temperature
Typical Turn-Off vs.Temperature
Typical Turn-On vs.Temperature
(IF=10mA, IL=1ADC
(IF=10mA, IL=1ADC
)
)
(IL=1ADC
)
14
12
10
8
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
20
18
16
14
12
10
8
6
6
4
4
2
2
0
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
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4
CPC1977
Typical Load Current
vs. Load Voltage
(IF=10mA,TA=25ºC)
Maximum Load Current
vs.Temperature with Heat Sink
(IF=20mA)
Typical On-Resistance
vs.Temperature
(IF=20mA, IL=0.75A)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
8
7
6
5
4
3
2
1
0
1.25
1.00
0.75
0.50
0.25
0
1ºC/W
5ºC/W
-0.25
-0.50
-0.75
-1.00
-1.25
10ºC/W
Free Air
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
0
-2.0
-1.33 -0.66
0.66
1.33
2.0
Temperature (ºC)
Temperature (ºC)
Load Voltage (V)
Typical Leakage vs.Temperature
Measured Across Pins 1&2
(VL=600VP)
Energy Rating Curve
Free Air, No Heat Sink
Typical Blocking Voltage
vs.Temperature
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
845
840
835
830
825
820
815
810
805
18
15
12
9
6
3
0
10µs 100µs 1ms 10ms 100ms 1s
10s 100s
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Time
Temperature (ºC)
Temperature (ºC)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
5
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CPC1977
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1977J
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
CPC1977J
245°C for 30 seconds
4.4 Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated
products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes.
Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic
energy should not be used.
RoHS
2002/95/EC
e
3
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CPC1977
4.5 Mechanical Dimensions
1.930 0.381
(0.076 0.015)
5.029 0.127
(0.198 0.005)
1.181 0.076
(0.047 0.003)
19.914 0.254
(0.784 0.010)
17.221 0.254
(0.678 0.010)
15.317 0.254
(0.603 0.010)
20.879 0.254
(0.822 0.010)
Isolated Heat Sink
2.362 0.381
(0.093 0.015)
20.396 0.508
(0.803 0.020)
DIMENSIONS
mm
(inches)
3.810 0.254
(0.150 0.010)
0.635 0.076
(0.025 0.003)
15.240 0.508
(0.600 0.020)
1.270 TYP
(0.050 TYP)
2.794 0.127
(0.110 0.005)
NOTE: Back-side heat sink meets 2500Vrms isolation to the pins.
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1977-R06
©Copyright 2011, Clare, Inc.
All rights reserved. Printed in USA.
1/7/2011
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