CEB75A3 [CET]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
CEB75A3
型号: CEB75A3
厂家: CHINO-EXCEL TECHNOLOGY    CHINO-EXCEL TECHNOLOGY
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总4页 (文件大小:395K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CEP75A3/CEB75A3  
N-Channel Enhancement Mode Field Effect Transistor  
FEATURES  
25V, 69A, RDS(ON) = 9m@VGS = 10V.  
RDS(ON) = 13m@VGS = 4.5V.  
Super high dense cell design for extremely low RDS(ON)  
.
High power and current handing capability.  
Lead free product is acquired.  
D
TO-263 & TO-220 package.  
G
CEB SERIES  
TO-263(DD-PAK)  
CEP SERIES  
TO-220  
S
ABSOLUTE MAXIMUM RATINGS T = 25 C unless otherwise noted  
c
Parameter  
Symbol  
VDS  
VGS  
ID  
Limit  
Units  
V
Drain-Source Voltage  
25  
Gate-Source Voltage  
±20  
69  
V
Drain Current-Continuous  
A
Drain Current-Pulsed a  
IDM  
276  
A
Maximum Power Dissipation @ TC = 25 C  
- Derate above 25 C  
68  
W
PD  
0.45  
-55 to 175  
W/ C  
C
Operating and Store Temperature Range  
TJ,Tstg  
Thermal Characteristics  
Parameter  
Symbol  
RθJC  
Limit  
2.2  
Units  
C/W  
C/W  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
RθJA  
62.5  
Rev 1. 2006.Nov  
Details are subject to change without notice .  
http://www.cetsemi.com  
1
CEP75A3/CEB75A3  
Electrical Characteristics T = 25 C unless otherwise noted  
c
Parameter  
Off Characteristics  
Symbol  
Test Condition  
Min  
Typ  
Max  
Units  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate Body Leakage Current, Forward  
Gate Body Leakage Current, Reverse  
On Characteristics b  
BVDSS  
IDSS  
VGS = 0V, ID = 250µA  
VDS = 25V, VGS = 0V  
VGS = 20V, VDS = 0V  
VGS = -20V, VDS = 0V  
25  
V
1
µA  
nA  
nA  
IGSSF  
IGSSR  
100  
-100  
6
Gate Threshold Voltage  
VGS(th)  
RDS(on)  
VGS = VDS, ID = 250µA  
VGS = 10V, ID = 35A  
VGS = 4.5V, ID = 29A  
1
3
9
V
7
m  
mΩ  
Static Drain-Source  
On-Resistance  
10  
13  
Dynamic Characteristics c  
Forward Transconductance  
Input Capacitance  
gFS  
Ciss  
VDS = 10V, ID = 15A  
12  
1190  
280  
155  
S
pF  
pF  
pF  
VDS = 15V, VGS = 0V,  
f = 1.0 MHz  
Output Capacitance  
Coss  
Crss  
Reverse Transfer Capacitance  
Switching Characteristics c  
Turn-On Delay Time  
Turn-On Rise Time  
td(on)  
tr  
td(off)  
tf  
13  
5
26  
10  
66  
14  
13  
ns  
ns  
VDD = 15V, ID = 1A,  
VGS = 10V, RGEN = 6Ω  
Turn-Off Delay Time  
Turn-Off Fall Time  
33  
7
ns  
ns  
Total Gate Charge  
Qg  
9.8  
3.4  
2.7  
nC  
nC  
nC  
VDS = 15V, ID = 20A,  
VGS = 5V  
Gate-Source Charge  
Gate-Drain Charge  
Qgs  
Qgd  
Drain-Source Diode Characteristics and Maximun Ratings  
Drain-Source Diode Forward Current  
Drain-Source Diode Forward Voltage b  
IS  
69  
A
V
VSD  
VGS = 0V, IS = 20A  
0.85  
1.2  
Notes :  
a.Repetitive Rating : Pulse width limited by maximum junction temperature.  
b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%.  
c.Guaranteed by design, not subject to production testin  
2
CEP75A3/CEB75A3  
100  
80  
60  
40  
20  
0
100  
VGS=10,8,6,4V  
80  
60  
V
GS=3V  
40  
25 C  
20  
TJ=125 C  
-55 C  
0
0
1
2
3
4
0
1
2
3
4
5
VDS, Drain-to-Source Voltage (V)  
VGS, Gate-to-Source Voltage (V)  
Figure 1. Output Characteristics  
Figure 2. Transfer Characteristics  
2.2  
1.9  
1.6  
1.3  
1.0  
0.7  
0.4  
1800  
1500  
1200  
900  
600  
300  
0
ID=40A  
VGS=10V  
C
iss  
C
oss  
C
rss  
-100  
-50  
0
50  
100  
150  
200  
0
5
10  
15  
20  
25  
VDS, Drain-to-Source Voltage (V)  
TJ, Junction Temperature( C)  
Figure 3. Capacitance  
Figure 4. On-Resistance Variation  
with Temperature  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
VDS=VGS  
ID=250µA  
V
GS=0V  
102  
101  
100  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
-50 -25  
0
25 50 75 100 125 150  
TJ, Junction Temperature( C)  
VSD, Body Diode Forward Voltage (V)  
Figure 5. Gate Threshold Variation  
with Temperature  
Figure 6. Body Diode Forward Voltage  
Variation with Source Current  
3
CEP75A3/CEB75A3  
103  
5
4
3
2
1
0
VDS=15V  
ID=20A  
RDS(ON)Limit  
10µs  
102  
100µs  
1ms  
DC  
101  
6
TC=25 C  
TJ=175 C  
Single Pulse  
100  
10-1  
100  
101  
102  
0
2
4
6
8
10  
Qg, Total Gate Charge (nC)  
VDS, Drain-Source Voltage (V)  
Figure 7. Gate Charge  
Figure 8. Maximum Safe  
Operating Area  
VDD  
on  
t
toff  
d(off)  
t
r
t
d(on)  
OUT  
RL  
t
f
t
VIN  
90%  
10%  
90%  
D
OUT  
V
V
VGS  
10%  
INVERTED  
RGEN  
G
90%  
50%  
50%  
S
IN  
V
10%  
PULSE WIDTH  
Figure 10. Switching Waveforms  
Figure 9. Switching Test Circuit  
100  
D=0.5  
0.2  
0.1  
10-1  
0.05  
PDM  
t1  
t2  
0.02  
0.01  
1. Rθ JC (t)=r (t) * Rθ JC  
2. Rθ JC=See Datasheet  
3. TJM-TC = P* Rθ JC (t)  
4. Duty Cycle, D=t1/t2  
Single Pulse  
10-2  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
Square Wave Pulse Duration (sec)  
Figure 11. Normalized Thermal Transient Impedance Curve  
4

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