1210M680KRR [CERAMATE]
Zinc Oxide; 氧化锌型号: | 1210M680KRR |
厂家: | CERAMATE TECHNICAL |
描述: | Zinc Oxide |
文件: | 总9页 (文件大小:247K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TYPE
MODEL
PAGE
1/9
SMV1210M□□□KRR
CITATION
SUBJECT
DATE Feb. 03, 2009
Structure
C01
REV.
1. STRUCTURE
NO.
ITEM
DESCRIPTION
1.1
1.2
1.3
1.4
Main Material
End termination
Packaging
Zinc Oxide
Ag/Ni/Sn
Reel
Complies with
Standard
IEC61000-4-5
1.5 Complies with RoHS
Standard
Yes
< 1000ppm
1.6
Lead content
Reflow solder profile
temperature
℃
250
1.7
(Recommend)
L
W
3.20
2.50
±
±
0.20
0.20
1.50
0.5 0.2
T(max.)
a
±
1.8
Dimensions
TYPE
MODEL
PAGE
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SMV1210M□□□KRR
CITATION
SUBJECT
DATE Feb. 03, 2009
Electrical Characteristics
C01
REV.
2. ELECTRICAL CHARACTERISTICS
N0.
2.0
ITEM
TEST METHODS
PERFORMANCE
Unless otherwise specified, all tests are made
under environmental conditions as given below:
Standard
Conditions
Temperature:
5~35°C
Relative humidity:
45~85 % RH
Maximum continuous sine wave(RMS) or DC
voltage which may be applied.
Maximum
Allowable Voltage
AC : *(1) Vrms
DC : *(1) V
2.1
2.2 Varistor Voltage
Varistor Voltage
V0.1mA : *(1) V
Voltage across the varistor measured at CmA DC.
2.3
Temperature
Coefficient
0 ~ −0.05 %/°C
Peak voltage across the varistor with a specified
Max. Clamping
Voltage
2.4
*(1) Vat 1 A
*(1) A
peak impulse current of 8x20μs waveform.
The max. current within the varistor voltage
change of less than ±10% when one impulse
current (8x20μs) applied.
Withstanding Surge
Current
2.5
The max. energy absorbed with a varistor voltage
change of less than ±10% when one impulse
(10x1000μs) is applied.
2.6
2.7
Energy
*(1) Joule
Trise
Response time
< 1 nS
I V v
<50μΑ
<200μA
at V
at V
×80%
1mA
2.8 Leakage current
I V v
×80% (After Reliability Test)
1mA
Capacitance shall be measured at 1 kHz±10%,1
Vrms max.(1 MHz below 100 pF) 0V bias and
20±2℃
2.9
Capacitance
*(1) pF.
*(1) See table 2.1 Electrical Characteristics
TYPE
MODEL
PAGE
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SMV1210M□□□KRR
CITATION
SUBJECT
DATE Feb. 03, 2009
C01
Electrical Characteristics
REV.
Table 2.1 Electrical Characteristics
Maximum
Allowable
Voltage
Max.
Clamping
Voltage
Part
Number
Varistor
Voltage
Withstanding
Surge Current
Energy Capacitance
V(
<
<
<
<
<
<
<
A(
PF(*1)(kHz)
5200
2000
1150
610
Symbol
AC
DC
5.5
11
*2)
*3)
J
V
(
1mA
8 ( 7.5~10.5 )
15 12.75~17.25 )
24( 1.6~26.4 )
)
1210M080KRR
4
8
20
25
38
54
65
77
90
250
>
>
>
>
>
>
>
>
>
0.4
1210M150
K
RR
(
0.6
0.8
1.2
1.4
1.6
2.0
2.3
1.4
250
250
250
250
250
250
250
200
1210M240KRR 14
1210M330KRR 20
1210M390KRR 25
1210M470KRR 30
18
26
30
38
45
56
85
2
33( 29.7~36.6 )
39( 35.1~42.9 )
47( 42.3~51.7 )
56( 50.4~61.6 )
68( 61.2~74.8 )
100(90~110 )
920
780
1210
1210
1210
M560
M680
M101
K
K
K
RR 35
RR 40
RR 60
400
300
<
<
110
165
210
TYPE
MODEL
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SMV1210M□□□KRR
CITATION
SUBJECT
DATE Feb. 03, 2009
C01
Reliability
REV.
3. ENVIRONMENTAL CHARACTERISTICS
Test method and description
for 1000 12 hours in a thermostatic bath
without load and then stored at room temperature and humidity for 1 to 2 hours.
The change of varistor voltage shall be within 10
No.
3.1
Characteristic
The specimen shall be subjected to 150
±
2
℃
±
High Temperature
Storage
﹪
.
The temperature cycle of specified
Step
Temperature
-40
Period
30Min±3
temperature shall be repeated five times
and then stored at room temperature and
humidity for one or two hours. The
1
2
3
4
±3
℃
Room Temperature
125
Room Temperature
1~2 hours
30Min
1~2 hours
3.2
Temperature Cycle
±2
℃
±3
change of varistor voltage shall be within
10
﹪and mechanical damage shall be
After being continuously applied the maximum allowable voltage at 85
±
2
℃
F
or 1000
hours, the specimen shall be stored at room temperature and humidity for one or two
hours, the change of varistor voltage shall be within 10
The specimen should be subjected to 40 , 90 to 95
maximum allowable voltage applied for 1000 hours, then stored at room temperature
and humidity for one or two hours. The change of varistor voltage shall be within 10
The specimen should be subjected to -40 , without load for 500 hours and then
stored at room temperature for one or two hours. The change of varistor voltage shall be
within 10
± 2
High Temperature
Load
3.3
3.4
3.5
﹪
.
±
2
℃
%RH environment, and the
Damp Heat Load/
Humidity Load
%
.
± 2℃
Low Temperature
Storage
﹪
4. TECHNICAL TERM
No.
4.1
Item
Specifications
Description
Operating Temperature
Range
Operating temperature range without derating.
-40℃ to +85℃
-40℃ to +125℃
< 50 ns
Storage Temperature
Range
Storage temperature range without voltage applied.
4.2
4.3
Transient Response
Time
Time lag between application of surge and varistor's
"turn-on" conduction action.
TYPE
MODEL
PAGE
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SMV1210M□□□KRR
CITATION
SUBJECT
DATE Feb. 03, 2009
S
o
lde
ring
C01
REV.
5. SOLDERING RECOMMENDATIONS
5.1 Recommended solder pad layout
A
B
C
D
1.8~2.5
4.2~5.2
2.2~3.0
1.3~2.0
(
Unit:mm)
5.2 The SIR test of the solder paste shall be done
5.3 Steel plate and foot distance printing
(
Based on JIS-Z-3284
)
Foot distance printing (mm)
> 0.65mm
Steel Plate thickness (mm)
0.18mm
0.65mm~0.5mm
0.50mm~0.40mm
<=0.40 mm
0.15mm
0.12mm
0.10mm
5.4 IR Soldering
Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and
gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and
solder liquids times. Make sure that the element is not 2.4 The IR reflow and temperature of Soldering for Pb
Free subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal
gradient. During the soldering process, pre- heating to within 100 degrees of the solders peak temperature is
essential to minimize thermal shock.
TYPE
MODEL
PAGE
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SMV1210M□□□KRR
CITATION
DATE Feb. 03, 2009
SUBJECT
S
o
lde
ring
REV.
C01
☆
IR reflow Pb Free Process suggestion profile
(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150
(2) Ramp-up rate (217 to Peak) + 3 /second max
(3) Temp. maintain at 175 +/-25 180 seconds max
(4) Temp. maintain above 217 ℃ 60-150 seconds
μ
m
℃
℃
℃
10~20
℃ +20℃/ -10 ℃ time within 5 ℃of actually peak temperature (tp)
(5) Peak temperature range 245
seconds
(6) Ramp down rate +6
℃/second max.
※
Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the
manufacturing process, and the specification of the reflow furnace.
5.5 Resistance to soldering heat-High Temperature Resistance:260
5.6 Hand Soldering
℃,10sec-3times.
In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of
soldering iron may cause electrical failures and mechanical damages such as crackings or breakings of the
devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept
minimum with following recommended conditions for hand soldering.
5.6.1 Recommended Soldering Condition 1
(1) Solder :
0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and
non-activated flux is recommended.
(2) Preheating
The Varistors shall be preheated so that Temperature Gradient between the devices and the tip of
soldering iron is 150℃ or below.
TYPE
MODEL
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SMV1210M□□□KRR
CITATION
SUBJECT
DATE Feb. 03, 2009
S
o
lde
ring
C01
REV.
(3)Soldering Iron
Rated Power of 20w max with 3mm soldering tip in diameter.
Temperature of soldering iron tip 380℃max,3-5sec ( The required amount of solder shall be melted
in advance on the soldering tip.)
(4)Cooling
After soldering. The Varistors shall be cooled gradually at room ambient temperature.
5.6.2 Recommended Soldering Condition 2(Without preheating)
(1)Solder iron tip shall not directly touch to ceramic dielectrics.
(2)Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external
electrode of Varistors.
5.7 Post Soldering Cleaning
5.7.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have influences on the
electrical characteristic and the reliability (such as humidity resistance)of the Varistors which have been
mounted on the board. It shall be confirmed that the characteristic and the reliability of the devices are not
affected by the applied cleaning conditions.
5.7.2. When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards. Following conditions are
recommended for preventing failures or damages of the devices due to the large vibration energy and the
resonance caused by the ultrasonic waves.
(1)Frequency 29MHz max
(2)Radiated Power 20w/lithr max
(3)Period 5minuets max
TYPE
MODEL
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SMV1210M□□□KRR
CITATION
SUBJECT
DATE Feb. 03, 2009
Pa
ckag
ing
S
pe
cif
ic
ation
C01
REV.
6. PACKAGING SPECIFICATION
6.1 Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should be
used to reel the carrier tape.
6.2 The adhesion of the heat-sealed cover tape shall be 40 +20/ -15grams.
6.3 Both the head and the end portion of the taping shall be empty for reel package and SMT auto-pickup machine.
And a normal paper tape shall be connected in the head of taping for the operator to handle
D
+0.10
-0.00
0
K
0.10
A
0.10
B
0.10
T
0.05
T
0.05
D
0.05
P
0.10
P
0.05
P
0
W
0.20
E
0.10
F
0.05
0
0
0
2
1
1
2
S
ymbol
±
±
±
±
±
±
±
±
±
0.05
±
±
±
2.78
3.46 1.55
0.22
1.77
1.50
1.00
4.00
2.00
4.00
8.00
1.75
3.50
mm
TYPE
MODEL
PAGE
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SMV1210M□□□KRR
CITATION
SUBJECT
DATE Feb. 03, 2009
Ree
l
D
imen
s
ion
C01
REV.
7. REEL DIMENSION
E
C
B
D
W1
W
A
W1
1.5 0.15
Symbol
A
B
C
D
E
W
Unit(mm)
178
±
1
60
±
0.5
13
±
0.2
21
±
0.2
2.0
±
0.5
9
±
0.5
±
Standard packaging
:1000 pcs/Reel.
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